チップレットの世界市場

当レポートでは、世界のチップレットの市場を調査し、市場概要、市場影響因子および市場機会の分析、法規制環境、新興技術および技術開発の動向、市場規模の推移・予測、各種区分・地域別の詳細分析、競合情勢、主要企業のプロファイルなどをまとめています。

目次

第1章 エグゼクティブサマリー

• 市場見通し
• 調査範囲
• 市場分析

第2章 市場概要

• 概要
• マクロ経済要因
• 先進パッケージング技術
• 地政学的緊張
• 見通し

第3章 市場力学

• 概要
• 市場促進要因
• 高性能コンピューティング
• 5Gのチップレットに対するニーズの高まり
• 市場抑制要因/課題
• 熟練技術者の不足
• 世界の政治・金融危機
• 市場機会
• 半導体産業への継続的な投資
• 先進運転支援システム (ADAS) での使用

第4章 規制状況

• 概要
• 北米
• アジア太平洋
• 欧州
• その他

第5章 新興技術

• 新興技術
• 異種統合
• 3D統合
• 先進パッケージング
• 共パッケージ光学部品
• チップレットベースのシステムオンチップ

第6章 市場セグメンテーション分析

• セグメンテーションの内訳
• 市場内訳：プロセッサ別
• CPU
• グラフィックスプロセッシングユニット
• フィールドプログラマブルゲートアレイ
• AI-ASICコプロセッサ
• アプリケーション処理ユニット
• 市場内訳：パッケージング技術別
• 3D
• システムインパッケージ
• ウエハレベルチップスケールパッケージング
• フリップチップチップスケールパッケージ
• フリップチップボールグリッドアレイ
• ファンアウト
• 市場内訳：エンドユーザー産業別
• エンタープライズエレクトロニクス
• CE製品
• 産業オートメーション
• 自動車
• ヘルスケア
• 軍事・航空宇宙
• その他
• 地理的内訳
• 市場内訳：地域別
• 北米
• 欧州
• アジア太平洋
• その他の地域

第7章 競合情勢

• 市場エコシステム分析
• 主要企業の分析
• 戦略分析

第8章 付録

• 調査手法
• 参考文献
• 略語
• 企業プロファイル
• ACHRONIX SEMICONDUCTOR CORP.
• ADVANCED MICRO DEVICES INC.
• BROADCOM
• GLOBALFOUNDRIES INC.
• IBM CORP.
• INTEL CORP.
• NVIDIA CORP.
• RANOVUS
• SAMSUNG
• TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.

List of Tables

• Summary Table : Global Market for Chiplets, by Region, Through 2029
• Table 1 : Global Market for Chiplets, by Processor, Through 2029
• Table 2 : Global Market for Chiplets, by Packaging Technology, Through 2029
• Table 3 : Global Market for Chiplets, by End-User Industry, Through 2029
• Table 4 : Global Market for Chiplets, by Region, Through 2029
• Table 5 : North American Market for Chiplets, by Country, Through 2029
• Table 6 : North American Market for Chiplets, by Processor, Through 2029
• Table 7 : North American Market for Chiplets, by Packaging Technology, Through 2029
• Table 8 : North American Market for Chiplets, by End-User Industry, Through 2029
• Table 9 : European Market for Chiplets, by Country, Through 2029
• Table 10 : European Market for Chiplets, by Processor, Through 2029
• Table 11 : European Market for Chiplets, by Packaging Technology, Through 2029
• Table 12 : European Market for Chiplets, by End-User Industry, Through 2029
• Table 13 : Asia-Pacific Market for Chiplets, by Country, Through 2029
• Table 14 : Asia-Pacific Market for Chiplets, by Processor, Through 2029
• Table 15 : Asia-Pacific Market for Chiplets, by Packaging Technology, Through 2029
• Table 16 : Asia-Pacific Market for Chiplets, by End-User Industry, Through 2029
• Table 17 : RoW Market for Chiplets, by Country, Through 2029
• Table 18 : RoW Market for Chiplets, by Processor, Through 2029
• Table 19 : RoW Market for Chiplets, by Packaging Technology, Through 2029
• Table 20 : RoW Market for Chiplets, by End-User Industry, Through 2029
• Table 21 : Recent Developments Related to Chiplets, 2022-2024
• Table 22 : Report Information Sources
• Table 23 : Abbreviations Used in the Report
• Table 24 : Achronix Semiconductor Corp.: Company Snapshot
• Table 25 : Achronix Semiconductor Corp.: Product Portfolio
• Table 26 : Achronix Semiconductor Corp.: News/Key Developments, 2023 and 2024
• Table 27 : Advanced Micro Devices Inc.: Company Snapshot
• Table 28 : Advanced Micro Devices Inc.: Financial Performance, FY 2022 and 2023
• Table 29 : Advanced Micro Devices Inc.: Product Portfolio
• Table 30 : Advanced Micro Devices Inc.: News/Key Developments, 2022 and 2023
• Table 31 : Broadcom: Company Snapshot
• Table 32 : Broadcom: Financial Performance, FY 2022 and 2023
• Table 33 : Broadcom: Product Portfolio
• Table 34 : Broadcom: News/Key Developments, 2022 and 2023
• Table 35 : GlobalFoundries Inc.: Company Snapshot
• Table 36 : GlobalFoundries Inc.: Financial Performance, FY 2022 and 2023
• Table 37 : GlobalFoundries Inc.: Product Portfolio
• Table 38 : GlobalFoundries Inc.: News/Key Developments, 2022-2024
• Table 39 : IBM Corp.: Company Snapshot
• Table 40 : IBM Corp.: Financial Performance, FY 2022 and 2023
• Table 41 : IBM Corp.: Product Portfolio
• Table 42 : IBM Corp.: News/Key Developments, 2024
• Table 43 : Intel Corp.: Company Snapshot
• Table 44 : Intel Corp.: Financial Performance, FY 2022 and 2023
• Table 45 : Intel Corp.: Product Portfolio
• Table 46 : Intel Corp.: News/Key Developments, 2022
• Table 47 : NVIDIA Corp.: Company Snapshot
• Table 48 : NVIDIA Corp.: Financial Performance, FY 2022 and 2023
• Table 49 : NVIDIA Corp.: Product Portfolio
• Table 50 : NVIDIA Corp.: News/Key Developments, 2022-2024
• Table 51 : RANOVUS: Company Snapshot
• Table 52 : RANOVUS: Product Portfolio
• Table 53 : Samsung: Company Snapshot
• Table 54 : Samsung: Financial Performance, FY 2022 and 2023
• Table 55 : Samsung: Product Portfolio
• Table 56 : Samsung: News/Key Developments, 2024
• Table 57 : Taiwan Semiconductor Manufacturing Co. Ltd.: Company Snapshot
• Table 58 : Taiwan Semiconductor Manufacturing Co. Ltd.: Financial Performance, FY 2022 and 2023
• Table 59 : Taiwan Semiconductor Manufacturing Co. Ltd.: Product Portfolio
• Table 60 : Taiwan Semiconductor Manufacturing Co. Ltd.: News/Key Developments, 2022

List of Figures

• Summary Figure : Global Market Shares of Chiplets, by Region, 2023
• Figure 1 : Market Dynamics for the Chiplet Industry
• Figure 2 : Emerging Chiplet Technologies
• Figure 3 : Global Market Shares of Chiplets, by Processor, 2023
• Figure 4 : Global Market Shares of Chiplets, by Packaging Technology, 2023
• Figure 5 : Global Market Shares of Chiplets, by End-User Industry, 2023
• Figure 6 : Global Market Shares of Chiplets, by Region, 2023
• Figure 7 : Global Chiplet Ecosystem
• Figure 8 : Advanced Micro Devices Inc.: Revenue Share, by Business Unit, FY 2023
• Figure 9 : Advanced Micro Devices Inc.: Revenue Share, by Region, FY 2023
• Figure 10 : Broadcom: Revenue Share, by Business Unit, FY 2023
• Figure 11 : Broadcom: Revenue Share, by Region, FY 2023
• Figure 12 : GlobalFoundries Inc.: Revenue Share, by Country/Region, FY 2023
• Figure 13 : IBM Corp.: Revenue Share, by Business Unit, FY 2023
• Figure 14 : IBM Corp.: Revenue Share, by Region, FY 2023
• Figure 15 : Intel Corp.: Revenue Share, by Business Unit, FY 2023
• Figure 16 : Intel Corp.: Revenue Share, by Region, FY 2023
• Figure 17 : NVIDIA Corp.: Revenue Share, by Business Unit, FY 2023
• Figure 18 : NVIDIA Corp.: Revenue Share, by Region, FY 2023
• Figure 19 : Samsung: Revenue Share, by Business Unit, FY 2023
• Figure 20 : Samsung: Revenue Share, by Country/Region, FY 2023
• Figure 21 : Taiwan Semiconductor Manufacturing Co. Ltd.: Revenue Share, by Business Unit, FY 2023
• Figure 22 : Taiwan Semiconductor Manufacturing Co. Ltd.: Revenue Share, by Region, FY 2023

This report assesses the chiplets market by processor, packaging technology, end-user, and regions. It also analyzes related companies and service providers. The report also discusses market dynamics, such as drivers, opportunities, and restraints. The study forecasts the market value ($ million) of chiplets for key geographies. The report also focuses on the key emerging technologies that will fuel their adoption in the near future.

Report Scope

This report offers a comprehensive analysis of chiplets, with a focus on five processor segments: CPUs, GPUs, field-programmable gate arrays (FPGAs), AI-application-specific integrated circuit (AI-ASIC) coprocessors and application processing units (APUs). The report further segments the market by packaging technology, specifically 2.5D/3D, system-in-package (SiP), wafer-level chip-scale package (WLCSP), flip chip chip-scale package (FCCSP), flip chip ball grid array (FCBGA) and fan-out (FO). In addition, the chiplet market is segmented by end users: enterprise electronics, consumer electronics, industrial automation, automotive, healthcare, military and aerospace. The use of chiplets in other sectors, such as IT and telecommunication, scientific research and gaming, is also analyzed. Regions covered include North America, Europe, Asia-Pacific and the rest of the world (RoW), which includes Latin America, the Middle East and Africa.

The study also analyzes the key drivers, macroeconomic factors and regional dynamics of the chiplet market. The report concludes by providing profiles of the leading chiplet manufacturers. The base year for the study is 2023, with market forecasts for 2024 through 2029, including projections of the compound annual growth rates (CAGRs) for the forecast period 2024-2029.

Report Includes

• In-depth assessment of the global market for semiconductor chiplets
• Analyses of global market trends, with market revenue data for 2023, estimates for 2024, forecasts for 2025 and 2027, and projected CAGRs through 2029
• Estimates of the market size and revenue growth prospects, along with a market share analysis by processor type, packaging technology, end use (application) industry and region
• Facts and figures pertaining to the market dynamics, technical advances, regulations, and the impact of macroeconomic factors
• Analysis of the industry structure, including companies' market shares and rankings, strategic alliances, M&A activities, and a venture funding outlook
• Company profiles

Table of Contents

Chapter 1 Executive Summary

• Market Outlook
• Scope of the Report
• Market Summary

Chapter 2 Market Overview

• Overview
• Macroeconomic Factors
• Advanced Packaging Technologies
• Geopolitical Tensions
• Outlook

Chapter 3 Market Dynamics

• Overview
• Market Drivers
• High-Performance Computing
• 5G's Growing Need for Chiplets
• Market Restraints/Challenges
• Shortage of Skilled Labor
• Global Political and Financial Crises
• Market Opportunities
• Continuing Investment in the Semiconductor Industry
• Use in Advanced Driver-Assistance Systems (ADAS)

Chapter 4 Regulatory Landscape

• Overview
• North America
• Asia-Pacific
• Europe
• RoW

Chapter 5 Emerging Technologies

• Emerging Technologies
• Heterogeneous Integration
• 3D Integration
• Advanced Packaging
• Co-Packaged Optics
• Chiplet-Based Systems-on-Chip

Chapter 6 Market Segmentation Analysis

• Segmentation Breakdown
• Market Breakdown by Processor
• CPUs
• Graphics Processing Units
• Field-Programmable Gate Arrays
• AI-ASIC Coprocessors
• Application Processing Units
• Market Breakdown by Packaging Technology
• 2.5D/3D
• System-in-Package
• Wafer-Level Chip-Scale Packaging
• Flip Chip Chip-Scale Package
• Flip Chip Ball Grid Array
• Fan-Out
• Market Breakdown by End-User Industry
• Enterprise Electronics
• Consumer Electronics
• Industrial Automation
• Automotive
• Healthcare
• Military and Aerospace
• Other End-User Industries
• Geographical Breakdown
• Market Breakdown by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World

Chapter 7 Competitive Landscape

• Market Ecosystem Analysis
• Analysis of Leading Companies
• Strategic Analysis
• Recent Developments

Chapter 8 Appendix

• Research Methodology
• References
• Abbreviations
• Company Profiles
• ACHRONIX SEMICONDUCTOR CORP.
• ADVANCED MICRO DEVICES INC.
• BROADCOM
• GLOBALFOUNDRIES INC.
• IBM CORP.
• INTEL CORP.
• NVIDIA CORP.
• RANOVUS
• SAMSUNG
• TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.