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市場調査レポート
商品コード
1722993
先端IC基板の市場規模、シェア、動向、予測:タイプ、用途、地域別、2025年~2033年Advanced IC Substrate Market Size, Share, Trends and Forecast by Type, Application, and Region, 2025-2033 |
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先端IC基板の市場規模、シェア、動向、予測:タイプ、用途、地域別、2025年~2033年 |
出版日: 2025年05月01日
発行: IMARC
ページ情報: 英文 147 Pages
納期: 2~3営業日
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先端IC基板の世界市場規模は2024年に105億8,000万米ドルに達しました。今後、2033年には172億6,000万米ドルに達すると予測され、2025~2033年の成長率(CAGR)は5.31%です。2024年現在、アジア太平洋地域が市場を独占しています。同市場は主に、高性能電子機器に対する需要の高まり、より小型・軽量でエネルギー効率の高い機器の採用の増加、世界中でデータセンターやクラウド・コンピューティング・サービスが増加していることが要因となっています。
先端集積回路(IC)基板は、電子機器にICを実装し相互接続するための土台となる重要な部品です。最適な電気性能、熱管理、シグナルインテグリティを提供するために、高度な材料と技術を利用しています。スマートフォン、タブレット、コンピューター、その他の電子機器に見られる高性能アプリケーションの特定の要件を満たすように設計されています。接続性の向上、消費電力の削減、効率的な放熱を実現するため、先進的なIC基板の需要は世界中で高まっています。
現在、複雑な電子システムのシームレスな機能を可能にする先端IC基板の採用が増加しており、市場にプラスの影響を与えています。さらに、第5世代(5G)技術の台頭と人工知能(AI)の採用増加が、市場の成長を強化しています。これとは別に、より高いデータ転送速度とより複雑な処理タスクに対応できる先進的なIC基板に対する需要の高まりが、有利な市場見通しをもたらしています。さらに、産業用アプリケーションにおける遠隔制御電気機器のニーズの高まりは、業界の投資家に有利な成長機会を提供しています。このほか、拡張現実(AR)、仮想現実(VR)、高精細(HD)ディスプレイなどの高度な機能に対する消費者の嗜好の高まりが、市場の成長に寄与しています。さらに、世界中でモノのインターネット(IoT)デバイスの利用が増加していることも、市場の成長を後押ししています。
高性能電子機器への需要の高まり
スマートフォン、タブレット、パーソナルコンピュータ(PC)、ウェアラブルデバイス、ノートPCなど、高度な電子機器に対する需要の高まりが市場の成長に寄与しています。また、消費者は、シームレスなマルチタスク、高速接続性、強化されたグラフィックス性能を提供する電子機器を好むようになっています。また、没入型体験を個人に提供するデバイスの採用も進んでいます。これとは別に、強力なプロセッサー、メモリー・モジュール、通信部品の統合に対応できる高度なIC基板に対する需要も増加しています。その結果、メーカーは電気経路とシグナルインテグリティが最適化された基板に投資し、最小限の待ち時間で効率的なデータ転送を実現しています。
小型化の人気の高まり
小型化、軽量化、エネルギー効率の高い機器に対する個人需要の高まりと、世界の小型化人気の高まりが、市場の成長を支えています。これに伴い、小型で高密度の先端IC基板へのニーズが高まっています。このほか、これらの基板は、最適な機能を維持しながら、多層コンポーネントの積層を可能にし、デバイスのフットプリントを縮小するという利点があります。さまざまなコンポーネントを1枚の基板に集積できるため、効率が向上し、信号干渉のリスクが減り、デバイス全体の性能が向上します。
データセンターの増加
世界中でデータセンターとクラウド・コンピューティング・サービスの数が増加していることが、市場の成長を後押ししています。企業や個人は、膨大な量の情報を保存・管理するために、クラウド・コンピューティング、ビッグデータ分析、オンライン・サービスへの依存度を高めています。データセンターには無数のサーバー、ストレージシステム、ネットワーク機器があり、かなりの熱を発生します。これに伴い、過熱を防ぎ、中断のない動作を保証するために、効率的な放熱が必要とされています。これに加え、先進的なIC基板は、熱管理機能を強化し、熱拡散特性を提供することで、これらのシステムの信頼性と寿命の維持を支援します。さらに、熱を効果的に管理できる高性能基板への需要の高まりが、市場の成長を強化しています。
The global advanced IC substrate market size reached USD 10.58 Billion in 2024. Looking forward, the market is expected to reach USD 17.26 Billion by 2033, exhibiting a growth rate (CAGR) of 5.31% during 2025-2033. Asia Pacific currently dominates the market in 2024. The market is primarily driven by the growing demand for high-performance electronic devices, rising adoption of smaller, lighter, and more energy-efficient devices, and the increasing number of data centers and cloud computing services across the globe.
An advanced integrated circuit (IC) substrate is a crucial component that serves as a foundation for mounting and interconnecting ICs within electronic devices. It utilizes advanced materials and technologies to provide optimal electrical performance, thermal management, and signal integrity. It is designed to meet the specific requirements of high-performance applications that are found in smartphones, tablets, computers, and other electronic devices. As it assists in offering enhanced connectivity, reduced power consumption, and efficient heat dissipation, the demand for advanced IC substrates is rising across the globe.
At present, the increasing adoption of advanced IC substrate, as it enables the seamless functioning of intricate electronic systems, is influencing the market positively. Moreover, the rising emergence of fifth-generation (5G) technology, along with the increasing adoption of artificial intelligence (AI), is strengthening the growth of the market. Apart from this, the growing demand for advanced IC substrates that can accommodate higher data transfer rates and more complex processing tasks is offering a favorable market outlook. Additionally, the rising need for remote-controlled electrical equipment in industrial applications is offering lucrative growth opportunities to industry investors. Besides this, the increasing consumer preferences for advanced features, such as augmented reality (AR), virtual reality (VR), and high-definition (HD) displays, are contributing to the growth of the market. In addition, the rising utilization of the Internet of Things (IoT) devices around the world is impelling the growth of the market.
Rising demand for high-performance electronic devices
The rising demand for advanced electronic devices, such as smartphones, tablets, personal computers (PCs), wearable devices, and laptops, is contributing to the growth of the market. In addition, consumers are increasingly preferring electronic devices that assist in providing seamless multitasking, high-speed connectivity, and enhanced graphics performance. They are also adopting devices that provide immersive experiences to individuals. Apart from this, there is an increase in the demand for advanced IC substrates that can accommodate the integration of powerful processors, memory modules, and communication components. As a result, manufacturers are investing in substrates with optimized electrical pathways and signal integrity that ensure efficient data transfer with minimal latency.
Increasing popularity of miniaturization
The increasing demand for smaller, lighter, and more energy-efficient devices among individuals, along with the rising popularity of miniaturization around the world, is supporting the growth of the market. In line with this, there is a rise in the need for compact and high-density advanced IC substrates. Besides this, these substrates benefit by enabling the stacking of multiple layers of components and reducing the footprint of devices while maintaining optimal functionality. The ability to integrate various components on a single substrate enhances efficiency, reduces the risk of signal interference, and improves the overall device performance, which is offering a positive market outlook.
Growing number of data centers
The rising number of data centers and cloud computing services across the globe is bolstering the growth of the market. Businesses and individuals rely increasingly on cloud computing, big data analysis, and online services for storing and managing vast volumes of information. Data centers have countless servers, storage systems, and networking equipment that generate substantial heat. In line with this, there is a need for efficient thermal dissipation to prevent overheating and ensure uninterrupted operation. Besides this, advanced IC substrates offer enhanced thermal management capabilities and heat-spreading properties that assist in maintaining the reliability and longevity of these systems. Furthermore, the increasing demand for high-performance substrates that can manage heat effectively is strengthening the growth of the market.
FC BGA represents the largest market segment
Consumer electronics accounts for the majority of the market share
Asia Pacific exhibits a clear dominance, accounting for the largest advanced IC substrate market share
The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.
Asia Pacific held the biggest market share due to the presence of improved manufacturing units. In line with this, the rising demand for innovative electronic devices among individuals is bolstering the growth of the market in the Asia Pacific region. Moreover, favorable government initiatives in the region are supporting the growth of the market. Apart from this, the rising popularity of automotive electronics due to the increasing demand for electric vehicles (EVs) is contributing to the growth of the market in the region.
Major players are consistently investing in research and development (R&D) activities to develop advanced IC substrate materials and technologies. This includes exploring novel materials with improved thermal conductivity, signal integrity, and electrical performance to cater to high-performance applications. Additionally, semiconductor manufacturers and consumer electronics companies are engaging in collaboration that enables the exchange of expertise, technology, and resources, that is leading to the development of tailored solutions that meet specific market needs. Besides this, companies are constantly refining their manufacturing processes to enhance the precision, scalability, and cost-efficiency of producing advanced IC substrates. This includes adopting advanced technologies, such as lithography, laser drilling, and advanced packaging techniques.
In 2023, LG Innotek unveiled the latest FC-BGA for the first time at the 'CES 2023'. It is highly integrated, multi layered, large scaled, and has fine patterning and a lot of micro vias.
In 2021, Advanced Semiconductor Engineering, Inc. (ASE) collaborated with Siemens Digital Industries Software to generate two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.
In 2021, AT&S AG, one of the leading manufacturers of high-end printed circuit boards and IC substrates, announced the development of a new production site for IC substrates in Southeast Asia, subject to the approval of the Supervisory Board.