3次元TSVと2.5次元の世界市場

3次元TSVと2.5次元の世界市場は2030年までに1,889億米ドルに達する見込み

2024年に447億米ドルと推定される3次元TSVと2.5次元の世界市場は、分析期間2024-2030年にCAGR 27.2%で成長し、2030年には1,889億米ドルに達すると予測されます。本レポートで分析したセグメントの1つである3D積層メモリパッケージングは、CAGR 28.2%を記録し、分析期間終了までに780億米ドルに達すると予測されます。5Dインターポーザパッケージング分野の成長率は、分析期間中CAGR 23.3%と推定されます。

米国市場は122億米ドル、中国はCAGR 35.8％で成長予測

米国の3次元TSVと2.5次元市場は2024年に122億米ドルと推定されます。世界第2位の経済大国である中国は、2030年までに470億米ドルの市場規模に達すると予測され、分析期間2024-2030年のCAGRは35.8%です。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ21.8%と24.5%と予測されています。欧州では、ドイツがCAGR約22.9%で成長すると予測されています。

世界の3次元TSVと2.5次元市場- 主要動向と促進要因のまとめ

3次元TSVと2.5次元パッケージは半導体集積をどのように再定義しているか？

3D貫通電極（TSV）と2.5D集積技術の出現は、先進的なチップ設計において、性能の向上、消費電力の削減、フォームファクタの最小化を実現する革新的な経路を提供することで、半導体の展望を再構築しています。従来のパッケージング手法とは異なり、3D TSVはシリコンウエハーにエッチングされた高アスペクト比のビアを使用して複数のダイを垂直に積み重ねることを可能にし、相互接続の長さを大幅に短縮し、より高速な信号伝送を可能にします。この垂直統合により、帯域幅の拡大、レイテンシーの改善、電力効率の向上が実現され、これらはすべて、高性能コンピューティング、人工知能、データセンター運用などのアプリケーションに不可欠なものです。一方、2.5Dパッケージは、複数のダイをインターポーザー上に並べて配置する中間的なアプローチを提供し、完全な3D積層に関連する熱や歩留まりの課題に対処しながら、2Dパッケージよりも向上した性能を提供します。これらの技術革新は異種集積をサポートし、ロジック、メモリー、アナログ、さらにはフォトニックコンポーネントをコンパクトな高機能モジュールに共存させることを可能にします。民生用電子機器から航空宇宙まで幅広い産業で、消費電力や性能を犠牲にすることなく小型化の要求に応えるため、こうしたパッケージング・アーキテクチャの採用が進んでいます。TSVを使用した高帯域幅メモリ（HBM）とロジックチップの統合はその代表例であり、ニューラルネットワークのトレーニングや3Dレンダリングなどのデータ集約的なタスクを可能にします。システム・オン・チップ（SoC）の複雑さが増すにつれ、モノリシック・スケーリングの限界は、ムーアの法則に代わる有効な選択肢として、業界を先進パッケージングへと押し上げています。TSVおよび2.5Dソリューションは、シグナルインテグリティの問題に対処し、より高いI/O密度をサポートすることで、よりインテリジェントでコンパクト、かつ電力効率に優れたアーキテクチャへと半導体が進化し続ける上で中心的な役割を果たしています。

技術大手や鋳造メーカーが3次元TSVと2.5次元技術に積極投資しているのはなぜか？

3次元TSVと2.5次元パッケージング技術に対する半導体鋳造所、集積デバイスメーカー、ハイテク大手による積極的な投資は、データ駆動型経済における、より高速で、より小型で、よりエネルギー効率の高いデバイスへのニーズの高まりに根ざしています。これらの先進パッケージング技術は、帯域幅のスケーラビリティ、パワーインテグリティ、フォームファクタの削減という点で明確な性能上の利点を提供し、人工知能、機械学習、グラフィックス処理、5Gインフラ向けの次世代チップセットに不可欠なものとなっています。TSMC、インテル、サムスン、ASEなどの大手企業は、TSVエッチング、ウエハーボンディング、インターポーザー製造に対応する設備の新設・拡張に多額の資金を投入しています。こうした投資は、ヘテロジニアス・インテグレーション（別々のプロセス・ノードで製造された異なる機能ユニットを、最適な性能とコスト効率を実現するために単一のパッケージに統合する）への需要の高まりに対する戦略的な対応でもあります。クラウド・コンピューティングとエッジ・デバイスは、これまで以上に小さなレイテンシと大きな並列性を求めており、これらはいずれもTSVとインターポーザによって可能になる高密度相互接続によって実現されます。これらの技術はまた、単一のモノリシック・ダイをスケールアップするのではなく、より小型の機能特化型チップを組み合わせるために使用される場合、コスト面でも大きな利点をもたらします。TSVと2.5Dアーキテクチャに支えられたチップレットベースの設計手法の採用は、モジュール式高性能コンピューティング・プラットフォームの商業的実現可能性をさらに拡大しています。政府や防衛機関も、次世代半導体のサプライチェーンを確保することの戦略的重要性を認識し、先進パッケージングにおける国内能力を奨励しています。業界パートナーシップ、ジョイントベンチャー、研究開発協力は技術革新を加速し、規模に応じた生産準備を可能にしています。材料、装置、熟練労働力のエコシステムが成熟するにつれ、投資の焦点は実験から本格的な展開へと移行しています。

3次元TSVと2.5次元の採用を加速させているアプリケーションと市場とは？

3次元TSVと2.5次元技術の採用が加速しているのは、データスループットの向上、低レイテンシ、より厳しいパワーエンベロープを要求する高性能アプリケーションの爆発的な成長と密接に結びついています。データセンターとクラウドインフラストラクチャでは、これらのテクノロジは、AIトレーニング、リアルタイム分析、仮想化などの大量ワークロードをサポートする強力なプロセッサとメモリモジュールを作成するために使用されます。AIやゲーム・アプリケーションに配備されるグラフィック・プロセッシング・ユニット（GPU）やテンソル・プロセッシング・ユニット（TPU）も、TSV統合HBMが可能にする高いメモリ帯域幅と緊密な結合から大きな恩恵を受けています。モバイルおよびコンシューマ・エレクトロニクスでは、TSVと2.5Dが、コンピューティング能力を犠牲にすることなく、より薄く、より軽く、よりエネルギー効率の高いデバイスを実現しています。自動車業界は、電気自動車や自律走行車、特にADAS（先進運転支援システム）やインフォテインメント・ユニットで増加する電子コンテンツをサポートするために、これらの技術を採用し始めています。航空宇宙と防衛は、スペース、重量、性能が厳しく制限されるミッションクリティカルな用途に、2.5Dと3Dパッケージングの信頼性とコンパクトさを活用しています。医療機器やウェアラブルも新たな応用分野であり、TSVによって診断、監視、治療機能用の小型フォームファクターに強力なチップを統合することが可能になります。さらに、エッジ・コンピューティング・デバイスの需要が高まっており、分散型で制約の多い環境でも堅牢な性能が要求されるため、小型で効率的なパッケージング・ソリューションへの関心が高まっています。マシンビジョンシステム、IoTセンサー、産業用ロボットは、処理能力と空間効率の理想的なバランスをTSVと2.5Dに見出しています。これらの技術に支えられたチップレットベースのアーキテクチャへの動向は、設計の柔軟性を高め、メーカーがニッチ市場向けのソリューションを迅速に試作し、カスタマイズすることを可能にしています。これらの多様なセクターが、よりデータ集約的でAI対応の機能性に収束し続けるにつれて、3次元TSVと2.5次元パッケージングの採用曲線は険しくなり、業界全体の将来のイノベーションを実現する重要なイネーブラーとしての役割が強化されると予想されます。

3次元TSVと2.5次元市場の成長を促進する主な要因は？

3次元TSVと2.5次元市場の成長は、進化する半導体設計ニーズ、変化する消費者技術需要、製造能力の進歩に直結するいくつかの要因によって牽引されています。大きな要因の一つは、トランジスタの微細化が物理的、経済的に限界に近づいているため、従来のプレーナースケーリングの限界を克服することが急務となっていることです。3次元TSVと2.5次元統合は、ノードを小型化することなく性能を向上させる代替経路を提供し、より高いI/O密度、信号伝送の改善、電力損失の低減を実現します。もう1つの重要な要因は、AIや高性能コンピューティングのワークロードの増加です。これらのワークロードは、TSVを介したHBM統合によって実現可能な、極めて高いメモリ帯域幅と低レイテンシを必要とします。複数の特殊なコアやチップレットを単一パッケージ内に集積するヘテロジニアス・コンピューティングへの依存度が高まっていることも、こうした先進パッケージング形式への移行を加速させています。さらに、モバイル機器、AR/VRヘッドセット、スマートウェアラブルの普及は、3次元TSVと2.5次元が提供できる小型でエネルギー効率の高いチップの需要を促進しています。車載分野では、電動化と自動化が推進され、車載計算に適した小型で高信頼性、熱効率の高いチップの需要が生まれています。ファインピッチTSVエッチング、ウエハー薄型化、サーマルインターフェイス材料などの製造プロセスの先進化により、これらのパッケージの大量生産がより現実的になり、コスト効率も向上しています。業界標準や設計ツールも成熟し、統合の複雑さが軽減され、開発サイクルの短縮が可能になりました。さらに、半導体サプライチェーンの地域化を目指す地政学的な取り組みが、国家戦略構想の一環として先進パッケージング施設への投資を後押ししています。チップ設計者、OSAT（Outsourced Semiconductor Assembly and Test）、EDA（Electronic Design Automation）ツール・プロバイダ間の協力的な取り組みは、コンセプトから商業展開までの経路を合理化しています。最後に、5G、エッジコンピューティング、AIの規模での融合は、よりインテリジェントで統合されたハードウェアソリューションに対する持続的な需要を生み出し、3次元TSVと2.5次元技術を半導体イノベーションの次の波における基礎コンポーネントとして確固たるものにしています。

セグメント

包装タイプ（3D積層メモリー包装、5Dインターポーザー包装、TSV付きCIS包装、3D SoC包装、その他の包装タイプ）、エンドユーザー（コンシューマー・エレクトロニクス・エンドユーザー、オートモーティブ・エンドユーザー、ハイパフォーマンス・コンピューティング＆ネットワーキング・エンドユーザー、その他のエンドユーザー）

調査対象企業の例

• Advanced Semiconductor Engineering（ASE）
• Amkor Technology
• Applied Materials
• Brewer Science
• Chipbond Technology Corp.
• Deca Technologies
• EV Group（EVG）
• Fraunhofer IZM
• GLOBALFOUNDRIES
• Huawei HiSilicon
• Intel Corporation
• Lam Research
• Samsung Electronics
• SK hynix
• SUSS MicroTec
• Taiwan Semiconductor Manufacturing Company（TSMC）
• Teledyne DALSA
• Texas Instruments
• Tokyo Electron Limited
• Xperi Inc.（includes Invensas）

AIインテグレーション

Global Industry Analystsは、有効な専門家コンテンツとAIツールにより、市場情報と競合情報を変革しています。

Global Industry Analystsは、LLMや業界固有のSLMを照会する一般的な規範に従う代わりに、ビデオ記録、ブログ、検索エンジン調査、膨大な量の企業、製品/サービス、市場データなど、世界中の専門家から収集したコンテンツのリポジトリを構築しました。

関税影響係数

Global Industry Analystsは、本社の国、製造拠点、輸出入（完成品とOEM）に基づく企業の競争力の変化を予測しています。この複雑で多面的な市場力学は、売上原価（COGS）の増加、収益性の低下、サプライチェーンの再構築など、ミクロおよびマクロの市場力学の中でも特に競合他社に影響を与える見込みです。

目次

第1章 調査手法

第2章 エグゼクティブサマリー

• 市場概要
• 主要企業
• 市場動向と促進要因
• 世界市場の見通し

第3章 市場分析

• 米国
• カナダ
• 日本
• 中国
• 欧州
• フランス
• ドイツ
• イタリア
• 英国
• スペイン
• ロシア
• その他欧州
• アジア太平洋
• オーストラリア
• インド
• 韓国
• その他アジア太平洋地域
• ラテンアメリカ
• アルゼンチン
• ブラジル
• メキシコ
• その他ラテンアメリカ
• 中東
• イラン
• イスラエル
• サウジアラビア
• アラブ首長国連邦
• その他中東
• アフリカ

第4章 競合

Global 3D TSV and 2.5D Market to Reach US$188.9 Billion by 2030

The global market for 3D TSV and 2.5D estimated at US$44.7 Billion in the year 2024, is expected to reach US$188.9 Billion by 2030, growing at a CAGR of 27.2% over the analysis period 2024-2030. 3D Stacked Memory Packaging, one of the segments analyzed in the report, is expected to record a 28.2% CAGR and reach US$78.0 Billion by the end of the analysis period. Growth in the 5D Interposer Packaging segment is estimated at 23.3% CAGR over the analysis period.

The U.S. Market is Estimated at US$12.2 Billion While China is Forecast to Grow at 35.8% CAGR

The 3D TSV and 2.5D market in the U.S. is estimated at US$12.2 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$47.0 Billion by the year 2030 trailing a CAGR of 35.8% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 21.8% and 24.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 22.9% CAGR.

Global 3D TSV and 2.5D Market - Key Trends & Drivers Summarized

How Are 3D TSV and 2.5D Packaging Redefining Semiconductor Integration?

The emergence of 3D Through-Silicon Via (TSV) and 2.5D integration technologies is reshaping the semiconductor landscape by offering innovative pathways to enhance performance, reduce power consumption, and minimize form factor in advanced chip designs. Unlike traditional packaging methods, 3D TSV enables vertical stacking of multiple dies using high-aspect-ratio vias etched through silicon wafers, significantly shortening interconnect lengths and allowing faster signal transmission. This vertical integration results in higher bandwidth, improved latency, and better power efficiency, all of which are critical for applications such as high-performance computing, artificial intelligence, and data center operations. On the other hand, 2.5D packaging provides an intermediate approach, where multiple dies are placed side-by-side on an interposer, offering improved performance over 2D packaging while addressing the thermal and yield challenges associated with full 3D stacking. These innovations support heterogeneous integration, allowing logic, memory, analog, and even photonic components to coexist in a compact, high-functionality module. Industries ranging from consumer electronics to aerospace are increasingly adopting these packaging architectures to meet the demand for miniaturization without compromising power or performance. The integration of High Bandwidth Memory (HBM) with logic chips using TSVs is a prime example, enabling data-intensive tasks such as neural network training and 3D rendering. As system-on-chip (SoC) complexity grows, the limitations of monolithic scaling have pushed the industry toward advanced packaging as a viable alternative to Moore’s Law. TSV and 2.5D solutions address signal integrity issues and support higher I/O density, thereby playing a central role in the continued evolution of semiconductors toward more intelligent, compact, and power-efficient architectures.

Why Are Tech Giants and Foundries Heavily Investing in 3D TSV and 2.5D Technologies?

The aggressive investments by semiconductor foundries, integrated device manufacturers, and tech giants in 3D TSV and 2.5D packaging technologies are rooted in the escalating need for faster, smaller, and more energy-efficient devices in a data-driven economy. These advanced packaging techniques offer clear performance advantages in terms of bandwidth scalability, power integrity, and form factor reduction, making them indispensable in next-generation chipsets for artificial intelligence, machine learning, graphics processing, and 5G infrastructure. Major players such as TSMC, Intel, Samsung, and ASE are allocating significant capital towards building and expanding facilities equipped to handle TSV etching, wafer bonding, and interposer fabrication, all of which require highly specialized and precise processes. These investments are also strategic responses to the growing demand for heterogeneous integration, where different functional units fabricated on separate process nodes are assembled into a single package for optimal performance and cost-efficiency. Cloud computing and edge devices are pushing for ever-smaller latencies and greater parallelism, both of which are enabled by the high-density interconnects made possible through TSVs and interposers. These technologies also offer significant cost advantages when used to combine smaller, function-specific chips rather than scaling up a single, monolithic die. The adoption of chiplet-based design methodologies, supported by TSV and 2.5D architectures, is further expanding the commercial feasibility of modular, high-performance computing platforms. Governments and defense agencies are also incentivizing domestic capabilities in advanced packaging, recognizing the strategic importance of securing next-generation semiconductor supply chains. Industry partnerships, joint ventures, and R&D collaborations are accelerating technical innovation and enabling production readiness at scale. As the ecosystem for materials, equipment, and skilled labor matures, the focus of investment is shifting from experimentation to full-fledged deployment, driven by both the technical superiority and the commercial viability of these packaging formats.

What Applications and Markets Are Accelerating Adoption of 3D TSV and 2.5D?

The accelerating adoption of 3D TSV and 2.5D technologies is closely tied to the explosive growth of high-performance applications that demand increased data throughput, lower latency, and tighter power envelopes. In data centers and cloud infrastructure, these technologies are used to create powerful processors and memory modules that support high-volume workloads such as AI training, real-time analytics, and virtualization. Graphics processing units (GPUs) and tensor processing units (TPUs) deployed in AI and gaming applications also benefit greatly from the high memory bandwidth and close coupling made possible by TSV-integrated HBM. In mobile and consumer electronics, TSV and 2.5D are enabling thinner, lighter, and more energy-efficient devices without sacrificing computing capability. The automotive industry is beginning to adopt these technologies to support the increasing electronic content in electric and autonomous vehicles, particularly in advanced driver assistance systems (ADAS) and infotainment units. Aerospace and defense are leveraging the reliability and compactness of 2.5D and 3D packaging for mission-critical applications where space, weight, and performance are tightly constrained. Medical devices and wearables are another emerging application area, with TSVs enabling the integration of powerful chips into small form factors for diagnostic, monitoring, and therapeutic functions. Additionally, the growing demand for edge computing devices, which require robust performance in decentralized and often constrained environments, is boosting interest in compact and efficient packaging solutions. Machine vision systems, IoT sensors, and industrial robotics are finding in TSV and 2.5D the ideal balance between processing power and spatial efficiency. The trend toward chiplet-based architectures, supported by these technologies, is also unlocking design flexibility, allowing manufacturers to rapidly prototype and customize solutions for niche markets. As these diverse sectors continue to converge on more data-intensive and AI-enabled functionalities, the adoption curve for 3D TSV and 2.5D packaging is expected to steepen, reinforcing their role as key enablers of future innovation across industries.

What Are the Key Drivers Fueling Growth in the 3D TSV and 2.5D Market?

The growth in the 3D TSV and 2.5D market is driven by several factors directly tied to evolving semiconductor design needs, changing consumer technology demands, and advancements in manufacturing capabilities. One major driver is the urgent need to overcome the limitations of traditional planar scaling as transistor miniaturization approaches physical and economic limits. 3D TSV and 2.5D integration provide alternative pathways to performance enhancement without the need for smaller nodes, offering higher I/O density, improved signal transmission, and reduced power loss. Another key factor is the rise of AI and high-performance computing workloads, which necessitate extremely high memory bandwidth and low latency, achievable through HBM integration via TSVs. The increasing reliance on heterogeneous computing, where multiple specialized cores or chiplets are integrated within a single package, is also accelerating the shift toward these advanced packaging formats. Furthermore, the proliferation of mobile devices, AR/VR headsets, and smart wearables is driving the demand for compact and energy-efficient chips that 3D TSV and 2.5D can deliver. The automotive sector’s push toward electrification and autonomy is creating demand for compact, high-reliability, thermally efficient chips suitable for in-vehicle computation. Advancements in fabrication processes, such as fine-pitch TSV etching, wafer thinning, and thermal interface materials, are making high-volume manufacturing of these packages more feasible and cost-effective. Industry standards and design tools have also matured, reducing integration complexity and enabling faster development cycles. Additionally, geopolitical efforts to localize semiconductor supply chains are fueling investments in advanced packaging facilities as part of national strategic initiatives. Collaborative efforts between chip designers, OSATs (Outsourced Semiconductor Assembly and Test), and EDA (Electronic Design Automation) tool providers are streamlining the path from concept to commercial deployment. Finally, the convergence of 5G, edge computing, and AI at scale is creating a sustained demand for more intelligent and integrated hardware solutions, solidifying 3D TSV and 2.5D technologies as foundational components in the next wave of semiconductor innovation.

SCOPE OF STUDY:

The report analyzes the 3D TSV and 2.5D market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Packaging Type (3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging, Other Packaging Types); End-User (Consumer Electronics End-User , Automotive End-User, High Performance Computing & Networking End-User, Other End-Users)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 42 Featured) -

• Advanced Semiconductor Engineering (ASE)
• Amkor Technology
• Applied Materials
• Brewer Science
• Chipbond Technology Corp.
• Deca Technologies
• EV Group (EVG)
• Fraunhofer IZM
• GLOBALFOUNDRIES
• Huawei HiSilicon
• Intel Corporation
• Lam Research
• Samsung Electronics
• SK hynix
• SUSS MicroTec
• Taiwan Semiconductor Manufacturing Company (TSMC)
• Teledyne DALSA
• Texas Instruments
• Tokyo Electron Limited
• Xperi Inc. (includes Invensas)

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TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

• 1. MARKET OVERVIEW
  • Influencer Market Insights
  • World Market Trajectories
  • Tariff Impact on Global Supply Chain Patterns
  • 3D TSV and 2.5D - Global Key Competitors Percentage Market Share in 2025 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
• 2. FOCUS ON SELECT PLAYERS
• 3. MARKET TRENDS & DRIVERS
  • Surging Demand for Compact and High-Performance Chips Throws the Spotlight on 3D TSV and 2.5D Integration Technologies
  • Rising AI and HPC Workloads Propel Growth of Advanced Packaging Solutions Like 3D TSV and 2.5D ICs
  • Here's How Growing Complexity in Semiconductor Architectures Expands Addressable Market Opportunity for Heterogeneous Integration
  • Increased Data Bandwidth and Latency Requirements Drive Adoption of Through-Silicon Via (TSV) Solutions
  • Edge Computing and IoT Proliferation Strengthen the Business Case for Power-Efficient 2.5D Packaging Designs
  • Here's the Story: Data Centers and Cloud Providers Turning to 2.5D and 3D TSV to Meet Thermal and Density Challenges
  • Advancements in Interposer Technology Sustain Growth Momentum for 2.5D Integration in GPUs and Networking Chips
  • Cost vs. Performance Trade-Offs Propel Hybrid Approaches Combining 2.5D Packaging with 3D TSV Elements
  • Miniaturization Trends Across Mobile and Wearables Markets Drive Demand for High-Density 3D TSV Structures
  • Yield Improvement and Design Tool Advancements Mitigate Historical Challenges and Drive Broader Market Adoption
  • High-Speed Interconnect Needs in AI Accelerators and ASICs Spur Use of 2.5D Solutions with Integrated Silicon Interposers
• 4. GLOBAL MARKET PERSPECTIVE
  • TABLE 1: World 3D TSV and 2.5D Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
  • TABLE 2: World Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 3: World Historic Review for 3D TSV and 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 4: World 16-Year Perspective for 3D TSV and 2.5D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2025 & 2030
  • TABLE 5: World Recent Past, Current & Future Analysis for 3D Stacked Memory Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 6: World Historic Review for 3D Stacked Memory Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 7: World 16-Year Perspective for 3D Stacked Memory Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 8: World Recent Past, Current & Future Analysis for 5D Interposer Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 9: World Historic Review for 5D Interposer Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 10: World 16-Year Perspective for 5D Interposer Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 11: World Recent Past, Current & Future Analysis for CIS with TSV Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 12: World Historic Review for CIS with TSV Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 13: World 16-Year Perspective for CIS with TSV Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 14: World Recent Past, Current & Future Analysis for 3D SoC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 15: World Historic Review for 3D SoC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 16: World 16-Year Perspective for 3D SoC Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 17: World Recent Past, Current & Future Analysis for Other Packaging Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 18: World Historic Review for Other Packaging Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 19: World 16-Year Perspective for Other Packaging Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 20: World Recent Past, Current & Future Analysis for Consumer Electronics End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 21: World Historic Review for Consumer Electronics End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 22: World 16-Year Perspective for Consumer Electronics End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 23: World Recent Past, Current & Future Analysis for Automotive End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 24: World Historic Review for Automotive End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 25: World 16-Year Perspective for Automotive End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 26: World Recent Past, Current & Future Analysis for High Performance Computing & Networking End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 27: World Historic Review for High Performance Computing & Networking End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 28: World 16-Year Perspective for High Performance Computing & Networking End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 29: World Recent Past, Current & Future Analysis for Other End-Users by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 30: World Historic Review for Other End-Users by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 31: World 16-Year Perspective for Other End-Users by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030

III. MARKET ANALYSIS

• UNITED STATES
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
  • TABLE 32: USA Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 33: USA Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 34: USA 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 35: USA Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 36: USA Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 37: USA 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• CANADA
  • TABLE 38: Canada Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 39: Canada Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 40: Canada 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 41: Canada Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 42: Canada Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 43: Canada 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• JAPAN
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
  • TABLE 44: Japan Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 45: Japan Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 46: Japan 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 47: Japan Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 48: Japan Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 49: Japan 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• CHINA
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
  • TABLE 50: China Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 51: China Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 52: China 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 53: China Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 54: China Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 55: China 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• EUROPE
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
  • TABLE 56: Europe Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 57: Europe Historic Review for 3D TSV and 2.5D by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 58: Europe 16-Year Perspective for 3D TSV and 2.5D by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2014, 2025 & 2030
  • TABLE 59: Europe Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 60: Europe Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 61: Europe 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 62: Europe Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 63: Europe Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 64: Europe 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• FRANCE
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
  • TABLE 65: France Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 66: France Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 67: France 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 68: France Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 69: France Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 70: France 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• GERMANY
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
  • TABLE 71: Germany Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 72: Germany Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 73: Germany 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 74: Germany Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 75: Germany Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 76: Germany 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• ITALY
  • TABLE 77: Italy Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 78: Italy Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 79: Italy 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 80: Italy Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 81: Italy Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 82: Italy 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• UNITED KINGDOM
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
  • TABLE 83: UK Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 84: UK Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 85: UK 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 86: UK Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 87: UK Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 88: UK 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• SPAIN
  • TABLE 89: Spain Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 90: Spain Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 91: Spain 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 92: Spain Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 93: Spain Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 94: Spain 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• RUSSIA
  • TABLE 95: Russia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 96: Russia Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 97: Russia 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 98: Russia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 99: Russia Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 100: Russia 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• REST OF EUROPE
  • TABLE 101: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 102: Rest of Europe Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 103: Rest of Europe 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 104: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 105: Rest of Europe Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 106: Rest of Europe 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• ASIA-PACIFIC
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
  • TABLE 107: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 108: Asia-Pacific Historic Review for 3D TSV and 2.5D by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 109: Asia-Pacific 16-Year Perspective for 3D TSV and 2.5D by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2014, 2025 & 2030
  • TABLE 110: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 111: Asia-Pacific Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 112: Asia-Pacific 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 113: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 114: Asia-Pacific Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 115: Asia-Pacific 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• AUSTRALIA
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
  • TABLE 116: Australia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 117: Australia Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 118: Australia 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 119: Australia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 120: Australia Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 121: Australia 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• INDIA
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
  • TABLE 122: India Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 123: India Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 124: India 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 125: India Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 126: India Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 127: India 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• SOUTH KOREA
  • TABLE 128: South Korea Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 129: South Korea Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 130: South Korea 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 131: South Korea Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 132: South Korea Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 133: South Korea 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• REST OF ASIA-PACIFIC
  • TABLE 134: Rest of Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 135: Rest of Asia-Pacific Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 136: Rest of Asia-Pacific 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 137: Rest of Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 138: Rest of Asia-Pacific Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 139: Rest of Asia-Pacific 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• LATIN AMERICA
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
  • TABLE 140: Latin America Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 141: Latin America Historic Review for 3D TSV and 2.5D by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 142: Latin America 16-Year Perspective for 3D TSV and 2.5D by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2014, 2025 & 2030
  • TABLE 143: Latin America Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 144: Latin America Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 145: Latin America 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 146: Latin America Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 147: Latin America Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 148: Latin America 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• ARGENTINA
  • TABLE 149: Argentina Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 150: Argentina Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 151: Argentina 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 152: Argentina Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 153: Argentina Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 154: Argentina 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• BRAZIL
  • TABLE 155: Brazil Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 156: Brazil Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 157: Brazil 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 158: Brazil Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 159: Brazil Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 160: Brazil 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• MEXICO
  • TABLE 161: Mexico Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 162: Mexico Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 163: Mexico 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 164: Mexico Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 165: Mexico Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 166: Mexico 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• REST OF LATIN AMERICA
  • TABLE 167: Rest of Latin America Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 168: Rest of Latin America Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 169: Rest of Latin America 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 170: Rest of Latin America Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 171: Rest of Latin America Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 172: Rest of Latin America 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• MIDDLE EAST
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
  • TABLE 173: Middle East Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 174: Middle East Historic Review for 3D TSV and 2.5D by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 175: Middle East 16-Year Perspective for 3D TSV and 2.5D by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2014, 2025 & 2030
  • TABLE 176: Middle East Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 177: Middle East Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 178: Middle East 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 179: Middle East Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 180: Middle East Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 181: Middle East 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• IRAN
  • TABLE 182: Iran Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 183: Iran Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 184: Iran 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 185: Iran Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 186: Iran Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 187: Iran 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• ISRAEL
  • TABLE 188: Israel Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 189: Israel Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 190: Israel 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 191: Israel Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 192: Israel Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 193: Israel 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• SAUDI ARABIA
  • TABLE 194: Saudi Arabia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 195: Saudi Arabia Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 196: Saudi Arabia 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 197: Saudi Arabia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 198: Saudi Arabia Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 199: Saudi Arabia 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• UNITED ARAB EMIRATES
  • TABLE 200: UAE Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 201: UAE Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 202: UAE 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 203: UAE Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 204: UAE Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 205: UAE 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• REST OF MIDDLE EAST
  • TABLE 206: Rest of Middle East Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 207: Rest of Middle East Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 208: Rest of Middle East 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 209: Rest of Middle East Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 210: Rest of Middle East Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 211: Rest of Middle East 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• AFRICA
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
  • TABLE 212: Africa Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 213: Africa Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 214: Africa 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 215: Africa Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 216: Africa Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 217: Africa 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030

IV. COMPETITION