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チップレットの市場規模、シェア、動向分析レポート：プロセッサタイプ別、パッケージング技術別、エンドユーザー産業別、地域別、セグメント予測、2025年～2033年

Chiplet Market Size, Share & Trends Analysis Report By Processor Type (CPU Chiplets, GPU Chiplets, AI/ML Accelerators), By Packaging Technology (2.5D/3D Packaging, Multi-Chip Module), By End-user Industry, By Region, And Segment Forecasts, 2025 - 2033

出版日
ページ情報
英文 130 Pages
納期
2～10営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=149.53円
チップレットの市場規模、シェア、動向分析レポート：プロセッサタイプ別、パッケージング技術別、エンドユーザー産業別、地域別、セグメント予測、2025年～2033年
出版日: 2025年07月07日
発行: Grand View Research
ページ情報: 英文 130 Pages
納期: 2～10営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 図表
  • 目次
概要

チップレット市場の概要

チップレットの世界市場規模は、2024年に90億6,000万米ドルと推定され、2033年には2,235億6,000万米ドルに達すると予測され、2025～2033年のCAGRは43.7%で成長します。同市場は、スケーラブルなモジュール型プロセッシング・アーキテクチャを必要とするAIやハイパフォーマンスコンピューティング（HPC）ワークロードの需要急増に牽引され、勢いを増しています。

モノリシックなシステムオンチップ（SoC）のコスト上昇と複雑化により、歩留まりの向上と市場投入期間の短縮を実現するチップレットベース分解設計へのシフトが進んでいます。さらに、2.5D/3D集積と先進パッケージング技術の急速な進歩により、異種集積の実現性とコスト効率が高まっています。同市場は、電力効率とカスタマイズが重要なエッジAIとIoTアプリケーションにおいても大きな可能性を秘めています。しかし、特に研究開発予算が限られている中小企業にとっては、高い設計・検証コストが足かせとなっています。

AIとHPCワークロードに対する需要の急増は、スケーラブルで効率的なコンピューティングソリューションのニーズに応えるため、チップレット技術の大幅な進歩を促しています。ヘルスケア、自動車、金融などの各産業では、データ処理にAIを利用する傾向が強まっており、HPCアプリケーションでは、シミュレーションや分析などのタスクに高い計算能力が求められています。従来型モノリシックチップでは、これらの課題に効率的に対応することが難しいため、柔軟性とコスト効率に優れたモジュール型チップレット・アーキテクチャがより魅力的になっています。例えば、アクセラAIは2025年3月、Digital In-MemoryComputing（D-IMC）アーキテクチャによるスケーラブルなAI推論チップレット、Titaniaを発表しました。DAREプロジェクトを通じて最大6,620万米ドル（6,160万ユーロ）のEU資金援助を受けているTitaniaは、エッジ・ツークラウドのAIとHPCアプリケーションを対象としており、プロセッサの独立性とエクストリームスケールコンピューティングを目指す欧州の戦略に合致しています。

半導体ノードの進歩に伴い、大規模なモノリシックSoCの設計、製造、検証にかかる費用は劇的にエスカレートしており、特に3nmや5nmのような最先端のプロセスノードでは、1チップあたり数億米ドルから10億米ドル以上の費用がかかることが多いです。このような増加は、トランジスタ数の増加、先進パッケージング、歩留まりを確保するための厳格なテストの必要性によってもたらされています。対照的に、チップレットは、機能をより小さく製造しやすいダイに分割するモジュール型アプローチを提供し、リスクとコストを削減します。このモジュール性はまた、開発サイクルを加速し、SoC全体ではなく個々のチップレットに欠陥を隔離することで歩留まりを向上させ、複雑な半導体設計に対してよりコスト効率が高く拡大性のあるソリューションを記載しています。

2.5D/3Dと先進パッケージング技術の急速な進歩が、チップレット市場の著しい成長を牽引しています。これらのパッケージング技術革新により、複数の異種ダイを単一パッケージング内に集積することが可能になり、従来型モノリシックチップに比べて性能、電力効率、フォームファクタが向上します。シリコンインターポーザ、シリコン貫通ビア（TSV）、チップ・オン・ウエハ・オン・サブストレート（CoWoS）などの技術により、高密度相互接続、信号遅延の短縮、熱管理の改善が可能になります。

エッジAIとIoTデバイスへの拡大は、データソースにより近い場所で動作するスケーラブルで低レイテンシ、エネルギー効率の高い処理ソリューションへのニーズの高まりによって推進されています。この動向は、スマートデバイス、コネクテッドセンサ、リアルタイム分析が自動車や産業オートメーションアプリケーションに急速に採用されていることが背景にあります。こうした需要に対応するため、モジュール型でカスタマイズ可能な統合を提供するチップレットアーキテクチャが不可欠となっており、エッジ展開における性能向上と市場投入までの時間短縮を可能にしています。例えば、DreamBigは2025年1月、3D HBMスタックチップレットハブとネットワーキングIOチップレットを統合したMARSチップレットプラットフォームの進化を発表しました。DreamBigはSamsung鋳造とSilicon Boxと提携し、レイテンシーの短縮とエネルギー効率の向上を実現した高性能AI、データセンター、自動車向けソリューションの提供を目指しています。これは、チップレットベースプラットフォームが次世代エッジAIとIoTイノベーションの重要なイネーブラーであることを示しています。

高い設計・検証コストがチップレット市場を大きく抑制しており、1プロジェクトあたり数百万米ドルに上ることも少なくありません。複数のダイを凝集システムに統合する複雑さにより、多様なコンポーネント間の互換性と信頼性を確保するために、広範なエンジニアリングリソース、包括的なテスト、徹底的な検証が要求されます。こうした多額の初期費用は、特に中小企業や新興企業にとって財務リスクを増大させ、より広範な採用を制限します。また、チップレットアーキテクチャの技術的優位性は明らかであるにもかかわらず、コストの高さが技術革新と市場拡大を遅らせています。

目次

第1章 調査手法と範囲

第2章 エグゼクティブサマリー

第3章 チップレット市場の変数、動向、範囲

  • 市場系統の展望
  • 市場力学
    • 市場促進要因分析
    • 市場抑制要因分析
    • 産業の課題
  • チップレット市場分析ツール
    • 産業分析-ポーターのファイブフォース分析
    • PESTEL分析

第4章 チップレット市場：プロセッサタイプ別、推定・動向分析

  • セグメントダッシュボード
    • チップレット市場：プロセッサタイプ変動分析、2024年と2033年
  • CPUチップレット
  • GPUチップレット
  • AI/MLアクセラレータ
  • FPGAチップレット
  • APUチップレット

第5章 チップレット市場：パッケージング技術別、推定・動向分析

  • セグメントダッシュボード
  • チップレット市場：パッケージング技術変動分析、2024年と2033年
  • 2.5D/3Dパッケージング
  • システムインパッケージング（SiP）
  • ファンアウトパッケージング
  • マルチチップモジュール（MCM）
  • フリップチップボールグリッドアレイ（FCBGA）

第6章 チップレット市場：エンドユーザー産業別、推定・動向分析

  • セグメントダッシュボード
  • チップレット市場：エンドユーザー産業変動分析、2024年と2033年
  • データセンターとHPC
  • 通信・IT
  • 自動車
  • 消費者と企業
  • 産業オートメーション
  • 航空宇宙と防衛
  • ヘルスケアと医療

第7章 チップレット市場：地域別、推定・動向分析

  • チップレット市場シェア、地域別、2024年と2033年
  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • 英国
    • ドイツ
    • フランス
  • アジア太平洋
    • 中国
    • 日本
    • インド
    • 韓国
    • オーストラリア
  • ラテンアメリカ
    • ブラジル
  • 中東・アフリカ
    • アラブ首長国連邦
    • サウジアラビア
    • 南アフリカ

第8章 競合情勢

  • 企業分類
  • 企業の市場ポジショニング
  • 企業ヒートマップ分析
  • 企業プロファイル/上場企業
    • Advanced Micro Devices, Inc.（AMD）
    • Intel Corporation
    • NVIDIA Corporation
    • Marvell Technology, Inc.
    • Broadcom Inc.
    • Samsung Electronics Co., Ltd.
    • Tenstorrent Inc.
    • Amazon Web Services, Inc.（AWS）
    • Alibaba Group Holding Ltd.（T-Head）
    • Microsoft Corporation
図表

List of Tables

  • Table 1 Global Chiplet Market size estimates & forecasts 2021 - 2033 (USD Million)
  • Table 2 Global Chiplet Market, by Region 2021 - 2033 (USD Million)
  • Table 3 Global Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 4 Global Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 5 Global Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 6 CPU Chiplets market, by region 2021 - 2033 (USD Million)
  • Table 7 GPU Chiplets market, by region 2021 - 2033 (USD Million)
  • Table 8 AI/ML Accelerators market by region 2021 - 2033 (USD Million)
  • Table 9 FPGA Chiplets market, by region 2021 - 2033 (USD Million)
  • Table 10 APU Chiplets market, by region 2021 - 2033 (USD Million)
  • Table 11 2.5D/3D Packaging market, by region 2021 - 2033 (USD Million)
  • Table 12 System-in-Package (SiP) market, by region 2021 - 2033 (USD Million)
  • Table 13 Fan-Out Packaging market, by region 2021 - 2033 (USD Million)
  • Table 14 Multi-Chip Module (MCM) market, by region 2021 - 2033 (USD Million)
  • Table 15 Flip-Chip Ball Grid Array (FCBGA) market, by region 2021 - 2033 (USD Million)
  • Table 16 Data Center & HPC market, by region 2021 - 2033 (USD Million)
  • Table 17 Automotive market, by region 2021 - 2033 (USD Million)
  • Table 18 Consumer & Enterprise market, by region 2021 - 2033 (USD Million)
  • Table 19 Industrial Automation market, by region 2021 - 2033 (USD Million)
  • Table 20 Aerospace & Defense market, by region 2021 - 2033 (USD Million)
  • Table 21 Healthcare & Medical market, by region 2021 - 2033 (USD Million)
  • Table 22 North America Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 23 North America Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 24 North America Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 25 U.S. Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 26 U.S. Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 27 U.S. Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 28 Canada Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 29 Canada Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 30 Canada Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 31 Mexico Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 32 Mexico Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 33 Mexico Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 34 Europe Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 35 Europe Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 36 Europe Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 37 UK Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 38 UK Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 39 UK Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 40 Germany Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 41 Germany Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 42 Germany Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 43 France Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 44 France Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 45 France Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 46 Asia Pacific Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 47 Asia Pacific Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 48 Asia Pacific Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 49 China Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 50 China Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 51 China Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 52 India Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 53 India Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 54 India Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 55 Japan Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 56 Japan Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 57 Japan Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 58 Australia Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 59 Australia Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 60 Australia Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 61 South Korea Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 62 South Korea Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 63 South Korea Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 64 Latin America Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 65 Latin America Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 66 Latin America Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 67 Brazil Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 68 Brazil Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 69 Brazil Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 70 Middle East & Africa Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 71 Middle East & Africa Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 72 Middle East & Africa Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 73 Kingdom of Saudi Arabia (KSA) Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 74 Kingdom of Saudi Arabia (KSA) Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 75 Kingdom of Saudi Arabia (KSA) Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 76 UAE Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 77 UAE Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 78 UAE Chiplet Market, By End User Industry 2021 - 2033 (USD Million)
  • Table 79 South Africa Chiplet Market, by Processor Type 2021 - 2033 (USD Million)
  • Table 80 South Africa Chiplet Market, by Packaging Technology 2021 - 2033 (USD Million)
  • Table 81 South Africa Chiplet Market, By End User Industry 2021 - 2033 (USD Million)

List of Figures

  • Fig. 1 Chiplet Market Segmentation
  • Fig. 2 Market research deployment mode
  • Fig. 3 Information procurement
  • Fig. 4 Primary research pattern
  • Fig. 5 Market research approaches
  • Fig. 6 Value chain-based sizing & forecasting
  • Fig. 7 Parent market analysis
  • Fig. 8 Market formulation & validation
  • Fig. 9 Chiplet Market snapshot
  • Fig. 10 Chiplet Market Segment Snapshot
  • Fig. 11 Chiplet Market Competitive Landscape Snapshot
  • Fig. 12 Market research deployment mode
  • Fig. 13 Market driver relevance analysis (Current & future impact)
  • Fig. 14 Market restraint relevance analysis (Current & future impact)
  • Fig. 15 Chiplet Market: Processor Type outlook key takeaways (USD Million)
  • Fig. 16 Chiplet Market: Processor Type Movement Analysis 2024 & 2033 (USD Million)
  • Fig. 17 CPU Chiplets market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 18 GPU Chiplets market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 19 AI/ML Accelerators market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 20 FPGA Chiplets market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 21 APU Chiplets market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 22 Chiplet Market: Packaging Technology Outlook Key Takeaways (USD Million)
  • Fig. 23 Chiplet Market: Packaging Technology Movement Analysis 2024 & 2033 (USD Million)
  • Fig. 24 2.5D/3D Packaging market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 25 System-in-Package (SiP) market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 26 Fan-Out Packaging market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 27 Multi-Chip Module (MCM) market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 28 Flip-Chip Ball Grid Array (FCBGA) market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 29 Chiplet Market: End User Industry Outlook Key Takeaways (USD Million)
  • Fig. 30 Chiplet Market: End User Industry Movement Analysis 2024 & 2033 (USD Million)
  • Fig. 31 Data Center & HPC market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 32 Telecom & IT market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 33 Automotive market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 34 Consumer & Enterprise market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 35 Industrial Automation market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 36 Aerospace & Defense market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 37 Healthcare & Medical market revenue estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 38 Regional marketplace: Key takeaways
  • Fig. 39 Chiplet Market: Regional Outlook, 2024 & 2033 (USD Million)
  • Fig. 40 North America Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 41 U.S. Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 42 Canada Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 43 Mexico Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 44 Europe Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 45 UK Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 46 Germany Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 47 France Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 48 Asia Pacific Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 49 Japan Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 50 China Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 51 India Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 52 Australia Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 53 South Korea Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 54 Latin America Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 55 Brazil Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 56 MEA Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 57 KSA Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 58 UAE Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 59 South Africa Chiplet Market estimates and forecasts, 2021 - 2033 (USD Million)
  • Fig. 60 Strategy framework
  • Fig. 61 Company Categorization
目次
Product Code: GVR-4-68040-663-7

Chiplet Market Summary

The global chiplet market size was estimated at USD 9.06 billion in 2024 and is projected to reach USD 223.56 billion by 2033, growing at a CAGR of 43.7% from 2025 to 2033. The market is gaining momentum, driven by surging demand for AI and high-performance computing (HPC) workloads, which require scalable, modular processing architectures.

The rising cost and complexity of monolithic system-on-chips (SoCs) are encouraging a shift toward disaggregated chiplet-based designs that improve yield and reduce time-to-market. Additionally, rapid advancements in 2.5D/3D integration and advanced packaging technologies are making heterogeneous integration more feasible and cost-effective. The market also holds significant potential in edge AI and IoT applications, where power efficiency and customization are critical. However, high design and validation costs further act as a restraint, particularly for smaller players with limited R&D budgets.

The surging demand for AI and HPC workloads is driving significant advancements in chiplet technology to meet the need for scalable, efficient computing solutions. Industries across sectors such as healthcare, automotive, and finance increasingly rely on AI for data processing, while HPC applications require enhanced computational power for tasks such as simulations and analytics. Traditional monolithic chips face challenges in addressing these demands efficiently, making modular chiplet architectures more attractive due to their flexibility and cost-effectiveness. For instance, in March 2025, Axelera AI unveiled Titania, a scalable AI inference chiplet based on its Digital In-MemoryComputing (D-IMC) architecture. Supported by up to USD 66.2 million (EUR 61.6 million) in EU funding through the DARE Project, Titania targets edge-to-cloud AI and HPC applications, aligning with Europe's strategy for processor independence and extreme-scale computing.

As semiconductor nodes advance, the expense to design, manufacture, and validate large monolithic SoCs has escalated dramatically, with costs often ranging from hundreds of millions to over a billion dollars per chip, especially at cutting-edge process nodes like 3nm or 5nm. This increase is driven by the need for greater transistor counts, advanced packaging, and rigorous testing to ensure high yields. Chiplets, by contrast, offer a modular approach that divides functionality across smaller, easier-to-manufacture dies, reducing risk and cost. This modularity also accelerates development cycles and enhances yield by isolating defects to individual chiplets rather than the entire SoC, presenting a more cost-effective and scalable solution for complex semiconductor designs.

Rapid advancements in 2.5D/3D and advanced packaging technologies are driving significant growth in the chiplet market. These packaging innovations enable the integration of multiple heterogeneous dies within a single package, enhancing performance, power efficiency, and form factor compared to traditional monolithic chips. Techniques such as silicon interposers, through-silicon vias (TSVs), and chip-on-wafer-on-substrate (CoWoS) allow for high-density interconnects, reduced signal latency, and improved thermal management.

The expansion into Edge AI and IoT devices is being propelled by the increasing need for scalable, low-latency, and energy-efficient processing solutions that can operate closer to data sources. This trend is driven by the rapid adoption of smart devices, connected sensors, and real-time analytics in automotive and industrial automation applications. To address these demands, chiplet architectures offering modular and customizable integration have become essential, enabling improved performance and faster time-to-market for edge deployments. For instance, in January 2025, DreamBig announced advancements in its MARS Chiplet Platform, integrating 3D HBM-stacked Chiplet Hub and Networking IO Chiplets. Partnering with Samsung Foundry and Silicon Box, DreamBig aims to deliver high-performance AI, data center, and automotive solutions with reduced latency and enhanced energy efficiency. This indicates that chiplet-based platforms are critical enablers of next-generation edge AI and IoT innovations.

High design and validation costs significantly restrain the chiplet market, frequently totaling several million USD per project. The complexity of integrating multiple dies into a cohesive system demands extensive engineering resources, comprehensive testing, and thorough validation to ensure compatibility and reliability across diverse components. These substantial upfront expenses increase financial risk, particularly for smaller companies and startups, limiting broader adoption. Also, the high cost barrier slows innovation and market expansion despite the clear technological advantages of chiplet architectures.

Global Chiplet Market Report Segmentation

This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the global chiplet market report based on processor type, packaging technology, end-user industry, and region:

  • Processor Type Outlook (Revenue, USD Million, 2021 - 2033)
  • CPU Chiplets
  • GPU Chiplets
  • AI/ML Accelerators
  • FPGA Chiplets
  • APU Chiplets
  • Packaging Technology Outlook (Revenue, USD Million, 2021 - 2033)
  • 2.5D/3D Packaging
  • System-in-Package (SiP)
  • Fan-Out Packaging
  • Multi-Chip Module (MCM)
  • Flip-Chip Ball Grid Array (FCBGA)
  • End-user Industry Outlook (Revenue, USD Million, 2021 - 2033)
  • Data Center & HPC
  • Telecom & IT
  • Automotive
  • Consumer & Enterprise
  • Industrial Automation
  • Aerospace & Defense
  • Healthcare & Medical
  • Regional Outlook (Revenue, USD Million, 2021 - 2033)
  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • Latin America
    • Brazil
  • Middle East & Africa (MEA)
    • UAE
    • Kingdom of Saudi Arabia (KSA)
    • South Africa

Table of Contents

Chapter 1. Methodology and Scope

  • 1.1. Market Segmentation and Scope
  • 1.2. Research Methodology
    • 1.2.1. Information Procurement
  • 1.3. Information or Data Analysis
  • 1.4. Methodology
  • 1.5. Research Scope and Assumptions
  • 1.6. Market Formulation & Validation
  • 1.7. List of Data Sources

Chapter 2. Executive Summary

  • 2.1. Market Outlook
  • 2.2. Segment Outlook
  • 2.3. Competitive Insights

Chapter 3. Chiplet Market Variables, Trends, & Scope

  • 3.1. Market Lineage Outlook
  • 3.2. Market Dynamics
    • 3.2.1. Market Driver Analysis
    • 3.2.2. Market Restraint Analysis
    • 3.2.3. Industry Challenge
  • 3.3. Chiplet Market Analysis Tools
    • 3.3.1. Industry Analysis - Porter's
      • 3.3.1.1. Bargaining power of the suppliers
      • 3.3.1.2. Bargaining power of the buyers
      • 3.3.1.3. Threats of substitution
      • 3.3.1.4. Threats from new entrants
      • 3.3.1.5. Competitive rivalry
    • 3.3.2. PESTEL Analysis
      • 3.3.2.1. Political landscape
      • 3.3.2.2. Economic landscape
      • 3.3.2.3. Social Landscape
      • 3.3.2.4. Technological landscape
      • 3.3.2.5. Environmental Landscape
      • 3.3.2.6. Legal landscape

Chapter 4. Chiplet Market: Processor Type Estimates & Trend Analysis

  • 4.1. Segment Dashboard
    • 4.1.1. Chiplet Market: Processor Type Movement Analysis, 2024 & 2033 (USD Million)
  • 4.2. CPU Chiplets
    • 4.2.1. CPU Chiplets Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.3. GPU Chiplets
    • 4.3.1. GPU Chiplets Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.4. AI/ML Accelerators
    • 4.4.1. AI/ML Accelerators Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.5. FPGA Chiplets
    • 4.5.1. FPGA Chiplets Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.6. APU Chiplets
    • 4.6.1. APU Chiplets Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 5. Chiplet Market: By Packaging Technology Estimates & Trend Analysis

  • 5.1. Segment Dashboard
  • 5.2. Chiplet Market: By Packaging Technology Movement Analysis, 2024 & 2033 (USD Million)
  • 5.3. 2.5D/3D Packaging
    • 5.3.1. 2.5D/3D Packaging Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.4. System-in-Package (SiP)
    • 5.4.1. System-in-Package (SiP) Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.5. Fan-Out Packaging
    • 5.5.1. Fan-Out Packaging Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.6. Multi-Chip Module (MCM)
    • 5.6.1. Multi-Chip Module (MCM) Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.7. Flip-Chip Ball Grid Array (FCBGA)
    • 5.7.1. Flip-Chip Ball Grid Array (FCBGA) Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 6. Chiplet Market: By End User Industry Estimates & Trend Analysis

  • 6.1. Segment Dashboard
  • 6.2. Chiplet Market: By End User Industry Movement Analysis, 2024 & 2033 (USD Million)
  • 6.3. Data Center & HPC
    • 6.3.1. Data Center & HPC Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4. Telecom & IT
    • 6.4.1. Telecom & IT Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5. Automotive
    • 6.5.1. Automotive Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.6. Consumer & Enterprise
    • 6.6.1. Consumer & Enterprise Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.7. Industrial Automation
    • 6.7.1. Industrial Automation Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.8. Aerospace & Defense
    • 6.8.1. Aerospace & Defense Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.9. Healthcare & Medical
    • 6.9.1. Healthcare & Medical Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 7. Chiplet Market: Regional Estimates & Trend Analysis

  • 7.1. Chiplet Market Share, By Region, 2024 & 2033 (USD Million)
  • 7.2. North America
    • 7.2.1. North America Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.2.2. U.S.
      • 7.2.2.1. U.S. Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.2.3. Canada
      • 7.2.3.1. Canada Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.2.4. Mexico
      • 7.2.4.1. Mexico Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.3. Europe
    • 7.3.1. Europe Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.3.2. UK
      • 7.3.2.1. UK Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.3.3. Germany
      • 7.3.3.1. Germany Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.3.4. France
      • 7.3.4.1. Italy Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.4. Asia Pacific
    • 7.4.1. Asia Pacific Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.4.2. China
      • 7.4.2.1. China Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.4.3. Japan
      • 7.4.3.1. Japan Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.4.4. India
      • 7.4.4.1. India Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.4.5. South Korea
      • 7.4.5.1. South Korea Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.4.6. Australia
      • 7.4.6.1. Australia Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.5. Latin America
    • 7.5.1. Latin America Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.5.2. Brazil
      • 7.5.2.1. Brazil Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.6. Middle East and Africa
    • 7.6.1. Middle East and Africa Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.6.2. UAE
      • 7.6.2.1. UAE Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.6.3. KSA
      • 7.6.3.1. KSA Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.6.4. South Africa
      • 7.6.4.1. South Africa Chiplet Market Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 8. Competitive Landscape

  • 8.1. Company Categorization
  • 8.2. Company Market Positioning
  • 8.3. Company Heat Map Analysis
  • 8.4. Company Profiles/Listing
    • 8.4.1. Advanced Micro Devices, Inc. (AMD)
      • 8.4.1.1. Participant's Overview
      • 8.4.1.2. Financial Performance
      • 8.4.1.3. Product Benchmarking
      • 8.4.1.4. Strategic Initiatives
    • 8.4.2. Intel Corporation
      • 8.4.2.1. Participant's Overview
      • 8.4.2.2. Financial Performance
      • 8.4.2.3. Product Benchmarking
      • 8.4.2.4. Strategic Initiatives
    • 8.4.3. NVIDIA Corporation
      • 8.4.3.1. Participant's Overview
      • 8.4.3.2. Financial Performance
      • 8.4.3.3. Product Benchmarking
      • 8.4.3.4. Strategic Initiatives
    • 8.4.4. Marvell Technology, Inc.
      • 8.4.4.1. Participant's Overview
      • 8.4.4.2. Financial Performance
      • 8.4.4.3. Product Benchmarking
      • 8.4.4.4. Strategic Initiatives
    • 8.4.5. Broadcom Inc.
      • 8.4.5.1. Participant's Overview
      • 8.4.5.2. Financial Performance
      • 8.4.5.3. Product Benchmarking
      • 8.4.5.4. Strategic Initiatives
    • 8.4.6. Samsung Electronics Co., Ltd.
      • 8.4.6.1. Participant's Overview
      • 8.4.6.2. Financial Performance
      • 8.4.6.3. Product Benchmarking
      • 8.4.6.4. Strategic Initiatives
    • 8.4.7. Tenstorrent Inc.
      • 8.4.7.1. Participant's Overview
      • 8.4.7.2. Financial Performance
      • 8.4.7.3. Product Benchmarking
      • 8.4.7.4. Strategic Initiatives
    • 8.4.8. Amazon Web Services, Inc. (AWS)
      • 8.4.8.1. Participant's Overview
      • 8.4.8.2. Financial Performance
      • 8.4.8.3. Product Benchmarking
      • 8.4.8.4. Strategic Initiatives
    • 8.4.9. Alibaba Group Holding Ltd. (T-Head)
      • 8.4.9.1. Participant's Overview
      • 8.4.9.2. Financial Performance
      • 8.4.9.3. Product Benchmarking
      • 8.4.9.4. Strategic Initiatives
    • 8.4.10. Microsoft Corporation
      • 8.4.10.1. Participant's Overview
      • 8.4.10.2. Financial Performance
      • 8.4.10.3. Product Benchmarking
      • 8.4.10.4. Strategic Initiatives