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1413467

半導体ボンディング市場：タイプ別、用途別-2024-2030年の世界予測

Semiconductor Bonding Market by Type (Die Bonder, Flip Chip Bonder, Wafer Bonder), Application (CMOS Image Sensors, LED, MEMS & Sensors) - Global Forecast 2024-2030
出版日: | 発行: 360iResearch | ページ情報: 英文 183 Pages | 納期: 即日から翌営業日

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価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=157.90円
半導体ボンディング市場：タイプ別、用途別-2024-2030年の世界予測
出版日: 2024年01月15日
発行: 360iResearch
ページ情報: 英文 183 Pages
納期: 即日から翌営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 図表
  • 目次
概要

半導体ボンディング市場規模は2023年に10億1,000万米ドルと推定され、2024年には10億1,000万米ドルに達し、CAGR 6.23%で2030年には15億4,000万米ドルに達すると予測されます。

半導体ボンディングの世界市場

主な市場の統計
基準年[2023］ 10億1,000万米ドル
予測年[2024］ 10億1,000万米ドル
予測年 [2030] 15億4,000万米ドル
CAGR（%） 6.23%
半導体ボンディング Market-IMG1

FPNVポジショニング・マトリックス

FPNVポジショニングマトリックスは半導体ボンディング市場を評価する上で極めて重要です。事業戦略と製品満足度に関連する主要指標を調査し、ベンダーの包括的な評価を提供します。この綿密な分析により、ユーザーは各自の要件に沿った十分な情報に基づいた意思決定を行うことができます。評価に基づき、ベンダーは成功の度合いが異なる4つの象限に分類されます：フォアフロント（F）、パスファインダー（P）、ニッチ（N）、バイタル（V）です。

市場シェア分析

市場シェア分析は、半導体ボンディング市場におけるベンダーの現状について、洞察に満ちた詳細な調査を提供する包括的なツールです。全体的な収益、顧客基盤、その他の主要指標についてベンダーの貢献度を綿密に比較・分析することで、企業の業績や市場シェア争いの際に直面する課題について理解を深めることができます。さらに、この分析により、調査対象基準年に観察された累積、断片化の優位性、合併の特徴などの要因を含む、この分野の競合特性に関する貴重な考察が得られます。このような詳細レベルの拡大により、ベンダーはより多くの情報に基づいた意思決定を行い、市場で競争優位に立つための効果的な戦略を考案することができます。

本レポートは、以下の側面に関する貴重な洞察を提供しています：

1-市場の浸透度：主要企業が提供する市場に関する包括的な情報を提示しています。

2-市場の開拓度：有利な新興市場を深く掘り下げ、成熟市場セグメントにおける浸透度を分析しています。

3-市場の多様化：新製品の発売、未開拓の地域、最近の開発、投資に関する詳細な情報を提供します。

4-競合の評価と情報：市場シェア、戦略、製品、認証、規制状況、特許状況、主要企業の製造能力などを網羅的に評価します。

5-製品開発およびイノベーション：将来の技術、研究開発活動、画期的な製品開発に関する知的洞察を提供します。

本レポートは、以下のような主要な質問に対応しています：

1-半導体ボンディング市場の市場規模および予測は？

2-半導体ボンディング市場の予測期間中に投資を検討すべき製品、セグメント、用途、分野は何か？

3-半導体ボンディング市場における技術動向と規制の枠組みは？

4-半導体ボンディング市場における主要ベンダーの市場シェアは？

5-半導体ボンディング市場への参入に適した形態や戦略的手段は？

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

  • 市場力学
    • 促進要因
      • 世界中の半導体製造の急激な成長と相まって、小型電子デバイスへの継続的な移行
      • 政府の重要な取り組みによる電気自動車およびハイブリッド車の普及拡大による潜在需要
      • モノのインターネット（IoT）ソリューションにおけるスタックドダイテクノロジーの採用が急増
    • 抑制要因
      • 半導体ボンディングソリューションの処理と所有権に関連する高コスト
    • 機会
      • 世界中の半導体製造に対する政府の有利な取り組みと投資
      • 家庭用電化製品とスマートデバイスの利用が世界中で急増
    • 課題
      • 小型電子デバイス製造の複雑さに伴う懸念
  • 市場セグメンテーション分析
  • 市場動向分析
  • 高インフレの累積的影響
  • ポーターのファイブフォース分析
  • バリューチェーンとクリティカルパス分析
  • 規制の枠組み

第6章 半導体ボンディング市場：タイプ別

  • ダイボンダー
  • フリップチップボンダー
  • ウエハーボンダー

第7章 半導体ボンディング市場：用途別

  • CMOSイメージセンサー
  • 導かれた
  • MEMSとセンサー
  • 高周波デバイス

第8章 南北アメリカの半導体ボンディング市場

  • アルゼンチン
  • ブラジル
  • カナダ
  • メキシコ
  • 米国

第9章 アジア太平洋地域の半導体ボンディング市場

  • オーストラリア
  • 中国
  • インド
  • インドネシア
  • 日本
  • マレーシア
  • フィリピン
  • シンガポール
  • 韓国
  • 台湾
  • タイ
  • ベトナム

第10章 欧州・中東・アフリカの半導体ボンディング市場

  • デンマーク
  • エジプト
  • フィンランド
  • フランス
  • ドイツ
  • イスラエル
  • イタリア
  • オランダ
  • ナイジェリア
  • ノルウェー
  • ポーランド
  • カタール
  • ロシア
  • サウジアラビア
  • 南アフリカ
  • スペイン
  • スウェーデン
  • スイス
  • トルコ
  • アラブ首長国連邦
  • 英国

第11章 競合情勢

  • FPNVポジショニングマトリクス
  • 市場シェア分析：主要企業別
  • 競合シナリオ主要企業別の分析

第12章 競争力のあるポートフォリオ

  • 主要な企業プロファイル
    • Applied Microengineering Ltd.
    • ASM Pacific Technology Ltd.
    • Ayumi Industries Co. Ltd.
    • BE Semiconductor Industries N.V.
    • Canon Anelva Corporation
    • Dr. Tresky AG
    • EV Group
    • Fasford Technology Co. Ltd.
    • Finetech GmbH & Co. KG
    • Kulicke and Soffa Industries Inc.
    • Mycronic AB
    • Palomar Technologies Inc.
    • SET Corporation SA
    • Shibaura Mechatronics Corporation
    • TDK Corporation
  • 主要な製品ポートフォリオ

第13章 付録

  • ディスカッションガイド
  • ライセンスと価格について
図表

LIST OF FIGURES

  • FIGURE 1. SEMICONDUCTOR BONDING MARKET RESEARCH PROCESS
  • FIGURE 2. SEMICONDUCTOR BONDING MARKET SIZE, 2023 VS 2030
  • FIGURE 3. SEMICONDUCTOR BONDING MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. SEMICONDUCTOR BONDING MARKET SIZE, BY REGION, 2023 VS 2030 (%)
  • FIGURE 5. SEMICONDUCTOR BONDING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. SEMICONDUCTOR BONDING MARKET DYNAMICS
  • FIGURE 7. SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 8. SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 9. SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 10. SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 11. AMERICAS SEMICONDUCTOR BONDING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 12. AMERICAS SEMICONDUCTOR BONDING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 13. UNITED STATES SEMICONDUCTOR BONDING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 14. UNITED STATES SEMICONDUCTOR BONDING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 15. ASIA-PACIFIC SEMICONDUCTOR BONDING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 16. ASIA-PACIFIC SEMICONDUCTOR BONDING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR BONDING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 18. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR BONDING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 19. SEMICONDUCTOR BONDING MARKET, FPNV POSITIONING MATRIX, 2023
  • FIGURE 20. SEMICONDUCTOR BONDING MARKET SHARE, BY KEY PLAYER, 2023

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR BONDING MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. SEMICONDUCTOR BONDING MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR BONDING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 6. SEMICONDUCTOR BONDING MARKET SIZE, BY DIE BONDER, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 7. SEMICONDUCTOR BONDING MARKET SIZE, BY FLIP CHIP BONDER, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 8. SEMICONDUCTOR BONDING MARKET SIZE, BY WAFER BONDER, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 10. SEMICONDUCTOR BONDING MARKET SIZE, BY CMOS IMAGE SENSORS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. SEMICONDUCTOR BONDING MARKET SIZE, BY LED, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. SEMICONDUCTOR BONDING MARKET SIZE, BY MEMS & SENSORS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. SEMICONDUCTOR BONDING MARKET SIZE, BY RADIOFREQUENCY DEVICES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. AMERICAS SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 15. AMERICAS SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 16. AMERICAS SEMICONDUCTOR BONDING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 17. ARGENTINA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 18. ARGENTINA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 19. BRAZIL SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 20. BRAZIL SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 21. CANADA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 22. CANADA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 23. MEXICO SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 24. MEXICO SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 25. UNITED STATES SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 26. UNITED STATES SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 27. UNITED STATES SEMICONDUCTOR BONDING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 28. ASIA-PACIFIC SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 29. ASIA-PACIFIC SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 30. ASIA-PACIFIC SEMICONDUCTOR BONDING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 31. AUSTRALIA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 32. AUSTRALIA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 33. CHINA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 34. CHINA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 35. INDIA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 36. INDIA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 37. INDONESIA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 38. INDONESIA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 39. JAPAN SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 40. JAPAN SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 41. MALAYSIA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 42. MALAYSIA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 43. PHILIPPINES SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. PHILIPPINES SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 45. SINGAPORE SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 46. SINGAPORE SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 47. SOUTH KOREA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. SOUTH KOREA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 49. TAIWAN SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 50. TAIWAN SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 51. THAILAND SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 52. THAILAND SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 53. VIETNAM SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 54. VIETNAM SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 55. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 56. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 57. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR BONDING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 58. DENMARK SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 59. DENMARK SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 60. EGYPT SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 61. EGYPT SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 62. FINLAND SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 63. FINLAND SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 64. FRANCE SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 65. FRANCE SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 66. GERMANY SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 67. GERMANY SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 68. ISRAEL SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 69. ISRAEL SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 70. ITALY SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 71. ITALY SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 72. NETHERLANDS SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 73. NETHERLANDS SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 74. NIGERIA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 75. NIGERIA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 76. NORWAY SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 77. NORWAY SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 78. POLAND SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 79. POLAND SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 80. QATAR SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 81. QATAR SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 82. RUSSIA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 83. RUSSIA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 84. SAUDI ARABIA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 85. SAUDI ARABIA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 86. SOUTH AFRICA SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 87. SOUTH AFRICA SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 88. SPAIN SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 89. SPAIN SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 90. SWEDEN SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 91. SWEDEN SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 92. SWITZERLAND SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 93. SWITZERLAND SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 94. TURKEY SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 95. TURKEY SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 96. UNITED ARAB EMIRATES SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 97. UNITED ARAB EMIRATES SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 98. UNITED KINGDOM SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 99. UNITED KINGDOM SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 100. SEMICONDUCTOR BONDING MARKET, FPNV POSITIONING MATRIX, 2023
  • TABLE 101. SEMICONDUCTOR BONDING MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 102. SEMICONDUCTOR BONDING MARKET LICENSE & PRICING
目次
Product Code: MRR-8201ABF21924

[183 Pages Report] The Semiconductor Bonding Market size was estimated at USD 1.01 billion in 2023 and expected to reach USD 1.01 billion in 2024, at a CAGR 6.23% to reach USD 1.54 billion by 2030.

Global Semiconductor Bonding Market

KEY MARKET STATISTICS
Base Year [2023] USD 1.01 billion
Estimated Year [2024] USD 1.01 billion
Forecast Year [2030] USD 1.54 billion
CAGR (%) 6.23%
Semiconductor Bonding Market - IMG1

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Semiconductor Bonding Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Semiconductor Bonding Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Semiconductor Bonding Market, highlighting leading vendors and their innovative profiles. These include Applied Microengineering Ltd., ASM Pacific Technology Ltd., Ayumi Industries Co. Ltd., BE Semiconductor Industries N.V., Canon Anelva Corporation, Dr. Tresky AG, EV Group, Fasford Technology Co. Ltd., Finetech GmbH & Co. KG, Kulicke and Soffa Industries Inc., Mycronic AB, Palomar Technologies Inc., SET Corporation SA, Shibaura Mechatronics Corporation, and TDK Corporation.

Market Segmentation & Coverage

This research report categorizes the Semiconductor Bonding Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Type
    • Die Bonder
    • Flip Chip Bonder
    • Wafer Bonder
  • Application
    • CMOS Image Sensors
    • LED
    • MEMS & Sensors
    • Radiofrequency Devices
  • Region
    • Americas
      • Argentina
      • Brazil
      • Canada
      • Mexico
      • United States
        • California
        • Florida
        • Illinois
        • New York
        • Ohio
        • Pennsylvania
        • Texas
    • Asia-Pacific
      • Australia
      • China
      • India
      • Indonesia
      • Japan
      • Malaysia
      • Philippines
      • Singapore
      • South Korea
      • Taiwan
      • Thailand
      • Vietnam
    • Europe, Middle East & Africa
      • Denmark
      • Egypt
      • Finland
      • France
      • Germany
      • Israel
      • Italy
      • Netherlands
      • Nigeria
      • Norway
      • Poland
      • Qatar
      • Russia
      • Saudi Arabia
      • South Africa
      • Spain
      • Sweden
      • Switzerland
      • Turkey
      • United Arab Emirates
      • United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Semiconductor Bonding Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Semiconductor Bonding Market?

3. What are the technology trends and regulatory frameworks in the Semiconductor Bonding Market?

4. What is the market share of the leading vendors in the Semiconductor Bonding Market?

5. Which modes and strategic moves are suitable for entering the Semiconductor Bonding Market?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Limitations
  • 1.7. Assumptions
  • 1.8. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

  • 4.1. Introduction
  • 4.2. Semiconductor Bonding Market, by Region

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Ongoing shift towards miniature electric devices coupled with exponential growth in semiconductor manufacturing across the globe
      • 5.1.1.2. Potential demand attributed to growing adoption of electric and hybrid vehicles with significant governmental initiatives
      • 5.1.1.3. Upsurging adoption of stacked die technology in the Internet of Things (IoT) solutions
    • 5.1.2. Restraints
      • 5.1.2.1. High cost associated with processing and ownership of semiconductor bonding solutions
    • 5.1.3. Opportunities
      • 5.1.3.1. Favorable governmental initiatives and investments for semiconductor manufacturing worldwide
      • 5.1.3.2. Proliferation in the utilization of consumer electronics and smart devices across the globe
    • 5.1.4. Challenges
      • 5.1.4.1. Concerns associated with complexities of miniature electronic devices manufacturing
  • 5.2. Market Segmentation Analysis
  • 5.3. Market Trend Analysis
  • 5.4. Cumulative Impact of High Inflation
  • 5.5. Porter's Five Forces Analysis
    • 5.5.1. Threat of New Entrants
    • 5.5.2. Threat of Substitutes
    • 5.5.3. Bargaining Power of Customers
    • 5.5.4. Bargaining Power of Suppliers
    • 5.5.5. Industry Rivalry
  • 5.6. Value Chain & Critical Path Analysis
  • 5.7. Regulatory Framework

6. Semiconductor Bonding Market, by Type

  • 6.1. Introduction
  • 6.2. Die Bonder
  • 6.3. Flip Chip Bonder
  • 6.4. Wafer Bonder

7. Semiconductor Bonding Market, by Application

  • 7.1. Introduction
  • 7.2. CMOS Image Sensors
  • 7.3. LED
  • 7.4. MEMS & Sensors
  • 7.5. Radiofrequency Devices

8. Americas Semiconductor Bonding Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific Semiconductor Bonding Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa Semiconductor Bonding Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. FPNV Positioning Matrix
  • 11.2. Market Share Analysis, By Key Player
  • 11.3. Competitive Scenario Analysis, By Key Player

12. Competitive Portfolio

  • 12.1. Key Company Profiles
    • 12.1.1. Applied Microengineering Ltd.
    • 12.1.2. ASM Pacific Technology Ltd.
    • 12.1.3. Ayumi Industries Co. Ltd.
    • 12.1.4. BE Semiconductor Industries N.V.
    • 12.1.5. Canon Anelva Corporation
    • 12.1.6. Dr. Tresky AG
    • 12.1.7. EV Group
    • 12.1.8. Fasford Technology Co. Ltd.
    • 12.1.9. Finetech GmbH & Co. KG
    • 12.1.10. Kulicke and Soffa Industries Inc.
    • 12.1.11. Mycronic AB
    • 12.1.12. Palomar Technologies Inc.
    • 12.1.13. SET Corporation SA
    • 12.1.14. Shibaura Mechatronics Corporation
    • 12.1.15. TDK Corporation
  • 12.2. Key Product Portfolio

13. Appendix

  • 13.1. Discussion Guide
  • 13.2. License & Pricing