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PCBにおけるIC基板の世界市場

IC Substrates in PCBs

出版日
ページ情報
英文 276 Pages
納期
即日から翌営業日
適宜更新あり
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価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=145.42円
PCBにおけるIC基板の世界市場
出版日: 2025年06月13日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 276 Pages
納期: 即日から翌営業日
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概要

PCBにおけるIC基板の世界市場は2030年までに175億米ドルに達する見込み

2024年に87億米ドルと推定されるPCBにおけるIC基板の世界市場は、2024年から2030年にかけてCAGR 12.3%で成長し、2030年には175億米ドルに達すると予測されます。本レポートで分析したセグメントの1つであるFC BGAは、CAGR 10.7%を記録し、分析期間終了時には109億米ドルに達すると予測されます。FC CSPセグメントの成長率は、分析期間でCAGR 15.5%と推定されます。

米国市場は24億米ドル、中国はCAGR16.3％で成長予測

米国のPCBにおけるIC基板市場は、2024年には24億米ドルになると推定されます。世界第2位の経済大国である中国は、2030年までに36億米ドルの市場規模に達すると予測され、分析期間2024-2030年のCAGRは16.3%です。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ9.1％と10.9％と予測されています。欧州では、ドイツがCAGR約9.7%で成長すると予測されています。

世界のPCBにおけるIC基板市場- 主要動向と促進要因のまとめ

なぜIC基板が次世代PCB設計の基幹になりつつあるのか？

集積回路（IC）基板は、プリント回路基板（PCB）においてますます重要性を増しており、半導体チップと広範な回路アセンブリの間の重要なインターフェースとして機能しています。これらの基板は機械的な支持を提供し、高密度の電気的相互接続を可能にするため、先進コンピューティング、家電、通信、車載電子機器などのチップパッケージングに不可欠です。従来のPCBとは異なり、IC基板は小型化、放熱、シグナルインテグリティ、多層配線など、高性能チップの要求に対応できるように設計されています。その結果、多くの半導体アプリケーションにおいて、リードフレームやセラミックパッケージに取って代わりつつあります。

ハイパフォーマンス・コンピューティング（HPC）、5Gインフラ、システム・イン・パッケージ（SiP）アーキテクチャの採用が増加していることから、IC基板は現代のエレクトロニクス設計の基礎的要素として位置づけられています。半導体パッケージは、受動的な筐体からシステム性能の能動的な構成要素へと進化しており、IC基板は、ますます小型化する形状での垂直スタッキング、電力供給、信号伝送を可能にしています。このシフトは、より高速で、より薄く、よりエネルギー効率の高いデバイスを求める消費者や産業界の需要によってもたらされており、これらはすべて、多層PCB環境にシームレスに統合される高度な基板技術に依存しています。

どのような技術革新がPCBシステムにおけるIC基板の能力を再構築しているのか？

IC基板市場は、材料科学、小型化、製造精度の革新の波を経験しています。大きな動向の一つは、従来のFR4から、BT樹脂、ABF（味の素ビルドアップフィルム）、エポキシ系材料を使用した高性能ビルドアップ基板への移行です。これらは、プロセッサーやメモリーデバイスの高速信号伝送に不可欠な、より微細なライン/スペース形状、より高いI/O密度、より低い誘電損失を可能にします。特にABF基板は、その優れた性能と信頼性により、CPU、GPU、AIアクセラレータなどの先進ノードのパッケージングにおけるデファクトスタンダードになりつつあります。

高密度相互接続（HDI）と組み込みトレース基板（ETS）技術の進歩は、PCBアセンブリにおけるIC基板の役割をさらに強化しています。これらにより、電気的性能を損なうことなく、より高い層数、超ファインピッチ配線、小型化が可能になります。フリップチップ・パッケージング、ファンアウト・ウエハーレベル・パッケージング（FOWLP）、チップレット・インテグレーションもまた、単一パッケージ内でのマルチダイおよび多機能サポートを要求することにより、基板設計を再構築しています。こうした要件を満たすため、メーカーは複雑な基板スタック全体でサブミクロン精度と層間アライメントを確保する高度なレーザー穴あけ、フォトリソグラフィー、検査システムに投資しています。

PCB用途で先端IC基板の需要を牽引している最終用途は？

IC基板の需要は、デジタル変革や製品革新が進む広範な業界によって促進されています。民生用電子機器では、スマートフォン、タブレット、ウェアラブル端末が、小型化されたロジックチップやメモリーチップを搭載するIC基板に依存しており、USB4、LPDDR5、Wi-Fi 7などの高速インターフェースをサポートする超薄型で熱効率の高い基板が求められています。コンピューティング分野では、サーバー、データセンター、HPCシステムが、AIワークロード、クラウドコンピューティング、複雑なデータ分析に電力を供給するマルチチップモジュールにIC基板を導入し、電気性能と熱管理の限界に課題しています。

自動車エレクトロニクス分野は、特にEV、自律走行システム、車載インフォテインメントなどの台頭により、自動車の電子コンテンツが増加しているため、主要な促進要因として台頭してきています。IC基板は、高信頼性と耐熱性が不可欠な電子制御ユニット（ECU）、バッテリー管理システム（BMS）、レーダー/ライダー・モジュールにおいて重要です。同様に、通信分野では、シグナルインテグリティと高速データ処理が最重要となる5G基地局、光モジュール、高周波RFデバイスで先進的な基板が活用されています。産業オートメーションや医療エレクトロニクスでも、IC基板は精密機器、画像システム、センサー統合で重要な役割を果たしています。

PCBにおけるIC基板市場の成長はいくつかの要因によってもたらされる...

PCBにおけるIC基板市場の成長は、半導体パッケージングの進化、高速データ要件、先進電子システムの普及に関連するいくつかの要因によって牽引されています。中でも、ヘテロジニアス・インテグレーションやチップレット・ベース・アーキテクチャへの移行が進んでおり、複雑な相互接続ソリューションが必要とされています。AIプロセッサー、グラフィックス・アクセラレーター、広帯域メモリーに対する需要の急増も、I/O数の多さ、信号損失の少なさ、優れた放熱性をサポートする基板の必要性を高めています。

材料の革新も重要な推進力となっており、基板メーカーは、より微細な形状や多層積層をサポートするため、ABFやその他の高度な誘電体の採用を増やしています。同時に、東アジアの大手企業によるサプライチェーンへの投資と生産能力の拡張は、半導体と先進パッケージングの需要急増に対応するための拡張性を確保しています。5Gの展開、自動車の電動化、エッジコンピューティングの成長はすべて、次世代PCBアセンブリにおけるIC基板の役割を強化しています。最後に、デバイスの機能が高まる一方でフォームファクターが縮小する中、IC基板はエレクトロニクス・バリューチェーンの各層で性能、電力効率、統合を実現する戦略的イネーブラーとして台頭しています。

セグメント

タイプ（FC BGA、FC CSP）、アプリケーション（タブレットPC、スマートフォン、ノートPC、ウェアラブルデバイス、その他のアプリケーション）

調査対象企業の例（注目の36社）

  • ASE Technology Holding Co., Ltd.
  • AT&S（Austria Technologie & Systemtechnik AG）
  • Daeduck Electronics Co., Ltd.
  • HannStar Board Corporation
  • Ibiden Co., Ltd.
  • KCE Electronics Public Company Limited
  • Kinsus Interconnect Technology Corp.
  • Kyocera Corporation
  • LG Innotek Co., Ltd.
  • Nan Ya PCB Corporation
  • Samsung Electro-Mechanics Co., Ltd.
  • Shennan Circuits Co., Ltd.
  • Shinko Electric Industries Co., Ltd.
  • Simmtech Co., Ltd.
  • Toppan Inc.
  • Tripod Technology Corporation
  • TTM Technologies, Inc.
  • Unimicron Technology Corporation
  • WUS Printed Circuit Co., Ltd.
  • Zhen Ding Technology Holding Limited

関税影響係数

Global Industry Analystsは、本社の国、製造拠点、輸出入（完成品とOEM）に基づく企業の競争力の変化を予測しています。この複雑で多面的な市場力学は、人為的な売上原価の増加、収益性の低下、サプライチェーンの再構築など、ミクロおよびマクロの市場力学の中でも特に競合他社に影響を与える見込みです。

Global Industry Analystsは、世界の主要なチーフ・エコノミスト（1万4,949人）、シンクタンク（62団体）、貿易・産業団体（171団体）の専門家の意見に熱心に従いながら、エコシステムへの影響を評価し、新たな市場の現実に対処しています。あらゆる主要国の専門家やエコノミストが、関税とそれが自国に与える影響についての意見を追跡調査しています。

Global Industry Analystsは、この混乱が今後2-3ヶ月で収束し、新しい世界秩序がより明確に確立されると予想しています。Global Industry Analystsは、これらの開発をリアルタイムで追跡しています。

2025年4月：交渉フェーズ

4月のリリースでは、世界市場全体に対する関税の影響を取り上げ、地域別の市場調整について紹介します。当社の予測は、過去のデータと進化する市場影響要因に基づいています。

2025年7月：最終関税リセット

お客様には、各国間で最終リセットが発表された後、7月に無料アップデート版をお届けします。最終アップデート版には、明確に定義された関税影響分析が組み込まれています。

相互および二国間貿易と関税の影響分析：

アメリカ <>中国<>メキシコ <>カナダ <>EU <>日本<>インド <>その他176カ国

業界をリードするエコノミスト：Global Industry Analystsの知識ベースは、国家、シンクタンク、貿易・産業団体、大企業、そして世界の計量経済状況におけるこの前例のないパラダイムシフトの影響を共有する領域の専門家など、最も影響力のあるチーフエコノミストの厳選されたグループを含む1万4,949人のエコノミストを追跡しています。我々の16,491以上のレポートのほとんどは、マイルストーンに基づくこの2段階のリリーススケジュールを取り入れています。

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • スペイン
  • ロシア
  • その他欧州
  • アジア太平洋
  • オーストラリア
  • インド
  • 韓国
  • その他アジア太平洋地域
  • ラテンアメリカ
  • アルゼンチン
  • ブラジル
  • メキシコ
  • その他ラテンアメリカ
  • 中東
  • イラン
  • イスラエル
  • サウジアラビア
  • アラブ首長国連邦
  • その他中東
  • アフリカ

第4章 競合

目次
Product Code: MCP35209

Global IC Substrates in PCBs Market to Reach US$17.5 Billion by 2030

The global market for IC Substrates in PCBs estimated at US$8.7 Billion in the year 2024, is expected to reach US$17.5 Billion by 2030, growing at a CAGR of 12.3% over the analysis period 2024-2030. FC BGA, one of the segments analyzed in the report, is expected to record a 10.7% CAGR and reach US$10.9 Billion by the end of the analysis period. Growth in the FC CSP segment is estimated at 15.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.4 Billion While China is Forecast to Grow at 16.3% CAGR

The IC Substrates in PCBs market in the U.S. is estimated at US$2.4 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$3.6 Billion by the year 2030 trailing a CAGR of 16.3% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 9.1% and 10.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 9.7% CAGR.

Global IC Substrates in PCBs Market - Key Trends & Drivers Summarized

Why Are IC Substrates Becoming the Backbone of Next-Generation PCB Design?

Integrated Circuit (IC) substrates are increasingly critical in printed circuit boards (PCBs), serving as the essential interface between semiconductor chips and the broader circuit assembly. These substrates provide mechanical support and enable high-density electrical interconnections, making them indispensable for chip packaging in advanced computing, consumer electronics, telecommunications, and automotive electronics. Unlike traditional PCBs, IC substrates are designed to handle the demands of high-performance chips, including miniaturization, heat dissipation, signal integrity, and multi-layer interconnect routing. As a result, they are rapidly replacing lead frames and ceramic packages in many semiconductor applications.

The rising adoption of high-performance computing (HPC), 5G infrastructure, and system-in-package (SiP) architectures has positioned IC substrates as a foundational element of modern electronics design. Semiconductor packaging has evolved from being a passive enclosure to an active component of system performance, with IC substrates enabling vertical stacking, power delivery, and signal transmission at increasingly smaller geometries. This shift is driven by consumer and industrial demand for faster, thinner, and more energy-efficient devices, all of which depend on sophisticated substrate technology that integrates seamlessly into multilayer PCB environments.

What Technological Innovations Are Reshaping IC Substrate Capabilities in PCB Systems?

The IC substrates market is experiencing a wave of innovation in material science, miniaturization, and manufacturing precision. One major trend is the transition from traditional FR4 to high-performance build-up substrates using BT resin, ABF (Ajinomoto Build-up Film), and epoxy-based materials. These enable finer line/space geometries, higher I/O densities, and lower dielectric loss, which are essential for high-speed signal transmission in processors and memory devices. ABF substrates, in particular, are becoming the de facto standard in packaging advanced nodes such as CPUs, GPUs, and AI accelerators due to their superior performance and reliability.

Advancements in high-density interconnect (HDI) and embedded trace substrate (ETS) technologies are further enhancing the role of IC substrates in PCB assemblies. These allow for higher layer counts, ultra-fine pitch wiring, and increased miniaturization-all without compromising electrical performance. Flip-chip packaging, fan-out wafer-level packaging (FOWLP), and chiplet integration are also reshaping substrate design by demanding multi-die and multi-functional support within a single package. To meet these requirements, manufacturers are investing in advanced laser drilling, photolithography, and inspection systems that ensure sub-micron precision and inter-layer alignment across complex substrate stacks.

Which End-Use Sectors Are Driving Demand for Advanced IC Substrates in PCB Applications?

The demand for IC substrates is being fueled by a broad spectrum of industries undergoing digital transformation and product innovation. In consumer electronics, smartphones, tablets, and wearables rely on IC substrates for their miniaturized logic and memory chips, demanding ultra-thin, thermally efficient substrates that support high-speed interfaces like USB4, LPDDR5, and Wi-Fi 7. In the computing sector, servers, data centers, and HPC systems are deploying IC substrates in multi-chip modules that power AI workloads, cloud computing, and complex data analytics-pushing the limits of electrical performance and thermal management.

The automotive electronics segment is emerging as a major growth driver due to the increasing electronic content in vehicles, particularly with the rise of EVs, autonomous driving systems, and in-vehicle infotainment. IC substrates are critical in electronic control units (ECUs), battery management systems (BMS), and radar/lidar modules, where high-reliability and heat resistance are essential. Likewise, the telecom sector is leveraging advanced substrates in 5G base stations, optical modules, and high-frequency RF devices, where signal integrity and high-speed data processing are paramount. Even in industrial automation and medical electronics, IC substrates are playing a crucial role in precision instrumentation, imaging systems, and sensor integration.

The Growth in the IC Substrates in PCBs Market Is Driven by Several Factors…

The growth in the IC substrates in PCBs market is driven by several factors related to semiconductor packaging evolution, high-speed data requirements, and the proliferation of advanced electronic systems. Chief among these is the ongoing transition to heterogeneous integration and chiplet-based architectures, which require complex interconnect solutions that IC substrates are uniquely positioned to deliver. The surge in demand for AI processors, graphics accelerators, and high-bandwidth memory has also intensified the need for substrates that support high I/O counts, minimal signal loss, and superior heat dissipation.

Material innovation is another key driver, with substrate manufacturers increasingly adopting ABF and other advanced dielectrics to support finer geometries and multilayer stacking. At the same time, supply chain investments and capacity expansions by major players in East Asia are ensuring scalability to meet demand surges in semiconductors and advanced packaging. The rollout of 5G, the electrification of vehicles, and the growth of edge computing are all reinforcing the role of IC substrates in next-gen PCB assemblies. Finally, as device functionality increases while form factors shrink, IC substrates are emerging as strategic enablers of performance, power efficiency, and integration in every layer of the electronics value chain.

SCOPE OF STUDY:

The report analyzes the IC Substrates in PCBs market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (FC BGA, FC CSP); Application (Tablet PC, Smart Phones, Laptops, Wearable Devices, Other Applications)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 36 Featured) -

  • ASE Technology Holding Co., Ltd.
  • AT&S (Austria Technologie & Systemtechnik AG)
  • Daeduck Electronics Co., Ltd.
  • HannStar Board Corporation
  • Ibiden Co., Ltd.
  • KCE Electronics Public Company Limited
  • Kinsus Interconnect Technology Corp.
  • Kyocera Corporation
  • LG Innotek Co., Ltd.
  • Nan Ya PCB Corporation
  • Samsung Electro-Mechanics Co., Ltd.
  • Shennan Circuits Co., Ltd.
  • Shinko Electric Industries Co., Ltd.
  • Simmtech Co., Ltd.
  • Toppan Inc.
  • Tripod Technology Corporation
  • TTM Technologies, Inc.
  • Unimicron Technology Corporation
  • WUS Printed Circuit Co., Ltd.
  • Zhen Ding Technology Holding Limited

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • IC Substrates in PCBs - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for High-Performance Semiconductors Fuels Growth of IC Substrates in Advanced PCB Assemblies
    • Miniaturization of Electronic Devices Drives Adoption of High-Density Interconnect (HDI) and IC Substrate-Based PCB Designs
    • Surge in AI, 5G, and High-Speed Computing Applications Boosts Use of Substrate-Like PCBs (SLPs) for Signal Integrity
    • Increased Complexity of System-in-Package (SiP) and Multi-Chip Modules Expands Demand for Advanced Substrate Materials
    • OEM Focus on Thermal Management and Electrical Performance Enhances Use of IC Substrates With Low Dk/Df Properties
    • Expansion of Automotive Electronics and ADAS Applications Elevates Need for Rigid, High-Reliability IC Substrate Layers
    • Growth in Consumer Electronics and Wearables Supports Volume Production of Miniaturized, Multi-Layer IC Substrate PCBs
    • Technological Innovations in Organic Substrates and Build-Up Layers Improve Functionality in High-I/O Density Packages
    • Rise in Chiplet and 2.5D/3D Packaging Architectures Drives Integration of IC Substrates Into PCB Interposer Structures
    • Global Semiconductor Supply Chain Realignment Encourages Investment in Domestic Substrate Fabrication Facilities
    • Rising Demand for High-Speed Memory and GPU Modules Propels Innovation in BT Resin-Based and ABF Substrate Materials
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World IC Substrates in PCBs Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for IC Substrates in PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for FC BGA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for FC BGA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for FC BGA by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for FC CSP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for FC CSP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for FC CSP by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Tablet PC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Tablet PC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for Tablet PC by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Smart Phones by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Smart Phones by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for Smart Phones by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Laptops by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Laptops by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Laptops by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 22: World 15-Year Perspective for Wearable Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 25: World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 26: USA Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 28: USA 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 29: USA Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 30: USA Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 31: USA 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 32: Canada Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 34: Canada 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 35: Canada Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 36: Canada Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 37: Canada 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • JAPAN
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 38: Japan Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Japan Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 40: Japan 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 41: Japan Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: Japan Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 43: Japan 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • CHINA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 44: China Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: China Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 46: China 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 47: China Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: China Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 49: China 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • EUROPE
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 50: Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe Historic Review for IC Substrates in PCBs by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 52: Europe 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 53: Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Europe Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 55: Europe 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 56: Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Europe Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 58: Europe 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • FRANCE
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 59: France Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 60: France Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 61: France 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 62: France Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: France Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 64: France 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • GERMANY
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 65: Germany Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Germany Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 67: Germany 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 68: Germany Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Germany Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 70: Germany 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 71: Italy Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: Italy Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 73: Italy 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 74: Italy Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Italy Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 76: Italy 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 77: UK Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 78: UK Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 79: UK 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 80: UK Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: UK Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 82: UK 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • SPAIN
    • TABLE 83: Spain Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Spain Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 85: Spain 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 86: Spain Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Spain Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 88: Spain 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • RUSSIA
    • TABLE 89: Russia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: Russia Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 91: Russia 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 92: Russia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Russia Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 94: Russia 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Rest of Europe Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 97: Rest of Europe 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 98: Rest of Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Rest of Europe Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 100: Rest of Europe 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for IC Substrates in PCBs by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 103: Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2015, 2025 & 2030
    • TABLE 104: Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Asia-Pacific Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 106: Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 107: Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Asia-Pacific Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 109: Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • AUSTRALIA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 110: Australia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Australia Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 112: Australia 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 113: Australia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: Australia Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 115: Australia 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • INDIA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 116: India Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: India Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 118: India 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 119: India Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: India Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 121: India 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • SOUTH KOREA
    • TABLE 122: South Korea Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: South Korea Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 124: South Korea 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 125: South Korea Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: South Korea Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 127: South Korea 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 128: Rest of Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Rest of Asia-Pacific Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 130: Rest of Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 131: Rest of Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Rest of Asia-Pacific Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 133: Rest of Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • LATIN AMERICA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 134: Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 135: Latin America Historic Review for IC Substrates in PCBs by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 136: Latin America 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2015, 2025 & 2030
    • TABLE 137: Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Latin America Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 139: Latin America 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 140: Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Latin America Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 142: Latin America 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ARGENTINA
    • TABLE 143: Argentina Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Argentina Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 145: Argentina 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 146: Argentina Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Argentina Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 148: Argentina 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • BRAZIL
    • TABLE 149: Brazil Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 150: Brazil Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 151: Brazil 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 152: Brazil Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 153: Brazil Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 154: Brazil 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • MEXICO
    • TABLE 155: Mexico Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 156: Mexico Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 157: Mexico 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 158: Mexico Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 159: Mexico Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 160: Mexico 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 161: Rest of Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 162: Rest of Latin America Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 163: Rest of Latin America 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 164: Rest of Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 165: Rest of Latin America Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 166: Rest of Latin America 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • MIDDLE EAST
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 167: Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 168: Middle East Historic Review for IC Substrates in PCBs by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 169: Middle East 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2015, 2025 & 2030
    • TABLE 170: Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 171: Middle East Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 172: Middle East 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 173: Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 174: Middle East Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 175: Middle East 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • IRAN
    • TABLE 176: Iran Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 177: Iran Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 178: Iran 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 179: Iran Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 180: Iran Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 181: Iran 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ISRAEL
    • TABLE 182: Israel Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 183: Israel Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 184: Israel 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 185: Israel Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 186: Israel Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 187: Israel 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • SAUDI ARABIA
    • TABLE 188: Saudi Arabia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 189: Saudi Arabia Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 190: Saudi Arabia 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 191: Saudi Arabia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 192: Saudi Arabia Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 193: Saudi Arabia 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 194: UAE Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 195: UAE Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 196: UAE 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 197: UAE Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 198: UAE Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 199: UAE 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 200: Rest of Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 201: Rest of Middle East Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 202: Rest of Middle East 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 203: Rest of Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 204: Rest of Middle East Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 205: Rest of Middle East 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • AFRICA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 206: Africa Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 207: Africa Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 208: Africa 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 209: Africa Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 210: Africa Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 211: Africa 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030

IV. COMPETITION