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3Dチップ（3D IC）の世界市場

3D Chips (3D IC)

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英文 276 Pages
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即日から翌営業日
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3Dチップ（3D IC）の世界市場
出版日: 2025年02月26日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 276 Pages
納期: 即日から翌営業日
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概要

3Dチップ（3D IC）の世界市場は2030年までに452億米ドルに達する見込み

2024年に168億米ドルと推定される3Dチップ（3D IC）の世界市場は、2024年から2030年にかけてCAGR 18.0％で成長し、2030年には452億米ドルに達すると予測されます。本レポートで分析しているセグメントの1つであるメモリは、CAGR 19.2％を記録し、分析期間終了時には222億米ドルに達すると予測されています。LED分野の成長率は、分析期間中CAGR 18.2％と推定されます。

米国市場は推定46億米ドル、中国はCAGR16.6%で成長予測

米国の3Dチップ（3D IC）市場は、2024年に46億米ドルと推定されます。世界第2位の経済大国である中国は、2030年までに67億米ドルの市場規模に達すると予測され、分析期間2024-2030年のCAGRは16.6%です。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ16.5％と15.2％と予測されています。欧州では、ドイツがCAGR約12.6％で成長すると予測されています。

3Dチップ（3D IC）-主要動向と促進要因

3D集積回路（3D IC）としても知られる3Dチップは、従来の2D ICの限界に対処した、半導体技術における革新的な進歩です。これらのチップは、シリコンウエハーまたはダイを多層に積み重ね、シリコン貫通ビア（TSV）を使ってそれらを垂直に接続することで作られます。このアーキテクチャ設計は、集積度を高め、消費電力を削減することで、チップ性能を大幅に向上させます。垂直積層により層間のインターコネクト長が短くなるため、信号のトランスミッション速度が向上し、レイテンシが短縮されます。これにより、ロジック、メモリー、アナログなどさまざまな種類の回路を1つのパッケージ内に集積することができ、コンパクトなフォーム・ファクターで機能と性能を高めることができます。3D ICのインパクトは、高性能コンピューティング、モバイル機器、データセンター、モノのインターネット（IoT）機器など、さまざまなアプリケーションにわたって大きく、従来の半導体スケーリングの物理的・経済的障壁を克服する道を提供しています。

3D IC市場の最も顕著な動向の1つは、高性能でエネルギー効率の高いコンピューティング・ソリューションに対する需要の高まりです。データセンターとクラウド・コンピューティング・サービスが急速に拡大する中、最小限のエネルギー消費で膨大な量のデータを処理できるプロセッサが急務となっています。3D ICは、その優れた性能とエネルギー効率により、こうした需要に特に適しています。さらに、人工知能（AI）や機械学習（ML）アプリケーションの急増により、複雑な計算を迅速に実行できるチップが必要とされています。3D ICの小型化と性能向上は、こうしたアプリケーションに理想的です。さらに、スマートフォンやウェアラブル機器など、家電製品の小型化の動向は、3D ICの採用を後押ししています。これらのチップは、より小さなパッケージでより多くの機能を実現し、より強力でありながらコンパクトなデバイスを求める消費者の需要に応えています。異なる種類の回路を1つの3Dパッケージに統合するヘテロジニアス・インテグレーションの開発は、3D ICの潜在的アプリケーションをさらに拡大し、さまざまな分野の特定のニーズに合わせたソリューションを提供します。

3D IC市場の成長は、いくつかの要因によってもたらされます。主な要因の1つは、電子機器の複雑化と高集積化へのニーズです。デバイスが高度化するにつれて、1つのパッケージにより多くの機能を統合できるチップへの需要が高まっており、3D ICはそれを実現できます。もう1つの重要な推進力は、データ集約型アプリケーションにおけるエネルギー効率と性能の向上を求める動きです。処理速度を向上させながら消費電力を削減できる3D ICは、データセンターや高性能コンピューティング環境での使用に魅力的です。さらに、製造技術の進歩により、3D ICの製造に関連するコストが削減され、より広範なアプリケーションで利用しやすくなっています。また、IoTデバイスの普及やエッジコンピューティングの重要性の高まりも市場の成長に寄与しています。これらのアプリケーションでは、小型で効率的な高性能チップが必要とされるからです。さらに、大手半導体企業による戦略的提携や研究開発への投資が、3D IC技術の革新と採用を加速させています。新素材の統合や先進パッケージング技術の開発も、3D ICの機能と応用を拡大しています。まとめると、技術の進歩、市場の需要、戦略的投資の収束が3D IC市場を前進させており、コンピューティング性能、エネルギー効率、デバイス機能の大幅な進歩が期待されています。

セグメント

製品（メモリ、LED、センサー、MEMS）;タイプ（積層3D、モノリシック3D）;エンドユーザー（家電、通信、自動車、軍事・航空宇宙、医療機器、産業分野、その他のエンドユーザー）

調査対象企業の例（注目の26社）

  • Amkor Technology, Inc.
  • Applied Materials, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • Renesas Electronics Corporation
  • STATS ChipPAC Pte., Ltd.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Co., Ltd.（TSMC）
  • Toshiba Corporation

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他欧州
  • アジア太平洋
  • その他の地域

第4章 競合

目次
Product Code: MCP-6575

Global 3D Chips (3D IC) Market to Reach US$45.2 Billion by 2030

The global market for 3D Chips (3D IC) estimated at US$16.8 Billion in the year 2024, is expected to reach US$45.2 Billion by 2030, growing at a CAGR of 18.0% over the analysis period 2024-2030. Memory, one of the segments analyzed in the report, is expected to record a 19.2% CAGR and reach US$22.2 Billion by the end of the analysis period. Growth in the LEDs segment is estimated at 18.2% CAGR over the analysis period.

The U.S. Market is Estimated at US$4.6 Billion While China is Forecast to Grow at 16.6% CAGR

The 3D Chips (3D IC) market in the U.S. is estimated at US$4.6 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$6.7 Billion by the year 2030 trailing a CAGR of 16.6% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 16.5% and 15.2% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 12.6% CAGR.

3D Chips (3D IC) - Key Trends and Drivers

3D chips, also known as 3D integrated circuits (3D ICs), represent a transformative advancement in semiconductor technology, addressing the limitations of traditional 2D ICs. These chips are created by stacking multiple layers of silicon wafers or dies and connecting them vertically using through-silicon vias (TSVs). This architectural design significantly enhances chip performance by increasing density and reducing power consumption. The vertical stacking shortens the interconnect lengths between layers, which improves signal transmission speed and reduces latency. This allows for integrating various types of circuits, such as logic, memory, and analog, within a single package, enhancing functionality and performance in a compact form factor. The impact of 3D ICs is profound across various applications, including high-performance computing, mobile devices, data centers, and Internet of Things (IoT) devices, offering a path to overcoming the physical and economic barriers of traditional semiconductor scaling.

One of the most prominent trends in the 3D IC market is the escalating demand for high-performance and energy-efficient computing solutions. As data centers and cloud computing services expand rapidly, there is a pressing need for processors capable of handling vast amounts of data with minimal energy consumption. 3D ICs are particularly well-suited for these demands due to their superior performance and energy efficiency. Additionally, the surge in artificial intelligence (AI) and machine learning (ML) applications necessitates chips that can execute complex computations swiftly. The compactness and enhanced performance of 3D ICs make them ideal for these applications. Moreover, the ongoing trend of miniaturization in consumer electronics, such as smartphones and wearable devices, is propelling the adoption of 3D ICs. These chips enable more functionality within smaller packages, addressing consumer demand for more powerful yet compact devices. The development of heterogeneous integration, where different types of circuits are combined in a single 3D package, further expands the potential applications of 3D ICs, offering solutions tailored to specific needs across various sectors.

The growth in the 3D IC market is driven by several factors. One major driver is the increasing complexity of electronic devices and the need for higher integration levels. As devices become more sophisticated, there is a greater demand for chips that can integrate more functions within a single package, which 3D ICs can provide. Another key driver is the push for improved energy efficiency and performance in data-intensive applications. The ability of 3D ICs to reduce power consumption while enhancing processing speed makes them attractive for use in data centers and high-performance computing environments. Additionally, advancements in fabrication and manufacturing technologies have reduced the costs associated with 3D IC production, making them more accessible to a broader range of applications. The proliferation of IoT devices and the increasing importance of edge computing also contribute to the market growth, as these applications require compact, efficient, and high-performance chips. Moreover, strategic collaborations and investments in research and development by major semiconductor companies are accelerating the innovation and adoption of 3D IC technologies. The integration of new materials and the development of advanced packaging techniques are also expanding the capabilities and applications of 3D ICs. In summary, the convergence of technological advancements, market demands, and strategic investments is propelling the 3D IC market forward, promising significant advancements in computing performance, energy efficiency, and device functionality.

SCOPE OF STUDY:

The report analyzes the 3D Chips (3D IC) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Product (Memory, LEDs, Sensors, MEMS); Type (Stacked 3D, Monolithic 3D); End-Use (Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 26 Featured) -

  • Amkor Technology, Inc.
  • Applied Materials, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • Renesas Electronics Corporation
  • STATS ChipPAC Pte., Ltd.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • Toshiba Corporation

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Global Economic Update
    • 3D Chips (3D IC) - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increasing Demand for High-Performance Computing Drives Adoption
    • Advances in Through-Silicon Via (TSV) Technology Propel Growth
    • Expansion of Data Centers Spurs Demand for Energy-Efficient 3D ICs
    • Rise of AI and Machine Learning Applications Expands Addressable Market Opportunity
    • Miniaturization Trends in Consumer Electronics Strengthen Business Case for 3D ICs
    • Growing Complexity of Electronic Devices Generates Demand for Higher Integration
    • Innovations in Heterogeneous Integration Techniques Accelerate Adoption
    • Shift Towards Edge Computing Sustains Growth in 3D IC Market
    • Consumer Demand for Compact and Powerful Devices Propels Market Growth
    • Development of Advanced Packaging Solutions Expands Market Opportunities
    • Emergence of Smart Devices Accelerates Demand for 3D ICs
    • Integration of New Materials in 3D ICs Generates Opportunities for Enhanced Functionality
    • Evolving Cloud Computing Requirements Propel Need for High-Density 3D ICs
    • Focus on Reducing Latency in Data Processing: Here's the Story of 3D IC Impact
    • Adoption of Biometric and Security Technologies Drives Market Growth for 3D ICs
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World 3D Chips (3D IC) Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for 3D Chips (3D IC) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for LEDs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for LEDs by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World 6-Year Perspective for Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 11: World 6-Year Perspective for MEMS by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 12: World Recent Past, Current & Future Analysis for Stacked 3D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 13: World 6-Year Perspective for Stacked 3D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Monolithic 3D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World 6-Year Perspective for Monolithic 3D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 17: World 6-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 18: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 19: World 6-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World 6-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 23: World 6-Year Perspective for Military & Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 24: World Recent Past, Current & Future Analysis for Medical Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 25: World 6-Year Perspective for Medical Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for Industrial Sector by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World 6-Year Perspective for Industrial Sector by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 28: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 29: World 6-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 30: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 31: USA 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 32: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: USA 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 34: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 35: USA 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • CANADA
    • TABLE 36: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Canada 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 38: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Canada 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 40: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 41: Canada 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • JAPAN
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 42: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 43: Japan 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 44: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Japan 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 46: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 47: Japan 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • CHINA
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 48: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 49: China 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 50: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: China 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 52: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 53: China 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • EUROPE
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 54: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 55: Europe 6-Year Perspective for 3D Chips (3D IC) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 56: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Europe 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 58: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 59: Europe 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 60: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 61: Europe 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • FRANCE
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 62: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: France 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 64: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 65: France 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 66: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 67: France 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • GERMANY
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 68: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Germany 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 70: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Germany 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 72: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Germany 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • ITALY
    • TABLE 74: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Italy 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 76: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 77: Italy 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 78: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 79: Italy 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • UNITED KINGDOM
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 80: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: UK 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 82: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 83: UK 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 84: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 85: UK 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 86: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 88: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 89: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 90: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 91: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • ASIA-PACIFIC
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 92: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 94: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 95: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 96: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 97: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • REST OF WORLD
    • TABLE 98: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Rest of World 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 100: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 101: Rest of World 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 102: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 103: Rest of World 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030

IV. COMPETITION