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3D IC市場規模、シェア、成長分析、基板別、製品別、コンポーネント別、3D技術別、用途別、地域別 - 産業予測、2024年～2031年

3D IC Market Size, Share, Growth Analysis, By Substrate(Silicon on Insulator, Bulk Silicon), By Product(Sensors, Memories, Logics, Light Emitting Diodes ), By Component, By 3D Technology, By Application, By Region - Industry Forecast 2024-2031

出版日: 2024年11月02日
発行: SkyQuest
ページ情報: 英文 197 Pages
納期: 3～5営業日

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USD 5,300 763,518円

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概要
目次

概要

サンプル依頼リストに入れる

3D ICの世界市場規模は、2022年に106億2,000万米ドルと評価され、2023年の114億9,000万米ドルから2031年には216億米ドルに成長し、予測期間（2024-2031年）のCAGRは8.21％で成長する見通しです。

世界の3D集積回路（IC）市場は、急速な技術開発とコンパクトで高性能な電子機器に対する需要の高まりにより、力強い成長軌道に乗っています。コンシューマーエレクトロニクス、特にスマートフォンやタブレットに3D ICが採用されているのは、集積回路を多層に積層することで動作効率とエネルギー消費量を向上させようという市場の狙いを反映しています。この革新的なアーキテクチャは、省エネルギーを促進し、シグナルインテグリティを強化するだけでなく、より軽く、より小さく、よりエネルギー効率の高いガジェットを求める消費者の嗜好にも対応しています。高い初期導入コスト、複雑な製造プロセス、熱管理や相互運用性への懸念といった課題に直面しているもの、3D IC市場には大きなビジネスチャンスがあります。人工知能（AI）と機械学習（ML）の台頭は、5G技術の展開と並んで、より高速なデータ処理能力の必要性を強調し、3D ICを現代の電子技術革新に不可欠なものにしています。業界が標準化や共同作業に関するハードルを乗り越え続けるなか、市場は大きく拡大する態勢を整えています。次世代エレクトロニクスの需要は急増するため、メーカーは3D IC技術の進歩を活用することが求められています。全体として、3D IC市場は、より小さく、効率的で、高速な電子ソリューションの追求によって推進され、進化するデジタルランドスケープにおける重要なプレーヤーとして位置づけられています。

市場概要
北米
- 米国
- カナダ
欧州
- ドイツ
- スペイン
- フランス
- 英国
- イタリア
- その他欧州地域
アジア太平洋地域
- 中国
- インド
- 日本
- 韓国
- その他アジア太平洋地域
ラテンアメリカ
- ブラジル
- その他ラテンアメリカ地域
中東・アフリカ（MEA）
- GCC諸国
- 南アフリカ
- その他中東・アフリカ地域

競合情勢

上位5社の比較
主要企業の市場ポジショニング（2023年）
主な市場企業が採用した戦略
市場における最近の活動
主要企業の市場シェア（2023年）

主要企業プロファイル

Advanced Semiconductor Engineering
ST Microelectronics
STATS ChipPAC
Taiwan Semiconductor Manufacturing
Samsung Electronics
IBM
AMKOR TECHNOLOGY
Toshiba Corporation
United Microelectronics Corporation
Xilinx Inc.
Micron Technology, Inc.
Samsung Electronics Co. Ltd.
Cadence
Monolithic 3D Inc.
Intel Corporation
NXP Semiconductors
Qualcomm
Broadcom Inc.
Analog Devices, Inc.
Siemens

Product Code: SQMIG45K2097

Global 3D IC Market size was valued at USD 10.62 billion in 2022 and is poised to grow from USD 11.49 billion in 2023 to USD 21.60 billion by 2031, growing at a CAGR of 8.21% during the forecast period (2024-2031).

The global 3D Integrated Circuit (IC) market is on a robust growth trajectory, driven by rapid technological developments and an escalating demand for compact, high-performance electronic devices. The adoption of 3D ICs across consumer electronics, particularly smartphones and tablets, reflects the market's aim to enhance operational efficiency and energy consumption by stacking multiple layers of integrated circuits. This innovative architecture not only facilitates energy savings and strengthens signal integrity but also caters to consumers' preferences for lighter, smaller, and more energy-efficient gadgets. Despite facing challenges such as high initial implementation costs, intricate manufacturing processes, and concerns over heat management and interoperability, the 3D IC market presents substantial opportunities. The rise of artificial intelligence (AI) and machine learning (ML), alongside the rollout of 5G technology, underscores the necessity for faster data processing capabilities, making 3D ICs integral to modern electronic innovations. As the industry continues to overcome hurdles related to standardization and collaborative efforts, the market is poised for significant expansion. Manufacturers are urged to leverage advancements in 3D IC technology, as the demand for next-generation electronics is set to soar. Overall, the 3D IC market is propelled by the quest for smaller, efficient, and high-speed electronic solutions, positioning itself as a vital player in the evolving digital landscape.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global 3D Ic market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global 3D Ic Market Segmental Analysis

Global 3D IC Market is segmented by Substrate, Product, Component, 3D Technology, Application, and Region. Based on Substrate, the market is segmented into Silicon on Insulator (SOI), Bulk Silicon. Based on Product, the market is segmented into Sensors, Memories, Logics, Light Emitting Diodes (LED), Micro Electro Mechanical Systems (MEMS). Based on Component, the market is segmented into Through Silicon Vias, Through Glass Vias, Silicon Interposer, Others. Based on 3D Technology, the market is segmented into Wafer Level Packaging, System Integration. Based on Application, the market is segmented into Consumer Electronics, ICT/Telecommunication, Military, Automotive, Biomedical, Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global 3D Ic Market

The global 3D IC market is driven by the increasing consumer demand for compact and high-performance electronic devices. As consumers gravitate towards smaller, lighter, and more powerful gadgets such as smartphones, tablets, and wearables, 3D IC technology provides a crucial solution by enabling the stacking of multiple layers of integrated circuits. This innovative approach enhances processing capabilities while minimizing power consumption and physical dimensions. Consequently, it aligns perfectly with the evolving needs of tech-savvy users seeking advanced functionality in their devices, fueling the expansion of the 3D IC market across various applications in electronics.

Restraints in the Global 3D Ic Market

The high start-up costs associated with 3D integrated circuit (IC) technology represent a significant market restraint, limiting its widespread adoption. The intricate fabrication processes and the requirement for specialized equipment result in elevated production costs, which can be prohibitive for many manufacturers. These initial financial barriers deter potential entrants and established companies from investing in the transition to 3D IC technology, slowing down industrial uptake across various sectors. Consequently, the reluctance to embrace this innovative technology restricts its market potential, hindering the overall growth and evolution of the 3D IC market on a global scale.

Market Trends of the Global 3D Ic Market

The global 3D IC market is witnessing a significant trend driven by the increasing integration of 3D ICs in artificial intelligence (AI) and machine learning (ML) applications. As industries demand enhanced data processing capabilities and superior performance to support the growing complexity of AI algorithms, the adoption of 3D IC technology is surging. This technology enables higher integration density and faster data transfer rates, essential for the efficient functioning of AI and ML systems. Consequently, this trend not only propels the demand for advanced 3D ICs but also signifies a broader technological evolution, positioning the market for substantial growth in the coming years.

Introduction

Objectives of the Study
Definitions
Market Scope

Research Methodology

Information Procurement
Secondary & Primary Data Sources
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Market Overview Outlook
Supply Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges
Porters Analysis
- Competitive rivalry
- Threat of Substitute Products
- Bargaining Power of Buyers
- Threat of New Entrants
- Bargaining Power of Suppliers

Key Market Insights

Technology Analysis
Value Chain Analysis
Ecosystem of the Market
Patent Analysis
Pricing Analysis
Regulatory Landscape
Innovation Matrix
PESTEL Analysis
Top Investment Analysis
Key Success Factor
Degree of Competition

3D IC Market by Substrate

Market Overview
Silicon on Insulator (SOI)
Bulk Silicon

3D IC Market by Product

Market Overview
Sensors
Memories
Logics
Light Emitting Diodes (LED)
Micro Electro Mechanical Systems (MEMS)

3D IC Market by Component

Market Overview
Through Silicon Vias
Through Glass Vias
Silicon Interposer
Others

3D IC Market by 3D Technology

Market Overview
Wafer Level Packaging
System Integration

3D IC Market by Application

Market Overview
Consumer Electronics
ICT/Telecommunication
Military
Automotive
Biomedical
Others

3D IC Market Size by Region

Market Overview
North America
- USA
- Canada
Europe
- Germany
- Spain
- France
- UK
- Italy
- Rest of Europe
Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America
- Brazil
- Rest of Latin America
Middle East & Africa (MEA)
- GCC Countries
- South Africa
- Rest of MEA

Competitive Landscape

Top 5 Player Comparison
Market Positioning of Key Players, 2023
Strategies Adopted by Key Market Players
Recent Activities in the Market
Key Companies Market Share (%), 2023

Key Company Profiles

Advanced Semiconductor Engineering
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ST Microelectronics
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
STATS ChipPAC
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Taiwan Semiconductor Manufacturing
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electronics
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
IBM
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
AMKOR TECHNOLOGY
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Toshiba Corporation
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
United Microelectronics Corporation
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Xilinx Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Micron Technology, Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electronics Co. Ltd.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Cadence
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Monolithic 3D Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Intel Corporation
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
NXP Semiconductors
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Qualcomm
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Broadcom Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Analog Devices, Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Siemens
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments

3D IC市場規模、シェア、成長分析、基板別、製品別、コンポーネント別、3D技術別、用途別、地域別 - 産業予測、2024年～2031年

3D IC Market Size, Share, Growth Analysis, By Substrate(Silicon on Insulator, Bulk Silicon), By Product(Sensors, Memories, Logics, Light Emitting Diodes ), By Component, By 3D Technology, By Application, By Region - Industry Forecast 2024-2031

目次

イントロダクション

調査手法

エグゼクティブサマリー

市場力学と見通し

主な市場の考察

3D IC市場：基板別

3D IC市場：製品別

3D IC市場：コンポーネント別

3D IC市場：3D技術別

3D IC市場：用途別

3D IC市場：地域別