サンプル依頼リスト カート
  • English
  • Traditional Chinese
  • Simplified Chinese
デフォルト表紙
市場調査レポート
商品コード
1707064

三次元（3D）集積回路（IC）の世界市場レポート 2025年

Three Dimensional (3D) Integrated Circuits (IC) Global Market Report 2025

出版日
ページ情報
英文 200 Pages
納期
2～10営業日
カスタマイズ可能
適宜更新あり
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=144.06円
三次元（3D）集積回路（IC）の世界市場レポート 2025年
出版日: 2025年04月01日
発行: The Business Research Company
ページ情報: 英文 200 Pages
納期: 2～10営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 目次
概要

三次元（3D）集積回路（IC）市場規模は、今後数年で急成長が見込まれます。2029年の年間平均成長率（CAGR）は15.7％で、258億3,000万米ドルに成長します。予測期間の成長は、スマートデバイスや高度な統合に対する需要の急増、研究開発活動への投資の増加、サーバーやデータハブ、軍事・航空宇宙分野などの分野における3D ICのニーズの増加、半導体産業に対するニーズの高まり、IoTやAI技術の拡大などに起因すると考えられます。予測期間の主な動向には、デバイスの小型化に対する絶え間ないニーズ、先進パッケージング技術の使用、デバイスの異種集積化、持続可能性とエネルギー効率の重視、特定用途向けの3D ICソリューションのカスタマイズ、性能と効率向上のための新材料の開発、コスト削減のための製造プロセスの強化などがあります。

拡大する半導体産業が3次元（3D）集積回路（IC）市場の成長を牽引すると予想されます。半導体産業には、半導体デバイスの設計、製造、販売に携わる企業が含まれ、コンピュータ、スマートフォン、産業機械など、さまざまな電子製品に欠かせない部品となっています。この業界は、スマートフォン、タブレット、ウェアラブルデバイスを含むコンシューマーエレクトロニクスの普及が進んでいるため大幅な成長を遂げており、これが先端半導体部品の需要を押し上げています。さらに、5Gネットワークの展開により、通信の強化、データ転送の高速化、接続性の向上のための新しい半導体技術が必要となります。3D ICは、性能の向上、電力効率の改善、スペースの最適化、効果的な熱管理など、半導体アプリケーションに数多くの利点を提供します。例えば、2024年7月、米国の半導体業界を代表する業界団体である半導体産業協会（SIA）は、2024年5月の世界の半導体業界の売上高が491億米ドルに達し、2023年5月の412億米ドルと比べて19.3％増加し、2024年4月の472億米ドルと比べて4.1％増加したと報告しました。このように、半導体に対するニーズの高まりが3D IC市場の拡大を後押ししています。

三次元（3D）集積回路（IC）市場の主要企業は、5G無線周波数性能など特定のアプリケーションや顧客要件に合わせたカスタム3D ICの開発に注力し、競争力を高め、市場の的確な要求に応え、専門的なソリューションを通じてより高い収益を上げることを目指しています。3D IC技術は、複数の高速コンポーネントを1つのパッケージに統合することで5Gを強化し、性能を向上させ、待ち時間を短縮し、よりコンパクトで効率的なネットワークインフラやデバイスを実現します。例えば、2024年5月、台湾を拠点とする多国籍企業で半導体企業のUnited Microelectronics Corporationは、業界初のRFSOI（Radio Frequency Silicon on Insulator）技術向け3D ICソリューションを発表し、5G時代における重要な進展を示しました。UMCの55nm RFSOIプラットフォームで利用可能なこの先駆的技術は、回路面積を45%以上削減し、5Gデバイスにより多くのRFコンポーネントを統合することを可能にします。この革新的な3D ICソリューションは、無線周波数（RF）干渉の課題に対処し、5Gミリ波（mmWave）技術の将来の開発に道を開きます。

目次

第1章 エグゼクティブサマリー

第2章 市場の特徴

第3章 市場動向と戦略

第4章 市場- 金利、インフレ、地政学、新型コロナウイルス感染症、そして景気回復が市場に与える影響を含むマクロ経済シナリオ

第5章 世界の成長分析と戦略分析フレームワーク

  • 世界三次元（3D）集積回路（IC） PESTEL分析（政治、社会、技術、環境、法的要因、促進要因と抑制要因）
  • 最終用途産業の分析
  • 世界の三次元（3D）集積回路（IC）市場：成長率分析
  • 世界の三次元（3D）集積回路（IC）市場の実績：規模と成長, 2019-2024
  • 世界の三次元（3D）集積回路（IC）市場の予測：規模と成長, 2024-2029, 2034F
  • 世界三次元（3D）集積回路（IC）総アドレス可能市場（TAM）

第6章 市場セグメンテーション

  • 世界の三次元（3D）集積回路（IC）市場：コンポーネント別、実績と予測, 2019-2024, 2024-2029F, 2034F
  • ガラス貫通ビア（TGV）
  • シリコン貫通ビア（TSV）
  • その他のコンポーネント
  • 世界の三次元（3D）集積回路（IC）市場：技術別、実績と予測, 2019-2024, 2024-2029F, 2034F
  • 3D積層集積回路（IC）
  • モノリシック3D集積回路（IC）
  • 統合およびパッケージタイプ
  • 世界の三次元（3D）集積回路（IC）市場：用途別、実績と予測, 2019-2024, 2024-2029F, 2034F
  • 航空宇宙および産業
  • 通信および情報技術（IT）
  • 自動車
  • 家電
  • 医学
  • 産業
  • その他の用途
  • 世界の三次元（3D）集積回路（IC）市場ガラス貫通ビア（TGV）の種類別サブセグメンテーション、実績と予測, 2019-2024, 2024-2029F, 2034F
  • 3D IC用ガラス基板
  • TGV製造プロセス
  • TGV相互接続
  • ICパッケージ用高性能ガラス
  • 世界の三次元（3D）集積回路（IC）市場シリコン貫通ビア（TSV）の種類別サブセグメンテーション、実績と予測, 2019-2024, 2024-2029F, 2034F
  • TSV製造用シリコンウエハー
  • TSV相互接続とビア形成
  • 銅TSV
  • TSVパッケージングソリューション
  • 3D IC向け高密度TSV
  • 世界の三次元（3D）集積回路（IC）市場、その他のコンポーネントのサブセグメンテーション（タイプ別）、実績と予測, 2019-2024, 2024-2029F, 2034F
  • マイクロバンプ
  • インターポーザー
  • 微小電気機械システム（MEMS）
  • 受動部品（抵抗器、コンデンサ）
  • 熱管理コンポーネント
  • 電力供給ネットワーク（PDN）コンポーネント
  • ウエハー接合材料
  • 試験および検査部品

第7章 地域別・国別分析

  • 世界の三次元（3D）集積回路（IC）市場：地域別、実績と予測, 2019-2024, 2024-2029F, 2034F
  • 世界の三次元（3D）集積回路（IC）市場：国別、実績と予測, 2019-2024, 2024-2029F, 2034F

第8章 アジア太平洋市場

第9章 中国市場

第10章 インド市場

第11章 日本市場

第12章 オーストラリア市場

第13章 インドネシア市場

第14章 韓国市場

第15章 西欧市場

第16章 英国市場

第17章 ドイツ市場

第18章 フランス市場

第19章 イタリア市場

第20章 スペイン市場

第21章 東欧市場

第22章 ロシア市場

第23章 北米市場

第24章 米国市場

第25章 カナダ市場

第26章 南米市場

第27章 ブラジル市場

第28章 中東市場

第29章 アフリカ市場

第30章 競合情勢と企業プロファイル

  • 三次元（3D）集積回路（IC）市場：競合情勢
  • 三次元（3D）集積回路（IC）市場：企業プロファイル
    • Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • Taiwan Semiconductor Manufacturing Company（TSMC）Overview, Products and Services, Strategy and Financial Analysis
    • Intel Corporation Overview, Products and Services, Strategy and Financial Analysis
    • International Business Machines Corporation Overview, Products and Services, Strategy and Financial Analysis
    • Qualcomm Incorporated Overview, Products and Services, Strategy and Financial Analysis

第31章 その他の大手企業と革新的企業

  • SK Hynix Inc.
  • Broadcom Inc.
  • Micron Technology Inc.
  • NVIDIA Corporation
  • Toshiba Corporation
  • Advanced Micro Devices Inc.（AMD）
  • ASML Holding N.V.
  • Texas Instruments Incorporated
  • MediaTek Inc.
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Analog Devices Inc.
  • Renesas Electronics Corporation
  • United Microelectronics Corporation

第32章 世界の市場競合ベンチマーキングとダッシュボード

第33章 主要な合併と買収

第34章 最近の市場動向

第35章 市場の潜在力が高い国、セグメント、戦略

  • 三次元（3D）集積回路（IC）市場2029：新たな機会を提供する国
  • 三次元（3D）集積回路（IC）市場2029：新たな機会を提供するセグメント
  • 三次元（3D）集積回路（IC）市場2029：成長戦略
    • 市場動向に基づく戦略
    • 競合の戦略

第36章 付録

目次
Product Code: r31389

Three-dimensional (3D) integrated circuits (ICs) are semiconductor devices where multiple layers of circuits are vertically stacked to form a single, compact unit. This vertical stacking allows for higher integration density, enhanced performance, and a smaller footprint compared to traditional two-dimensional (2D) ICs.

The primary components of three-dimensional (3D) integrated circuits (ICs) include through-glass vias (TGVs), silicon vias (TSVs), and others. Through-glass vias are tiny holes or channels created through a glass substrate to enable electrical signals to pass between different layers of a 3D IC, using glass as an insulating material due to its dielectric properties. The technology types include 3D stacked integrated circuits (ICs), monolithic 3D integrable circuits (ICs), and various integration and packaging types for applications such as aerospace and industrial, telecommunication and information technology (IT), automotive, consumer electronics, medical, industrial, and others.

The three dimensional (3D) integrated circuit (IC) market research report is one of a series of new reports from the business research company that provides three dimensional (3D) integrated circuit (IC) market statistics, including three dimensional (3D) integrated circuit (IC) industry global market size, regional shares, competitors with an three dimensional (3D) integrated circuit (IC) market share, detailed three dimensional (3D) integrated circuit (IC) market segments, market trends and opportunities, and any further data you may need to thrive in the three dimensional (3D) integrated circuit (IC) industry. This three dimensional (3D) integrated circuit (IC) market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The three dimensional (3D) integrated circuits (IC) market size has grown rapidly in recent years. It will grow from $12.41 billion in 2024 to $14.41 billion in 2025 at a compound annual growth rate (CAGR) of 16.1%. The growth in the historic period can be attributed to increased demand for advanced electronic products, the rising need for improved energy efficiency, rising demand for higher-performance electronics.

The three dimensional (3D) integrated circuits (IC) market size is expected to see rapid growth in the next few years. It will grow to $25.83 billion in 2029 at a compound annual growth rate (CAGR) of 15.7%. The growth in the forecast period can be attributed to a spike in demand for smart devices and sophisticated integrations, an increase in investment in research and development activities, an increasing need for 3D ICs in sectors like servers and data hubs, and the military and aerospace sectors, growing need for semiconductor industries, expansion of IoT and AI technologies. Major trends in the forecast period include the constant need for miniaturization of devices, the use of advanced packaging technologies, heterogeneous integration of devices, a focus on sustainability and energy efficiency, the customization of 3D IC solutions for specific applications, the development of new materials for better performance and efficiency, and enhanced manufacturing processes to reduce costs.

The expanding semiconductor industry is expected to drive the growth of the three-dimensional (3D) integrated circuit (IC) market. The semiconductor industry includes companies involved in designing, manufacturing, and selling semiconductor devices, which are crucial components in various electronic products such as computers, smartphones, and industrial machinery. This industry is experiencing substantial growth due to the increasing prevalence of consumer electronics, including smartphones, tablets, and wearable devices, which boosts the demand for advanced semiconductor components. Additionally, the rollout of 5G networks necessitates new semiconductor technologies for enhanced communication, faster data transfer, and improved connectivity. 3D ICs offer numerous benefits for semiconductor applications, such as enhanced performance, improved power efficiency, space optimization, and effective thermal management. For example, in July 2024, the Semiconductor Industry Association (SIA), a US-based trade association representing the United States semiconductor industry, reported that global semiconductor industry sales reached $49.1 billion in May 2024, a 19.3% increase compared to $41.2 billion in May 2023, and a 4.1% increase compared to $47.2 billion in April 2024. Thus, the growing need for semiconductors drives the expansion of the 3D IC market.

Leading companies in the Three Dimensional (3D) Integrated Circuits (IC) market are focusing on developing custom 3D ICs tailored to specific applications or customer requirements, such as 5G radio frequency performance, to gain a competitive edge, meet precise market demands, and drive higher revenue through specialized solutions. 3D IC technology enhances 5G by integrating multiple high-speed components into a single package, improving performance, reducing latency, and enabling more compact and efficient network infrastructure and devices. For instance, in May 2024, United Microelectronics Corporation, a Taiwan-based multinational corporation and semiconductor company, introduced the industry's first 3D IC solution for radio frequency silicon on insulator (RFSOI) technology, marking a significant advancement in the 5G era. This pioneering technology, available on UMC's 55nm RFSOI platform, reduces circuit footprint by over 45%, allowing for the integration of more RF components into 5G devices. This innovative 3D IC solution addresses the challenge of radio frequency (RF) interference and paves the way for future developments in 5G millimeter-wave (mmWave) technology.

In February 2022, Advanced Micro Devices Inc. (AMD), a US-based semiconductor company, acquired Xilinx Inc. for an undisclosed amount. The acquisition of Xilinx aims to enhance AMD's portfolio by incorporating Xilinx's leading FPGA and adaptive computing technologies, thereby strengthening AMD's position in high-performance computing, data centers, and embedded markets. Xilinx Inc. is a US-based technology and semiconductor company that manufactures 3D ICs.

Major companies operating in the three dimensional (3D) integrated circuits (IC) market are Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company (TSMC), Intel Corporation, International Business Machines Corporation, Qualcomm Incorporated, SK Hynix Inc., Broadcom Inc., Micron Technology Inc., NVIDIA Corporation, Toshiba Corporation, Advanced Micro Devices Inc. (AMD), ASML Holding N.V., Texas Instruments Incorporated, MediaTek Inc., STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Analog Devices Inc., Renesas Electronics Corporation, United Microelectronics Corporation, ON Semiconductor Corporation, GlobalFoundries Inc., Microchip Technology Incorporated, Marvell Technology Group Ltd., JCET Group, Xilinx Inc., Silicon Labs Inc., Rambus Inc.

North America was the largest region in the three dimensional (3D) integrated circuit (IC) market in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the three dimensional (3D) integrated circuits (IC) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the three dimensional (3D) integrated circuits (IC) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The three-dimensional (3D) integrated circuit (IC) market consists of sales of chip-on-chip (CoC), wafer-on-wafer (WoW), and chip-on-wafer (CoW). Values in this market are 'factory gate' values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Three Dimensional (3D) Integrated Circuits (IC) Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on three dimensional (3d) integrated circuits (ic) market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

  • Gain a truly global perspective with the most comprehensive report available on this market covering 15 geographies.
  • Assess the impact of key macro factors such as conflict, pandemic and recovery, inflation and interest rate environment and the 2nd Trump presidency.
  • Create regional and country strategies on the basis of local data and analysis.
  • Identify growth segments for investment.
  • Outperform competitors using forecast data and the drivers and trends shaping the market.
  • Understand customers based on the latest market shares.
  • Benchmark performance against key competitors.
  • Suitable for supporting your internal and external presentations with reliable high quality data and analysis
  • Report will be updated with the latest data and delivered to you within 2-3 working days of order along with an Excel data sheet for easy data extraction and analysis.
  • All data from the report will also be delivered in an excel dashboard format.

Where is the largest and fastest growing market for three dimensional (3d) integrated circuits (ic) ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The three dimensional (3d) integrated circuits (ic) market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

  • Markets Covered:1) By Components: Through Glass Vias (TGVs); Through Silicon Vias (TSVs); Other Components
  • 2) By Technology: 3D Stacked Integrated Circuit (ICs); Monolithic 3D Integrated Circuit (ICs); Integration And Packaging Type
  • 3) By Application: Aerospace And Industrial; Telecommunication And Information Technology (IT); Automotive; Consumer Electronics; Medical; Industrial; Other Applications
  • Subsegments:
  • 1) By Through Glass Vias (TGVs): Glass Substrate For 3D ICs; TGV Fabrication Process; TGV Interconnects; High-Performance Glass For IC Packaging
  • 2) By Through Silicon Vias (TSVs): Silicon Wafer For TSV Fabrication; TSV Interconnects and Via Formation; Copper TSVs; TSV Packaging Solutions; High-Density Tsvs For 3D ICs
  • 3) By Other Components: Microbumps; Interposers; Microelectromechanical Systems (MEMS); Passive Components (Resistors, Capacitors); Thermal Management Components; Power Delivery Network (PDN) Components; Wafer Bonding Materials; Test And Inspection Components
  • Companies Mentioned: Samsung Electronics Co. Ltd.; Taiwan Semiconductor Manufacturing Company (TSMC); Intel Corporation; International Business Machines Corporation; Qualcomm Incorporated
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Three Dimensional (3D) Integrated Circuits (IC) Market Characteristics

3. Three Dimensional (3D) Integrated Circuits (IC) Market Trends And Strategies

4. Three Dimensional (3D) Integrated Circuits (IC) Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Covid And Recovery On The Market

5. Global Three Dimensional (3D) Integrated Circuits (IC) Growth Analysis And Strategic Analysis Framework

  • 5.1. Global Three Dimensional (3D) Integrated Circuits (IC) PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
  • 5.2. Analysis Of End Use Industries
  • 5.3. Global Three Dimensional (3D) Integrated Circuits (IC) Market Growth Rate Analysis
  • 5.4. Global Three Dimensional (3D) Integrated Circuits (IC) Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
  • 5.5. Global Three Dimensional (3D) Integrated Circuits (IC) Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
  • 5.6. Global Three Dimensional (3D) Integrated Circuits (IC) Total Addressable Market (TAM)

6. Three Dimensional (3D) Integrated Circuits (IC) Market Segmentation

  • 6.1. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Through Glass Vias (TGVs)
  • Through Silicon Vias (TSVs)
  • Other Components
  • 6.2. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 3D Stacked Integrated Circuit (ICs)
  • Monolithic 3D Integrated Circuit (ICs)
  • Integration And Packaging Type
  • 6.3. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Aerospace And Industrial
  • Telecommunication And Information Technology (IT)
  • Automotive
  • Consumer Electronics
  • Medical
  • Industrial
  • Other Applications
  • 6.4. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Sub-Segmentation Of Through Glass Vias (TGVs), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Glass Substrate For 3D ICs
  • TGV Fabrication Process
  • TGV Interconnects
  • High-Performance Glass For IC Packaging
  • 6.5. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Sub-Segmentation Of Through Silicon Vias (TSVs), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Silicon Wafer For TSV Fabrication
  • TSV Interconnects and Via Formation
  • Copper TSVs
  • TSV Packaging Solutions
  • High-Density Tsvs For 3D ICs
  • 6.6. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Sub-Segmentation Of Other Components, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Microbumps
  • Interposers
  • Microelectromechanical Systems (MEMS)
  • Passive Components (Resistors, Capacitors)
  • Thermal Management Components
  • Power Delivery Network (PDN) Components
  • Wafer Bonding Materials
  • Test And Inspection Components

7. Three Dimensional (3D) Integrated Circuits (IC) Market Regional And Country Analysis

  • 7.1. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 7.2. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market

  • 8.1. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.3. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.4. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Three Dimensional (3D) Integrated Circuits (IC) Market

  • 9.1. China Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 9.2. China Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.3. China Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.4. China Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Three Dimensional (3D) Integrated Circuits (IC) Market

  • 10.1. India Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.2. India Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.3. India Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Three Dimensional (3D) Integrated Circuits (IC) Market

  • 11.1. Japan Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 11.2. Japan Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.3. Japan Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.4. Japan Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Three Dimensional (3D) Integrated Circuits (IC) Market

  • 12.1. Australia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.2. Australia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.3. Australia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market

  • 13.1. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.2. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.3. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market

  • 14.1. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 14.2. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.3. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.4. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market

  • 15.1. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 15.2. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.3. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.4. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Three Dimensional (3D) Integrated Circuits (IC) Market

  • 16.1. UK Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.2. UK Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.3. UK Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Three Dimensional (3D) Integrated Circuits (IC) Market

  • 17.1. Germany Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.2. Germany Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.3. Germany Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Three Dimensional (3D) Integrated Circuits (IC) Market

  • 18.1. France Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.2. France Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.3. France Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Three Dimensional (3D) Integrated Circuits (IC) Market

  • 19.1. Italy Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.2. Italy Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.3. Italy Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Three Dimensional (3D) Integrated Circuits (IC) Market

  • 20.1. Spain Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.2. Spain Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.3. Spain Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market

  • 21.1. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 21.2. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.3. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.4. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Three Dimensional (3D) Integrated Circuits (IC) Market

  • 22.1. Russia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.2. Russia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.3. Russia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Three Dimensional (3D) Integrated Circuits (IC) Market

  • 23.1. North America Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 23.2. North America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.3. North America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.4. North America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Three Dimensional (3D) Integrated Circuits (IC) Market

  • 24.1. USA Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 24.2. USA Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.3. USA Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.4. USA Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Three Dimensional (3D) Integrated Circuits (IC) Market

  • 25.1. Canada Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 25.2. Canada Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.3. Canada Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.4. Canada Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Three Dimensional (3D) Integrated Circuits (IC) Market

  • 26.1. South America Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 26.2. South America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.3. South America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.4. South America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market

  • 27.1. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.2. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.3. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market

  • 28.1. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 28.2. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.3. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.4. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Three Dimensional (3D) Integrated Circuits (IC) Market

  • 29.1. Africa Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 29.2. Africa Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.3. Africa Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.4. Africa Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Three Dimensional (3D) Integrated Circuits (IC) Market Competitive Landscape And Company Profiles

  • 30.1. Three Dimensional (3D) Integrated Circuits (IC) Market Competitive Landscape
  • 30.2. Three Dimensional (3D) Integrated Circuits (IC) Market Company Profiles
    • 30.2.1. Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.2. Taiwan Semiconductor Manufacturing Company (TSMC) Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.3. Intel Corporation Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.4. International Business Machines Corporation Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.5. Qualcomm Incorporated Overview, Products and Services, Strategy and Financial Analysis

31. Three Dimensional (3D) Integrated Circuits (IC) Market Other Major And Innovative Companies

  • 31.1. SK Hynix Inc.
  • 31.2. Broadcom Inc.
  • 31.3. Micron Technology Inc.
  • 31.4. NVIDIA Corporation
  • 31.5. Toshiba Corporation
  • 31.6. Advanced Micro Devices Inc. (AMD)
  • 31.7. ASML Holding N.V.
  • 31.8. Texas Instruments Incorporated
  • 31.9. MediaTek Inc.
  • 31.10. STMicroelectronics N.V.
  • 31.11. Infineon Technologies AG
  • 31.12. NXP Semiconductors N.V.
  • 31.13. Analog Devices Inc.
  • 31.14. Renesas Electronics Corporation
  • 31.15. United Microelectronics Corporation

32. Global Three Dimensional (3D) Integrated Circuits (IC) Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Three Dimensional (3D) Integrated Circuits (IC) Market

34. Recent Developments In The Three Dimensional (3D) Integrated Circuits (IC) Market

35. Three Dimensional (3D) Integrated Circuits (IC) Market High Potential Countries, Segments and Strategies

  • 35.1 Three Dimensional (3D) Integrated Circuits (IC) Market In 2029 - Countries Offering Most New Opportunities
  • 35.2 Three Dimensional (3D) Integrated Circuits (IC) Market In 2029 - Segments Offering Most New Opportunities
  • 35.3 Three Dimensional (3D) Integrated Circuits (IC) Market In 2029 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer