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半導体接合材料の世界市場：動向、機会、競合分析（2023年～2028年）

Semiconductor Bonding Material Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日: | 発行: Lucintel | ページ情報: 英文 150 Pages | 納期: 3営業日

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半導体接合材料の世界市場：動向、機会、競合分析（2023年～2028年）
出版日: 2023年04月01日
発行: Lucintel
ページ情報: 英文 150 Pages
納期: 3営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

世界の半導体接合材料の市場規模は、2023年～2028年の間にCAGR8%で成長し、2028年までに推定9億米ドルに達すると予想されています。この市場の主な促進要因は、マイクロエレクトロメカニカルシステムの需要の高まり、電気自動車への嗜好の高まり、IoT（モノのインターネット）ベースのデバイスにおけるスタックダイ技術の需要の高まりです。

当レポートでは、世界の半導体接合材料市場について調査分析し、市場力学、セグメント別・地域別の市場動向と予測、競合情勢、主要企業プロファイルなどを提供しています。

目次

第1章 エグゼクティブサマリー

第2章 世界の半導体接合材料市場：市場力学

  • イントロダクション、背景、および分類
  • サプライチェーン
  • 業界の原動力と課題

第3章 市場動向と予測分析（2017年～2028年）

  • マクロ経済の動向（2017年～2022年）と予測（2023年～2028年）
  • 世界の半導体接合材料市場の動向（2017年～2022年）と予測（2023年～2028年）
  • 世界の半導体接合材料市場：製品タイプ別
    • ダイボンダー
    • ウエハボンダー
    • フリップチップボンダー
  • 世界の半導体接合材料市場：加工タイプ別
    • ダイ -to- ダイ（D2D）接合
    • ダイ -to- ウエハ（D2W）接合
    • ウエハ -to- ウエハ（W2W）接合
  • 世界の半導体接合材料市場：接合技術別
    • ダイボンディング技術
    • ウエハ接合技術
  • 世界の半導体接合材料市場：用途別
    • RFデバイス
    • CMOSイメージセンサー
    • LED
    • 3D NAND
    • MEMSとセンサー

第4章 市場動向と予測分析：地域別（2017年～2028年）

  • 世界の半導体接合材料市場：地域別
  • 北米
    • 製品タイプ別
    • 用途別
  • 欧州
    • 製品タイプ別
    • 用途別
  • アジア太平洋
    • 製品タイプ別
    • 用途別
  • 世界のその他地域
    • 製品タイプ別
    • 用途別

第5章 競合分析

  • 製品ポートフォリオ分析
  • 運用統合
  • ポーターのファイブフォース分析

第6章 成長機会と戦略分析

  • 成長機会分析
    • 製品タイプ別
    • 加工タイプ別
    • 接合技術別
    • 用途別
    • 地域別
  • 市場の新たな動向
  • 戦略分析
    • 新製品の開発
    • 市場の能力拡大
    • 合併、買収、および合弁事業
    • 認定とライセンス

第7章 主要企業プロファイル

  • ASM Pacific
  • BE Semiconductor
  • Panasonic
  • Fasford
  • Shinkawa
  • EV Group
目次

Semiconductor Bonding Material Market Trends and Forecast

The future of the global semiconductor bonding material market looks promising with opportunities in the RF device, CMOS image sensor, LED, 3D NAND, and MEMS & sensor applications. The global semiconductor bonding material market is expected to reach an estimated $0.90 billion by 2028 with a CAGR of 8% from 2023 to 2028. The major drivers for this market are rising demand for micro-electromechanical systems, growing preference for electric vehicles, and escalating demand for stacked die technology in IoT (internet of things)-based devices.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Semiconductor Bonding Material Market by Segment

The study includes a forecast for the global semiconductor bonding material market by product type, process type, bonding technology, application, and region, as follows:

Semiconductor Bonding Material Market by Product Type [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Die Bonder
  • Wafer Bonder
  • Flip Chip Bonder

Semiconductor Bonding Material Market by Process Type [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Die to Die Bonding
  • Die to Wafer Bonding
  • Wafer to Wafer Bonding

Semiconductor Bonding Material Market by Bonding Technology [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Die Bonding Technology
  • Wafer Bonding Technology
    • Wafer Bonding Technology
  • Direct and Anodic Wafer Bonding
  • Indirect Wafer Bonding

Semiconductor Bonding Material Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:

  • RF Devices
  • CMOS Image Sensors
  • LED
  • 3D NAND
  • MEMS and Sensors

Semiconductor Bonding Material Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Semiconductor Bonding Material Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor bonding material companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductors bonding material companies profiled in this report include.

  • ASM Pacific
  • BE Semiconductor
  • Panasonic
  • Fasford
  • Shinkawa
  • EV Group

Semiconductor Bonding Material Market Insights

  • Lucintel forecasts that wafer bonder will remain the largest segment over the forecast period due to increasing application in manufacturing ICs, microsystems, nanoelectronics, and other micromechanical systems.
  • LED is expected to remain the largest segment due to expanding usage of semiconductor bonding materials in various applications, such as street lighting, APAC will remain the largest region due to growing production and adoption of electronic products and the presence some of the largest semiconductor companies in countries like China, India, and Vietnam.

Features of the Semiconductor Bonding Material Market

  • Market Size Estimates: Semiconductor bonding material market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: Semiconductor bonding material market size by various segments, such as by product type, process type, bonding technology, application, and region
  • Regional Analysis: Semiconductor bonding material market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different by product type, process type, bonding technology, application, and regions for the semiconductor bonding material market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the semiconductor bonding material market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the semiconductor bonding material market size?

Answer: The global semiconductor bonding material market is expected to reach an estimated $0.90 billion by 2028.

Q2. What is the growth forecast for semiconductor bonding material market?

Answer: The global semiconductor bonding material market is expected to grow with a CAGR of 8% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the semiconductor bonding material market?

Answer: The major drivers for this market are rising demand for micro-electromechanical systems, growing preference for electric vehicles, and escalating demand for stacked die technology in IoT (internet of things)-based devices.

Q4. What are the major segments for semiconductor bonding material market?

Answer: The future of the semiconductor bonding material market looks promising with opportunities in the RF device, CMOS image sensor, LED, 3D NAND, and MEMS & sensor applications.

Q5. Who are the key semiconductor bonding material companies?

Answer: Some of the key semiconductors bonding material companies are as follows:

  • ASM Pacific
  • BE Semiconductor
  • Panasonic
  • Fasford
  • Shinkawa
  • EV Group

Q6. Which semiconductor bonding material segment will be the largest in future?

Answer:Lucintel forecasts that wafer bonder will remain the largest segment over the forecast period due to increasing application in manufacturing ICs, microsystems, nanoelectronics, and other micromechanical systems.

Q7. In semiconductor bonding material market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region due to growing production and adoption of electronic products and the presence some of the largest semiconductor companies in countries like China, India, and Vietnam.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1. What are some of the most promising, high-growth opportunities for the semiconductor bonding material market by product type (die bonder, wafer bonder, and flip chip bonder), process type (die to die bonding, die to wafer bonding, and wafer to wafer bonding), bonding technology (die bonding technology and wafer bonding technology), application (RF devices, CMOS image sensors, LED, 3D NAND, and MEMS & sensors), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Semiconductor Bonding Material Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global Semiconductor Bonding Material Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global Semiconductor Bonding Material Market by Product Type
    • 3.3.1: Die Bonder
    • 3.3.2: Wafer Bonder
    • 3.3.3 Flip Chip Bonder
  • 3.4: Global Semiconductor Bonding Material Market by Process Type
    • 3.4.1: Die to Die Bonding
    • 3.4.2: Die to Wafer Bonding
    • 3.4.3: Wafer to Wafer Bonding
  • 3.5: Global Semiconductor Bonding Material Market by Bonding Technology
    • 3.5.1: Die Bonding Technology
    • 3.5.2: Wafer Bonding Technology
      • 3.5.2.1: Wafer Bonding Technology
        • 3.5.2.1.1: Direct and Anodic Wafer Bonding
        • 3.5.2.1.2: Indirect Wafer Bonding
  • 3.6: Global Semiconductor Bonding Material Market by Application
    • 3.6.1: RF Devices
    • 3.6.2: CMOS Image Sensors
    • 3.6.3: LED
    • 3.6.4: 3D NAND
    • 3.6.5: MEMS and Sensors

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Global Semiconductor Bonding Material Market by Region
  • 4.2: North American Semiconductor Bonding Material Market
    • 4.2.1: North American Semiconductor Bonding Material Market by Product Type: Die Bonder, Wafer Bonder, and Flip Chip Bonder
    • 4.2.2: North American Semiconductor Bonding Material Market by Application: RF Devices, CMOS Image Sensors, LED, 3D NAND, and MEMS & Sensors
  • 4.3: European Semiconductor Bonding Material Market
    • 4.3.1: European Semiconductor Bonding Material Market by Product Type: Die Bonder, Wafer Bonder, and Flip Chip Bonder
    • 4.3.2: European Semiconductor Bonding Material Market by Application: RF Devices, CMOS Image Sensors, LED, 3D NAND, and MEMS & Sensors
  • 4.4: APAC Semiconductor Bonding Material Market
    • 4.4.1: APAC Semiconductor Bonding Material Market by Product Type: Die Bonder, Wafer Bonder, and Flip Chip Bonder
    • 4.4.2: APAC Semiconductor Bonding Material Market by Application: RF Devices, CMOS Image Sensors, LED, 3D NAND, and MEMS & Sensors
  • 4.5: ROW Semiconductor Bonding Material Market
    • 4.5.1: ROW Semiconductor Bonding Material Market by Product Type: Die Bonder, Wafer Bonder, and Flip Chip Bonder
    • 4.5.2: ROW Semiconductor Bonding Material Market by Application: RF Devices, CMOS Image Sensors, LED, 3D NAND, and MEMS & Sensors

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Semiconductor Bonding Material Market by Product Type
    • 6.1.2: Growth Opportunities for the Global Semiconductor Bonding Material Market by Process Type
    • 6.1.3: Growth Opportunities for the Global Semiconductor Bonding Material Market by Bonding Technology
    • 6.1.4: Growth Opportunities for the Global Semiconductor Bonding Material Market by Application
    • 6.1.5: Growth Opportunities for the Global Semiconductor Bonding Material Market by Region
  • 6.2: Emerging Trends in the Global Semiconductor Bonding Material Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Semiconductor Bonding Material Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Semiconductor Bonding Material Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: ASM Pacific
  • 7.2: BE Semiconductor
  • 7.3: Panasonic
  • 7.4: Fasford
  • 7.5: Shinkawa
  • 7.6: EV Group