表紙:3D TSVデバイスの世界市場
市場調査レポート
商品コード
339785

3D TSVデバイスの世界市場

3D TSV Devices

出版日: | 発行: Global Industry Analysts, Inc. | ページ情報: 英文 338 Pages | 納期: 即日から翌営業日

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3D TSVデバイスの世界市場
出版日: 2022年02月01日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 338 Pages
納期: 即日から翌営業日
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  • 概要
  • 目次
概要

当レポートでは、3D TSV (through silicon via:Si貫通電極) デバイスの世界市場に注目し、2013-2020年の期間を対象に取引価額の推移を地域 (米国、カナダ、日本、欧州、アジア太平洋地域、中南米、その他) 別に検証・予測するほか、市場の現況や今後の動向、大小参入企業28社のプロファイルをはじめとする競合環境などについての調査・分析情報をまとめています。

第1章 イントロダクション、調査方法、製品の定義

  • 調査の信頼性とレポートの限界
  • 免責事項
  • データの解釈とレポート作成レベル
    • 定量技法と分析
  • 製品の定義と調査範囲

第2章 エグゼクティブサマリー

  • 産業概要
    • はじめに
    • 3D IC設計における3D TSVの役割拡大で加速に向かう市場
    • 3D TSVを他の3D IC設計技術と比較する - 寸評
    • 市場見通し
    • 競合状況
    • 市場構造
    • 3D TSVデバイス製造における優位の維持を目指す受託生産業者
    • 自社ウェハー加工ユニットへの3D TSV工程増設に向かう垂直統合型デバイスメーカー (IDM)
    • 3D TSV環境での地位を競い合う半導体後工程サービス業者 (OSAT)
    • 半導体バリューチェーンを改変するTSV技術
  • 注目すべき市場動向および推進要因
    • 家庭用電子機器セクターの上昇機運で弾みを増す3D TSVデバイスの市場見通し
    • 3D TSV技術採用の主要家庭用電子機器製品を検証する
      • スマートフォン
      • タブレットPC
    • 高度成長を継続するIC製造セクターは3D TSVデバイスの吉兆
    • 重要統計データ
    • 進行中のクラウド利用アプリケーションの増殖に活気づく3D TSVデバイス導入
    • データセンタートラフィックの動向 - 補足検証
    • DRAMメモリー分野で弾みを増す3D TSV
    • 次世代TSV利用DRAMメモリーソリューションの考察
      • ハイブリッドメモリーキューブ (HMC)
      • 高帯域幅メモリー (HBM)
      • Wide I/OおよびWide I/O 2 DRAM
        • モバイルDRAM - LPDDR3とWide IOの比較
    • MEMS (微小電気機械システム) 市場の成長で加速する市場拡大
    • 高品質製品の商機を広げるウェアラブル機器
    • CMOSイメージセンサー業界での大型商機を目前にする3D TSVデバイス
    • セクターおよび装置・機器別に見たCMOSイメージセンサー (CIS) 利用
    • イメージングおよびオプトエレクトロニクス - 3D TSVにとって重要な最終利用分野
    • 先進LEDパッケージングで成長を見る3D TSV
    • 3D WLCSP (Wafer Level Chip Scale Package) - 3D TSVの成熟分野
    • TSV導入に際して注目を集めるDRIE (Deep reactive-ion etching:深堀り反応性イオンエッチング) ボッシュ法
    • 3D ICデバイスの性能を高めるシステムレベル探索および3Dフロアプランニング技法
    • 上昇カーブを見せる斬新なデータベースやルーティングデバイスへの需要
    • 3D IC技術の進化で新型ツール需要に拍車
  • 製品・技術概要
    • イントロダクション
    • TSVプロセスのさまざまなステップ
    • TSVプロセスの形式
    • Via-First法
    • Via-Middle法
    • Via-Last法
    • TSVにバイアホールを形成する方法
    • DRIE法
    • レーザー穿孔法
    • 3D ICデバイスの利点
    • 従来技法に優る性能
    • パッケージサイズ/形状ファクターの減少
    • 不均一集積
    • 問題点
    • 高コスト
    • 工程中の収率損失
    • 完成した設計、検証ツールの不在
    • 品質保証された良品ベアチップ (KGD) に向けた十分なサポートの欠如
    • 技術発展
    • コンフォーマルシード/バリヤ
    • 原子層蒸着 (ALD) と化学蒸着 (CVD)
    • コンフォーマル原子層蒸着バリヤ
    • 無電解銅めっき
  • 製品導入・発売
  • 最新産業動向
  • 世界の主要参入企業
  • 世界市場見通し

第3章 市場

  • 米国
  • カナダ
  • 日本
  • 欧州
  • アジア太平洋地域
    • 中国
    • 韓国
    • その他アジア太平洋地域諸国
  • その他の地域

競合環境

目次
Product Code: MCP-7927

What`s New for 2022?

» Global competitiveness and key competitor percentage market shares

» Market presence across multiple geographies - Strong/Active/Niche/Trivial

» Online interactive peer-to-peer collaborative bespoke updates

» Access to our digital archives and MarketGlass Research Platform

» Complimentary updates for one year

Global 3D TSV Devices Market to Reach $12.7 Billion by 2026

Three-Dimensional (3D) Through-Silicon-Via (TSV) technology is steadily gaining image as the highly-advanced semiconductor packaging model that dramatically improves chip performance and functionality. A breakthrough System-in-Package (SiP) model, 3D TSV basically focuses on making interconnects to stack multiple dies, by drilling via-holes that are later filled with conductive material such as copper, to fabricate integrated chips (ICs) with high-level performance and space efficiency attributes. Driven by growing demand from global electronics manufacturers for innovative, high-performance chip architectures and designs in advanced packaging with superior performance, power consumption, and form factor features, 3D TSV technology has made robust progress within the global semiconductor sector. While the trends in the global electronics sector continue to put focus on advanced wafer packaging technologies such as 3D TSV technology, factors such as expanding Information & Communication Technologies (ICT) sector, stupendous increase in communications services providers (CSPs) operations, intensified activity in corporate data centers, and growing proliferation of cloud computing services are placing laser focus on 3D TSV. Over the past few years, the global electronics sector has been witnessing progressive advancements in all the core segments including consumer electronics, automotive electronics, medical electronics, and defense electronics among others.

Amid the COVID-19 crisis, the global market for 3D TSV Devices estimated at US$4.2 Billion in the year 2020, is projected to reach a revised size of US$12.7 Billion by 2026, growing at a CAGR of 20.5% over the analysis period. Memory, one of the segments analyzed in the report, is projected to grow at a 19.9% CAGR to reach US$4.5 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Mems segment is readjusted to a revised 21.6% CAGR for the next 7-year period. This segment currently accounts for a 22.2% share of the global 3D TSV Devices market.

The U.S. Market is Estimated at $808.8 Million in 2021, While China is Forecast to Reach $3.4 Billion by 2026

The 3D TSV Devices market in the U.S. is estimated at US$808.8 Million in the year 2021. The country currently accounts for a 16.73% share in the global market. China, the world second largest economy, is forecast to reach an estimated market size of US$3.4 Billion in the year 2026 trailing a CAGR of 24.4% through the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 15.7% and 17.1% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 15.6% CAGR while Rest of European market (as defined in the study) will reach US$4.3 Billion by the close of the analysis period.

Asia-Pacific (including China and Japan) is spearheading growth in the global 3D TSV market, led by countries such as China, South Korea, Australia, Singapore, and Indonesia that are key centers for the production of consumer electronics and automobiles. The growing demand for silicon wafers in the production of smartphones and the implementation of 5G technology, are particularly fueling market growth in the region. In 2019, collective laser?assisted bonding process for 3D TSV integration using nonconductive paste (NCP) was developed in South Korea. This allows the simultaneous stacking of many TSV dies to enhance productivity, while keeping the solder joints reliable using LAB (laser?assisted bonding) technology. Growth of the Asian 3D TSV market is also being fostered by the rising adoption of new memory technology and the presence of key market players in the region. In Europe and North America, increasing R&D activities related to 3D IC design is aiding market growth. The rising 3D packaging with the use of TSV technology in the semiconductor sector is being fueled by the requirement to enhance performance and lower time delays. Also, the growing use of TSV technology for functional integration along with wafer fabrication and assembly in the semiconductor sector is spurring market growth. Europe is at the forefront in terms of 3D TSV technology, given the presence of various R&D companies. In Latin America, the 3D TSV market is gaining from the rising demand for various electronic products. In the region, Brazil is a main market for cell phones, computers and other consumer electronics.

CMOS Image Sensors Segment to Reach $1.7 Billion by 2026

In the global CMOS Image Sensors segment, USA, Canada, Japan, China and Europe will drive the 18.9% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$390.7 Million in the year 2020 will reach a projected size of US$1.3 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$570.9 Million by the year 2026.

Select Competitors (Total 68 Featured) -

  • ASE Group
  • Amkor Technology, Inc.
  • Broadcom Inc.
  • Intel Corporation
  • JCET Group
  • KIOXIA America Inc.
  • Samsung Group
  • STMicroelectronics N.V.
  • Taiwan Semiconductor Manufacturing Company Limited

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • 3D TSV Devices - Global Key Competitors Percentage Market Share in 2022 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
    • Impact of COVID-19 Pandemic and Looming Global Recession: 2020 Marked as a Year of Disruption & Transformation
    • World Economic Growth Projections (Real GDP, Annual % Change) for 2020 through 2022
    • Impact of COVID-19 on the Semiconductor Industry Exposes the Risk of Value Chain Modularity
    • Among the Hammered Companies in the Supply Chain is the "Semiconductor Industry"
    • Measuring the Impact of COVID-19 on the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020
    • Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020
    • Semiconductor Trends for Specific End-Use Categories
    • COVID-19 Pandemic Storm Warrants New Strategies to Help Semiconductor Leaders Secure New Lease of Life
    • Falling Consumer Confidence Impacts Sales of Automotive and Consumer Electronics
    • Industrial Activity Remain Subdued in 2020
    • Global PMI Index Points for the Years 2018, 2019 & 2020
    • A Prelude to 3D TVS
    • Comparison of 3D TSV with Other 3D IC Integration Technologies: A Snapshot
    • Global Market Prospects & Outlook
    • Regional Analysis
    • Global Market for 3D TSV Devices: Percentage Breakdown of Sales for Developed and Developing Regions (2021 & 2027)
    • Global Market for 3D TSV Devices - Geographic Regions Ranked by % CAGR (Sales) for 2020-2027: China, Asia-Pacific, Rest of World, USA, Canada, Europe, and Japan
    • Competitive Scenario
    • Foundries Stay Ahead in 3D TSV Device Manufacturing
    • IDMs Include 3D TSV Technology in their Wafer Processing Units
    • OSAT Companies Vie for Place in 3D TSV Landscape
    • Advantages & Limitations for Foundries, IDMs, and OSATs Operating in 3D TSV Landscape: A Snapshot
    • Recent Market Activity
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • 3D TSV Devices Market Strongly Influenced by Trends in Consumer Electronics Sector
    • Post Pandemic Recovery in CE Sector to Augment Prospects
    • Worldwide Shipments of Smartphones, Tablets, and Laptops (in Million Units) for the Years 2019, 2021 and 2023
    • Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022
    • A Review of Key CE Products Driving Adoption of 3D TSV Technology
    • Smartphones
    • Smartphone Penetration Rate as Share of Total Population: 2016-2021
    • Tablet PCs
    • Uptrend in 3D IC Technology Augments Business Case
    • Fast Evolving 3D IC Technology to Spur Demand
    • Digital Transformation Drive to Steer Future Growth of 3D TSV Market
    • Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
    • IoT Ecosystem to Rev Up Opportunities for 3D TSV Devices
    • Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
    • Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
    • Global IoT Market (In US$ Billion) by Industry for the Years 2018 and 2022
    • World IoT Semiconductors Market by Function (2018 & 2022): Percentage Breakdown of Value Sales for Communications, Processing, and Sensing
    • AI Hardware: Potential New Growth Avenue
    • Global AI Semiconductor Market (In US$ Billion) for Years 2020, 2023 & 2025
    • Automobile Electronification Trends Widen the Addressable Market
    • Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
    • World Automobile Production in Million Units: 2008-2022
    • Anticipated Post COVID Recovery to Revive Opportunities in Aerospace Sector
    • Commercial Airline Revenue Growth (in %) for 2010-2020
    • Global Airlines Performance by Region: 2020 Vs 2019
    • Sustained High Growth in ICT Sector Augurs Well
    • World Internet Penetration Rate (in %) by Geographic Region: June 2021
    • Global IP Traffic Volume in Exabytes for the Years 2019 and 2022
    • Breakdown of Global IP Traffic by Application Type (in %): 2019 & 2022
    • Global Wireless Communication Market (2018 & 2020): Percentage Breakdown of Traffic Volume by Mobile Device Type
    • Ongoing Proliferation of Cloud-Based Applications to Encourage Adoption of 3D TSV Devices
    • Global Public Cloud Computing Market (in US$ Billion) by Segment for the Years 2019 and 2022
    • Key Benefits Driving Adoption of Cloud Services of Large, Medium and Small Businesses
    • Growing Performance Requirements of Modern Data Centers to Extend Opportunities for 3D TSV Devices
    • Data Center Traffic Trends: A Complementary Review
    • Global Data Center IP Traffic Breakdown (in %) by Cloud and Traditional Data Centers for the Years 2017, 2019 and 2021
    • 3D TSV Gaining Traction in DRAM Memory Sector
    • A Review of Next-Generation TSV-based DRAM Memory Solutions
    • Mobile DRAM - LPDDR3 Vs. Wide IO
    • Growing Market for MEMS to Fuel Market Expansion
    • Wearable Devices to Extend High-Quality Opportunities
    • 3D TSV Devices Sense large Opportunities in CMOS Image Sensors Vertical
    • Global CMOS Image Sensor (CIS) Package Solutions Market (2021): Percentage Share Breakdown of Volume Shipments by Technology
    • Use of CMOS Image Sensor (CIS) by Sector & Device/Equipment
    • Imaging & Optoelectronics: An Important End-Use Segment for 3D TSV
    • 3D TSV Sees Growth in Advanced LED Packaging
    • 3D WLCSP: A Mature 3D TSV Segment
    • DRIE Bosch Process Gaining Prominence in TSV Implementation
    • System-Level Exploration and 3D Floorplanning Technique Enhance Performance of 3D IC Devices
    • Demand for Innovative Databases and Wireless Routing Augment Market Demand
    • Issues
  • PRODUCT OVERVIEW
    • An Insight into Through-Silicon Via (TSV)
    • An Introduction to Through-silicon via (TSV) Devices
    • Benefits of 3D TSV Devices
    • Historical Timeline
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for 3D TSV Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 2: World Historic Review for 3D TSV Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 3: World 12-Year Perspective for 3D TSV Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2021 & 2027
    • TABLE 4: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 5: World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 6: World 12-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2021 & 2027
    • TABLE 7: World Recent Past, Current & Future Analysis for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 8: World Historic Review for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 9: World 12-Year Perspective for MEMS by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2021 & 2027
    • TABLE 10: World Recent Past, Current & Future Analysis for CMOS Image Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 11: World Historic Review for CMOS Image Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 12: World 12-Year Perspective for CMOS Image Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2021 & 2027
    • TABLE 13: World Recent Past, Current & Future Analysis for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 14: World Historic Review for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 15: World 12-Year Perspective for Imaging & Optoelectronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2021 & 2027
    • TABLE 16: World Recent Past, Current & Future Analysis for Advanced LED Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 17: World Historic Review for Advanced LED Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 18: World 12-Year Perspective for Advanced LED Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2021 & 2027
    • TABLE 19: World Recent Past, Current & Future Analysis for Other Products by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 20: World Historic Review for Other Products by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 21: World 12-Year Perspective for Other Products by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2021 & 2027
    • TABLE 22: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 23: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 24: World 12-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2021 & 2027
    • TABLE 25: World Recent Past, Current & Future Analysis for Information & Communication Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 26: World Historic Review for Information & Communication Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 27: World 12-Year Perspective for Information & Communication Technology by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2021 & 2027
    • TABLE 28: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 29: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 30: World 12-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2021 & 2027
    • TABLE 31: World Recent Past, Current & Future Analysis for Military, Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 32: World Historic Review for Military, Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 33: World 12-Year Perspective for Military, Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2021 & 2027
    • TABLE 34: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 35: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 36: World 12-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2021 & 2027

III. MARKET ANALYSIS

  • UNITED STATES
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2022 (E)
    • Demand for Performance-Rich Consumer Electronics Puts Focus on 3D TSV Devices
    • Demand for MEMS Technologies in Mobile & Automotive Sector to Create Opportunities for 3D TSV Devices
    • TABLE 37: USA Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 38: USA Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 39: USA 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 40: USA Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 41: USA Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 42: USA 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027
  • CANADA
    • TABLE 43: Canada Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 44: Canada Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 45: Canada 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 46: Canada Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 47: Canada Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 48: Canada 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027
  • JAPAN
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2022 (E)
    • Market Overview
    • Japanese Semiconductor Materials Market (2015, 2019 & 2020): Annual Sales in US$ Million
    • TABLE 49: Japan Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 50: Japan Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 51: Japan 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 52: Japan Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 53: Japan Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 54: Japan 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027
  • CHINA
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2022 (E)
    • Market Overview
    • Chinese Semiconductor Materials Market (2015, 2019 & 2020): Annual Sales in US$ Million
    • TABLE 55: China Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 56: China Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 57: China 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 58: China Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 59: China Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 60: China 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027
  • EUROPE
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2022 (E)
    • TABLE 61: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 62: Europe Historic Review for 3D TSV Devices by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 63: Europe 12-Year Perspective for 3D TSV Devices by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2021 & 2027
    • TABLE 64: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 65: Europe Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 66: Europe 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 67: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 68: Europe Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 69: Europe 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027
  • FRANCE
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2022 (E)
    • TABLE 70: France Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 71: France Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 72: France 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 73: France Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 74: France Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 75: France 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027
  • GERMANY
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2022 (E)
    • TABLE 76: Germany Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 77: Germany Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 78: Germany 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 79: Germany Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 80: Germany Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 81: Germany 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027
  • ITALY
    • TABLE 82: Italy Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 83: Italy Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 84: Italy 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 85: Italy Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 86: Italy Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 87: Italy 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027
  • UNITED KINGDOM
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2022 (E)
    • TABLE 88: UK Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 89: UK Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 90: UK 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 91: UK Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 92: UK Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 93: UK 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027
  • REST OF EUROPE
    • TABLE 94: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 95: Rest of Europe Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 96: Rest of Europe 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 97: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 98: Rest of Europe Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 99: Rest of Europe 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027
  • ASIA-PACIFIC
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2022 (E)
    • South Korea
    • South Korean Semiconductor Materials Market (2015-2020): Annual Sales in US$ Million
    • Taiwan
    • Taiwan Semiconductor Fabrication Materials Market (2015-2020): Annual Sales in US$ Million
    • TABLE 100: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 101: Asia-Pacific Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 102: Asia-Pacific 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 103: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 104: Asia-Pacific Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 105: Asia-Pacific 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027
  • REST OF WORLD
    • TABLE 106: Rest of World Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 107: Rest of World Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 108: Rest of World 12-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2021 & 2027
    • TABLE 109: Rest of World Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 110: Rest of World Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2019 and % CAGR
    • TABLE 111: Rest of World 12-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2021 & 2027

IV. COMPETITION

  • Total Companies Profiled: 68