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ダイボンダー装置市場レポート：2030年までの動向、予測、競合分析

Die Bonder Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日: | 発行: Lucintel | ページ情報: 英文 150 - page report | 納期: 3営業日

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ダイボンダー装置市場レポート：2030年までの動向、予測、競合分析
出版日: 2024年01月29日
発行: Lucintel
ページ情報: 英文 150 - page report
納期: 3営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

ダイボンダー装置の動向と予測

世界のダイボンダー装置市場は、2024年から2030年までのCAGRが3.0%で、2030年には推定8億3,330万米ドルに達すると予測されています。この市場の主な促進要因は、モノのインターネット（IoT）機器におけるスタックダイ技術の利用の増加、極小電子部品への需要の高まり、半導体IC設計の複雑化に伴うワイヤレスアプリケーション向けの高品質半導体ICのニーズの拡大です。世界のダイボンダー装置市場の将来は、民生用電子機器、自動車、産業、通信、ヘルスケア、航空宇宙・防衛の各市場における機会で有望視されています。

ダイボンダー装置市場の洞察

Lucintelの予測では、全自動ダイボンダーは、大規模な組み立てとパッケージング、精度の向上、自動組み立てとパッケージングなどの有利な特性により、予測期間中に最も高い成長が見込まれています。

アジア太平洋は、タブレットやスマートフォンのニーズが高まっていること、メーカーが豊富であることから、予測期間中に最も高い成長が見込まれています。

よくある質問

Q1.市場規模は？

A1.ダイボンダー装置の世界市場は、2030年までに推定8億3,330万米ドルに達する見込みです。

Q2.市場の成長予測は？

A2.ダイボンダー装置の世界市場は、2024年から2030年にかけてCAGR 3.0%で成長すると予測されます。

Q3.市場の成長に影響を与える主な促進要因は？

A3.この市場の主な促進要因は、モノのインターネット（IoT）機器におけるスタックダイ技術の使用の増加、極小電子部品への需要の増加、半導体IC設計の複雑化に伴うワイヤレスアプリケーション向けの高品質半導体ICのニーズの拡大です。

Q4.市場の主要セグメントは？

A4.世界のダイボンダー装置市場の将来は、民生用電子機器、自動車、産業、通信、ヘルスケア、航空宇宙・防衛市場に機会があり、有望です。

Q5.市場の主要企業は？

A5.ダイボンダー装置の主要企業は以下の通りです。

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies

Q6.今後、最大となる市場セグメントは？

A6.Lucintelの予測では、全自動ダイボンダーは、大規模な組み立てとパッケージング、精度の向上、自動化された組み立てとパッケージングなどの有利な特性により、予測期間中に最も高い成長が見込まれています。

Q7.市場において、今後5年間に最大になると予想される地域は？

A7.APACは、タブレットやスマートフォンへのニーズの高まりと、同地域のメーカーの多さから、予測期間中に最も高い成長が見込まれます。

Q8.レポートのカスタマイズは可能？

A8.はい、Lucintelは追加費用なしで10％のカスタマイズを提供します。

目次

第1章 エグゼクティブサマリー

第2章 世界のダイボンダー装置市場：市場力学

  • イントロダクション、背景、分類
  • サプライチェーン
  • 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

  • マクロ経済動向（2018～2023年）と予測（2024～2030年）
  • 世界のダイボンダー装置市場動向（2018～2023年）と予測（2024～2030年）
  • タイプ別の世界のダイボンダー装置市場
    • 手動ダイボンダー
    • 半自動ダイボンダー
    • 全自動ダイボンダー
  • ボンディング技術別の世界のダイボンダー装置市場
    • エポキシ
    • 共晶
    • 軟質ハンダ
    • その他
  • デバイス別の世界のダイボンダー装置市場
    • オプトエレクトロニクス
    • MEMSとMOEMS
    • パワーデバイス
  • 用途別の世界のダイボンダー装置市場
    • 家電
    • 自動車
    • 産業用
    • 電気通信
    • ヘルスケア
    • 航空宇宙と防衛
    • その他

第4章 2018年から2030年までの地域別の市場動向と予測分析

  • 地域別の世界のダイボンダー装置市場
  • 北米のダイボンダー装置市場
  • 欧州のダイボンダー装置市場
  • アジア太平洋のダイボンダー装置市場
  • その他地域のダイボンダー装置市場

第5章 競合の分析

  • 製品ポートフォリオ分析
  • 運用上の統合
  • ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

  • 成長機会分析
    • タイプ別の世界のダイボンダー装置市場の成長機会
    • ボンディング技術別の世界のダイボンダー装置市場の成長機会
    • デバイス別の世界のダイボンダー装置市場の成長機会
    • 用途別の世界のダイボンダー装置市場の成長機会
    • 地域別の世界のダイボンダー装置市場の成長機会
  • 世界のダイボンダー装置市場の新たな動向
  • 戦略的分析
    • 新製品の開発
    • 世界のダイボンダー装置市場の能力拡大
    • 世界のダイボンダー装置市場における合併、買収、合弁事業
    • 認証とライセンシング

第7章 有力企業の企業プロファイル

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies
目次

Die Bonder Equipment Trends and Forecast

The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets. The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030 with a CAGR of 3.0% from 2024 to 2030. The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.

A more than 150-page report is developed to help in your business decisions.

Die Bonder Equipment by Segment

The study includes a forecast for the global die bonder equipment by type, bonding technique, device, application, and region.

Die Bonder Equipment Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Manual Die Bonders
  • Semiautomatic Die Bonders
  • Fully Automatic Die Bonders

Die Bonder Equipment Market by Bonding Technique [Shipment Analysis by Value from 2018 to 2030]:

  • Epoxy
  • Eutectic
  • Soft Solder
  • Others

Die Bonder Equipment Market by Device [Shipment Analysis by Value from 2018 to 2030]:

  • Optoelectronics
  • MEMS and MOEMS
  • Power Devices

Die Bonder Equipment Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • Automotive
  • Industrial
  • Telecommunications
  • Healthcare
  • Aerospace & Defense
  • Others

Die Bonder Equipment Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Die Bonder Equipment Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies die bonder equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the die bonder equipment companies profiled in this report include-

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies

Die Bonder Equipment Market Insights

Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.

APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.

Features of the Global Die Bonder Equipment Market

Market Size Estimates: Die bonder equipment market size estimation in terms of value ($M).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Die bonder equipment market size by bonding technique, device, application, and region in terms of value ($M).

Regional Analysis: Die bonder equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, bonding technique, device, application, and regions for the die bonder equipment market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the die bonder equipment market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the die bonder equipment market size?

Answer: The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030.

Q2. What is the growth forecast for die bonder equipment market?

Answer: The global die bonder equipment market is expected to grow with a CAGR of 3.0% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the die bonder equipment market?

Answer: The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.

Q4. What are the major segments for die bonder equipment market?

Answer: The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets.

Q5. Who are the key die bonder equipment market companies?

Answer: Some of the key die bonder equipment companies are as follows.

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies

Q6. Which die bonder equipment market segment will be the largest in future?

Answer: Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.

Q7. In die bonder equipment market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the die bonder equipment market by type (manual die bonders, semiautomatic die bonders, and fully automatic die bonders), bonding technique (epoxy, eutectic, soft solder, and others), device (optoelectronics, MEMS and MOEMS, and power devices), application (consumer electronics, automotive, industrial, telecommunications, healthcare, aerospace & defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Die Bonder Equipment Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Die Bonder Equipment Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Die Bonder Equipment Market by Type
    • 3.3.1: Manual Die Bonders
    • 3.3.2: Semiautomatic Die Bonders
    • 3.3.3: Fully Automatic Die Bonders
  • 3.4: Global Die Bonder Equipment Market by Bonding Technique
    • 3.4.1: Epoxy
    • 3.4.2: Eutectic
    • 3.4.3: Soft Solder
    • 3.4.4: Others
  • 3.5: Global Die Bonder Equipment Market by Device
    • 3.5.1: Optoelectronics
    • 3.5.2: MEMS and MOEMS
    • 3.5.3: Power Devices
  • 3.6: Global Die Bonder Equipment Market by Application
    • 3.6.1: Consumer Electronics
    • 3.6.2: Automotive
    • 3.6.3: Industrial
    • 3.6.4: Telecommunications
    • 3.6.5: Healthcare
    • 3.6.6: Aerospace & Defense
    • 3.6.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Die Bonder Equipment Market by Region
  • 4.2: North American Die Bonder Equipment Market
    • 4.2.2: North American Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others
  • 4.3: European Die Bonder Equipment Market
    • 4.3.1: European Die Bonder Equipment Market by Type: Manual Die Bonders, Semiautomatic Die Bonders, and Fully Automatic Die Bonders
    • 4.3.2: European Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others
  • 4.4: APAC Die Bonder Equipment Market
    • 4.4.1: APAC Die Bonder Equipment Market by Type: Manual Die Bonders, Semiautomatic Die Bonders, and Fully Automatic Die Bonders
    • 4.4.2: APAC Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others
  • 4.5: ROW Die Bonder Equipment Market
    • 4.5.1: ROW Die Bonder Equipment Market by Type: Manual Die Bonders, Semiautomatic Die Bonders, and Fully Automatic Die Bonders
    • 4.5.2: ROW Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Die Bonder Equipment Market by Type
    • 6.1.2: Growth Opportunities for the Global Die Bonder Equipment Market by Bonding Technique
    • 6.1.3: Growth Opportunities for the Global Die Bonder Equipment Market by Device
    • 6.1.4: Growth Opportunities for the Global Die Bonder Equipment Market by Application
    • 6.1.5: Growth Opportunities for the Global Die Bonder Equipment Market by Region
  • 6.2: Emerging Trends in the Global Die Bonder Equipment Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Die Bonder Equipment Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Die Bonder Equipment Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: BE Semiconductor Industries
  • 7.2: ASM Pacific Technology
  • 7.3: Kulicke & Soffa
  • 7.4: Mycronic
  • 7.5: Palomar Technologies
  • 7.6: West*Bond
  • 7.7: MicroAssembly Technologies