サンプル依頼リスト カート
  • English
表紙：3D ICの世界市場：規模・予測 - タイプ別、コンポーネント別、用途別、エンドユーザー別、地域別分析、2023～2030年
市場調査レポート
商品コード
1407979

3D ICの世界市場：規模・予測 - タイプ別、コンポーネント別、用途別、エンドユーザー別、地域別分析、2023～2030年

Global 3D IC Market Size study & Forecast, by Type, by Component (Through-Silicon Via, Through Glass Via, Silicon Interposer), by Application, by End User and Regional Analysis, 2023-2030
出版日: | 発行: Bizwit Research & Consulting LLP | ページ情報: 英文 | 納期: 2～3営業日

● お客様のご希望に応じて、既存データの加工や未掲載情報（例：国別セグメント）の追加などの対応が可能です。　 詳細はお問い合わせください。

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.76円
3D ICの世界市場：規模・予測 - タイプ別、コンポーネント別、用途別、エンドユーザー別、地域別分析、2023～2030年
出版日: 2023年12月20日
発行: Bizwit Research & Consulting LLP
ページ情報: 英文
納期: 2～3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界の3D ICの市場規模は、2022年に約120億5,000万米ドルに達し、2023～2030年の予測期間中に20%以上の健全な成長率で成長すると予測されています。

3D IC（3次元集積回路）は、集積回路（IC）としても知られる複数の半導体チップを垂直に積み重ねて3次元構造を作る技術を指します。この技術は、従来の2次元集積回路の限界を克服するために、マイクロエレクトロニクスや集積回路設計の分野で採用されています。3D IC市場は、コンシューマーエレクトロニクスの需要増加やコネクテッドウェアラブルデバイスの需要拡大などの要因により拡大しています。その結果、2023～2030年の予測期間中、国際市場では3D ICの需要が徐々に増加しています。

スマートフォン、タブレット、ゲーム機などのコンシューマーエレクトロニクスは、継続的に性能向上に努めています。3D IC技術は、データ転送の高速化、信号遅延の低減、電力効率の向上を可能にします。消費者がより高速で、より強力で、よりエネルギー効率の高いデバイスを求める中、メーカーはこうした要件を満たすために3D ICに目を向けています。Statistaによると、2023年のコンシューマーエレクトロニクス市場は6,025億米ドルの規模になると予想され、2023～2027年の間に12.07%の成長率で成長し、2027年には9,503億米ドルに達すると推定されます。さらに、2023年の米国の家電小売売上高は4,850億米ドルです。3D IC市場を牽引するもう1つの重要な要因は、コネクテッドウェアラブル機器に対する需要の増加です。ウェアラブルデバイスはより洗練され、健康モニタリング、フィットネストラッキング、ナビゲーション、通信などの複雑なタスクを実行できるようになってきています。ウェアラブル機器の処理能力向上に対する需要は、強力なプロセッサとメモリを小さなスペースに統合する方法を提供する3D ICによって満たされています。また、Statistaによると、2022年には、接続されたウェアラブルデバイスの数が世界的に大幅に増加し、前年の9億2,900万台から11億台に達しました。さらに、スマート家電への3D ICの統合が進み、IoT技術の採用が増加していることから、予測期間中、市場に有利な成長機会が生まれると予想されます。しかし、3D IC技術に関連する高コストと技術的な複雑さが、2023～2030年の予測期間を通じて市場全体の成長を阻害します。

3D ICの世界市場調査において考慮した主要地域は、アジア太平洋、北米、欧州、ラテンアメリカ、中東・アフリカです。北米は、同地域の技術進歩による集積回路需要の増加により、2022年の市場を独占しました。この地域の圧倒的な実績は、3D ICの全体的な需要を促進すると予想されます。さらに、アジア太平洋地域は、技術的なアップグレードやスマートデバイスの需要の増加などの要因により、予測期間中に最も急速に成長すると予想されています。スマートデバイスの需要の高まりは、無線およびブロードバンドネットワークの改善への投資を促進し、これらのデバイスがシームレスかつ効率的に機能することを保証しています。

本調査の目的は、近年のさまざまなセグメントと国の市場規模を明らかにし、今後数年間の市場規模を予測することです。本レポートは、調査対象国における産業の質的・量的側面の両方を盛り込むよう設計されています。

また、市場の将来的な成長を規定する促進要因や課題などの重要な側面に関する詳細情報も提供しています。さらに、主要企業の競合情勢や製品提供の詳細な分析とともに、利害関係者が投資するためのミクロ市場における潜在的な機会も組み込んでいます。

目次

第1章 エグゼクティブサマリー

第2章 世界の3D IC市場の定義と範囲

  • 調査目的
  • 市場の定義と範囲
    • 業界の進化
    • 調査範囲
  • 調査対象年
  • 通貨換算レート

第3章 世界の3D ICの市場力学

  • 3D IC市場の影響分析（2020～2030年）
    • 市場促進要因
      • コンシューマーエレクトロニクスの需要増加
      • コネクテッドウェアラブルデバイスの需要拡大
    • 市場課題
      • 3D IC技術に伴う高コスト
      • 技術的な複雑さ
    • 市場機会
      • スマート家電における3D IC統合の増加
      • IoT技術の採用拡大

第4章 世界の3D IC市場の産業分析

  • ポーターのファイブフォースモデル
    • 供給企業の交渉力
    • 買い手の交渉力
    • 新規参入業者の脅威
    • 代替品の脅威
    • 競争企業間の敵対関係
  • ポーターのファイブフォース影響分析
  • PEST分析
    • 政治
    • 経済
    • 社会
    • 技術
    • 環境
    • 法律
  • 主な投資機会
  • 主要成功戦略
  • COVID-19影響分析
  • 破壊的動向
  • 業界専門家の視点
  • アナリストの結論・提言

第5章 3D ICの世界市場：タイプ別

  • 市場スナップショット
  • 3D ICの世界市場：タイプ別、実績 - ポテンシャル分析
  • 3D ICの世界市場：タイプ別、2020～2030年、推定・予測
  • 3D ICの世界市場：サブセグメント別分析
    • 積層3D
    • モノリシック3D

第6章 3D ICの世界市場：コンポーネント別

  • 市場スナップショット
  • 3D ICの世界市場：コンポーネント別、実績 - ポテンシャル分析
  • 3D ICの世界市場：コンポーネント別、2020～2030年、推定・予測
  • 3D ICの世界市場：サブセグメント別分析
    • Through-Silicon Via (TSV)
    • Through Glass Via (TGV)
    • Silicon Interposer

第7章 3D ICの世界市場：用途別

  • 市場スナップショット
  • 3D ICの世界市場：用途別、実績 - ポテンシャル分析
  • 3D ICの世界市場：用途別、2020～2030年、推定・予測
  • 3D ICの世界市場：サブセグメント別分析
    • ロジック
    • イメージング・オプトエレクトロニクス
    • メモリ
    • MEMS/センサー
    • LED
    • その他

第8章 3D ICの世界市場：エンドユーザー別

  • 市場スナップショット
  • 3D ICの世界市場：エンドユーザー別、実績 - ポテンシャル分析
  • 3D ICの世界市場：エンドユーザー別、2020～2030年、推定・予測
  • 3D ICの世界市場：サブセグメント別分析
    • コンシューマーエレクトロニクス
    • 通信
    • 自動車
    • 軍事・航空宇宙
    • 医療機器
    • 産業機器
    • その他

第9章 3D ICの世界市場：地域別分析

  • 主要国
  • 主な新興国
  • 3D IC市場：地域別市場スナップショット
  • 北米
    • 米国
    • カナダ
  • 欧州
    • 英国
    • ドイツ
    • フランス
    • スペイン
    • イタリア
    • その他の欧州
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • オーストラリア
    • 韓国
    • その他のアジア太平洋
  • ラテンアメリカ
    • ブラジル
    • メキシコ
  • 中東・アフリカ
    • サウジアラビア
    • 南アフリカ
    • その他の中東・アフリカ

第10章 競合情報

  • 主要企業のSWOT分析
  • 主要市場戦略
  • 企業プロファイル
    • Advanced Semiconductor Engineering, Inc
    • Amkor Technology, Inc
    • Samsung Electronics Co., Ltd.
    • United Microelectronics Corporation
    • STMicroelectronics N.V.
    • Toshiba Corporation
    • Intel Corporation
    • Micron Technology, Inc
    • Taiwan Semiconductor Manufacturing Company Limited
    • Xilinx Inc

第11章 調査プロセス

図表

LIST OF TABLES

  • TABLE 1. Global 3D IC Market, report scope
  • TABLE 2. Global 3D IC Market estimates & forecasts by Region 2020-2030 (USD Billion)
  • TABLE 3. Global 3D IC Market estimates & forecasts by Type 2020-2030 (USD Billion)
  • TABLE 4. Global 3D IC Market estimates & forecasts by Component 2020-2030 (USD Billion)
  • TABLE 5. Global 3D IC Market estimates & forecasts by Application 2020-2030 (USD Billion)
  • TABLE 6. Global 3D IC Market estimates & forecasts by End User 2020-2030 (USD Billion)
  • TABLE 7. Global 3D IC Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 8. Global 3D IC Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 9. Global 3D IC Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 10. Global 3D IC Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 11. Global 3D IC Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 12. Global 3D IC Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 13. Global 3D IC Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 14. Global 3D IC Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 15. Global 3D IC Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 16. Global 3D IC Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 17. U.S. 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 18. U.S. 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 19. U.S. 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 20. Canada 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 21. Canada 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 22. Canada 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 23. UK 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 24. UK 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 25. UK 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 26. Germany 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 27. Germany 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 28. Germany 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 29. France 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 30. France 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 31. France 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 32. Italy 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 33. Italy 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 34. Italy 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 35. Spain 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 36. Spain 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 37. Spain 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 38. RoE 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 39. RoE 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 40. RoE 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 41. China 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 42. China 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 43. China 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 44. India 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 45. India 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 46. India 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 47. Japan 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 48. Japan 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 49. Japan 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 50. South Korea 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 51. South Korea 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 52. South Korea 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 53. Australia 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 54. Australia 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 55. Australia 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 56. RoAPAC 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 57. RoAPAC 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 58. RoAPAC 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 59. Brazil 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 60. Brazil 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 61. Brazil 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 62. Mexico 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 63. Mexico 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 64. Mexico 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 65. RoLA 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 66. RoLA 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 67. RoLA 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 68. Saudi Arabia 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 69. South Africa 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 70. RoMEA 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 71. List of secondary sources, used in the study of global 3D IC Market
  • TABLE 72. List of primary sources, used in the study of global 3D IC Market
  • TABLE 73. Years considered for the study
  • TABLE 74. Exchange rates considered

List of tables and figures and dummy in nature, final lists may vary in the final deliverable

LIST OF FIGURES

  • FIG 1. Global 3D IC Market, research methodology
  • FIG 2. Global 3D IC Market, Market estimation techniques
  • FIG 3. Global Market size estimates & forecast methods
  • FIG 4. Global 3D IC Market, key trends 2022
  • FIG 5. Global 3D IC Market, growth prospects 2023-2030
  • FIG 6. Global 3D IC Market, porters 5 force model
  • FIG 7. Global 3D IC Market, pest analysis
  • FIG 8. Global 3D IC Market, value chain analysis
  • FIG 9. Global 3D IC Market by segment, 2020 & 2030 (USD Billion)
  • FIG 10. Global 3D IC Market by segment, 2020 & 2030 (USD Billion)
  • FIG 11. Global 3D IC Market by segment, 2020 & 2030 (USD Billion)
  • FIG 12. Global 3D IC Market by segment, 2020 & 2030 (USD Billion)
  • FIG 13. Global 3D IC Market by segment, 2020 & 2030 (USD Billion)
  • FIG 14. Global 3D IC Market, regional snapshot 2020 & 2030
  • FIG 15. North America 3D IC Market 2020 & 2030 (USD Billion)
  • FIG 16. Europe 3D IC Market 2020 & 2030 (USD Billion)
  • FIG 17. Asia pacific 3D IC Market 2020 & 2030 (USD Billion)
  • FIG 18. Latin America 3D IC Market 2020 & 2030 (USD Billion)
  • FIG 19. Middle East & Africa 3D IC Market 2020 & 2030 (USD Billion)

List of tables and figures and dummy in nature, final lists may vary in the final deliverable

目次

Global 3D IC Market is valued at approximately USD 12.05 billion in 2022 and is anticipated to grow with a healthy growth rate of more than 20% over the forecast period 2023-2030. 3D IC, or 3D Integrated Circuit, refers to a technology in which multiple semiconductor chips, also known as Integrated Circuits (ICs), are stacked vertically on top of each other to create a three-dimensional structure. This technology is employed in the field of microelectronics and integrated circuit design to overcome some of the limitations of traditional 2D integrated circuits. The 3D IC Market is expanding because of factors such as increasing demand for consumer electronics and growing demand for connected wearable devices. As a result, the demand for 3D IC has progressively increased in the international market during the forecast period 2023-2030.

Consumer electronics, such as smartphones, tablets, and gaming consoles, are continuously striving for improved performance. 3D IC technology allows for faster data transfer, reduced signal delays, and better power efficiency. As consumers demand faster, more powerful, and more energy-efficient devices, manufacturers turn to 3D ICs to meet these requirements. According to Statista, in 2023, the Consumer Electronics market is expected to be worth USD 602.50 billion and estimated to reach up to USD 950.30 billion by 2027 in between 2023-2027 at a rate of 12.07%. Furthermore, in 2023, consumer electronics retail sales in the United States account for USD 485 billion. Another important factor that drives the 3D IC Market is the increasing demand for connected wearable devices. Wearable devices are becoming more sophisticated and capable of performing complex tasks, such as health monitoring, fitness tracking, navigation, and communication. The demand for increased processing power in wearables is met by 3D ICs, which provide a way to integrate powerful processors and memory in a small space. In addition, as per Statista, in 2022, the global number of connected wearable devices increased substantially and reached up to 1.1 billion in number as compared to 929 million a year before. Moreover, the rising integration of 3D IC in smart home appliances and the growing adoption of IoT technology is anticipated to create lucrative growth opportunities for the market over the forecast period. However, high costs associated with 3D IC technology and technical complexity are going to impede overall market growth throughout the forecast period of 2023-2030.

The key regions considered for the Global 3D IC Market study includes Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. North America dominated the market in 2022 owing to the increased demand for integrated circuits due to technological advancements in the region. The region's dominant performance is anticipated to propel the overall demand for 3D IC. Furthermore, Asia Pacific is expected to grow fastest over the forecast period, owing to factors such as increased focus on technological upgradations and growing demand for smart devices in the region. The growing demand for smart devices has driven investments in improved wireless and broadband networks, ensuring that these devices can function seamlessly and efficiently.

Major market player included in this report are:

  • Advanced Semiconductor Engineering, Inc
  • Amkor Technology, Inc
  • Samsung Electronics Co., Ltd.
  • United Microelectronics Corporation
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • Intel Corporation
  • Micron Technology, Inc
  • Taiwan Semiconductor Manufacturing Company Limited
  • Xilinx Inc

Recent Developments in the Market:

  • In October 2023, During the TSMC 2023 OIP Ecosystem Forum, Taiwan Semiconductor Manufacturing Co. Ltd unveiled the new 3Dblox 2.0 open standard and highlighted important achievements within its Open Innovation Platform (OIP) 3DFabric Alliance. 3Dblox 2.0 features sophisticated 3D IC design tools that are intended to considerably improve design efficiency. Simultaneously, the 3DFabric Alliance continues to promote integration across memory, substrate, testing, manufacturing, and packaging. TSMC stays at the forefront of 3D IC innovation, bringing its vast 3D silicon stacking and superior packaging capabilities to a wider variety of customers.

Global 3D IC Market Report Scope:

  • Historical Data - 2020 - 2021
  • Base Year for Estimation - 2022
  • Forecast period - 2023-2030
  • Report Coverage - Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
  • Segments Covered - Type, Component, Application, End User, Region
  • Regional Scope - North America; Europe; Asia Pacific; Latin America; Middle East & Africa
  • Customization Scope - Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Type

  • Stacked 3D
  • Monolithic 3D

By Component

  • Through-Silicon Via (TSV)
  • Through Glass Via (TGV)
  • Silicon Interposer

By Application

  • Logic
  • Imaging & optoelectronics
  • Memory
  • MEMS/Sensors
  • LED
  • Others

By End User

  • Consumer Electronics
  • Telecommunication
  • Automotive
  • Military & Aerospace
  • Medical Devices
  • Industrial
  • Others

By Region:

  • North America
  • U.S.
  • Canada
  • Europe
  • UK
  • Germany
  • France
  • Spain
  • Italy
  • ROE
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • RoAPAC
  • Latin America
  • Brazil
  • Mexico
  • Middle East & Africa
  • Saudi Arabia
  • South Africa
  • Rest of Middle East & Africa

Table of Contents

Chapter 1. Executive Summary

  • 1.1. Market Snapshot
  • 1.2. Global & Segmental Market Estimates & Forecasts, 2020-2030 (USD Billion)
    • 1.2.1. 3D IC Market, by Region, 2020-2030 (USD Billion)
    • 1.2.2. 3D IC Market, by Type, 2020-2030 (USD Billion)
    • 1.2.3. 3D IC Market, by Component, 2020-2030 (USD Billion)
    • 1.2.4. 3D IC Market, by Application, 2020-2030 (USD Billion)
    • 1.2.5. 3D IC Market, by End User, 2020-2030 (USD Billion)
  • 1.3. Key Trends
  • 1.4. Estimation Methodology
  • 1.5. Research Assumption

Chapter 2. Global 3D IC Market Definition and Scope

  • 2.1. Objective of the Study
  • 2.2. Market Definition & Scope
    • 2.2.1. Industry Evolution
    • 2.2.2. Scope of the Study
  • 2.3. Years Considered for the Study
  • 2.4. Currency Conversion Rates

Chapter 3. Global 3D IC Market Dynamics

  • 3.1. 3D IC Market Impact Analysis (2020-2030)
    • 3.1.1. Market Drivers
      • 3.1.1.1. Increasing demand for consumer electronics
      • 3.1.1.2. Growing demand for connected wearable devices
    • 3.1.2. Market Challenges
      • 3.1.2.1. High costs associated with 3D IC technology
      • 3.1.2.2. Technical complexity
    • 3.1.3. Market Opportunities
      • 3.1.3.1. Rising integration of 3D IC in smart home appliances
      • 3.1.3.2. Growing adoption of IoT technology

Chapter 4. Global 3D IC Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
  • 4.2. Porter's 5 Force Impact Analysis
  • 4.3. PEST Analysis
    • 4.3.1. Political
    • 4.3.2. Economical
    • 4.3.3. Social
    • 4.3.4. Technological
    • 4.3.5. Environmental
    • 4.3.6. Legal
  • 4.4. Top investment opportunity
  • 4.5. Top winning strategies
  • 4.6. COVID-19 Impact Analysis
  • 4.7. Disruptive Trends
  • 4.8. Industry Expert Perspective
  • 4.9. Analyst Recommendation & Conclusion

Chapter 5. Global 3D IC Market, by Type

  • 5.1. Market Snapshot
  • 5.2. Global 3D IC Market by Type, Performance - Potential Analysis
  • 5.3. Global 3D IC Market Estimates & Forecasts by Type 2020-2030 (USD Billion)
  • 5.4. 3D IC Market, Sub Segment Analysis
    • 5.4.1. Stacked 3D
    • 5.4.2. Monolithic 3D

Chapter 6. Global 3D IC Market, by Component

  • 6.1. Market Snapshot
  • 6.2. Global 3D IC Market by Component, Performance - Potential Analysis
  • 6.3. Global 3D IC Market Estimates & Forecasts by Component 2020-2030 (USD Billion)
  • 6.4. 3D IC Market, Sub Segment Analysis
    • 6.4.1. Through-Silicon Via (TSV)
    • 6.4.2. Through Glass Via (TGV)
    • 6.4.3. Silicon Interposer

Chapter 7. Global 3D IC Market, by Application

  • 7.1. Market Snapshot
  • 7.2. Global 3D IC Market by Application, Performance - Potential Analysis
  • 7.3. Global 3D IC Market Estimates & Forecasts by Application 2020-2030 (USD Billion)
  • 7.4. 3D IC Market, Sub Segment Analysis
    • 7.4.1. Logic
    • 7.4.2. Imaging & optoelectronics
    • 7.4.3. Memory
    • 7.4.4. MEMS/Sensors
    • 7.4.5. LED
    • 7.4.6. Others

Chapter 8. Global 3D IC Market, by End User

  • 8.1. Market Snapshot
  • 8.2. Global 3D IC Market by End User, Performance - Potential Analysis
  • 8.3. Global 3D IC Market Estimates & Forecasts by End User 2020-2030 (USD Billion)
  • 8.4. 3D IC Market, Sub Segment Analysis
    • 8.4.1. Consumer Electronics
    • 8.4.2. Telecommunication
    • 8.4.3. Automotive
    • 8.4.4. Military & Aerospace
    • 8.4.5. Medical Devices
    • 8.4.6. Industrial
    • 8.4.7. Others

Chapter 9. Global 3D IC Market, Regional Analysis

  • 9.1. Top Leading Countries
  • 9.2. Top Emerging Countries
  • 9.3. 3D IC Market, Regional Market Snapshot
  • 9.4. North America 3D IC Market
    • 9.4.1. U.S. 3D IC Market
      • 9.4.1.1. Type breakdown estimates & forecasts, 2020-2030
      • 9.4.1.2. Component breakdown estimates & forecasts, 2020-2030
      • 9.4.1.3. Application breakdown estimates & forecasts, 2020-2030
      • 9.4.1.4. End User breakdown estimates & forecasts, 2020-2030
    • 9.4.2. Canada 3D IC Market
  • 9.5. Europe 3D IC Market Snapshot
    • 9.5.1. U.K. 3D IC Market
    • 9.5.2. Germany 3D IC Market
    • 9.5.3. France 3D IC Market
    • 9.5.4. Spain 3D IC Market
    • 9.5.5. Italy 3D IC Market
    • 9.5.6. Rest of Europe 3D IC Market
  • 9.6. Asia-Pacific 3D IC Market Snapshot
    • 9.6.1. China 3D IC Market
    • 9.6.2. India 3D IC Market
    • 9.6.3. Japan 3D IC Market
    • 9.6.4. Australia 3D IC Market
    • 9.6.5. South Korea 3D IC Market
    • 9.6.6. Rest of Asia Pacific 3D IC Market
  • 9.7. Latin America 3D IC Market Snapshot
    • 9.7.1. Brazil 3D IC Market
    • 9.7.2. Mexico 3D IC Market
  • 9.8. Middle East & Africa 3D IC Market
    • 9.8.1. Saudi Arabia 3D IC Market
    • 9.8.2. South Africa 3D IC Market
    • 9.8.3. Rest of Middle East & Africa 3D IC Market

Chapter 10. Competitive Intelligence

  • 10.1. Key Company SWOT Analysis
    • 10.1.1. Company 1
    • 10.1.2. Company 2
    • 10.1.3. Company 3
  • 10.2. Top Market Strategies
  • 10.3. Company Profiles
    • 10.3.1. Advanced Semiconductor Engineering, Inc
      • 10.3.1.1. Key Information
      • 10.3.1.2. Overview
      • 10.3.1.3. Financial (Subject to Data Availability)
      • 10.3.1.4. Product Summary
      • 10.3.1.5. Recent Developments
    • 10.3.2. Amkor Technology, Inc
    • 10.3.3. Samsung Electronics Co., Ltd.
    • 10.3.4. United Microelectronics Corporation
    • 10.3.5. STMicroelectronics N.V.
    • 10.3.6. Toshiba Corporation
    • 10.3.7. Intel Corporation
    • 10.3.8. Micron Technology, Inc
    • 10.3.9. Taiwan Semiconductor Manufacturing Company Limited
    • 10.3.10. Xilinx Inc

Chapter 11. Research Process

  • 11.1. Research Process
    • 11.1.1. Data Mining
    • 11.1.2. Analysis
    • 11.1.3. Market Estimation
    • 11.1.4. Validation
    • 11.1.5. Publishing
  • 11.2. Research Attributes
  • 11.3. Research Assumption