半導体ボンディング装置市場レポート：2030年までの動向、予測、競合分析

半導体ボンディング装置の動向と予測

世界の半導体ボンディング装置市場は、2024年から2030年までのCAGRが10.8%で、2030年には推定11億米ドルに達すると予測されています。この市場の主な促進要因は、フットプリントを縮小し、処理能力を高め、効率を向上させた半導体デバイスに対するニーズの高まり、半導体メーカーによる研究開発活動への投資の増加、自動車、ヘルスケア、産業などさまざまな業界における半導体チップの採用の増加です。世界の半導体ボンディング装置市場の将来は、先進パッケージング、パワーICとパワーディスクリート、フォトニックデバイス、MEMsセンサーとアクチュエーター、エンジニアリング基板、CMOSイメージセンサー市場にチャンスがありそうです。

半導体ボンディング装置市場の洞察

Lucintelの予測では、ハイブリッドボンディング装置は従来の方法に比べて優れた電気的・熱的性能を発揮できるため、予測期間中に最も高い成長が見込まれます。

アジア太平洋は、国内の主要サプライヤによる戦略的投資と、同地域で確立された半導体セクターにより、予測期間中に最も高い成長が見込まれます。

よくある質問

Q1.市場規模は？

A1.世界の半導体ボンディング装置市場は、2030年までに推定11億米ドルに達すると予想されています。

Q2.市場の成長予測は？

A2.世界の半導体ボンディング装置市場は、2024年から2030年にかけてCAGR 10.8%で成長する見込みです。

Q3.市場の成長に影響を与える主な促進要因は？

A3.この市場の主な促進要因は、フットプリントを縮小し、処理能力を高め、効率を向上させた半導体デバイスに対するニーズの高まり、半導体メーカーによる研究開発活動への投資の増加、自動車、ヘルスケア、産業など様々な産業における半導体チップの採用の増加です。

Q4.市場の主要セグメントは？

A4.世界の半導体ボンディング装置市場の将来は、先進パッケージング、パワーICとパワーディスクリート、フォトニックデバイス、MEMsセンサーとアクチュエーター、エンジニアリング基板、CMOSイメージセンサー市場の機会で有望視されています。

Q5.市場の主要企業は？

A5.半導体ボンディング装置の主要企業は以下の通り。

• EV Group
• ASMPT Semiconductor Solutions
• MRSI Systems
• WestBond
• Panasonic Industry
• Palomar Technologies
• Dr. Tresky
• BE Semiconductor Industries
• Fasford Technology
• Kulicke and Soffa Industries

Q6.今後、最大となる市場セグメントは？

A6.Lucintelは、ハイブリッドボンディング装置は、従来の方法と比較して優れた電気的・熱的性能を発揮できるため、予測期間中に最も高い成長が見込まれると予測しています。

Q7.市場において、今後5年間に最大になると予想される地域は？

A7.APACは、国内の主要サプライヤによる戦略的投資と、同地域の半導体セクターが確立されていることから、予測期間中に最も高い成長が見込まれます。

Q8.レポートのカスタマイズは可能？

A8.はい、Lucintelは追加費用なしで10％のカスタマイズを提供します。

目次

第1章 エグゼクティブサマリー

第2章 世界の半導体ボンディング装置市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2018年～2030年の市場動向と予測分析

• マクロ経済動向（2018年～2023年）と予測（2024年～2030年）
• 世界の半導体ボンディング装置市場動向（2018年～2023年）と予測（2024年～2030年）
• 世界の半導体ボンディング装置市場、タイプ別
  • 永久接着装置
  • 仮着装置
  • ハイブリッド接合装置
• 世界の半導体ボンディング装置市場、用途別
  • 先進パッケージング
  • パワーICとパワーディスクリート
  • フォトニックデバイス
  • MEMSセンサーとアクチュエーター
  • 加工基板
  • CMOSイメージセンサー

第4章 2018年～2030年の地域別の市場動向と予測分析

• 地域別の世界の半導体ボンディング装置市場
• 北米の半導体ボンディング装置市場
• 欧州の半導体ボンディング装置市場
• アジア太平洋の半導体ボンディング装置市場
• その他地域の半導体ボンディング装置市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • タイプ別の世界の半導体ボンディング装置市場の成長機会
  • 用途別の世界の半導体ボンディング装置市場の成長機会
  • 地域別の世界の半導体ボンディング装置市場の成長機会
• 世界の半導体ボンディング装置市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界の半導体ボンディング装置市場の能力拡大
  • 世界の半導体ボンディング装置市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• EV Group
• ASMPT Semiconductor Solutions
• MRSI Systems
• WestBond
• Panasonic Industry
• Palomar Technologies
• Dr. Tresky
• BE Semiconductor Industries
• Fasford Technology
• Kulicke and Soffa Industries

Semiconductor Bonding Equipment Trends and Forecast

The future of the global semiconductor bonding equipment market looks promising with opportunities in the advanced packaging, power IC and power discrete, photonic device, MEMs sensors and actuators, engineered substrates, CMOS image sensor markets. The global semiconductor bonding equipment market is expected to reach an estimated $1.1 billion by 2030 with a CAGR of 10.8% from 2024 to 2030. The major drivers for this market are growing need for semiconductor devices with reduced footprints, more processing power, and improved efficiency, increasing investments in research and development activities by semiconductor manufacturers, as well as, rising adoption of semiconductor chips in various industries, including automotive, healthcare, and industrial.

A more than 150-page report is developed to help in your business decisions.

Semiconductor Bonding Equipment by Segment

The study includes a forecast for the global semiconductor bonding equipment by type, application, and region.

Semiconductor Bonding Equipment Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Permanent Bonding Equipment
• Temporary Bonding Equipment
• Hybrid Bonding Equipment

Semiconductor Bonding Equipment Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• Advanced Packaging
• Power IC and Power Discrete
• Photonic Devices
• MEMS Sensors and Actuators
• Engineered Substrates
• CMOS Image Sensors

Semiconductor Bonding Equipment Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Semiconductor Bonding Equipment Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor bonding equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor bonding equipment companies profiled in this report include-

• EV Group
• ASMPT Semiconductor Solutions
• MRSI Systems
• WestBond
• Panasonic Industry
• Palomar Technologies
• Dr. Tresky
• BE Semiconductor Industries
• Fasford Technology
• Kulicke and Soffa Industries

Semiconductor Bonding Equipment Market Insights

Lucintel forecasts that hybrid bonding equipment is expected to witness the highest growth over the forecast period because it can deliver superior electrical and thermal performance compared to traditional methods.

APAC is expected to witness highest growth over the forecast period due to strategic investments by key domestic suppliers and the well-established semiconductor sector in the region.

Features of the Global Semiconductor Bonding Equipment Market

Market Size Estimates: Semiconductor bonding equipment market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Semiconductor bonding equipment market size by type, application, and region in terms of value ($B).

Regional Analysis: Semiconductor bonding equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the semiconductor bonding equipment market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor bonding equipment market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the semiconductor bonding equipment market size?

Answer: The global semiconductor bonding equipment market is expected to reach an estimated $1.1 billion by 2030.

Q2. What is the growth forecast for semiconductor bonding equipment market?

Answer: The global semiconductor bonding equipment market is expected to grow with a CAGR of 10.8% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the semiconductor bonding equipment market?

Answer: The major drivers for this market are growing need for semiconductor devices with reduced footprints, more processing power, and improved efficiency, increasing investments in research and development activities by semiconductor manufacturers, as well as, rising adoption of semiconductor chips in various industries, including automotive, healthcare, and industrial.

Q4. What are the major segments for semiconductor bonding equipment market?

Answer: The future of the global semiconductor bonding equipment market looks promising with opportunities in the advanced packaging, power IC and power discrete, photonic device, MEMs sensors and actuators, engineered substrates, CMOS image sensor markets.

Q5. Who are the key semiconductor bonding equipment market companies?

Answer: Some of the key semiconductor bonding equipment companies are as follows.

• EV Group
• ASMPT Semiconductor Solutions
• MRSI Systems
• WestBond
• Panasonic Industry
• Palomar Technologies
• Dr. Tresky
• BE Semiconductor Industries
• Fasford Technology
• Kulicke and Soffa Industries

Q6. Which semiconductor bonding equipment market segment will be the largest in future?

Answer: Lucintel forecasts that hybrid bonding equipment is expected to witness the highest growth over the forecast period because it can deliver superior electrical and thermal performance compared to traditional methods.

Q7. In semiconductor bonding equipment market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to strategic investments by key domestic suppliers and the well-established semiconductor sector in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the semiconductor bonding equipment market by type (permanent bonding equipment, temporary bonding equipment, and hybrid bonding equipment), application (advanced packaging, power IC and power discrete, photonic devices, MEMS sensors and actuators, engineered substrates, and CMOS image sensors), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Semiconductor Bonding Equipment Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global Semiconductor Bonding Equipment Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global Semiconductor Bonding Equipment Market by Type
  • 3.3.1: Permanent Bonding Equipment
  • 3.3.2: Temporary Bonding Equipment
  • 3.3.3: Hybrid Bonding Equipment
• 3.4: Global Semiconductor Bonding Equipment Market by Application
  • 3.4.1: Advanced Packaging
  • 3.4.2: Power IC and Power Discrete
  • 3.4.3: Photonic Devices
  • 3.4.4: MEMS Sensors and Actuators
  • 3.4.5: Engineered Substrates
  • 3.4.6: CMOS Image Sensors

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global Semiconductor Bonding Equipment Market by Region
• 4.2: North American Semiconductor Bonding Equipment Market
  • 4.2.2: North American Semiconductor Bonding Equipment Market by Application: Advanced Packaging, Power IC and Power Discrete, Photonic Devices, MEMS Sensors and Actuators, Engineered Substrates, and CMOS Image Sensors
• 4.3: European Semiconductor Bonding Equipment Market
  • 4.3.1: European Semiconductor Bonding Equipment Market by Type: Permanent Bonding Equipment, Temporary Bonding Equipment, and Hybrid Bonding Equipment
  • 4.3.2: European Semiconductor Bonding Equipment Market by Application: Advanced Packaging, Power IC and Power Discrete, Photonic Devices, MEMS Sensors and Actuators, Engineered Substrates, and CMOS Image Sensors
• 4.4: APAC Semiconductor Bonding Equipment Market
  • 4.4.1: APAC Semiconductor Bonding Equipment Market by Type: Permanent Bonding Equipment, Temporary Bonding Equipment, and Hybrid Bonding Equipment
  • 4.4.2: APAC Semiconductor Bonding Equipment Market by Application: Advanced Packaging, Power IC and Power Discrete, Photonic Devices, MEMS Sensors and Actuators, Engineered Substrates, and CMOS Image Sensors
• 4.5: ROW Semiconductor Bonding Equipment Market
  • 4.5.1: ROW Semiconductor Bonding Equipment Market by Type: Permanent Bonding Equipment, Temporary Bonding Equipment, and Hybrid Bonding Equipment
  • 4.5.2: ROW Semiconductor Bonding Equipment Market by Application: Advanced Packaging, Power IC and Power Discrete, Photonic Devices, MEMS Sensors and Actuators, Engineered Substrates, and CMOS Image Sensors

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Semiconductor Bonding Equipment Market by Type
  • 6.1.2: Growth Opportunities for the Global Semiconductor Bonding Equipment Market by Application
  • 6.1.3: Growth Opportunities for the Global Semiconductor Bonding Equipment Market by Region
• 6.2: Emerging Trends in the Global Semiconductor Bonding Equipment Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Semiconductor Bonding Equipment Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Semiconductor Bonding Equipment Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: EV Group
• 7.2: ASMPT Semiconductor Solutions
• 7.3: MRSI Systems
• 7.4: WestBond
• 7.5: Panasonic Industry
• 7.6: Palomar Technologies
• 7.7: Dr. Tresky
• 7.8: BE Semiconductor Industries
• 7.9: Fasford Technology
• 7.10: Kulicke and Soffa Industries