サンプル依頼リスト カート
  • English
  • Korean
  • Traditional Chinese
  • Simplified Chinese
デフォルト表紙
市場調査レポート
商品コード
1500789

3D IC市場：世界の産業分析、規模、シェア、成長、動向、2024～2033年予測

3D ICs Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2024-2033

出版日
ページ情報
英文 299 Pages
納期
2～5営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=144.06円
3D IC市場：世界の産業分析、規模、シェア、成長、動向、2024～2033年予測
出版日: 2024年06月14日
発行: Persistence Market Research
ページ情報: 英文 299 Pages
納期: 2～5営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 目次
概要

Persistence Market Researchはこのほど、3D ICの世界市場に関する包括的なレポートを発表しました。本レポートでは、市場促進要因・動向・機会・課題など、重要な市場力学を徹底的に評価し、市場構造に関する詳細な洞察を提供しています。

主要洞察

  • 3D ICの市場規模（2024年）：14億米ドル
  • 予測市場規模（2033年）：31億米ドル
  • 世界市場成長率（CAGR 2024～2033）：9.2%

3D IC市場-調査範囲：

3D IC（3次元集積回路）は、半導体技術の大きな進歩であり、シリコンウエハーまたはダイの積層と垂直統合を可能にします。このアプローチにより、性能が向上し、消費電力が削減され、電子機器の設置面積が縮小されます。3D IC市場は、コンシューマー・エレクトロニクス、自動車、医療、通信など幅広い用途に対応しています。主要製品セグメントには、メモリー、ロジック、MEMSデバイスなどがあり、これらは現代の電子システムに不可欠なものです。

市場促進要因：

世界の3D IC市場は、高性能コンピューティングデバイスに対する需要の高まり、電子部品の小型化、エネルギー効率の高いシステムに対するニーズの高まりなど、いくつかの重要な要因によって牽引されています。IoTデバイスの普及と5G技術の登場が、市場の成長をさらに後押ししています。スルーシリコンビア（TSV）技術などの製造技術の進歩は、3D ICの性能と集積能力を高め、さまざまな産業での採用を促進しています。

市場抑制要因：

有望な成長展望にもかかわらず、3D IC市場は、製造コストの高さ、複雑な設計とテストプロセス、熱管理の問題に関連する課題に直面しています。高度な製造設備への多額の設備投資が必要なため、中小企業にとっては参入障壁となっています。さらに、信頼性の高い相互接続を確保し、高密度に集積された回路の放熱を管理するという技術的課題は、3D ICの拡大性と性能に影響を与える可能性があります。

市場機会：

3D IC市場は、技術革新、半導体研究開発への投資の増加、人工知能、自律走行車、高度医療機器などの新興セグメントにおける3D ICの用途拡大により、大きな成長機会をもたらしています。技術的課題を克服し、3D ICの商業化を加速するには、半導体メーカー、装置サプライヤー、エンドユーザー間の協力が不可欠です。さらに、先端材料の統合とハイブリッド接合技術の開拓は、市場成長の新たな道を開くと期待されます。

本レポートで扱う主要質問

  • 3D IC市場の世界の成長を促す主要要因は何か？
  • 異なる業界別で3D ICの採用を促進している製品タイプとアプリケーションは何か？
  • 技術の進歩は3D IC市場の競合情勢をどのように変えているのか？
  • 3D IC市場に貢献している主要参入企業は誰で、市場の関連性を維持するためにどのような戦略を採用しているのか？
  • 世界の3D IC市場の新たな動向と将来性は？

目次

第1章 エグゼクティブ概要

第2章 市場概要

  • 市場範囲/ 分類
  • 市場の定義/ 範囲/ 制限

第3章 市場背景

  • 市場力学
  • シナリオ予測
  • 機会マップ分析
  • 投資実現可能性マトリックス
  • PESTLEとポーター分析
  • 規制状況
  • 地域親市場展望

第4章 世界の3D IC市場分析

  • 過去の市場規模・金額（10億米ドル）分析、2019～2023年
  • 現在と将来の市場規模・金額（10億米ドル）予測、2024～2033年
    • 前年比成長動向分析
    • 絶対金額機会分析

第5章 世界の3D IC市場分析：基質別

  • イントロダクション/主要調査結果
  • 市場規模・金額（10億米ドル）の過去の分析、基質別、2019～2023年
  • 現在の市場規模・金額（10億米ドル）の分析と予測、基質別、2024～2033年
    • シリコンオンインシュレータ（SOI）
    • バルクシリコン
  • 基質別前年比成長動向分析、2019～2023年
  • 基質別絶対金額機会分析、2024～2033年

第6章 世界の3D IC市場分析：3D技術別

  • イントロダクション/主要調査結果
  • 市場規模・金額（10億米ドル）の過去の分析、3D技術別、2019～2023年
  • 現在の市場規模・金額（10億米ドル）の分析と予測、3D技術別、2024～2033年
    • ウエハーレベルパッケージング
    • システムインテグレーション
  • 3D技術別前年比成長動向分析、2019～2023年
  • 3D技術別絶対金額機会分析、2024～2033年

第7章 世界3D IC市場分析：用途別

  • イントロダクション/主要調査結果
  • 市場規模・金額（10億米ドル）の過去の分析、用途別、2019～2023年
  • 現在の市場規模・金額（10億米ドル）の分析と予測、用途別、2024～2033年
    • 家電
    • ICT/通信
    • 軍事
    • 自動車
    • バイオメディカル
    • その他
  • 用途別前年比成長動向分析、2019～2023年
  • 用途別絶対金額機会分析、2024～2033年

第8章 世界の3D IC市場分析：コンポーネント別

  • イントロダクション/主要調査結果
  • 市場規模・金額（10億米ドル）の過去の分析、コンポーネント別、2019～2023年
  • 現在の市場規模・金額（10億米ドル）の分析と予測、コンポーネント別、2024～2033年
    • シリコン貫通ビア
    • ガラス貫通ビア
    • シリコンインターポーザ
    • その他
  • コンポーネント別前年比成長動向分析、2019～2023年
  • コンポーネント別絶対金額機会分析、2024～2033年

第9章 世界の3D IC市場分析：製品別

  • イントロダクション/主要調査結果
  • 市場規模・金額（10億米ドル）の過去の分析、製品別、2019～2023年
  • 現在の市場規模・金額（10億米ドル）の分析と予測、製品別、2024～2033年
    • センサー
    • メモリ
    • ロジック
    • 発光ダイオード（LED）
    • 微小電気機械システム（MEMS）
  • 製品別前年比成長動向分析、2019～2023年
  • 製品別絶対的金額機会分析、2024～2033年

第10章 世界の3D IC市場分析：地域別

  • イントロダクション
  • 市場規模・金額（10億米ドル）の過去の分析、地域別、2019～2023年
  • 現在の市場規模・金額（10億米ドル）の分析と予測、地域別、2024～2033年
    • 北米
    • ラテンアメリカ
    • 欧州
    • アジア太平洋
    • 中東・アフリカ
  • 地域別市場の魅力分析

第11章 北米の3D IC市場分析：国別

第12章 ラテンアメリカの3D IC市場分析：国別

第13章 欧州の3D IC市場分析：国別

第14章 アジア太平洋の3D IC市場分析：国別

第15章 中東・アフリカの3D IC市場分析：国別

第16章 主要国の3D IC市場分析

  • 米国
  • カナダ
  • ブラジル
  • メキシコ
  • ドイツ
  • 英国
  • フランス
  • スペイン
  • イタリア
  • 中国
  • 日本
  • 韓国
  • マレーシア
  • シンガポール
  • オーストラリア
  • ニュージーランド
  • GCC諸国
  • 南アフリカ
  • イスラエル

第17章 市場構造分析

  • 競合ダッシュボード
  • 競合ベンチマーク
  • 主要企業の市場シェア分析

第18章 競合分析

  • 競合の詳細
    • 3M Company
    • Advanced Semiconductor Engineering
    • Micron Technology
    • ST Microelectronics
    • STATS ChipPAC
    • Taiwan Semiconductor Manufacturing
    • Samsung Electronics
    • IBM
    • STMicroelectronics
    • Xilinx
    • Taiwan Semiconductor Manufacturing Company, Ltd

第19章 使用される仮定と頭字語

第20章 調査手法

目次
Product Code: PMRREP33436

Persistence Market Research has recently released a comprehensive report on the worldwide market for 3D ICs. The report offers a thorough assessment of crucial market dynamics, including drivers, trends, opportunities, and challenges, providing detailed insights into the market structure.

Key Insights:

  • 3D ICs Market Size (2024E): USD 1.4 Billion
  • Projected Market Value (2033F): USD 3.1 Billion
  • Global Market Growth Rate (CAGR 2024 to 2033): 9.2%

3D ICs Market - Report Scope:

3D ICs, or three-dimensional integrated circuits, represent a major advancement in semiconductor technology, enabling the stacking of silicon wafers or dies and their vertical integration. This approach enhances performance, reduces power consumption, and shrinks the footprint of electronic devices. The 3D ICs market serves a wide range of applications, including consumer electronics, automotive, healthcare, and telecommunications. Key product segments include memory, logic, and MEMS devices, which are integral to modern electronic systems.

Market Growth Drivers:

The global 3D ICs market is driven by several key factors, including the escalating demand for high-performance computing devices, miniaturization of electronic components, and the growing need for energy-efficient systems. The proliferation of IoT devices and the advent of 5G technology are further propelling market growth. Advances in manufacturing techniques, such as through-silicon via (TSV) technology, enhance the performance and integration capabilities of 3D ICs, fostering their adoption across various industries.

Market Restraints:

Despite promising growth prospects, the 3D ICs market faces challenges related to high manufacturing costs, complex design and testing processes, and thermal management issues. The need for significant capital investment in advanced fabrication facilities poses barriers to entry for smaller players. Additionally, technical challenges in ensuring reliable interconnects and managing heat dissipation in densely packed circuits can affect the scalability and performance of 3D ICs.

Market Opportunities:

The 3D ICs market presents significant growth opportunities driven by technological innovations, increasing investments in semiconductor R&D, and the expanding applications of 3D ICs in emerging fields such as artificial intelligence, autonomous vehicles, and advanced medical devices. Collaboration between semiconductor manufacturers, equipment suppliers, and end-users is crucial to overcoming technical challenges and accelerating the commercialization of 3D ICs. Furthermore, the integration of advanced materials and the development of hybrid bonding techniques are expected to open new avenues for market growth.

Key Questions Answered in the Report:

  • What are the primary factors driving the growth of the 3D ICs market globally?
  • Which product types and applications are driving 3D IC adoption across different industry verticals?
  • How are technological advancements reshaping the competitive landscape of the 3D ICs market?
  • Who are the key players contributing to the 3D ICs market, and what strategies are they employing to maintain market relevance?
  • What are the emerging trends and future prospects in the global 3D ICs market?

Competitive Intelligence and Business Strategy:

Leading players in the global 3D ICs market, including Intel Corporation, Samsung Electronics Co., Ltd., and TSMC, focus on innovation, product differentiation, and strategic partnerships to gain a competitive edge. These companies invest in R&D to develop advanced 3D IC solutions, leveraging TSV and other cutting-edge technologies to meet the demands of high-performance applications. Collaborations with system integrators, OEMs, and research institutions facilitate market access and promote technology adoption. Moreover, emphasis on improving manufacturing yield, cost efficiency, and thermal management is essential to sustaining market leadership in the dynamic 3D IC landscape.

Key Companies Profiled:

  • Mediatek
  • 3M Company
  • Advanced Semiconductor Engineering
  • Micron Technology
  • STATS ChipPAC
  • Taiwan Semiconductor Manufacturing
  • Samsung Electronics
  • IBM
  • STMicroelectronics
  • Xilinx
  • Taiwan Semiconductor Manufacturing Company Ltd

3D ICs Market Outlook by Category

By Substrate:

  • Silicon on Insulator (SOI)
  • Bulk Silicon

By 3D Technology:

  • Wafer Level Packaging
  • System Integration

By Application:

  • Consumer Electronics
  • ICT/Telecommunication
  • Military
  • Automotive
  • Biomedical
  • Others

By Component:

  • Through Silicon Vias
  • Through Glass Vias
  • Silicon Interposer
  • Others

By Product:

  • Sensors
  • Memories
  • Logics
  • Light Emitting Diodes (LED)
  • Micro Electro Mechanical Systems (MEMS)

By Region:

  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East and Africa

Table of Contents

1. Executive Summary

  • 1.1. Global Market Outlook
  • 1.2. Demand-side Trends
  • 1.3. Supply-side Trends
  • 1.4. Technology Roadmap Analysis
  • 1.5. Analysis and Recommendations

2. Market Overview

  • 2.1. Market Coverage / Taxonomy
  • 2.2. Market Definition / Scope / Limitations

3. Market Background

  • 3.1. Market Dynamics
    • 3.1.1. Drivers
    • 3.1.2. Restraints
    • 3.1.3. Opportunity
    • 3.1.4. Trends
  • 3.2. Scenario Forecast
    • 3.2.1. Demand in Optimistic Scenario
    • 3.2.2. Demand in Likely Scenario
    • 3.2.3. Demand in Conservative Scenario
  • 3.3. Opportunity Map Analysis
  • 3.4. Investment Feasibility Matrix
  • 3.5. PESTLE and Porter's Analysis
  • 3.6. Regulatory Landscape
    • 3.6.1. By Key Regions
    • 3.6.2. By Key Countries
  • 3.7. Regional Parent Market Outlook

4. Global 3D Ics Market Analysis 2019-2023 and Forecast, 2024-2033

  • 4.1. Historical Market Size Value (US$ Bn) Analysis, 2019-2023
  • 4.2. Current and Future Market Size Value (US$ Bn) Projections, 2024-2033
    • 4.2.1. Y-o-Y Growth Trend Analysis
    • 4.2.2. Absolute $ Opportunity Analysis

5. Global 3D Ics Market Analysis 2019-2023 and Forecast 2024-2033, By Substrate

  • 5.1. Introduction / Key Findings
  • 5.2. Historical Market Size Value (US$ Bn) Analysis By Substrate, 2019-2023
  • 5.3. Current and Future Market Size Value (US$ Bn) Analysis and Forecast By Substrate, 2024-2033
    • 5.3.1. Silicon on Insulator (SOI)
    • 5.3.2. Bulk Silicon
  • 5.4. Y-o-Y Growth Trend Analysis By Substrate, 2019-2023
  • 5.5. Absolute $ Opportunity Analysis By Substrate, 2024-2033

6. Global 3D Ics Market Analysis 2019-2023 and Forecast 2024-2033, By 3D Technology

  • 6.1. Introduction / Key Findings
  • 6.2. Historical Market Size Value (US$ Bn) Analysis By 3D Technology, 2019-2023
  • 6.3. Current and Future Market Size Value (US$ Bn) Analysis and Forecast By 3D Technology, 2024-2033
    • 6.3.1. Wafer Level Packaging
    • 6.3.2. System Integration
  • 6.4. Y-o-Y Growth Trend Analysis By 3D Technology, 2019-2023
  • 6.5. Absolute $ Opportunity Analysis By 3D Technology, 2024-2033

7. Global 3D Ics Market Analysis 2019-2023 and Forecast 2024-2033, By Application

  • 7.1. Introduction / Key Findings
  • 7.2. Historical Market Size Value (US$ Bn) Analysis By Application, 2019-2023
  • 7.3. Current and Future Market Size Value (US$ Bn) Analysis and Forecast By Application, 2024-2033
    • 7.3.1. Consumer Electronics
    • 7.3.2. ICT/ Telecommunication
    • 7.3.3. Military
    • 7.3.4. Automotive
    • 7.3.5. Biomedical
    • 7.3.6. Others
  • 7.4. Y-o-Y Growth Trend Analysis By Application, 2019-2023
  • 7.5. Absolute $ Opportunity Analysis By Application, 2024-2033

8. Global 3D Ics Market Analysis 2019-2023 and Forecast 2024-2033, By Component

  • 8.1. Introduction / Key Findings
  • 8.2. Historical Market Size Value (US$ Bn) Analysis By Component, 2019-2023
  • 8.3. Current and Future Market Size Value (US$ Bn) Analysis and Forecast By Component, 2024-2033
    • 8.3.1. Through Silicon Vias
    • 8.3.2. Through Glass Vias
    • 8.3.3. Silicon Interposer
    • 8.3.4. Others
  • 8.4. Y-o-Y Growth Trend Analysis By Component, 2019-2023
  • 8.5. Absolute $ Opportunity Analysis By Component, 2024-2033

9. Global 3D Ics Market Analysis 2019-2023 and Forecast 2024-2033, By Product

  • 9.1. Introduction / Key Findings
  • 9.2. Historical Market Size Value (US$ Bn) Analysis By Product, 2019-2023
  • 9.3. Current and Future Market Size Value (US$ Bn) Analysis and Forecast By Product, 2024-2033
    • 9.3.1. Sensors
    • 9.3.2. Memories
    • 9.3.3. Logics
    • 9.3.4. Light Emitting Diodes (LED)
    • 9.3.5. Micro electro mechanical systems (MEMS)
  • 9.4. Y-o-Y Growth Trend Analysis By Product, 2019-2023
  • 9.5. Absolute $ Opportunity Analysis By Product, 2024-2033

10. Global 3D Ics Market Analysis 2019-2023 and Forecast 2024-2033, By Region

  • 10.1. Introduction
  • 10.2. Historical Market Size Value (US$ Bn) Analysis By Region, 2019-2023
  • 10.3. Current Market Size Value (US$ Bn) Analysis and Forecast By Region, 2024-2033
    • 10.3.1. North America
    • 10.3.2. Latin America
    • 10.3.3. Europe
    • 10.3.4. Asia Pacific
    • 10.3.5. MEA
  • 10.4. Market Attractiveness Analysis By Region

11. North America 3D Ics Market Analysis 2019-2023 and Forecast 2024-2033, By Country

  • 11.1. Historical Market Size Value (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2023
  • 11.2. Market Size Value (US$ Bn) Forecast By Market Taxonomy, 2024-2033
    • 11.2.1. By Country
      • 11.2.1.1. U.S.
      • 11.2.1.2. Canada
    • 11.2.2. By Substrate
    • 11.2.3. By 3D Technology
    • 11.2.4. By Application
    • 11.2.5. By Component
    • 11.2.6. By Product
  • 11.3. Market Attractiveness Analysis
    • 11.3.1. By Country
    • 11.3.2. By Substrate
    • 11.3.3. By 3D Technology
    • 11.3.4. By Application
    • 11.3.5. By Component
    • 11.3.6. By Product
  • 11.4. Key Takeaways

12. Latin America 3D Ics Market Analysis 2019-2023 and Forecast 2024-2033, By Country

  • 12.1. Historical Market Size Value (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2023
  • 12.2. Market Size Value (US$ Bn) Forecast By Market Taxonomy, 2024-2033
    • 12.2.1. By Country
      • 12.2.1.1. Brazil
      • 12.2.1.2. Mexico
      • 12.2.1.3. Rest of Latin America
    • 12.2.2. By Substrate
    • 12.2.3. By 3D Technology
    • 12.2.4. By Application
    • 12.2.5. By Component
    • 12.2.6. By Product
  • 12.3. Market Attractiveness Analysis
    • 12.3.1. By Country
    • 12.3.2. By Substrate
    • 12.3.3. By 3D Technology
    • 12.3.4. By Application
    • 12.3.5. By Component
    • 12.3.6. By Product
  • 12.4. Key Takeaways

13. Europe 3D Ics Market Analysis 2019-2023 and Forecast 2024-2033, By Country

  • 13.1. Historical Market Size Value (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2023
  • 13.2. Market Size Value (US$ Bn) Forecast By Market Taxonomy, 2024-2033
    • 13.2.1. By Country
      • 13.2.1.1. Germany
      • 13.2.1.2. U.K.
      • 13.2.1.3. France
      • 13.2.1.4. Spain
      • 13.2.1.5. Italy
      • 13.2.1.6. Rest of Europe
    • 13.2.2. By Substrate
    • 13.2.3. By 3D Technology
    • 13.2.4. By Application
    • 13.2.5. By Component
    • 13.2.6. By Product
  • 13.3. Market Attractiveness Analysis
    • 13.3.1. By Country
    • 13.3.2. By Substrate
    • 13.3.3. By 3D Technology
    • 13.3.4. By Application
    • 13.3.5. By Component
    • 13.3.6. By Product
  • 13.4. Key Takeaways

14. Asia Pacific 3D Ics Market Analysis 2019-2023 and Forecast 2024-2033, By Country

  • 14.1. Historical Market Size Value (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2023
  • 14.2. Market Size Value (US$ Bn) Forecast By Market Taxonomy, 2024-2033
    • 14.2.1. By Country
      • 14.2.1.1. China
      • 14.2.1.2. Japan
      • 14.2.1.3. South Korea
      • 14.2.1.4. India
      • 14.2.1.5. Malaysia
      • 14.2.1.6. Singapore
      • 14.2.1.7. Australia
      • 14.2.1.8. New Zealand
      • 14.2.1.9. Rest of APAC
    • 14.2.2. By Substrate
    • 14.2.3. By 3D Technology
    • 14.2.4. By Application
    • 14.2.5. By Component
    • 14.2.6. By Product
  • 14.3. Market Attractiveness Analysis
    • 14.3.1. By Country
    • 14.3.2. By Substrate
    • 14.3.3. By 3D Technology
    • 14.3.4. By Application
    • 14.3.5. By Component
    • 14.3.6. By Product
  • 14.4. Key Takeaways

15. MEA 3D Ics Market Analysis 2019-2023 and Forecast 2024-2033, By Country

  • 15.1. Historical Market Size Value (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2023
  • 15.2. Market Size Value (US$ Bn) Forecast By Market Taxonomy, 2024-2033
    • 15.2.1. By Country
      • 15.2.1.1. GCC Countries
      • 15.2.1.2. South Africa
      • 15.2.1.3. Israel
      • 15.2.1.4. Rest of MEA
    • 15.2.2. By Substrate
    • 15.2.3. By 3D Technology
    • 15.2.4. By Application
    • 15.2.5. By Component
    • 15.2.6. By Product
  • 15.3. Market Attractiveness Analysis
    • 15.3.1. By Country
    • 15.3.2. By Substrate
    • 15.3.3. By 3D Technology
    • 15.3.4. By Application
    • 15.3.5. By Component
    • 15.3.6. By Product
  • 15.4. Key Takeaways

16. Key Countries 3D Ics Market Analysis

  • 16.1. U.S.
    • 16.1.1. Pricing Analysis
    • 16.1.2. Market Share Analysis, 2024
      • 16.1.2.1. By Substrate
      • 16.1.2.2. By 3D Technology
      • 16.1.2.3. By Application
      • 16.1.2.4. By Component
      • 16.1.2.5. By Product
  • 16.2. Canada
    • 16.2.1. Pricing Analysis
    • 16.2.2. Market Share Analysis, 2024
      • 16.2.2.1. By Substrate
      • 16.2.2.2. By 3D Technology
      • 16.2.2.3. By Application
      • 16.2.2.4. By Component
      • 16.2.2.5. By Product
  • 16.3. Brazil
    • 16.3.1. Pricing Analysis
    • 16.3.2. Market Share Analysis, 2024
      • 16.3.2.1. By Substrate
      • 16.3.2.2. By 3D Technology
      • 16.3.2.3. By Application
      • 16.3.2.4. By Component
      • 16.3.2.5. By Product
  • 16.4. Mexico
    • 16.4.1. Pricing Analysis
    • 16.4.2. Market Share Analysis, 2024
      • 16.4.2.1. By Substrate
      • 16.4.2.2. By 3D Technology
      • 16.4.2.3. By Application
      • 16.4.2.4. By Component
      • 16.4.2.5. By Product
  • 16.5. Germany
    • 16.5.1. Pricing Analysis
    • 16.5.2. Market Share Analysis, 2024
      • 16.5.2.1. By Substrate
      • 16.5.2.2. By 3D Technology
      • 16.5.2.3. By Application
      • 16.5.2.4. By Component
      • 16.5.2.5. By Product
  • 16.6. U.K.
    • 16.6.1. Pricing Analysis
    • 16.6.2. Market Share Analysis, 2024
      • 16.6.2.1. By Substrate
      • 16.6.2.2. By 3D Technology
      • 16.6.2.3. By Application
      • 16.6.2.4. By Component
      • 16.6.2.5. By Product
  • 16.7. France
    • 16.7.1. Pricing Analysis
    • 16.7.2. Market Share Analysis, 2024
      • 16.7.2.1. By Substrate
      • 16.7.2.2. By 3D Technology
      • 16.7.2.3. By Application
      • 16.7.2.4. By Component
      • 16.7.2.5. By Product
  • 16.8. Spain
    • 16.8.1. Pricing Analysis
    • 16.8.2. Market Share Analysis, 2024
      • 16.8.2.1. By Substrate
      • 16.8.2.2. By 3D Technology
      • 16.8.2.3. By Application
      • 16.8.2.4. By Component
      • 16.8.2.5. By Product
  • 16.9. Italy
    • 16.9.1. Pricing Analysis
    • 16.9.2. Market Share Analysis, 2024
      • 16.9.2.1. By Substrate
      • 16.9.2.2. By 3D Technology
      • 16.9.2.3. By Application
      • 16.9.2.4. By Component
      • 16.9.2.5. By Product
  • 16.10. China
    • 16.10.1. Pricing Analysis
    • 16.10.2. Market Share Analysis, 2024
      • 16.10.2.1. By Substrate
      • 16.10.2.2. By 3D Technology
      • 16.10.2.3. By Application
      • 16.10.2.4. By Component
      • 16.10.2.5. By Product
  • 16.11. Japan
    • 16.11.1. Pricing Analysis
    • 16.11.2. Market Share Analysis, 2024
      • 16.11.2.1. By Substrate
      • 16.11.2.2. By 3D Technology
      • 16.11.2.3. By Application
      • 16.11.2.4. By Component
      • 16.11.2.5. By Product
  • 16.12. South Korea
    • 16.12.1. Pricing Analysis
    • 16.12.2. Market Share Analysis, 2024
      • 16.12.2.1. By Substrate
      • 16.12.2.2. By 3D Technology
      • 16.12.2.3. By Application
      • 16.12.2.4. By Component
      • 16.12.2.5. By Product
  • 16.13. Malaysia
    • 16.13.1. Pricing Analysis
    • 16.13.2. Market Share Analysis, 2024
      • 16.13.2.1. By Substrate
      • 16.13.2.2. By 3D Technology
      • 16.13.2.3. By Application
      • 16.13.2.4. By Component
      • 16.13.2.5. By Product
  • 16.14. Singapore
    • 16.14.1. Pricing Analysis
    • 16.14.2. Market Share Analysis, 2024
      • 16.14.2.1. By Substrate
      • 16.14.2.2. By 3D Technology
      • 16.14.2.3. By Application
      • 16.14.2.4. By Component
      • 16.14.2.5. By Product
  • 16.15. Australia
    • 16.15.1. Pricing Analysis
    • 16.15.2. Market Share Analysis, 2024
      • 16.15.2.1. By Substrate
      • 16.15.2.2. By 3D Technology
      • 16.15.2.3. By Application
      • 16.15.2.4. By Component
      • 16.15.2.5. By Product
  • 16.16. New Zealand
    • 16.16.1. Pricing Analysis
    • 16.16.2. Market Share Analysis, 2024
      • 16.16.2.1. By Substrate
      • 16.16.2.2. By 3D Technology
      • 16.16.2.3. By Application
      • 16.16.2.4. By Component
      • 16.16.2.5. By Product
  • 16.17. GCC Countries
    • 16.17.1. Pricing Analysis
    • 16.17.2. Market Share Analysis, 2024
      • 16.17.2.1. By Substrate
      • 16.17.2.2. By 3D Technology
      • 16.17.2.3. By Application
      • 16.17.2.4. By Component
      • 16.17.2.5. By Product
  • 16.18. South Africa
    • 16.18.1. Pricing Analysis
    • 16.18.2. Market Share Analysis, 2024
      • 16.18.2.1. By Substrate
      • 16.18.2.2. By 3D Technology
      • 16.18.2.3. By Application
      • 16.18.2.4. By Component
      • 16.18.2.5. By Product
  • 16.19. Israel
    • 16.19.1. Pricing Analysis
    • 16.19.2. Market Share Analysis, 2024
      • 16.19.2.1. By Substrate
      • 16.19.2.2. By 3D Technology
      • 16.19.2.3. By Application
      • 16.19.2.4. By Component
      • 16.19.2.5. By Product

17. Market Structure Analysis

  • 17.1. Competition Dashboard
  • 17.2. Competition Benchmarking
  • 17.3. Market Share Analysis of Top Players
    • 17.3.1. By Regional
    • 17.3.2. By Substrate
    • 17.3.3. By 3D Technology
    • 17.3.4. By Application
    • 17.3.5. By Component
    • 17.3.6. By Product

18. Competition Analysis

  • 18.1. Competition Deep Dive
    • 18.1.1. 3M Company
      • 18.1.1.1. Overview
      • 18.1.1.2. Product Portfolio
      • 18.1.1.3. Profitability by Market Segments
      • 18.1.1.4. Sales Footprint
        • 18.1.1.4.1. Marketing Strategy
    • 18.1.2. Advanced Semiconductor Engineering
      • 18.1.2.1. Overview
      • 18.1.2.2. Product Portfolio
      • 18.1.2.3. Profitability by Market Segments
      • 18.1.2.4. Sales Footprint
        • 18.1.2.4.1. Marketing Strategy
    • 18.1.3. Micron Technology
      • 18.1.3.1. Overview
      • 18.1.3.2. Product Portfolio
      • 18.1.3.3. Profitability by Market Segments
      • 18.1.3.4. Sales Footprint
        • 18.1.3.4.1. Marketing Strategy
    • 18.1.4. ST Microelectronics
      • 18.1.4.1. Overview
      • 18.1.4.2. Product Portfolio
      • 18.1.4.3. Profitability by Market Segments
      • 18.1.4.4. Sales Footprint
        • 18.1.4.4.1. Marketing Strategy
    • 18.1.5. STATS ChipPAC
      • 18.1.5.1. Overview
      • 18.1.5.2. Product Portfolio
      • 18.1.5.3. Profitability by Market Segments
      • 18.1.5.4. Sales Footprint
        • 18.1.5.4.1. Marketing Strategy
    • 18.1.6. Taiwan Semiconductor Manufacturing
      • 18.1.6.1. Overview
      • 18.1.6.2. Product Portfolio
      • 18.1.6.3. Profitability by Market Segments
      • 18.1.6.4. Sales Footprint
        • 18.1.6.4.1. Marketing Strategy
    • 18.1.7. Samsung Electronics
      • 18.1.7.1. Overview
      • 18.1.7.2. Product Portfolio
      • 18.1.7.3. Profitability by Market Segments
      • 18.1.7.4. Sales Footprint
        • 18.1.7.4.1. Marketing Strategy
    • 18.1.8. IBM
      • 18.1.8.1. Overview
      • 18.1.8.2. Product Portfolio
      • 18.1.8.3. Profitability by Market Segments
      • 18.1.8.4. Sales Footprint
        • 18.1.8.4.1. Marketing Strategy
    • 18.1.9. STMicroelectronics
      • 18.1.9.1. Overview
      • 18.1.9.2. Product Portfolio
      • 18.1.9.3. Profitability by Market Segments
      • 18.1.9.4. Sales Footprint
        • 18.1.9.4.1. Marketing Strategy
    • 18.1.10. Xilinx
      • 18.1.10.1. Overview
      • 18.1.10.2. Product Portfolio
      • 18.1.10.3. Profitability by Market Segments
      • 18.1.10.4. Sales Footprint
        • 18.1.10.4.1. Marketing Strategy
    • 18.1.11. Taiwan Semiconductor Manufacturing Company, Ltd
      • 18.1.11.1. Overview
      • 18.1.11.2. Product Portfolio
      • 18.1.11.3. Profitability by Market Segments
      • 18.1.11.4. Sales Footprint
        • 18.1.11.4.1. Marketing Strategy

19. Assumptions & Acronyms Used

20. Research Methodology