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先端IC基板の市場規模、シェア、動向分析レポート：タイプ別、技術別、用途別、地域別、セグメント予測、2025～2033年

Advanced IC Substrates Market Size, Share & Trends Analysis Report By Type (Flip Chip Ball Grid Array (FCBGA) Substrates, Flip Chip Chip Scale Package (FCCSP) Substrates), By Technology, By Application, By Region, And Segment Forecasts, 2025 - 2033

出版日
ページ情報
英文 130 Pages
納期
2～10営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=149.53円
先端IC基板の市場規模、シェア、動向分析レポート：タイプ別、技術別、用途別、地域別、セグメント予測、2025～2033年
出版日: 2025年07月03日
発行: Grand View Research
ページ情報: 英文 130 Pages
納期: 2～10営業日
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  • 概要
  • 図表
  • 目次
概要

先端IC基板市場の概要

世界の先端IC基板市場規模は、2024年に167億3,000万米ドルと推定され、2033年には372億米ドルに達し、2025～2033年のCAGRは9.4%で成長すると予測されています。ヘテロジニアス集積やチップレットベースアーキテクチャの採用が増加していることが、世界の先端IC基板産業の重要な動向として浮上しており、高密度化の需要を促進しています。

これらの多層基板は、AI、5G、自動車アプリケーションにわたる小型、エネルギー効率、高性能半導体包装を可能にします。電動モビリティとクリーンな輸送に向けた世界の後押しが、先端IC基板の需要を大幅に押し上げています。炭化ケイ素や窒化ガリウムなどのワイドバンドギャップ半導体の採用は、電気自動車のパワートレインや高電圧産業システムの中心になりつつあります。炭化ケイ素は、Teslaなどの大手メーカーが電気自動車用インバータに使用して以来、広く支持されるようになりました。高い電界耐性や熱伝導性などの優れた特性は、要求の厳しい自動車環境に理想的です。このシフトは、2019年のわずか4%から、2030年には高級車の総価値の20%以上を半導体が占めるようになるという予測によってさらに裏付けられています。その結果、高電圧・高温性能をサポートする堅牢な基板材料への需要が、自動車セグメントの市場成長を後押ししています。

人工知能アプリケーションの急増は、半導体の展望を再構築し、包装と基板技術に激しい性能要求を突きつけています。AIチップは現在、迅速なデータ転送、低消費電力、熱性能の向上を要求しており、産業はより洗練された包装ソリューションの開発を推進しています。国立先進包装製造プログラムは、人工知能を、装置、電力供給、チップレットサポートシステムの技術革新を必要とする重要な推進力として特定しています。政府が支援する投資はこれらのセグメントの研究を加速させており、今後5年間で1億米ドルの資金が見込まれています。こうした開発は、高密度で熱効率の高い基板、特にデータセンターやエッジデバイスのAI中心のハードウェアに最適化された基板の需要を押し上げ、市場全体の成長を促進しています。

半導体産業は、異種集積やチップレットベースシステムアーキテクチャへの移行に伴い、大きな変革期を迎えています。従来型モノリシックチップ設計は、歩留まり向上とコスト削減を実現するモジュール型チップレット構成に取って代わられつつあります。この進化には、多様なチップレット間のシームレスな通信をサポートする高性能相互接続プラットフォームとして機能する先進的IC基板が必要です。調査予測によると、包装の将来は、インターポーザーのような中間層の必要性に代わって、チップレットから基板への直接組み立てによる簡素化された階層に移行します。基板技術は、受動部品や能動部品を組み込んだシリコンコアやガラスコアを含むように適応されつつあります。このアーキテクチャの転換は、より効率的でスケーラブル、かつコスト効率の高い半導体設計と製造を可能にし、市場を活性化しています。

ウエハーベースラウンドプロセスから大面積パネルレベル包装への移行は、基板製造プロセスを再定義しています。パネルサイズは最大650mm×650mmに達し、メーカーは1サイクルにより多くのデバイスを処理できるようになり、スループットの大幅な向上と製造コストの削減を実現しています。この進化は、モバイルエレクトロニクス、医療用ウェアラブル、軟質ハイブリッドデバイスなどの大量生産セグメントに特に大きな影響を与えます。また、より大きなパネルを使用することで、より薄い基板上に、より複雑な設計を統合することが可能になり、潜在的なアプリケーションの幅が広がります。

最近のサプライチェーンの混乱に対応して、いくつかの政府は先端IC基板の再調達と国産化に注力しています。米国は現在、最先端のチップ包装に不可欠なフリップチップ・ボールグリッド・アレイやフリップチップチップ・スケール包装のようなハイエンド基板を製造する能力を最小限に抑えています。CHIPS and Science Actの一環として、連邦政府による総額3億米ドル近い支援が国内能力構築に向けて行われています。こうした取り組みには、基板試作のための積層造形や三次元印刷などの新技術への投資も含まれます。その狙いは、海外サプライヤーへの依存を減らし、半導体産業のより強靭で安全な供給網を確立することにあります。こうした戦略的な動きは、先進包装技術への一貫したアクセスを確保し、主要な垂直市場全体で長期的な成長を促進することで、市場を後押ししています。

目次

第1章 調査手法と範囲

第2章 エグゼクティブサマリー

第3章 先端IC基板市場の変数、動向、範囲

  • 市場系統の展望
  • 市場力学
    • 市場促進要因分析
    • 市場抑制要因分析
    • 産業の課題
  • 先進IC基板市場分析ツール
    • 産業分析-ポーターのファイブフォース分析
    • PESTEL分析

第4章 先端IC基板市場：タイプ別、推定・動向分析

  • セグメントダッシュボード
  • 先端IC基板市場：タイプ変動分析、2024年と2033年
  • フリップチップボールグリッドアレイ（FCBGA）基板
  • フリップチップチップスケール包装（FCCSP）基板
  • ワイヤボンド基板
  • 埋め込み基板
  • その他

第5章 先端IC基板市場：技術別、推定・動向分析

  • セグメントダッシュボード
  • 先端IC基板市場：技術変動分析、2024年と2033年
  • 高密度相互接続（HDI）基板
  • ビルドアップ基板
  • コアレス基板
  • 有機基質
  • セラミック基板

第6章 先端IC基板市場：用途別、推定・動向分析

  • セグメントダッシュボード
  • 先端IC基板市場：用途変動分析、2024年と2033年
  • モバイルとコンシューマーエレクトロニクス
  • 自動車用電子機器
  • ネットワークと通信デバイス
  • コンピューティングとデータセンター
  • その他

第7章 先端IC基板市場：地域別、推定・動向分析

  • 先進IC基板市場シェア、地域別、2024年と2033年、100万米ドル
  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • 英国
    • ドイツ
    • フランス
  • アジア太平洋
    • 中国
    • 日本
    • インド
    • 韓国
    • オーストラリア
  • ラテンアメリカ
    • ブラジル
  • 中東・アフリカ
    • アラブ首長国連邦
    • サウジアラビア
    • 南アフリカ

第8章 競合情勢

  • 企業分類
  • 企業の市場ポジショニング
  • 企業ヒートマップ分析
  • 企業プロファイル/上場企業
    • ASE TECHNOLOGY HOLDING
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Fujitsu
    • IBIDEN
    • KINSUS INTERCONNECT TECHNOLOGY CORP
    • KYOCERA Corporation
    • LG Innotek
    • NAN YA PLASTICS CORPORATION
    • SAMSUNG ELECTRO-MECHANICS
    • Unimicron
図表

List of Tables

  • Table 1 Global Advanced IC Substrates Market size estimates & forecasts 2021 - 2033 (USD Million)
  • Table 2 Global Advanced IC Substrates Market, by region 2021 - 2033 (USD Million)
  • Table 3 Global Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 4 Global Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 5 Global Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 6 Flip Chip Ball Grid Array (FCBGA) Substrates market, by region 2021 - 2033 (USD Million)
  • Table 7 Flip Chip Chip Scale Package (FCCSP) Substrates market, by region 2021 - 2033 (USD Million)
  • Table 8 Wire Bond Substrates market, by region 2021 - 2033 (USD Million)
  • Table 9 Embedded Substrates market, by region 2021 - 2033 (USD Million)
  • Table 10 Others market, by region 2021 - 2033 (USD Million)
  • Table 11 High-Density Interconnect (HDI) Substrates market, by region 2021 - 2033 (USD Million)
  • Table 12 Build-Up Substrates market, by region 2021 - 2033 (USD Million)
  • Table 13 Coreless Substrates market, by region 2021 - 2033 (USD Million)
  • Table 14 Organic Substrates market, by region 2021 - 2033 (USD Million)
  • Table 15 Ceramic Substrates market, by region 2021 - 2033 (USD Million)
  • Table 16 Mobile and Consumer Electronics market, by region 2021 - 2033 (USD Million)
  • Table 17 Automotive Electronics market, by region 2021 - 2033 (USD Million)
  • Table 18 Networking and Communication Devices market, by region 2021 - 2033 (USD Million)
  • Table 19 Computing and Data Centers market, by region 2021 - 2033 (USD Million)
  • Table 20 Others market, by region 2021 - 2033 (USD Million)
  • Table 21 North America Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 22 North America Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 23 North America Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 24 U.S. Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 25 U.S. Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 26 U.S. Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 27 Canada Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 28 Canada Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 29 Canada Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 30 Mexico Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 31 Mexico Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 32 Mexico Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 33 Europe Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 34 Europe Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 35 Europe Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 36 UK Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 37 UK Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 38 UK Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 39 Germany Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 40 Germany Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 41 Germany Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 42 France Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 43 France Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 44 France Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 45 Asia Pacific Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 46 Asia Pacific Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 47 Asia Pacific Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 48 China Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 49 China Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 50 China Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 51 India Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 52 India Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 53 India Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 54 Japan Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 55 Japan Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 56 Japan Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 57 Australia Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 58 Australia Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 59 Australia Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 60 South Korea Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 61 South Korea Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 62 South Korea Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 63 Latin America Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 64 Latin America Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 65 Latin America Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 66 Brazil Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 67 Brazil Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 68 Brazil Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 69 MEA Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 70 MEA Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 71 MEA Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 72 UAE Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 73 UAE Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 74 UAE Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 75 KSA Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 76 KSA Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 77 KSA Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)
  • Table 78 South Africa Advanced IC Substrates Market, by Type 2021 - 2033 (USD Million)
  • Table 79 South Africa Advanced IC Substrates Market, by Technology 2021 - 2033 (USD Million)
  • Table 80 South Africa Advanced IC Substrates Market, by Application 2021 - 2033 (USD Million)

List of Figures

  • Fig. 1 Advanced IC Substrates Market Segmentation
  • Fig. 2 Market research deployment mode
  • Fig. 3 Information procurement
  • Fig. 4 Primary research pattern
  • Fig. 5 Market research approaches
  • Fig. 6 Value chain-based sizing & forecasting
  • Fig. 7 Parent market analysis
  • Fig. 8 Market formulation & validation
  • Fig. 9 Advanced IC Substrates Market snapshot
  • Fig. 10 Advanced IC Substrates Market segment snapshot
  • Fig. 11 Advanced IC Substrates Market competitive landscape snapshot
  • Fig. 12 Market research deployment mode
  • Fig. 13 Market driver relevance analysis (Current & future impact)
  • Fig. 14 Market restraint relevance analysis (Current & future impact)
  • Fig. 15 Advanced IC Substrates Market: Type outlook key takeaways (USD million)
  • Fig. 16 Advanced IC Substrates Market: Type movement analysis (USD million), 2024 & 2033
  • Fig. 17 Flip Chip Ball Grid Array (FCBGA) Substrates market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 18 Flip Chip Chip Scale Package (FCCSP) Substrates market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 19 Wire Bond Substrates market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 20 Embedded Substrates market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 21 Others market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 22 Advanced IC Substrates Market: Technology outlook key takeaways (USD million)
  • Fig. 23 Advanced IC Substrates Market: Technology movement analysis (USD million), 2024 & 2033
  • Fig. 24 High-Density Interconnect (HDI) Substrates market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 25 Build-Up Substrates market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 26 Coreless Substrates market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 27 Organic Substrates market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 28 Ceramic Substrates market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 29 Advanced IC Substrates Market: Application outlook key takeaways (USD million)
  • Fig. 30 Advanced IC Substrates Market: Application movement analysis (USD million), 2024 & 2033
  • Fig. 31 Mobile and Consumer Electronics market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 32 Automotive Electronics market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 33 Networking and Communication Devices market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 34 Computing and Data Centers market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 35 Others market revenue estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 36 Regional marketplace: Key takeaways
  • Fig. 37 Advanced IC Substrates Market: Regional outlook, 2024 & 2033, USD Million
  • Fig. 38 North America Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 39 U.S. Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 40 Canada Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 41 Mexico Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 42 Europe Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 43 UK Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 44 Germany Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 45 France Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 46 Asia Pacific Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 47 Japan Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 48 China Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 49 India Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 50 Australia Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 51 South Korea Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 52 Latin America Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 53 Brazil Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 54 MEA Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 55 KSA Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 56 UAE Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 57 South Africa Advanced IC Substrates Market estimates and forecasts, 2021 - 2033 (USD million)
  • Fig. 58 Strategy framework
  • Fig. 59 Company Categorization
目次
Product Code: GVR-4-68040-656-0

Advanced IC Substrates Market Summary

The global advanced IC substrates market size was estimated at USD 16.73 billion in 2024, and is projected to reach USD 37.20 billion by 2033, growing at a CAGR of 9.4% from 2025 to 2033. The rising adoption of heterogeneous integration and chiplet-based architectures has emerged as a significant trend in the global advanced IC substrates industry, driving demand for high-density.

These multi-layer substrates enable compact, energy-efficient, and high-performance semiconductor packaging across AI, 5G, and automotive applications. The global push toward electric mobility and cleaner transportation is significantly boosting the demand for advanced IC substrates. The adoption of wide bandgap semiconductors such as silicon carbide and gallium nitride is becoming central to electric vehicle powertrains and high-voltage industrial systems. Silicon carbide has gained widespread traction since its use in electric vehicle inverters by major manufacturers like Tesla. Its superior properties, such as higher electric field tolerance and thermal conductivity, make it ideal for demanding automotive environments. This shift is further supported by projections that semiconductors will account for over 20 percent of a premium vehicle's total value by 2030, up from just four percent in 2019. As a result, demand for robust substrate materials that support high voltage and temperature performance is propelling the market growth in the automotive sector.

The surge in artificial intelligence applications is reshaping the semiconductor landscape, placing intense performance demands on packaging and substrate technologies. AI chips now require rapid data transfer, lower power consumption, and enhanced thermal performance, which is pushing the industry to develop more sophisticated packaging solutions. The National Advanced Packaging Manufacturing Program has identified artificial intelligence as a key driver requiring innovation in equipment, power delivery, and chiplet support systems. Government-backed investments are accelerating research in these areas, with expectations of one hundred million dollars in funding over the next five years. These developments are boosting the demand for high-density and thermally efficient substrates, particularly those optimized for AI-centric hardware in data centers and edge devices, thereby propelling the overall market growth.

The semiconductor industry is undergoing a major transformation as it shifts toward heterogeneous integration and chiplet-based system architectures. Traditional monolithic chip designs are being replaced with modular chiplet configurations that improve yield and lower costs. This evolution requires advanced IC substrates to serve as the high-performance interconnect platform supporting seamless communication between diverse chiplets. Research forecasts indicate that the future of packaging will move toward simplified hierarchy with direct chiplet-to-substrate assembly, replacing the need for intermediary layers like interposers. Substrate technologies are being adapted to include silicon and glass cores, along with embedded passive and active components. This architectural shift is boosting the market by enabling more efficient, scalable, and cost-effective semiconductor design and manufacturing.

The transition from round wafer-based processing to large area panel-level packaging is redefining the substrate manufacturing process. Panel sizes reaching up to six hundred fifty millimeters by six hundred fifty millimeters are enabling manufacturers to process more devices per cycle, significantly improving throughput and lowering production costs. This evolution is particularly impactful for high-volume sectors such as mobile electronics, medical wearables, and flexible hybrid devices. The use of larger panels also allows for the integration of more complex designs on thinner substrates, expanding the range of potential applications.

In response to recent supply chain disruptions, several governments are focusing on reshoring and domesticating the production of advanced IC substrates. The U.S. currently has minimal capacity to manufacture high-end substrates like Flip Chip Ball Grid Array or Flip Chip Chip Scale Package, which are critical to leading-edge chip packaging. As part of the CHIPS and Science Act, federal support totaling nearly three hundred million dollars is being directed toward building domestic capabilities. These efforts include investment in emerging technologies such as additive manufacturing and three-dimensional printing for substrate prototyping. The aim is to reduce dependence on foreign suppliers and establish a more resilient and secure supply network for the semiconductor industry. These strategic moves are boosting the market by ensuring consistent access to advanced packaging technologies and driving long-term growth across key verticals.

Global Advanced IC Substrates Market Report Segmentation

This report forecasts revenue growth at the global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the global advanced IC substrates market report based on type, technology, application, and region:

  • Type Outlook (Revenue, USD Million, 2021 - 2033)
  • Flip Chip Ball Grid Array (FCBGA) Substrates
  • Flip Chip Chip Scale Package (FCCSP) Substrates
  • Wire Bond Substrates
  • Embedded Substrates
  • Others
  • Technology Outlook (Revenue, USD Million, 2021 - 2033)
  • High-Density Interconnect (HDI) Substrates
  • Build-Up Substrates
  • Coreless Substrates
  • Organic Substrates
  • Ceramic Substrates
  • Application Outlook (Revenue, USD Million, 2021 - 2033)
  • Mobile and Consumer Electronics
  • Automotive Electronics
  • Networking and Communication Devices
  • Computing and Data Centers
  • Others
  • Regional Outlook (Revenue, USD Million, 2021 - 2033)
  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
  • Latin America
    • Brazil
  • Middle East and Africa (MEA)
    • KSA
    • UAE
    • South Africa

Table of Contents

Chapter 1. Methodology and Scope

  • 1.1. Market Segmentation and Scope
  • 1.2. Research Methodology
    • 1.2.1. Information Procurement
  • 1.3. Information or Data Analysis
  • 1.4. Methodology
  • 1.5. Research Scope and Assumptions
  • 1.6. Market Formulation & Validation
  • 1.7. Country Based Segment Share Calculation
  • 1.8. List of Data Sources

Chapter 2. Executive Summary

  • 2.1. Market Outlook
  • 2.2. Segment Outlook
  • 2.3. Competitive Insights

Chapter 3. Advanced IC Substrates Market Variables, Trends, & Scope

  • 3.1. Market Lineage Outlook
  • 3.2. Market Dynamics
    • 3.2.1. Market Driver Analysis
    • 3.2.2. Market Restraint Analysis
    • 3.2.3. Industry Challenge
  • 3.3. Advanced IC Substrates Market Analysis Tools
    • 3.3.1. Industry Analysis - Porter's
      • 3.3.1.1. Bargaining power of the suppliers
      • 3.3.1.2. Bargaining power of the buyers
      • 3.3.1.3. Threats of substitution
      • 3.3.1.4. Threats from new entrants
      • 3.3.1.5. Competitive rivalry
    • 3.3.2. PESTEL Analysis
      • 3.3.2.1. Political landscape
      • 3.3.2.2. Economic landscape
      • 3.3.2.3. Social landscape
      • 3.3.2.4. Technological landscape
      • 3.3.2.5. Environmental landscape
      • 3.3.2.6. Legal landscape

Chapter 4. Advanced IC Substrates Market: Type Estimates & Trend Analysis

  • 4.1. Segment Dashboard
  • 4.2. Advanced IC Substrates Market: Type Movement Analysis, 2024 & 2033 (USD Million)
  • 4.3. Flip Chip Ball Grid Array (FCBGA) Substrates
    • 4.3.1. Flip Chip Ball Grid Array (FCBGA) Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.4. Flip Chip Chip Scale Package (FCCSP) Substrates
    • 4.4.1. Flip Chip Chip Scale Package (FCCSP) Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.5. Wire Bond Substrates
    • 4.5.1. Wire Bond Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.6. Embedded Substrates
    • 4.6.1. Embedded Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.7. Others
    • 4.7.1. Others Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 5. Advanced IC Substrates Market: Technology Estimates & Trend Analysis

  • 5.1. Segment Dashboard
  • 5.2. Advanced IC Substrates Market: Technology Movement Analysis, 2024 & 2033 (USD Million)
  • 5.3. High-Density Interconnect (HDI) Substrates
    • 5.3.1. High-Density Interconnect (HDI) Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.4. Build-Up Substrates
    • 5.4.1. Build-Up Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.5. Coreless Substrates
    • 5.5.1. Coreless Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.6. Organic Substrates
    • 5.6.1. Organic Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.7. Ceramic Substrates
    • 5.7.1. Ceramic Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 6. Advanced IC Substrates Market: Application Estimates & Trend Analysis

  • 6.1. Segment Dashboard
  • 6.2. Advanced IC Substrates Market: Application Movement Analysis, 2024 & 2033 (USD Million)
  • 6.3. Mobile and Consumer Electronics
    • 6.3.1. Mobile and Consumer Electronics Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4. Automotive Electronics
    • 6.4.1. Automotive Electronics Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5. Networking and Communication Devices
    • 6.5.1. Networking and Communication Devices Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.6. Computing and Data Centers
    • 6.6.1. Computing and Data Centers Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.7. Others
    • 6.7.1. Others Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 7. Advanced IC Substrates Market: Regional Estimates & Trend Analysis

  • 7.1. Advanced IC Substrates Market Share, By Region, 2024 & 2033, USD Million
  • 7.2. North America
    • 7.2.1. North America Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.2.2. U.S.
      • 7.2.2.1. U.S. Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.2.3. Canada
      • 7.2.3.1. Canada Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.2.4. Mexico
      • 7.2.4.1. Mexico Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.3. Europe
    • 7.3.1. Europe Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.3.2. UK
      • 7.3.2.1. UK Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.3.3. Germany
      • 7.3.3.1. Germany Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.3.4. France
      • 7.3.4.1. France Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.4. Asia Pacific
    • 7.4.1. Asia Pacific Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.4.2. China
      • 7.4.2.1. China Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.4.3. Japan
      • 7.4.3.1. Japan Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.4.4. India
      • 7.4.4.1. India Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.4.5. South Korea
      • 7.4.5.1. South Korea Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.4.6. Australia
      • 7.4.6.1. Australia Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.5. Latin America
    • 7.5.1. Latin America Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.5.2. Brazil
      • 7.5.2.1. Brazil Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.6. Middle East and Africa
    • 7.6.1. Middle East and Africa Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.6.2. UAE
      • 7.6.2.1. UAE Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.6.3. KSA
      • 7.6.3.1. KSA Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.6.4. South Africa
      • 7.6.4.1. South Africa Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 8. Competitive Landscape

  • 8.1. Company Categorization
  • 8.2. Company Market Positioning
  • 8.3. Company Heat Map Analysis
  • 8.4. Company Profiles/Listing
    • 8.4.1. ASE TECHNOLOGY HOLDING
      • 8.4.1.1. Participant's Overview
      • 8.4.1.2. Financial Performance
      • 8.4.1.3. Product Benchmarking
      • 8.4.1.4. Strategic Initiatives
    • 8.4.2. AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
      • 8.4.2.1. Participant's Overview
      • 8.4.2.2. Financial Performance
      • 8.4.2.3. Product Benchmarking
      • 8.4.2.4. Strategic Initiatives
    • 8.4.3. Fujitsu
      • 8.4.3.1. Participant's Overview
      • 8.4.3.2. Financial Performance
      • 8.4.3.3. Product Benchmarking
      • 8.4.3.4. Strategic Initiatives
    • 8.4.4. IBIDEN
      • 8.4.4.1. Participant's Overview
      • 8.4.4.2. Financial Performance
      • 8.4.4.3. Product Benchmarking
      • 8.4.4.4. Strategic Initiatives
    • 8.4.5. KINSUS INTERCONNECT TECHNOLOGY CORP
      • 8.4.5.1. Participant's Overview
      • 8.4.5.2. Financial Performance
      • 8.4.5.3. Product Benchmarking
      • 8.4.5.4. Strategic Initiatives
    • 8.4.6. KYOCERA Corporation
      • 8.4.6.1. Participant's Overview
      • 8.4.6.2. Financial Performance
      • 8.4.6.3. Product Benchmarking
      • 8.4.6.4. Strategic Initiatives
    • 8.4.7. LG Innotek
      • 8.4.7.1. Participant's Overview
      • 8.4.7.2. Financial Performance
      • 8.4.7.3. Product Benchmarking
      • 8.4.7.4. Strategic Initiatives
    • 8.4.8. NAN YA PLASTICS CORPORATION
      • 8.4.8.1. Participant's Overview
      • 8.4.8.2. Financial Performance
      • 8.4.8.3. Product Benchmarking
      • 8.4.8.4. Strategic Initiatives
    • 8.4.9. SAMSUNG ELECTRO-MECHANICS
      • 8.4.9.1. Participant's Overview
      • 8.4.9.2. Financial Performance
      • 8.4.9.3. Product Benchmarking
      • 8.4.9.4. Strategic Initiatives
    • 8.4.10. Unimicron
      • 8.4.10.1. Participant's Overview
      • 8.4.10.2. Financial Performance
      • 8.4.10.3. Product Benchmarking
      • 8.4.10.4. Strategic Initiatives