ToF 3DカメラIC市場レポート：2030年までの動向、予測、競合分析

ToF 3DカメラICの動向と予測

世界のToF 3DカメラIC市場は、2024年から2030年にかけてCAGR 32.1％で成長すると予測されます。この市場の主な促進要因は、洗練された撮影機能を備えたスマートフォンへの関心の高まり、生体認証および顔認識システムへの需要の高まり、さらにセンサーのサイズ、精度、解像度の向上など、ToFカメラ集積回路の継続的な技術開拓と革新です。世界のToF 3DカメラIC市場の将来は、民生用電子機器市場や自動車市場における機会で有望視されています。

ToF 3DカメラIC市場の洞察

Lucintelの予測では、間接ToFセンサセグメントは、より高い精度を示し、消費電力が少ないため、予測期間中に最も高い成長が見込まれます。

アジア太平洋は予測期間中に最も高い成長が見込まれます。

よくある質問

Q1.市場の成長予測は？

A1.世界のToF 3DカメラIC市場は、2024年から2030年にかけてCAGR 32.1%で成長する見込みです。

Q2.市場の成長に影響を与える主な促進要因は？

A2.この市場の主な促進要因は、洗練された写真撮影機能を備えたスマートフォンへの関心の高まり、生体認証および顔認証システムへの需要の高まり、さらにセンサーのサイズ、精度、解像度の向上など、ToFカメラ集積回路の継続的な技術開拓と革新です。

Q3.市場の主要セグメントは？

A3.世界のToF 3DカメラIC市場の将来は、民生用電子機器と自動車市場に機会があり、有望です。

Q4.市場の主要企業は？

A4.主なToF 3DカメラIC企業は以下の通り。

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

Q5.今後、最大となる市場セグメントは？

A5.Lucintelの予測では、間接ToFセンサーセグメントは、より高い精度を示し、消費電力が少ないため、予測期間中に最も高い成長が見込まれます。

Q6.市場において、今後5年間に最大になると予想される地域は？

A6.APACは予測期間中に最も高い成長が見込まれます。

Q7.レポートのカスタマイズは可能？

A7.はい、Lucintelは追加費用なしで10％のカスタマイズを提供します。

目次

第1章 エグゼクティブサマリー

第2章 世界のToF 3DカメラIC市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2018年～2030年の市場動向と予測分析

• マクロ経済動向（2018年～2023年）と予測（2024年～2030年）
• 世界のToF 3DカメラIC市場動向（2018年～2023年）と予測（2024年～2030年）
• 世界のToF 3DカメラIC市場、タイプ別
  • 直接ToFセンサー
  • 間接ToFセンサー
• 世界のToF 3DカメラIC市場、用途別
  • 家庭用電化製品
  • 自動車
  • その他

第4章 2018年～2030年の地域別の市場動向と予測分析

• 地域別の世界のToF 3DカメラIC市場
• 北米のToF 3DカメラIC市場
• 欧州のToF 3DカメラIC市場
• アジア太平洋のToF 3DカメラIC市場
• その他地域のToF 3DカメラIC市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • タイプ別の世界のToF 3DカメラIC市場の成長機会
  • 用途別の世界のToF 3DカメラIC市場の成長機会
  • 地域別の世界のToF 3DカメラIC市場の成長機会
• 世界のToF 3DカメラIC市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界のToF 3DカメラIC市場の能力拡大
  • 世界のToF 3DカメラIC市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

ToF 3D Camera IC Trends and Forecast

The future of the global ToF 3D camera IC market looks promising with opportunities in the consumer electronic and automobile markets. The global ToF 3D camera IC market is expected to grow with a CAGR of 32.1% from 2024 to 2030. The major drivers for this market are rising interest in smartphones with sophisticated photography features, growing demand for biometric and facial recognition systems, as well as, continuous technological development and innovation in ToF camera integrated circuits, including enhanced size, precision, and resolution of the sensor.

A more than 150-page report is developed to help in your business decisions.

ToF 3D Camera IC by Segment

The study includes a forecast for the global ToF 3D camera IC by type, application, and region.

ToF 3D Camera IC Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Direct ToF Sensor
• Indirect ToF Sensor

ToF 3D Camera IC Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• Consumer Electronic
• Automobile
• Others

ToF 3D Camera IC Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of ToF 3D Camera IC Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies ToF 3D camera IC companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the ToF 3D camera IC companies profiled in this report include-

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

ToF 3D Camera IC Market Insights

Lucintel forecasts that indirect ToF sensor segment is expected to witness highest growth over the forecast period because it shows higher accuracy and consumes less power.

APAC is expected to witness highest growth over the forecast period.

Features of the Global ToF 3D Camera IC Market

Market Size Estimates: ToF 3D camera IC market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: ToF 3D camera IC market size by type, application, and region in terms of value ($B).

Regional Analysis: ToF 3D camera IC market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the ToF 3D camera IC market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the ToF 3D camera IC market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for ToF 3D camera IC market?

Answer: The global ToF 3D camera IC market is expected to grow with a CAGR of 32.1% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the ToF 3D camera IC market?

Answer: The major drivers for this market are rising interest in smartphones with sophisticated photography features, growing demand for biometric and facial recognition systems, as well as, continuous technological development and innovation in ToF camera integrated circuits, including enhanced size, precision, and resolution of the sensor.

Q3. What are the major segments for ToF 3D camera IC market?

Answer: The future of the global ToF 3D camera IC market looks promising with opportunities in the consumer electronic and automobile markets.

Q4. Who are the key ToF 3D camera IC market companies?

Answer: Some of the key ToF 3D camera IC companies are as follows.

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

Q5. Which ToF 3D camera IC market segment will be the largest in future?

Answer: Lucintel forecasts that indirect ToF sensor segment is expected to witness highest growth over the forecast period because it shows higher accuracy and consumes less power.

Q6. In ToF 3D camera IC market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the ToF 3D camera IC market by type (direct ToF sensor and indirect ToF sensor), application (consumer electronic, automobile, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global ToF 3D Camera IC Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global ToF 3D Camera IC Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global ToF 3D Camera IC Market by Type
  • 3.3.1: Direct ToF Sensor
  • 3.3.2: Indirect ToF Sensor
• 3.4: Global ToF 3D Camera IC Market by Application
  • 3.4.1: Consumer Electronic
  • 3.4.2: Automobile
  • 3.4.3: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global ToF 3D Camera IC Market by Region
• 4.2: North American ToF 3D Camera IC Market
  • 4.2.2: North American ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others
• 4.3: European ToF 3D Camera IC Market
  • 4.3.1: European ToF 3D Camera IC Market by Type: Direct ToF Sensor and Indirect ToF Sensor
  • 4.3.2: European ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others
• 4.4: APAC ToF 3D Camera IC Market
  • 4.4.1: APAC ToF 3D Camera IC Market by Type: Direct ToF Sensor and Indirect ToF Sensor
  • 4.4.2: APAC ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others
• 4.5: ROW ToF 3D Camera IC Market
  • 4.5.1: ROW ToF 3D Camera IC Market by Type: Direct ToF Sensor and Indirect ToF Sensor
  • 4.5.2: ROW ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global ToF 3D Camera IC Market by Type
  • 6.1.2: Growth Opportunities for the Global ToF 3D Camera IC Market by Application
  • 6.1.3: Growth Opportunities for the Global ToF 3D Camera IC Market by Region
• 6.2: Emerging Trends in the Global ToF 3D Camera IC Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global ToF 3D Camera IC Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global ToF 3D Camera IC Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: ams OSRAM
• 7.2: Infineon & PMD
• 7.3: Melexis
• 7.4: STMicroelectronics
• 7.5: Texas Instruments
• 7.6: Nuvoton
• 7.7: Toppan