チップレット市場：プロセッサー、パッケージング技術、最終用途別-2025-2030年の世界予測

チップレット市場の2023年の市場規模は105億3,000万米ドルで、2024年には142億2,000万米ドル、CAGR36.74%で成長し、2030年には941億7,000万米ドルに達すると予測されています。

半導体技術の絶え間ない進化は、チップレット・アーキテクチャーが主役となる新時代を迎えました。革新的な設計パラダイムが従来のモノリシック・ソリューションからモジュラー・システムに移行するにつれ、高性能コンピューティングと高度な電子統合の状況は急速に進化しています。

チップレットは、事前に検証された小型の集積回路で、これを組み合わせることで高度に洗練されたシステムをチップ上に構築します。このアプローチは開発サイクルを加速させるだけでなく、多様なアプリケーションの要求に応える比類のない柔軟性を提供します。ここ数年、業界ではチップレット技術の利点を活用することを目的とした研究や商業化の取り組みが急増しています。カスタマイズ性、電力効率の改善、市場投入までの時間の短縮は、この変革を推進する魅力的な利点のほんの一部に過ぎません。

世界企業が新たな戦略に投資し、新興企業が新たな知見をもたらす中、チップレット市場は技術革新の温床となりつつあります。コスト、パフォーマンス、スケーラビリティといった従来の制約を克服する手段として、チップレットを採用する企業が増えています。この入門的な概観は、現在進行中の大きな変革について明確な理解を提供し、半導体産業の将来を形作るセグメンテーション、地域ダイナミックス、主要プレーヤー、戦略的提言の詳細な探求の舞台を整えるものです。

チップレット市場の変革

最近の技術進歩は、進化する市場要求と相まって、チップレットランドスケープに変革的な変化をもたらしました。業界のモジュール設計への移行は従来の障壁を打ち破り、性能、コスト効率、適応性の大幅な改善をもたらしています。

歴史的に、集積回路は単一のモノリシック・エンティティとして設計されてきました。しかし、最近のアプリケーションの複雑化に伴い、より汎用的なアプローチが必要とされています。チップレットにより、設計者は機能を特化したコンポーネントに分離することができ、それぞれが目的に応じて最適に設計されます。このプラグマティズムは開発リスクを低減し、特定の機能に合わせてカスタマイズされた技術ブロックを組み合わせて使用できるようにすることで、イノベーションを促進します。

市場投入までの時間を短縮しようという動きも、チップレットの採用を加速させています。検証済みのモジュールを活用することで、企業は製品開発プロセスを合理化し、設計サイクルを大幅に短縮することができます。業界では現在、鋳造所、デザインハウス、システムインテグレーターが協力し、最新のコンピューティングの高度な要求を満たすソリューションの開発に取り組んでいます。そうすることで、半導体の状況は、性能指標を再定義するだけでなく、技術革新プロセスの全体的な持続可能性を強化する、前例のない変革を経験しています。

チップレット市場の主なセグメンテーション洞察

市場セグメンテーションを深く掘り下げると、チップレット分野が需要の高い成長分野をターゲットとして、いかに綿密に分類されているかがわかります。主要なセグメンテーションの1つは、プロセッサのタイプに基づいています。アプリケーション・プロセッシング・ユニット、人工知能アプリケーション専用集積回路コンプレッサー、セントラル・プロセッシング・ユニット、フィールド・プログラマブル・ゲート・アレイ、グラフィック・プロセッシング・ユニットといった多様なコンポーネントを追跡することで、市場は包括的に分析されます。これらのプロセッサー分類は、ますます特殊化する性能要件や計算要件を満たすチップレットを調整する上で極めて重要な役割を果たしています。

もう1つの重要な区分は、パッケージング技術に基づくものです。2.5Dおよび3D構造、フリップチップ・ボールグリッド・アレイ、フリップチップ・スケール・パッケージ、システム・イン・パッケージ・ソリューション、ウエハーレベル・チップ・スケール・パッケージなど、さまざまなパッケージング・イノベーションで市場を評価することで、各技術が提供する統合効率と性能効率に関する重要な洞察が得られます。このセグメンテーションは、スペースとリソースの利用を最適化しながら、熱管理、相互接続密度、メカニカルインテグリティに対処するためにメーカーが採用している多様なアプローチを強調しています。

さらに、最終用途に基づくセグメンテーションは、アプリケーションのダイナミクスを詳細に示します。自動車、民生用電子機器、防衛・航空宇宙、ヘルスケア、製造、通信などの業界では、これまで以上に高いレベルの性能と信頼性が求められており、チップレットは特定の規格や厳しい業界固有の要件を満たすように設計されています。このような市場セグメンテーションの洞察は、市場が技術的に多様であるだけでなく、アプリケーション主導のさまざまな課題に対応できるようにきめ細かく調整されていることを示しています。

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

• 市場力学
  • 促進要因
    • より小型でコンパクトな電子機器の需要の高まり
    • 世界中のデータセンター数の増加
    • ADAS向け車載処理強化の需要増加
  • 抑制要因
    • チップレットの相互接続の複雑さの問題
  • 機会
    • 高度な処理ニーズによりUAVにチップレットを導入する可能性
    • 5Gネットワークへの継続的な投資と展開
  • 課題
    • チップレットに関連するスケーラビリティとセキュリティの懸念
• 市場セグメンテーション分析
  • プロセッサ：電力効率と汎用性により、民生用電子機器におけるアプリケーション処理ユニットの重要性が高まっています。
  • パッケージング技術：低コストで非常にコンパクトかつ高性能なパッケージによるウェハレベルチップスケールパッケージの新たな用途
  • 最終用途：精度と信頼性の特性により、ヘルスケア分野でチップレットの採用が増加
• ポーターのファイブフォース分析
• PESTEL分析
  • 政治的
  • 経済
  • 社会
  • 技術的
  • 法律上
  • 環境

第6章 チップレット市場プロセッサー別

• アプリケーション処理ユニット
• 人工知能特定用途向け集積回路コンプレッサー
• 中央処理装置
• フィールドプログラマブルゲートアレイ
• グラフィックプロセッシングユニット

第7章 チップレット市場パッケージングテクノロジー

• 2.5Dと3D
• フリップチップボールグリッドアレイ
• フリップチップスケールパッケージ
• システムインパッケージ
• ウエハレベルチップスケールパッケージ

第8章 チップレット市場：最終用途別

• 自動車
• 家電
• 防衛・航空宇宙
• ヘルスケア
• 製造業
• 通信

第9章 南北アメリカのチップレット市場

• アルゼンチン
• ブラジル
• カナダ
• メキシコ
• 米国

第10章 アジア太平洋地域のチップレット市場

• オーストラリア
• 中国
• インド
• インドネシア
• 日本
• マレーシア
• フィリピン
• シンガポール
• 韓国
• 台湾
• タイ
• ベトナム

第11章 欧州・中東・アフリカのチップレット市場

• デンマーク
• エジプト
• フィンランド
• フランス
• ドイツ
• イスラエル
• イタリア
• オランダ
• ナイジェリア
• ノルウェー
• ポーランド
• カタール
• ロシア
• サウジアラビア
• 南アフリカ
• スペイン
• スウェーデン
• スイス
• トルコ
• アラブ首長国連邦
• 英国

第12章 競合情勢

• 市場シェア分析, 2023
• FPNVポジショニングマトリックス, 2023
• 競合シナリオ分析
• 戦略分析と提言

企業一覧

• Achronix Semiconductor Corporation
• Advanced Micro Devices, Inc.
• Alphawave IP Group PLC
• Apple Inc.
• Arm Holdings PLC
• ASE Technology Holding Co, Ltd.
• Ayar Labs, Inc.
• Beijing ESWIN Technology Group Co., Ltd.
• Broadcom Inc.
• Cadence Design Systems, Inc.
• Chipuller
• Eliyan Corp
• GlobalFoundries Inc.
• Huawei Technologies Co., Ltd.
• Intel Corporation
• International Business Machines Corporation
• JCET Group
• Kandou Bus, S.A.
• Marvell Technology, Inc.
• Mercury Systems, Inc.
• Netronome Systems, Inc.
• NHanced Semiconductors, Inc.
• NVIDIA Corporation
• NXP Semiconductors N.V.
• Palo Alto Electron, Inc.
• Qualcomm Incorporated
• RANVOUS Inc.
• Samsung Electronics Co., Ltd.
• Socionext Inc.
• Synopsys, Inc.
• Tachyum S.r.o.
• Taiwan Semiconductor Manufacturing Company Limited
• Tenstorrent Inc.
• TongFu Microelectronics Co., Ltd.
• X-Celeprint by Xtrion N.V.

LIST OF FIGURES

• FIGURE 1. CHIPLET MARKET MULTI-CURRENCY
• FIGURE 2. CHIPLET MARKET MULTI-LANGUAGE
• FIGURE 3. CHIPLET MARKET RESEARCH PROCESS
• FIGURE 4. CHIPLET MARKET SIZE, 2023 VS 2030
• FIGURE 5. GLOBAL CHIPLET MARKET SIZE, 2018-2030 (USD MILLION)
• FIGURE 6. GLOBAL CHIPLET MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 7. GLOBAL CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 8. GLOBAL CHIPLET MARKET SIZE, BY PROCESSOR, 2023 VS 2030 (%)
• FIGURE 9. GLOBAL CHIPLET MARKET SIZE, BY PROCESSOR, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 10. GLOBAL CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2030 (%)
• FIGURE 11. GLOBAL CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 12. GLOBAL CHIPLET MARKET SIZE, BY END-USE, 2023 VS 2030 (%)
• FIGURE 13. GLOBAL CHIPLET MARKET SIZE, BY END-USE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 14. AMERICAS CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 15. AMERICAS CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 16. UNITED STATES CHIPLET MARKET SIZE, BY STATE, 2023 VS 2030 (%)
• FIGURE 17. UNITED STATES CHIPLET MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 18. ASIA-PACIFIC CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 19. ASIA-PACIFIC CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 20. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 21. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 22. CHIPLET MARKET SHARE, BY KEY PLAYER, 2023
• FIGURE 23. CHIPLET MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

• TABLE 1. CHIPLET MARKET SEGMENTATION & COVERAGE
• TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
• TABLE 3. GLOBAL CHIPLET MARKET SIZE, 2018-2030 (USD MILLION)
• TABLE 4. GLOBAL CHIPLET MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 5. GLOBAL CHIPLET MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 6. CHIPLET MARKET DYNAMICS
• TABLE 7. GLOBAL CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 8. GLOBAL CHIPLET MARKET SIZE, BY APPLICATION PROCESSING UNIT, BY REGION, 2018-2030 (USD MILLION)
• TABLE 9. GLOBAL CHIPLET MARKET SIZE, BY ARTIFICIAL INTELLIGENCE APPLICATION-SPECIFIC INTEGRATED CIRCUIT COMPRESSOR, BY REGION, 2018-2030 (USD MILLION)
• TABLE 10. GLOBAL CHIPLET MARKET SIZE, BY CENTRAL PROCESSING UNIT, BY REGION, 2018-2030 (USD MILLION)
• TABLE 11. GLOBAL CHIPLET MARKET SIZE, BY FIELD-PROGRAMMABLE GATE ARRAY, BY REGION, 2018-2030 (USD MILLION)
• TABLE 12. GLOBAL CHIPLET MARKET SIZE, BY GRAPHIC PROCESSING UNIT, BY REGION, 2018-2030 (USD MILLION)
• TABLE 13. GLOBAL CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 14. GLOBAL CHIPLET MARKET SIZE, BY 2.5 & 3D, BY REGION, 2018-2030 (USD MILLION)
• TABLE 15. GLOBAL CHIPLET MARKET SIZE, BY FLIP CHIP BALL GRID ARRAY, BY REGION, 2018-2030 (USD MILLION)
• TABLE 16. GLOBAL CHIPLET MARKET SIZE, BY FLIP CHIP SCALE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 17. GLOBAL CHIPLET MARKET SIZE, BY SYSTEM-IN-PACKAGE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 18. GLOBAL CHIPLET MARKET SIZE, BY WAFER-LEVEL CHIP SCALE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 19. GLOBAL CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 20. GLOBAL CHIPLET MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 21. GLOBAL CHIPLET MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 22. GLOBAL CHIPLET MARKET SIZE, BY DEFENSE & AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 23. GLOBAL CHIPLET MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 24. GLOBAL CHIPLET MARKET SIZE, BY MANUFACTURING, BY REGION, 2018-2030 (USD MILLION)
• TABLE 25. GLOBAL CHIPLET MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 26. AMERICAS CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 27. AMERICAS CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 28. AMERICAS CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 29. AMERICAS CHIPLET MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 30. ARGENTINA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 31. ARGENTINA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 32. ARGENTINA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 33. BRAZIL CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 34. BRAZIL CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 35. BRAZIL CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 36. CANADA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 37. CANADA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 38. CANADA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 39. MEXICO CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 40. MEXICO CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 41. MEXICO CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 42. UNITED STATES CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 43. UNITED STATES CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 44. UNITED STATES CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 45. UNITED STATES CHIPLET MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
• TABLE 46. ASIA-PACIFIC CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 47. ASIA-PACIFIC CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 48. ASIA-PACIFIC CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 49. ASIA-PACIFIC CHIPLET MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 50. AUSTRALIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 51. AUSTRALIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 52. AUSTRALIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 53. CHINA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 54. CHINA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 55. CHINA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 56. INDIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 57. INDIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 58. INDIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 59. INDONESIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 60. INDONESIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 61. INDONESIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 62. JAPAN CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 63. JAPAN CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 64. JAPAN CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 65. MALAYSIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 66. MALAYSIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 67. MALAYSIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 68. PHILIPPINES CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 69. PHILIPPINES CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 70. PHILIPPINES CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 71. SINGAPORE CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 72. SINGAPORE CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 73. SINGAPORE CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 74. SOUTH KOREA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 75. SOUTH KOREA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 76. SOUTH KOREA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 77. TAIWAN CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 78. TAIWAN CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 79. TAIWAN CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 80. THAILAND CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 81. THAILAND CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 82. THAILAND CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 83. VIETNAM CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 84. VIETNAM CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 85. VIETNAM CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 86. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 87. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 88. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 89. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 90. DENMARK CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 91. DENMARK CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 92. DENMARK CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 93. EGYPT CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 94. EGYPT CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 95. EGYPT CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 96. FINLAND CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 97. FINLAND CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 98. FINLAND CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 99. FRANCE CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 100. FRANCE CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 101. FRANCE CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 102. GERMANY CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 103. GERMANY CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 104. GERMANY CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 105. ISRAEL CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 106. ISRAEL CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 107. ISRAEL CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 108. ITALY CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 109. ITALY CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 110. ITALY CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 111. NETHERLANDS CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 112. NETHERLANDS CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 113. NETHERLANDS CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 114. NIGERIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 115. NIGERIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 116. NIGERIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 117. NORWAY CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 118. NORWAY CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 119. NORWAY CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 120. POLAND CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 121. POLAND CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 122. POLAND CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 123. QATAR CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 124. QATAR CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 125. QATAR CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 126. RUSSIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 127. RUSSIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 128. RUSSIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 129. SAUDI ARABIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 130. SAUDI ARABIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 131. SAUDI ARABIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 132. SOUTH AFRICA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 133. SOUTH AFRICA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 134. SOUTH AFRICA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 135. SPAIN CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 136. SPAIN CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 137. SPAIN CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 138. SWEDEN CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 139. SWEDEN CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 140. SWEDEN CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 141. SWITZERLAND CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 142. SWITZERLAND CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 143. SWITZERLAND CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 144. TURKEY CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 145. TURKEY CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 146. TURKEY CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 147. UNITED ARAB EMIRATES CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 148. UNITED ARAB EMIRATES CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 149. UNITED ARAB EMIRATES CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 150. UNITED KINGDOM CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
• TABLE 151. UNITED KINGDOM CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 152. UNITED KINGDOM CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
• TABLE 153. CHIPLET MARKET SHARE, BY KEY PLAYER, 2023
• TABLE 154. CHIPLET MARKET, FPNV POSITIONING MATRIX, 2023

The Chiplet Market was valued at USD 10.53 billion in 2023 and is projected to grow to USD 14.22 billion in 2024, with a CAGR of 36.74%, reaching USD 94.17 billion by 2030.

The continuous evolution of semiconductor technologies has ushered in a new era, one where chiplet architecture takes center stage. As innovative design paradigms shift from traditional monolithic solutions to modular systems, the landscape of high-performance computing and advanced electronic integration is rapidly evolving.

Chiplets are small, pre-validated integrated circuits that combine to create highly sophisticated systems on a chip. This approach not only accelerates development cycles but also offers unparalleled flexibility in meeting diverse application demands. Over the past few years, the industry has witnessed a surge in research and commercialization efforts aimed at exploiting the benefits of chiplet technology. Customization, improved power efficiency, and reduced time-to-market are just a few of the compelling advantages driving this transformation.

As global players invest in new strategies and emerging startups bring fresh insights, the chiplet market is becoming a hotbed for technological breakthroughs. Companies are increasingly embracing chiplets as a way to overcome traditional limitations in cost, performance, and scalability. This introductory overview provides a clear understanding of the significant transformation underway and sets the stage for a detailed exploration of segmentation, regional dynamics, key players, and strategic recommendations that will shape the future of the semiconductor industry.

Transformative Shifts in the Chiplet Landscape

Recent technological progress coupled with evolving market demands has precipitated a transformative shift in the chiplet landscape. The industry's move towards modular design is breaking conventional barriers, introducing substantial improvements in performance, cost efficiency, and adaptability.

Historically, integrated circuits were designed as single, monolithic entities. However, the increasing complexity of modern applications has necessitated a more versatile approach. Chiplets enable designers to segregate functionalities among specialized components, each optimally engineered for its purpose. This pragmatism reduces development risks and fosters innovation by allowing companies to mix and match technology blocks tailored for specific functions.

The drive for faster time-to-market has also accelerated the adoption of chiplets. By leveraging pre-validated modules, organizations can streamline product development processes and considerably shorten design cycles. The industry is now witnessing a surge in collaborative initiatives between foundries, design houses, and system integrators who are working collectively to develop solutions that meet the high demands of modern computing. In doing so, the semiconductor landscape is experiencing an unprecedented transformation that not only redefines performance metrics but also enhances the overall sustainability of the innovation process.

Key Segmentation Insights in the Chiplet Market

A deep dive into market segmentation reveals how the chiplet sector is meticulously categorized to target high-demand growth areas. One major segmentation is based on Processor types. The market is comprehensively analyzed by tracking diverse components such as Application Processing Units, Artificial Intelligence Application-Specific Integrated Circuit Compressors, Central Processing Units, Field-Programmable Gate Arrays, and Graphic Processing Units. These processor classifications play a pivotal role in tailoring chiplets that meet increasingly specific performance and computational requirements.

Another significant segmentation is based on Packaging Technology. Evaluating the market across various packaging innovations like 2.5 & 3D structures, Flip Chip Ball Grid Array, Flip Chip Scale Package, System-in-Package solutions, and Wafer-Level Chip Scale Packages provides vital insights into the integration and performance efficiencies that each technology offers. This segmentation underlines the diverse approaches that manufacturers are adopting to address thermal management, interconnect density, and mechanical integrity while optimizing space and resource utilization.

Furthermore, segmentation based on End-use presents a detailed view into application dynamics. With industries such as Automotive, Consumer Electronics, Defense & Aerospace, Healthcare, Manufacturing, and Telecommunications demanding ever higher levels of performance and reliability, chiplets are being engineered to satisfy specific standards and rigorous industry-specific requirements. These segmentation insights collectively illustrate a market that is not only diversified in technical offerings but also finely tuned to cater to a wide array of application-driven challenges.

Based on Processor, market is studied across Application Processing Unit, Artificial Intelligence Application-Specific Integrated Circuit Compressor, Central Processing Unit, Field-Programmable Gate Array, and Graphic Processing Unit.

Based on Packaging Technology, market is studied across 2.5 & 3D, Flip Chip Ball Grid Array, Flip Chip Scale Package, System-in-Package, and Wafer-Level Chip Scale Package.

Based on End-use, market is studied across Automotive, Consumer Electronics, Defense & Aerospace, Healthcare, Manufacturing, and Telecommunications.

Key Regional Insights Shaping the Market

An analysis of regional trends shows that the evolution of chiplet technology is a global phenomenon driven by varied market dynamics and regional innovations. In the Americas, industry leaders are pioneering cutting-edge developments in semiconductor manufacturing and integration. Robust investment in research and development along with strategic collaborations have established this region as a hub for technological breakthroughs and commercialization strategies.

In regions spanning Europe, the Middle East, and Africa, well-established industrial infrastructures and governmental initiatives are driving adoption. These regions are actively focusing on advanced packaging solutions and integrated circuit innovations, ensuring that chiplet technology remains at the forefront of local semiconductor strategies. Meanwhile, in the Asia-Pacific region, rapid industrialization coupled with government support in emerging technology sectors has fostered a fertile environment for the mass adoption of chiplets. Here, a synergy between mature production capabilities and aggressive innovation policies has positioned the region as a central player in the global semiconductor arena.

These regional insights underscore varied yet complementary approaches to technological adoption and highlight opportunities for cross-regional collaboration as the global market converges around chiplet-based design paradigms.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across Arizona, California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Key Company Insights Driving Innovation

Numerous players are making significant strides in unlocking the full potential of chiplet technology, demonstrating both innovation and strategic acumen. Industry frontrunners include Achronix Semiconductor Corporation, Advanced Micro Devices, Inc., and Alphawave IP Group PLC, each excelling in creating solutions that push the boundaries of performance and efficiency. Major technology giants such as Apple Inc., Arm Holdings PLC, as well as ASE Technology Holding Co, Ltd., are reshaping the market narrative by integrating chiplets into next-generation devices, thereby redefining power and speed metrics.

Other influential firms like Ayar Labs, Inc., Beijing ESWIN Technology Group Co., Ltd., and Broadcom Inc. have undertaken initiatives that merge traditional semiconductor technology with advanced chiplet architectures. These companies are continuously harnessing the capabilities of chiplets to deliver products that are more scalable and efficient. Noteworthy contributions from Cadence Design Systems, Inc. and Chipuller further bolster design innovation, while companies such as Eliyan Corp, GlobalFoundries Inc., and Huawei Technologies Co., Ltd. are leveraging chiplets to optimize both functionality and energy consumption.

Prominent names like Intel Corporation, International Business Machines Corporation, and JCET Group are driving expansive research in chiplet integration, setting standards through collaborative breakthroughs. Further, Kandou Bus, S.A., Marvell Technology, Inc., Mercury Systems, Inc., and Netronome Systems, Inc. are advancing this field with robust market strategies. Companies such as NHanced Semiconductors, Inc., NVIDIA Corporation, NXP Semiconductors N.V., Palo Alto Electron, Inc., and Qualcomm Incorporated continue to push the envelope, along with RANVOUS Inc., Samsung Electronics Co., Ltd., Socionext Inc., Synopsys, Inc., Tachyum S.r.o., Taiwan Semiconductor Manufacturing Company Limited, Tenstorrent Inc., TongFu Microelectronics Co., Ltd., and X-Celeprint by Xtrion N.V. Their combined efforts highlight a competitive and rapidly progressing industry where strategic investments in chiplets are driving a paradigm shift towards modular and highly integrated system designs.

The report delves into recent significant developments in the Chiplet Market, highlighting leading vendors and their innovative profiles. These include Achronix Semiconductor Corporation, Advanced Micro Devices, Inc., Alphawave IP Group PLC, Apple Inc., Arm Holdings PLC, ASE Technology Holding Co, Ltd., Ayar Labs, Inc., Beijing ESWIN Technology Group Co., Ltd., Broadcom Inc., Cadence Design Systems, Inc., Chipuller, Eliyan Corp, GlobalFoundries Inc., Huawei Technologies Co., Ltd., Intel Corporation, International Business Machines Corporation, JCET Group, Kandou Bus, S.A., Marvell Technology, Inc., Mercury Systems, Inc., Netronome Systems, Inc., NHanced Semiconductors, Inc., NVIDIA Corporation, NXP Semiconductors N.V., Palo Alto Electron, Inc., Qualcomm Incorporated, RANVOUS Inc., Samsung Electronics Co., Ltd., Socionext Inc., Synopsys, Inc., Tachyum S.r.o., Taiwan Semiconductor Manufacturing Company Limited, Tenstorrent Inc., TongFu Microelectronics Co., Ltd., and X-Celeprint by Xtrion N.V.. Actionable Recommendations for Industry Leaders

For decision-makers and industry experts aiming to remain at the forefront of technological innovation, it is crucial to adapt proactively to the changing dynamics of chiplet integration. Industry leaders are advised to invest in flexible design methodologies that leverage the inherent advantages of chiplet architecture. Embracing a modular approach can significantly reduce time-to-market while providing the agility necessary to meet evolving market demands.

Furthermore, continuous collaboration with research institutions, technological partners, and strategic suppliers is essential for developing state-of-the-art packaging and integration solutions. By adopting cross-functional teams that bring together expertise from software engineering, hardware design, and advanced manufacturing processes, organizations can foster an environment of innovation that drives competitive advantage. It is important to monitor emerging trends and incorporate advanced packaging technologies that promise heightened performance, reliability, and energy efficiency.

Adopting a customer-centric strategy that aligns product development with end-user needs, particularly in high-demand sectors such as Automotive, Consumer Electronics, and Telecommunications, remains paramount. Integrating feedback loops into the development cycle can further optimize chiplet-based solutions. In summary, seizing the opportunities presented by chiplet technologies necessitates a holistic approach that encourages both internal innovation and external collaboration.

Conclusion: Embracing the Chiplet Future

In conclusion, the chiplet revolution is redefining the semiconductor industry by offering advanced, flexible, and scalable solutions. The shift toward modular architectures is not merely a technological upgrade but a strategic move that aligns with the broader trend of rapid innovation and customized performance. Comprehensive segmentation insights reveal specialized approaches based on processors, packaging technologies, and distinct end-use applications. Regional dynamics highlight varied market trends, while leading companies continue to drive transformative changes through innovation and strategic positioning.

This new paradigm necessitates that industry stakeholders reassess their strategies and invest in future-proof solutions to remain competitive. The profound shifts witnessed across manufacturing techniques, market segmentation, and regional influences serve as a testament to the immense potential of chiplets in reshaping the electronics landscape.

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Growing demand for smaller and more compact electronic devices
    • 5.1.1.2. Increase in the number of data centers globally
    • 5.1.1.3. Growing demand to enhance in-vehicle processing for ADAS
  • 5.1.2. Restraints
    • 5.1.2.1. Interconnection complexity issues with chiplets
  • 5.1.3. Opportunities
    • 5.1.3.1. Potential deployment of chiplets in UAVs due to advanced processing needs
    • 5.1.3.2. Continuous investments and roll-out of 5G network
  • 5.1.4. Challenges
    • 5.1.4.1. Scalability and security concerns associated with chiplets
• 5.2. Market Segmentation Analysis
  • 5.2.1. Processor: Growing significance of application processing units in consumer electronics due to power efficiency and versatility
  • 5.2.2. Packaging Technology: Emerging applications of wafer-level chip scale packages due to highly compact and high-performance packages with low-cost
  • 5.2.3. End-use: Rising adoption of chiplets in the healthcare sector owing to precision and reliability properties
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Chiplet Market, by Processor

• 6.1. Introduction
• 6.2. Application Processing Unit
• 6.3. Artificial Intelligence Application-Specific Integrated Circuit Compressor
• 6.4. Central Processing Unit
• 6.5. Field-Programmable Gate Array
• 6.6. Graphic Processing Unit

7. Chiplet Market, by Packaging Technology

• 7.1. Introduction
• 7.2. 2.5 & 3D
• 7.3. Flip Chip Ball Grid Array
• 7.4. Flip Chip Scale Package
• 7.5. System-in-Package
• 7.6. Wafer-Level Chip Scale Package

8. Chiplet Market, by End-use

• 8.1. Introduction
• 8.2. Automotive
• 8.3. Consumer Electronics
• 8.4. Defense & Aerospace
• 8.5. Healthcare
• 8.6. Manufacturing
• 8.7. Telecommunications

9. Americas Chiplet Market

• 9.1. Introduction
• 9.2. Argentina
• 9.3. Brazil
• 9.4. Canada
• 9.5. Mexico
• 9.6. United States

10. Asia-Pacific Chiplet Market

• 10.1. Introduction
• 10.2. Australia
• 10.3. China
• 10.4. India
• 10.5. Indonesia
• 10.6. Japan
• 10.7. Malaysia
• 10.8. Philippines
• 10.9. Singapore
• 10.10. South Korea
• 10.11. Taiwan
• 10.12. Thailand
• 10.13. Vietnam

11. Europe, Middle East & Africa Chiplet Market

• 11.1. Introduction
• 11.2. Denmark
• 11.3. Egypt
• 11.4. Finland
• 11.5. France
• 11.6. Germany
• 11.7. Israel
• 11.8. Italy
• 11.9. Netherlands
• 11.10. Nigeria
• 11.11. Norway
• 11.12. Poland
• 11.13. Qatar
• 11.14. Russia
• 11.15. Saudi Arabia
• 11.16. South Africa
• 11.17. Spain
• 11.18. Sweden
• 11.19. Switzerland
• 11.20. Turkey
• 11.21. United Arab Emirates
• 11.22. United Kingdom

12. Competitive Landscape

• 12.1. Market Share Analysis, 2023
• 12.2. FPNV Positioning Matrix, 2023
• 12.3. Competitive Scenario Analysis
  • 12.3.1. PseudolithIC Inc. secures USD 6 million seed funding to accelerate compound semiconductor chiplet innovation
  • 12.3.2. Baya Systems secures over USD 36 million in Series B funding
  • 12.3.3. Intel unveiled chiplet at OFC 2024, revolutionizing high-speed data transmission and integrated photonics technology
  • 12.3.4. Rapidus and International Business Machines Corporation expand collaboration on advancing chiplet packaging technology
  • 12.3.5. Advanced Micro Devices, Inc. receives IEEE 2024 Corporate Innovation Award for chiplet technology
  • 12.3.6. Eliyan secures USD 60 million funding to advance chiplet interconnect technology for AI chips
  • 12.3.7. Cadence Design Systems Inc. and Arm revolutionize automotive with advanced chiplet platform for software-defined vehicles and ADAS
  • 12.3.8. Tenstorrent adopts Blue Cheetah's chiplet interconnect IP for enhanced AI and RISC-V solutions
  • 12.3.9. TDK Ventures invests in Silicon Box's chiplet packaging design to drive semiconductor innovation
  • 12.3.10. ASE Technology Holding Co., Ltd. introduces an integrated design ecosystem to halve silicon package design time
  • 12.3.11. Intel unveils a UCIe-connected chiplet-based test chip at Innovation 2023 by integrating Intel and Synopsys IPs using the EMIB interface.
  • 12.3.12. Marvell Technology collaborates with IMEC on automotive chiplet initiative for advanced computing SoCs
  • 12.3.13. Alphawave Semi expands collaboration with Samsung Electronics Co., Ltd. by introducing 3nm connectivity IP solutions
  • 12.3.14. International Business Machines Corporation advances chiplets with hybrid bonding for thinner, smaller connections
• 12.4. Strategy Analysis & Recommendation
  • 12.4.1. Advanced Micro Devices, Inc.
  • 12.4.2. Intel Corporation
  • 12.4.3. Taiwan Semiconductor Manufacturing Company Limited
  • 12.4.4. NVIDIA Corporation

Companies Mentioned

• 1. Achronix Semiconductor Corporation
• 2. Advanced Micro Devices, Inc.
• 3. Alphawave IP Group PLC
• 4. Apple Inc.
• 5. Arm Holdings PLC
• 6. ASE Technology Holding Co, Ltd.
• 7. Ayar Labs, Inc.
• 8. Beijing ESWIN Technology Group Co., Ltd.
• 9. Broadcom Inc.
• 10. Cadence Design Systems, Inc.
• 11. Chipuller
• 12. Eliyan Corp
• 13. GlobalFoundries Inc.
• 14. Huawei Technologies Co., Ltd.
• 15. Intel Corporation
• 16. International Business Machines Corporation
• 17. JCET Group
• 18. Kandou Bus, S.A.
• 19. Marvell Technology, Inc.
• 20. Mercury Systems, Inc.
• 21. Netronome Systems, Inc.
• 22. NHanced Semiconductors, Inc.
• 23. NVIDIA Corporation
• 24. NXP Semiconductors N.V.
• 25. Palo Alto Electron, Inc.
• 26. Qualcomm Incorporated
• 27. RANVOUS Inc.
• 28. Samsung Electronics Co., Ltd.
• 29. Socionext Inc.
• 30. Synopsys, Inc.
• 31. Tachyum S.r.o.
• 32. Taiwan Semiconductor Manufacturing Company Limited
• 33. Tenstorrent Inc.
• 34. TongFu Microelectronics Co., Ltd.
• 35. X-Celeprint by Xtrion N.V.