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半導体ボンディングの世界市場規模調査＆予測、プロセスタイプ別、ボンディング技術別、用途別、地域別分析、2023-2030年

Global Semiconductor Bonding Market Size study & Forecast, by Type by Process Type, by Bonding Technology, by Application and Regional Analysis, 2023-2030
出版日: | 発行: Bizwit Research & Consulting LLP | ページ情報: 英文 200 Pages | 納期: 2～3営業日

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価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.58円
半導体ボンディングの世界市場規模調査＆予測、プロセスタイプ別、ボンディング技術別、用途別、地域別分析、2023-2030年
出版日: 2024年04月05日
発行: Bizwit Research & Consulting LLP
ページ情報: 英文 200 Pages
納期: 2～3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

半導体ボンディングの世界市場規模は、2022年に約9億1,000万米ドルと評価され、予測期間2023-2030年には3.60%以上の健全な成長率で成長すると予測されています。

半導体ボンディングは、2つの半導体材料を接合して機能的なデバイスや構造を作るプロセスです。この接合はさまざまな技術によって達成され、その方法の選択は特定の用途と関係する材料の特性に依存します。さらに、小型電子部品の需要の高まり、MEMSとセンサーの採用の高まり、電気自動車とハイブリッド車の需要の高まりが、予測期間2023-2030年の間に市場に有利な需要を生み出すと予想されます。

また、電気自動車やハイブリッド車の需要拡大が半導体ボンディング市場の成長に大きく寄与しています。電気自動車（EV）とハイブリッド電気自動車（HEV）は、モーター制御、バッテリー管理、電力変換などの機能でパワーエレクトロニクスに大きく依存しています。絶縁ゲートバイポーラトランジスタ（IGBT）やパワーモジュールなどの半導体デバイスは、これらのアプリケーションで重要な役割を果たしています。国際エネルギー機関によると、2019年のバッテリー電気自動車（BEV）の販売台数は58万台、プラグインハイブリッド車（PHEV）の販売台数は150万台でした。2022年にはそれぞれ290万台、730万台に達します。その結果、EVに対する需要の高まりが市場の有利な需要を促進すると予想されます。さらに、自動車分野でのIoTとAIの採用の増加、接続性と5G採用の増加は、市場成長のための有利な機会を創出すると予想されます。しかし、半導体ボンディングソリューションに関連する高コストは、2023-2030年の予測期間を通じて市場成長を阻害します。

半導体ボンディングの世界市場調査において考慮された主要地域は、アジア太平洋、北米、欧州、ラテンアメリカ、中東＆アフリカです。北米は、電子機器需要の増加、半導体製造における技術進歩や技術革新の拡大、人工知能（AI）やデータセンターの増加により、2022年に最大の市場シェアで市場を独占しました。一方、アジア太平洋地域は、電子機器需要の増加、半導体産業の拡大、研究開発への投資の増加、モノのインターネット（IoT）の採用拡大などの要因により、予測期間中に最も速い成長率で成長すると予想されます。

本調査の目的は、近年におけるさまざまなセグメントと国の市場規模を明らかにし、今後数年間の市場規模を予測することです。本レポートは、調査対象国における産業の質的・量的側面の両方を盛り込むよう設計されています。

また、市場の将来的な成長を規定する促進要因や課題などの重要な側面に関する詳細情報も提供しています。さらに、主要企業の競合情勢や製品提供の詳細な分析とともに、利害関係者が投資するためのミクロ市場における潜在的な機会も組み込んでいます。

目次

第1章 エグゼクティブサマリー

第2章 世界の半導体ボンディング市場の定義と範囲

  • 調査目的
  • 市場の定義と範囲
    • 産業の進化
    • 調査範囲
  • 調査対象年
  • 通貨換算レート

第3章 半導体ボンディングの世界市場力学

  • 半導体ボンディング市場の影響分析（2020-2030年）
    • 市場促進要因
      • 小型電子部品の需要増加
      • MEMSとセンサーの採用増加
      • 電気自動車とハイブリッド車の需要拡大
    • 市場の課題
      • 半導体ボンディングソリューションに関連する高コスト
      • 回路構造の微細化に伴う複雑化
    • 市場機会
      • 自動車分野におけるIoTとAIの採用拡大
      • 接続性と5G採用の増加

第4章 世界の半導体ボンディング市場産業分析

  • ポーターのファイブフォースモデル
    • 供給企業の交渉力
    • 買い手の交渉力
    • 新規参入業者の脅威
    • 代替品の脅威
    • 競争企業間の敵対関係
  • ポーターのファイブフォース影響分析
  • PEST分析
    • 政治
    • 経済
    • 社会
    • 技術
    • 環境
    • 法律
  • 主な投資機会
  • 主要成功戦略
  • COVID-19影響分析
  • 破壊的動向
  • 業界専門家の視点
  • アナリストの結論・提言

第5章 半導体ボンディングの世界市場：タイプ別

  • 市場スナップショット
  • 半導体ボンディングの世界市場：タイプ別、実績 - ポテンシャル分析
  • 半導体ボンディングの世界市場：タイプ別推定・予測2020-2030年
  • 半導体ボンディングの世界市場、サブセグメント別分析
    • ダイボンダー
    • ウエハーボンダー
    • フリップチップボンダー

第6章 半導体ボンディングの世界市場：プロセスタイプ別

  • 市場スナップショット
  • 半導体ボンディングの世界市場：プロセスタイプ別、実績 - ポテンシャル分析
  • 半導体ボンディングの世界市場：プロセスタイプ別推定・予測2020-2030
  • 半導体ボンディング市場、サブセグメント別分析
    • Die to Dieボンディング
    • Die to Waferボンディング
    • Wafer to Waferボンディング

第7章 半導体ボンディングの世界市場：ボンディング技術別

  • 市場スナップショット
  • 半導体ボンディングの世界市場：ボンディング技術別、実績 - ポテンシャル分析
  • 半導体ボンディングの世界市場：ボンディング技術別推計・予測2020-2030
  • 半導体ボンディング市場：サブセグメント別分析
    • ダイボンディング技術
    • ウエハーボンディング技術

第8章 半導体ボンディングの世界市場：用途別

  • 市場スナップショット
  • 半導体ボンディングの世界市場：用途別、実績 - ポテンシャル分析
  • 半導体ボンディングの世界市場、用途別推定・予測2020-2030
  • 半導体ボンディングの世界市場、サブセグメント別分析
    • RFデバイス
    • MEMSとセンサー
    • CMOSイメージセンサ
    • LED
    • D NAND

第9章 半導体ボンディングの世界市場：地域別分析

  • 主要国
  • 主な新興国
  • 半導体ボンディング市場：地域別市場スナップショット
  • 北米
    • 米国
      • タイプ別推定・予測、2020-2030年
      • プロセスタイプの推定・予測、2020-2030年
      • ボンディング技術別の推定・予測、2020-2030年
      • 用途別推定・予測、2020～2030年
    • カナダ
  • 欧州半導体ボンディング市場スナップショット
    • 英国
    • ドイツ
    • フランス
    • スペイン
    • イタリア
    • その他欧州
  • アジア太平洋半導体ボンディング市場スナップショット
    • 中国
    • インド
    • 日本
    • オーストラリア
    • 韓国
    • その他アジア太平洋地域
  • ラテンアメリカ半導体ボンディング市場スナップショット
    • ブラジル
    • メキシコ
  • 中東・アフリカ
    • サウジアラビア
    • 南アフリカ
    • その他中東とアフリカ

第10章 競合情報

  • 主要企業のSWOT分析
  • 主要市場戦略
  • 企業プロファイル
    • Besemiconductor
      • 主要情報
      • 会社概要
      • 財務（データ入手可能性による）
      • 製品概要
      • 最近の動向
    • SUSS MicroTec SE
    • Kulicke and Soffa Industries
    • Shibuara Mechatronics Corporation
    • TDK Corporation
    • Palomar Technologies
    • EV Group (EVG)
    • SHINKAWA Electric Co., Ltd
    • Tokyo Electron Limited
    • Intel Corporation

第11章 調査プロセス

  • 調査プロセス
    • データマイニング
    • 分析
    • 市場推定
    • 検証
    • 出版
  • 調査属性
  • 調査前提条件
図表

LIST OF TABLES

  • TABLE 1.Global Semiconductor Bonding Market, report scope
  • TABLE 2.Global Semiconductor Bonding Market estimates & forecasts by region 2020-2030 (USD Billion)
  • TABLE 3.Global Semiconductor Bonding Market estimates & forecasts by Type 2020-2030 (USD Billion)
  • TABLE 4.Global Semiconductor Bonding Market estimates & forecasts by Process Type 2020-2030 (USD Billion)
  • TABLE 5.Global Semiconductor Bonding Market estimates & forecasts by Bonding Technology 2020-2030 (USD Billion)
  • TABLE 6.Global Semiconductor Bonding Market estimates & forecasts by Application 2020-2030 (USD Billion)
  • TABLE 7.Global Semiconductor Bonding Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 8.Global Semiconductor Bonding Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 9.Global Semiconductor Bonding Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 10.Global Semiconductor Bonding Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 11.Global Semiconductor Bonding Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 12.Global Semiconductor Bonding Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 13.Global Semiconductor Bonding Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 14.Global Semiconductor Bonding Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 15.Global Semiconductor Bonding Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 16.Global Semiconductor Bonding Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 17.U.S. Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 18.U.S. Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 19.U.S. Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 20.Canada Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 21.Canada Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 22.Canada Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 23.UK Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 24.UK Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 25.UK Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 26.Germany Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 27.Germany Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 28.Germany Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 29.France Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 30.France Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 31.France Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 32.Italy Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 33.Italy Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 34.Italy Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 35.Spain Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 36.Spain Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 37.Spain Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 38.RoE Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 39.RoE Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 40.RoE Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 41.China Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 42.China Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 43.China Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 44.India Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 45.India Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 46.India Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 47.Japan Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 48.Japan Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 49.Japan Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 50.South Korea Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 51.South Korea Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 52.South Korea Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 53.Australia Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 54.Australia Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 55.Australia Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 56.RoAPAC Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 57.RoAPAC Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 58.RoAPAC Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 59.Brazil Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 60.Brazil Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 61.Brazil Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 62.Mexico Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 63.Mexico Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 64.Mexico Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 65.RoLA Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 66.RoLA Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 67.RoLA Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 68.Saudi Arabia Semiconductor Bonding Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 69.South Africa Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 70.RoMEA Semiconductor Bonding Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 71.List of secondary sources, used in the study of global Semiconductor Bonding Market
  • TABLE 72.List of primary sources, used in the study of global Semiconductor Bonding Market
  • TABLE 73.Years considered for the study
  • TABLE 74.Exchange rates considered

List of tables and figures and dummy in nature, final lists may vary in the final deliverable

LIST OF FIGURES

  • FIG 1.Global Semiconductor Bonding Market, research methodology
  • FIG 2.Global Semiconductor Bonding Market, Market estimation techniques
  • FIG 3.Global Market size estimates & forecast methods
  • FIG 4.Global Semiconductor Bonding Market, key trends 2022
  • FIG 5.Global Semiconductor Bonding Market, growth prospects 2023-2030
  • FIG 6.Global Semiconductor Bonding Market, porters 5 force model
  • FIG 7.Global Semiconductor Bonding Market, pest analysis
  • FIG 8.Global Semiconductor Bonding Market, value chain analysis
  • FIG 9.Global Semiconductor Bonding Market by segment, 2020 & 2030 (USD Billion)
  • FIG 10.Global Semiconductor Bonding Market by segment, 2020 & 2030 (USD Billion)
  • FIG 11.Global Semiconductor Bonding Market by segment, 2020 & 2030 (USD Billion)
  • FIG 12.Global Semiconductor Bonding Market by segment, 2020 & 2030 (USD Billion)
  • FIG 13.Global Semiconductor Bonding Market by segment, 2020 & 2030 (USD Billion)
  • FIG 14.Global Semiconductor Bonding Market, regional snapshot 2020 & 2030
  • FIG 15.North America Semiconductor Bonding Market 2020 & 2030 (USD Billion)
  • FIG 16.Europe Semiconductor Bonding Market 2020 & 2030 (USD Billion)
  • FIG 17.Asia pacific Semiconductor Bonding Market 2020 & 2030 (USD Billion)
  • FIG 18.Latin America Semiconductor Bonding Market 2020 & 2030 (USD Billion)
  • FIG 19.Middle East & Africa Semiconductor Bonding Market 2020 & 2030 (USD Billion)

List of tables and figures and dummy in nature, final lists may vary in the final deliverable

目次

Global Semiconductor Bonding Market is valued approximately at USD 0.91 billion in 2022 and is anticipated to grow with a healthy growth rate of more than 3.60% over the forecast period 2023-2030. Semiconductor bonding is the process of joining two semiconductor materials to create a functional device or structure. This bonding can be achieved through various techniques, and the choice of method depends on the specific application and the properties of the materials involved. Moreover, the rising demand for miniature electronic components, rising adoption of MEMS and sSensors, growing demand for electric and hybrid vehicles that are anticipated to create the lucrative demand for the market during forecast period 2023-2030.

Additionally, the growing demand for electric and hybrid vehicles is a significant factor contributing to the growth of the Semiconductor Bonding Market. The Electric vehicles (EVs) and hybrid electric vehicles (HEVs) rely heavily on power electronics for functions such as motor control, battery management, and power conversion. Semiconductor devices like such as insulated gate bipolar transistors (IGBTs) and power modules play a crucial role in these applications. According to The International Energy Agency, in 2019, the number of Battery Electric Vehicles (BEV) and Plug-in Hybrid Vehicles (PHEV) sold was 580,000 and 1,500,000, respectively. In 2022, the numbers reached 2,900,000 and 7,300,000, respectively. As a result, the growing demand for EVs is anticipated to propel lucrative demand for the market. Moreover, the growing adoption of IoT and AI in automotive sector, and increased connectivity and 5G adoption is anticipated to create the lucrative opportunity for the market growth. However, the high cost associated with semiconductor bonding solution stifles market growth throughout the forecast period of 2023-2030.

The key regions considered for the Global Semiconductor Bonding Market study includes Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. North America dominated the market in 2022 with largest market share owing to the increasing demand for electronic devices, growing technological advancements and innovations in semiconductor manufacturing, and rise in artificial intelligence (AI) and data centers. Whereas, the Asia Pacific region is expected to grow with the fastest growth rate during the forecast period, owing to factors such as the rising demand for electronic devices, growing expansion of semiconductor industry, increased investments in research and development, and growing adoption of internet of things (IoT).

Major market player included in this report are:

  • Besemiconductor
  • SUSS MicroTec SE
  • Kulicke and Soffa Industries
  • Shibuara Mechatronics Corporation
  • TDK Corporation
  • Palomar Technologies
  • EV Group (EVG)
  • SHINKAWA Electric Co., Ltd
  • Tokyo Electron Limited
  • Intel Corporation

Recent Developments in the Market:

  • In April 2021, ASM Pacific Technology has introduced three cutting-edge manufacturing systems that incorporate X-Celeprint's Micro Transfer Printing and ASM AMICRA's high-precision die bonding technology. These systems are designed to facilitate large-scale heterogeneous integration of ultra-thin dies, supporting wafer sizes of up to 300 mm.

Global Semiconductor Bonding Market Report Scope:

  • Historical Data - 2020 - 2021
  • Base Year for Estimation - 2022
  • Forecast period - 2023-2030
  • Report Coverage - Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
  • Segments Covered - Type, Process Type, Bonding Technology, Application, Region
  • Regional Scope - North America; Europe; Asia Pacific; Latin America; Middle East & Africa
  • Customization Scope - Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Type:

  • Die Bonder
  • Wafer Bonder
  • Flip Chip Bonder

By Process Type:

  • Die-To-Die Bonding
  • Die-To Wafer Bonding
  • Wafer-To-Wafer Bonding

By Bonding Technology:

  • Die Bonding Technology
  • Wafer Bonding Technology

By Application:

  • RF Devices
  • Mems and Sensors
  • CMOS Image Sensors
  • LED
  • 3D NAND

By Region:

  • North America
  • U.S.
  • Canada
  • Europe
  • UK
  • Germany
  • France
  • Spain
  • Italy
  • ROE
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • RoAPAC
  • Latin America
  • Brazil
  • Mexico
  • Middle East & Africa
  • Saudi Arabia
  • South Africa
  • Rest of Middle East & Africa

Table of Contents

Chapter 1.Executive Summary

  • 1.1.Market Snapshot
  • 1.2.Global & Segmental Market Estimates & Forecasts, 2020-2030 (USD Billion)
    • 1.2.1.Semiconductor Bonding Market, by region, 2020-2030 (USD Billion)
    • 1.2.2.Semiconductor Bonding Market, by Type, 2020-2030 (USD Billion)
    • 1.2.3.Semiconductor Bonding Market, by Process Type, 2020-2030 (USD Billion)
    • 1.2.4.Semiconductor Bonding Market, by Bonding Technology, 2020-2030 (USD Billion)
    • 1.2.5.Semiconductor Bonding Market, by Application, 2020-2030 (USD Billion)
  • 1.3.Key Trends
  • 1.4.Estimation Methodology
  • 1.5.Research Assumption

Chapter 2.Global Semiconductor Bonding Market Definition and Scope

  • 2.1.Objective of the Study
  • 2.2.Market Definition & Scope
    • 2.2.1.Industry Evolution
    • 2.2.2.Scope of the Study
  • 2.3.Years Considered for the Study
  • 2.4.Currency Conversion Rates

Chapter 3.Global Semiconductor Bonding Market Dynamics

  • 3.1.Semiconductor Bonding Market Impact Analysis (2020-2030)
    • 3.1.1.Market Drivers
      • 3.1.1.1.Rising demand for miniature electronic components
      • 3.1.1.2.Rising adoption of MEMS and Sensors
      • 3.1.1.3.Growing demand for electric and hybrid vehicles
    • 3.1.2.Market Challenges
      • 3.1.2.1.High cost associated with semiconductor bonding solution
      • 3.1.2.2.Increased complexities related to miniaturized structures of circuits
    • 3.1.3.Market Opportunities
      • 3.1.3.1.Growing adoption of IoT and AI in automotive sector
      • 3.1.3.2.Increased connectivity and 5G adoption

Chapter 4.Global Semiconductor Bonding Market: Industry Analysis

  • 4.1.Porter's 5 Force Model
    • 4.1.1.Bargaining Power of Suppliers
    • 4.1.2.Bargaining Power of Buyers
    • 4.1.3.Threat of New Entrants
    • 4.1.4.Threat of Substitutes
    • 4.1.5.Competitive Rivalry
  • 4.2.Porter's 5 Force Impact Analysis
  • 4.3.PEST Analysis
    • 4.3.1.Political
    • 4.3.2.Economical
    • 4.3.3.Social
    • 4.3.4.Technological
    • 4.3.5.Environmental
    • 4.3.6.Legal
  • 4.4.Top investment opportunity
  • 4.5.Top winning strategies
  • 4.6.COVID-19 Impact Analysis
  • 4.7.Disruptive Trends
  • 4.8.Industry Expert Perspective
  • 4.9.Analyst Recommendation & Conclusion

Chapter 5.Global Semiconductor Bonding Market, by Type

  • 5.1.Market Snapshot
  • 5.2.Global Semiconductor Bonding Market by Type, Performance - Potential Analysis
  • 5.3.Global Semiconductor Bonding Market Estimates & Forecasts by Type 2020-2030 (USD Billion)
  • 5.4.Semiconductor Bonding Market, Sub Segment Analysis
    • 5.4.1. Die Bonder
    • 5.4.2.Wafer Bonder
    • 5.4.3.Flip Chip Bonder

Chapter 6.Global Semiconductor Bonding Market, by Process Type

  • 6.1.Market Snapshot
  • 6.2.Global Semiconductor Bonding Market by Process Type, Performance - Potential Analysis
  • 6.3.Global Semiconductor Bonding Market Estimates & Forecasts by Process Type 2020-2030 (USD Billion)
  • 6.4.Semiconductor Bonding Market, Sub Segment Analysis
    • 6.4.1. Die-To-Die Bonding
    • 6.4.2.Die-To Wafer Bonding
    • 6.4.3.Wafer-To-Wafer Bonding

Chapter 7.Global Semiconductor Bonding Market, by Bonding Technology

  • 7.1.Market Snapshot
  • 7.2.Global Semiconductor Bonding Market by Bonding Technology, Performance - Potential Analysis
  • 7.3.Global Semiconductor Bonding Market Estimates & Forecasts by Bonding Technology 2020-2030 (USD Billion)
  • 7.4.Semiconductor Bonding Market, Sub Segment Analysis
    • 7.4.1. Die Bonding Technology
    • 7.4.2.Wafer Bonding Technology

Chapter 8.Global Semiconductor Bonding Market, by Application

  • 8.1.Market Snapshot
  • 8.2.Global Semiconductor Bonding Market by Application, Performance - Potential Analysis
  • 8.3.Global Semiconductor Bonding Market Estimates & Forecasts by Application 2020-2030 (USD Billion)
  • 8.4.Semiconductor Bonding Market, Sub Segment Analysis
    • 8.4.1. RF Devices
    • 8.4.2.Mems and Sensors
    • 8.4.3.CMOS Image Sensors
    • 8.4.4.LED
    • 8.4.5.3D NAND

Chapter 9.Global Semiconductor Bonding Market, Regional Analysis

  • 9.1.Top Leading Countries
  • 9.2.Top Emerging Countries
  • 9.3.Semiconductor Bonding Market, Regional Market Snapshot
  • 9.4.North America Semiconductor Bonding Market
    • 9.4.1.U.S. Semiconductor Bonding Market
      • 9.4.1.1.Type breakdown estimates & forecasts, 2020-2030
      • 9.4.1.2.Process Type breakdown estimates & forecasts, 2020-2030
      • 9.4.1.3.Bonding Technology breakdown estimates & forecasts, 2020-2030
      • 9.4.1.4.Application breakdown estimates & forecasts, 2020-2030
    • 9.4.2.Canada Semiconductor Bonding Market
  • 9.5.Europe Semiconductor Bonding Market Snapshot
    • 9.5.1.U.K. Semiconductor Bonding Market
    • 9.5.2.Germany Semiconductor Bonding Market
    • 9.5.3.France Semiconductor Bonding Market
    • 9.5.4.Spain Semiconductor Bonding Market
    • 9.5.5.Italy Semiconductor Bonding Market
    • 9.5.6.Rest of Europe Semiconductor Bonding Market
  • 9.6.Asia-Pacific Semiconductor Bonding Market Snapshot
    • 9.6.1.China Semiconductor Bonding Market
    • 9.6.2.India Semiconductor Bonding Market
    • 9.6.3.Japan Semiconductor Bonding Market
    • 9.6.4.Australia Semiconductor Bonding Market
    • 9.6.5.South Korea Semiconductor Bonding Market
    • 9.6.6.Rest of Asia Pacific Semiconductor Bonding Market
  • 9.7.Latin America Semiconductor Bonding Market Snapshot
    • 9.7.1.Brazil Semiconductor Bonding Market
    • 9.7.2.Mexico Semiconductor Bonding Market
  • 9.8.Middle East & Africa Semiconductor Bonding Market
    • 9.8.1.Saudi Arabia Semiconductor Bonding Market
    • 9.8.2.South Africa Semiconductor Bonding Market
    • 9.8.3.Rest of Middle East & Africa Semiconductor Bonding Market

Chapter 10.Competitive Intelligence

  • 10.1.Key Company SWOT Analysis
  • 10.2.Top Market Strategies
  • 10.3.Company Profiles
    • 10.3.1. Besemiconductor
      • 10.3.1.1.Key Information
      • 10.3.1.2.Overview
      • 10.3.1.3.Financial (Subject to Data Availability)
      • 10.3.1.4.Product Summary
      • 10.3.1.5.Recent Developments
    • 10.3.2. SUSS MicroTec SE
    • 10.3.3.Kulicke and Soffa Industries
    • 10.3.4.Shibuara Mechatronics Corporation
    • 10.3.5.TDK Corporation
    • 10.3.6.Palomar Technologies
    • 10.3.7.EV Group (EVG)
    • 10.3.8.SHINKAWA Electric Co., Ltd
    • 10.3.9.Tokyo Electron Limited
    • 10.3.10.Intel Corporation

Chapter 11.Research Process

  • 11.1.Research Process
    • 11.1.1.Data Mining
    • 11.1.2.Analysis
    • 11.1.3.Market Estimation
    • 11.1.4.Validation
    • 11.1.5.Publishing
  • 11.2.Research Attributes
  • 11.3.Research Assumption