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半導体組立試験サービスの世界市場：業界分析、規模、シェア、成長、動向、予測（2025年～2032年）

Semiconductor Assembly Test Services Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2025 - 2032

出版日
ページ情報
英文 280 Pages
納期
2～5営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=143.57円
半導体組立試験サービスの世界市場：業界分析、規模、シェア、成長、動向、予測（2025年～2032年）
出版日: 2025年04月10日
発行: Persistence Market Research
ページ情報: 英文 280 Pages
納期: 2～5営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 目次
概要

世界の半導体組立試験サービスの市場規模は、2025年に394億米ドルになるとみられ、2025年～2032年の予測期間に6.2%のCAGRで拡大し、2032年には601億米ドルに達すると予測されています。

半導体組立試験サービス（SATS）は、ウエハダイシング、ダイアタッチ、ワイヤーボンディング、封止、機能テストなどの工程を含む半導体製造バリューチェーンにおいて重要な役割を担っています。これらのサービスは、集積回路（IC）が民生用電子機器、車載システム、産業機器、通信機器などのエンドユーザーアプリケーションに組み込まれる前に、その品質、信頼性、性能を保証するものです。SATS市場は、ファブレス半導体企業、集積デバイスメーカー（IDM）、鋳造にサービスを提供し、費用対効果が高く、拡張性があり、技術的に高度なバックエンドサービスを提供しています。市場成長の原動力は、各業界における半導体需要の増加、チップパッケージング技術の急速な先進化、集積回路設計の複雑化です。

世界のSATS市場は、特にスマートフォン、電気自動車、AI、IoT、5Gインフラなどの高成長分野での先端エレクトロニクス需要の急増によって推進されています。チップ設計が微細化し、機能密度が高まるにつれて、精密組立とテストの必要性が高まっています。さらに、ファブレス企業やIDMが専門のOSAT（半導体組立試験のアウトソーシング）プロバイダーにアウトソーシングする動向は、スケールメリットと業務効率を提供することで市場の成長を後押ししています。SiP（システムインパッケージ）、3D ICパッケージング、TSV（スルーシリコン・ビア）技術の採用など、技術の進歩はSATSプロバイダーにとって新たな成長の道を開くものです。

SATS市場は力強い成長が見込まれますが、高額の設備投資、技術の陳腐化、サプライチェーンの混乱といった課題に直面しています。半導体設計の技術革新のペースが速いため、SATSプロバイダーは設備や能力を継続的にアップグレードする必要があり、特に中小企業にとってはコスト負担が大きいです。さらに、装置ベンダーの集中や主要半導体生産地域の地政学的緊張への依存は、サプライチェーンの回復力に脆弱性をもたらします。限られた熟練労働力と大手IDMの社内検査能力との競合激化も、独立系SATSプロバイダーの収益性と成長性に影響を与える可能性があります。

SATS市場は、ヘテロジニアス・インテグレーション、チップレット・アーキテクチャ、エレクトロニクスの小型化に対する需要の拡大に後押しされ、大きなビジネスチャンスをもたらしています。自律走行車、スマートマニュファクチャリング、ウェアラブル技術の台頭は、高性能でコンパクトな半導体ソリューションに対する需要の強固なパイプラインを生み出し、それが専門的なパッケージングとテストサービスの必要性を後押ししています。さらに、AI主導のテスト、自動化、デジタルツインテクノロジーへの戦略的投資により、品質管理が強化され、市場投入までの時間が短縮され、業務効率が最適化されています。アジア太平洋とラテンアメリカの新興市場は、エレクトロニクス製造エコシステムの成長と政府の積極的な取り組みに支えられ、SATSプロバイダーにとって未開拓の可能性を秘めています。

当レポートでは、世界の半導体組立試験サービス市場について調査し、サービス別、用途別、地域別動向、および市場に参入する企業のプロファイルなどを提供しています。

目次

第1章 エグゼクティブサマリー

第2章 市場概要

第3章 主要な市場動向

第4章 価格分析

第5章 世界の半導体組立試験サービス市場の需要（10億米ドル単位）分析

  • 過去の市場金額（10億米ドル）分析、2019年～2024年
  • 現在および将来の市場金額（10億米ドル）予測、2025年～2032年

第6章 市場背景

第7章 世界の半導体組立試験サービス市場分析、サービス別

  • イントロダクション/主な調査結果
  • 過去の市場規（10億米ドル）分析、サービス別、2019年～2024年
  • 現在および将来の市場規模（10億米ドル）分析と予測、サービス別、2025年～2032年
    • 組立・梱包サービス
    • 試験サービス
  • サービス別の市場の魅力分析

第8章 世界の半導体組立試験サービス市場分析、用途別

  • イントロダクション/主な調査結果
  • 過去の市場規（10億米ドル）分析、用途別、2019年～2024年
  • 現在および将来の市場規模（10億米ドル）分析と予測、用途別、2025年～2032年
    • 通信
    • コンピューティング・とネットワーク
    • 家電
    • 産業
    • 自動車用電子機器
  • 用途別の市場の魅力分析

第9章 世界の半導体組立試験サービス市場分析、地域別

  • イントロダクション/主な調査結果
  • 過去の市場規（10億米ドル）分析、地域別、2019年～2024年
  • 現在および将来の市場規模（10億米ドル）分析と予測、地域別、2025年～2032年
    • 北米
    • ラテンアメリカ
    • 欧州
    • 東アジア
    • 南アジア太平洋
    • 中東・アフリカ
  • 地域別の市場の魅力分析

第10章 北米の半導体組立試験サービス市場分析

第11章 ラテンアメリカの半導体組立試験サービス市場分析

第12章 欧州の半導体組立試験サービス市場分析

第13章 南アジア・太平洋の半導体組立試験サービス市場分析

第14章 東アジアの半導体組立試験サービス市場分析

第15章 中東・アフリカの半導体組立および試験サービス市場分析

第16章 主要国別半導体組立試験サービス市場分析

  • 米国
  • カナダ
  • メキシコ
  • ブラジル
  • ドイツ
  • イタリア
  • フランス
  • 英国
  • スペイン
  • ベネルクス
  • ロシア
  • その他の欧州諸国
  • 中国
  • 日本
  • 韓国
  • インド
  • マレーシア
  • インドネシア
  • シンガポール
  • オーストラリアとニュージーランド
  • GCC諸国
  • トルコ
  • 南アフリカ
  • その他の中東・アフリカ諸国

第17章 市場構造分析

第18章 競合分析

  • 競合ダッシュボード
  • 競合ベンチマーク
  • 競合の詳細
    • ASE Group, Inc.
    • Amkor Technology, Inc.
    • Siliconware Precision Industries Co., Ltd.
    • Powertech Technology, Inc.
    • United Test and Assembly Center Ltd.
    • JCET Group Co Ltd
    • Chips Technologies, Inc.
    • Chipbond Technology Corporation.
    • King Yuan Electronics Co Ltd
    • .Unisem

第19章 前提と使用される頭字語

第20章 調査手法

目次
Product Code: PMRREP4786

Persistence Market Research has recently released a comprehensive report on the worldwide market for semiconductor assembly and testing services (SATS). The report offers a thorough assessment of crucial market dynamics, including drivers, trends, opportunities, and challenges, providing detailed insights into the market structure. This research publication presents exclusive data and statistics outlining the anticipated growth trajectory of the global semiconductor assembly and testing services market from 2025 to 2032.

Key Insights:

  • Semiconductor Assembly and Testing Services Market Size (2025E): USD 39.4 Billion
  • Projected Market Value (2032F): USD 60.1 Billion
  • Global Market Growth Rate (CAGR 2025 to 2032): 6.2%

Semiconductor Assembly and Testing Services Market - Report Scope:

Semiconductor assembly and testing services (SATS) play a vital role in the semiconductor manufacturing value chain, involving processes such as wafer dicing, die attach, wire bonding, encapsulation, and functional testing. These services ensure the quality, reliability, and performance of integrated circuits (ICs) before they are integrated into end-user applications, including consumer electronics, automotive systems, industrial equipment, and communication devices. The SATS market serves fabless semiconductor companies, integrated device manufacturers (IDMs), and foundries, offering cost-effective, scalable, and technologically advanced backend services. Market growth is being driven by increasing semiconductor demand across industries, rapid advancements in chip packaging technologies, and the rising complexity of integrated circuit designs.

Market Growth Drivers:

The global SATS market is propelled by surging demand for advanced electronics, particularly in high-growth segments such as smartphones, electric vehicles, AI, IoT, and 5G infrastructure. As chip designs become more sophisticated, with smaller nodes and greater functional density, the need for precision assembly and testing intensifies. Additionally, the trend toward outsourcing by fabless companies and IDMs to specialized OSAT (outsourced semiconductor assembly and test) providers boosts market growth by offering economies of scale and operational efficiency. Technological advancements, including the adoption of system-in-package (SiP), 3D IC packaging, and through-silicon via (TSV) technology, are reshaping the landscape and opening new growth avenues for SATS providers.

Market Restraints:

Despite strong growth prospects, the SATS market faces challenges related to high capital investment, technological obsolescence, and supply chain disruptions. The rapid pace of innovation in semiconductor design requires SATS providers to continuously upgrade their equipment and capabilities, posing cost burdens, especially for small and mid-sized players. Additionally, dependence on a concentrated number of equipment vendors and geopolitical tensions in key semiconductor-producing regions create vulnerabilities in supply chain resilience. Limited skilled labor and increasing competition from in-house testing capabilities of large IDMs may also impact the profitability and growth potential of independent SATS providers.

Market Opportunities:

The SATS market presents significant opportunities fueled by the expanding demand for heterogeneous integration, chiplet architecture, and miniaturized electronics. The rise of autonomous vehicles, smart manufacturing, and wearable technologies is generating a robust pipeline of demand for high-performance and compact semiconductor solutions, which in turn drives the need for specialized packaging and testing services. Furthermore, strategic investments in AI-driven testing, automation, and digital twin technologies are enhancing quality control, reducing time-to-market, and optimizing operational efficiency. Emerging markets in Asia Pacific and Latin America offer untapped potential for SATS providers, supported by growing electronics manufacturing ecosystems and favorable government initiatives.

Key Questions Answered in the Report:

  • What are the primary factors driving the growth of the semiconductor assembly and testing services market globally?
  • Which technologies and end-use applications are accelerating SATS adoption across industries?
  • How are advancements in packaging and testing techniques reshaping the competitive landscape?
  • Who are the major players in the SATS market, and what strategies are they implementing to maintain competitiveness?
  • What are the emerging trends and future outlook for the global SATS market?

Competitive Intelligence and Business Strategy:

Leading players in the global SATS market, including ASE Technology Holding Co., Ltd., Amkor Technology, Inc., JCET Group Co., Ltd., and Powertech Technology Inc., focus on continuous innovation, capacity expansion, and strategic collaborations to stay competitive. These companies are investing in advanced packaging technologies such as fan-out wafer-level packaging (FOWLP), flip-chip, and 2.5D/3D ICs to meet the evolving demands of end-use sectors. Mergers and acquisitions are being pursued to strengthen geographic presence and technological capabilities. Additionally, partnerships with semiconductor foundries, fabless firms, and EDA tool providers enable these SATS players to deliver integrated solutions and streamline the product development lifecycle.

Key Companies Profiled:

  • ASE Group, Inc.
  • Amkor Technology, Inc.
  • Siliconware Precision Industries Co., Ltd.
  • Powertech Technology, Inc.
  • United Test and Assembly Center Ltd.
  • JCET Group Co Ltd
  • Chips Technologies, Inc.
  • Chipbond Technology Corporation.
  • King Yuan Electronics Co Ltd
  • Unisem

Key Segments of Semiconductor Assembly Test Services Market Research

By Service:

  • Assembly & Packaging Services
  • Copper Wire & Gold Wire Bonding
  • Flip Chip
  • Wafer Level Packaging
  • TSV
  • Others
  • Testing Services

By Application:

  • Communication
  • Computing & Networking
  • Consumer Electronics
  • Industrial
  • Automotive Electronics

By Region:

  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia & Pacific
  • Middle East and Africa (MEA)

Table of Contents

1. Executive Summary

  • 1.1. Global Market Outlook
  • 1.2. Demand Side Trends
  • 1.3. Supply Side Trends
  • 1.4. Analysis and Recommendations

2. Market Overview

  • 2.1. Market Coverage / Taxonomy
  • 2.2. Market Definition / Scope / Limitations

3. Key Market Trends

  • 3.1. Key Trends Impacting the Market
  • 3.2. Product Innovation / Development Trends

4. Pricing Analysis

  • 4.1. Pricing Analysis, By Semiconductor Assembly Test Services
  • 4.2. Average Pricing Analysis Benchmark

5. Global Semiconductor Assembly and Test Services Market Demand (Value in US$ Bn) Analysis 2019-2024 and Forecast, 2025-2032

  • 5.1. Historical Market Value (US$ Bn) Analysis, 2019-2024
  • 5.2. Current and Future Market Value (US$ Bn) Projections, 2025-2032
    • 5.2.1. Y-o-Y Growth Trend Analysis
    • 5.2.2. Absolute $ Opportunity Analysis

6. Market Background

  • 6.1. Macro-Economic Factors
  • 6.2. Forecast Factors - Relevance & Impact
  • 6.3. Value Chain
  • 6.4. COVID-19 Crisis - Impact Assessment
    • 6.4.1. Current Statistics
    • 6.4.2. Short-Mid-Long Term Outlook
    • 6.4.3. Likely Rebound
  • 6.5. Market Dynamics
    • 6.5.1. Drivers
    • 6.5.2. Restraints
    • 6.5.3. Opportunities

7. Global Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032, By Service

  • 7.1. Introduction / Key Findings
  • 7.2. Historical Market Size (US$ Bn) Analysis By Service, 2019-2024
  • 7.3. Current and Future Market Size (US$ Bn) Analysis and Forecast By Service, 2025-2032
    • 7.3.1. Assembly & Packaging Services
      • 7.3.1.1. Copper Wire & Gold Wire Bonding
      • 7.3.1.2. Flip Chip
      • 7.3.1.3. Wafer Level Packaging
      • 7.3.1.4. TSV
      • 7.3.1.5. Others
    • 7.3.2. Testing Services
  • 7.4. Market Attractiveness Analysis By Service

8. Global Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032, by Application

  • 8.1. Introduction / Key Findings
  • 8.2. Historical Market Size (US$ Bn) Analysis By Application, 2019-2024
  • 8.3. Current and Future Market Size (US$ Bn) Analysis and Forecast By Application, 2025-2032
    • 8.3.1. Communication
    • 8.3.2. Computing & Networking
    • 8.3.3. Consumer Electronics
    • 8.3.4. Industrial
    • 8.3.5. Automotive Electronics
  • 8.4. Market Attractiveness Analysis By Application

9. Global Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032, by Region

  • 9.1. Introduction / Key Findings
  • 9.2. Historical Market Size (US$ Bn) Analysis By Region, 2019-2024
  • 9.3. Current and Future Market Size (US$ Bn) Analysis and Forecast By Region, 2025-2032
    • 9.3.1. North America
    • 9.3.2. Latin America
    • 9.3.3. Europe
    • 9.3.4. East Asia
    • 9.3.5. South Asia Pacific
    • 9.3.6. Middle East and Africa
  • 9.4. Market Attractiveness Analysis By Region

10. North America Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 10.1. Introduction
  • 10.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 10.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 10.3.1. By Service
    • 10.3.2. By Application
    • 10.3.3. By Country
      • 10.3.3.1. U.S.
      • 10.3.3.2. Canada
  • 10.4. Market Attractiveness Analysis
    • 10.4.1. By Service
    • 10.4.2. By Application
    • 10.4.3. By Country
  • 10.5. Market Trends
  • 10.6. Key Market Participants - Intensity Mapping

11. Latin America Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 11.1. Introduction
  • 11.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 11.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 11.3.1. By Service
    • 11.3.2. By Application
    • 11.3.3. By Country
      • 11.3.3.1. Brazil
      • 11.3.3.2. Mexico
      • 11.3.3.3. Rest of Latin America
  • 11.4. Market Attractiveness Analysis
    • 11.4.1. By Service
    • 11.4.2. By Application
    • 11.4.3. By Country

12. Europe Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 12.1. Introduction
  • 12.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 12.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 12.3.1. By Service
    • 12.3.2. By Application
    • 12.3.3. By Country
      • 12.3.3.1. Germany
      • 12.3.3.2. Italy
      • 12.3.3.3. France
      • 12.3.3.4. U.K.
      • 12.3.3.5. Spain
      • 12.3.3.6. BENELUX
      • 12.3.3.7. Russia
      • 12.3.3.8. Rest of Europe
  • 12.4. Market Attractiveness Analysis
    • 12.4.1. By Service
    • 12.4.2. By Application
    • 12.4.3. By Country

13. South Asia & Pacific Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 13.1. Introduction
  • 13.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 13.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 13.3.1. By Service
    • 13.3.2. By Application
    • 13.3.3. By Country
      • 13.3.3.1. India
      • 13.3.3.2. Indonesia
      • 13.3.3.3. Malaysia
      • 13.3.3.4. Singapore
      • 13.3.3.5. Australia & New Zealand
      • 13.3.3.6. Rest of South Asia and Pacific
  • 13.4. Market Attractiveness Analysis
    • 13.4.1. By Service
    • 13.4.2. By Application
    • 13.4.3. By Country

14. East Asia Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 14.1. Introduction
  • 14.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 14.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 14.3.1. By Service
    • 14.3.2. By Application
    • 14.3.3. By Country
      • 14.3.3.1. China
      • 14.3.3.2. Japan
      • 14.3.3.3. South Korea
  • 14.4. Market Attractiveness Analysis
    • 14.4.1. By Service
    • 14.4.2. By Application
    • 14.4.3. By Country

15. Middle East and Africa Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 15.1. Introduction
  • 15.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 15.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 15.3.1. By Service
    • 15.3.2. By Application
    • 15.3.3. By Country
      • 15.3.3.1. GCC Countries
      • 15.3.3.2. Turkey
      • 15.3.3.3. South Africa
      • 15.3.3.4. Rest of Middle East and Africa
  • 15.4. Market Attractiveness Analysis
    • 15.4.1. By Service
    • 15.4.2. By Application
    • 15.4.3. By Country

16. Key Countries Analysis- Semiconductor Assembly and Test Services Market

  • 16.1. U.S. Semiconductor Assembly and Test Services Market Analysis
    • 16.1.1. By Service
    • 16.1.2. By Application
  • 16.2. Canada Semiconductor Assembly and Test Services Market Analysis
    • 16.2.1. By Service
    • 16.2.2. By Application
  • 16.3. Mexico Semiconductor Assembly and Test Services Market Analysis
    • 16.3.1. By Service
    • 16.3.2. By Application
  • 16.4. Brazil Semiconductor Assembly and Test Services Market Analysis
    • 16.4.1. By Service
    • 16.4.2. By Application
  • 16.5. Germany Semiconductor Assembly and Test Services Market Analysis
    • 16.5.1. By Service
    • 16.5.2. By Application
  • 16.6. Italy Semiconductor Assembly and Test Services Market Analysis
    • 16.6.1. By Service
    • 16.6.2. By Application
  • 16.7. France Semiconductor Assembly and Test Services Market Analysis
    • 16.7.1. By Service
    • 16.7.2. By Application
  • 16.8. U.K. Semiconductor Assembly and Test Services Market Analysis
    • 16.8.1. By Service
    • 16.8.2. By Application
  • 16.9. Spain Semiconductor Assembly and Test Services Market Analysis
    • 16.9.1. By Service
    • 16.9.2. By Application
  • 16.10. BENELUX Semiconductor Assembly and Test Services Market Analysis
    • 16.10.1. By Service
    • 16.10.2. By Application
  • 16.11. Russia Semiconductor Assembly and Test Services Market Analysis
    • 16.11.1. By Service
    • 16.11.2. By Application
  • 16.12. Rest of Europe Semiconductor Assembly and Test Services Market Analysis
    • 16.12.1. By Service
    • 16.12.2. By Application
  • 16.13. China Semiconductor Assembly and Test Services Market Analysis
    • 16.13.1. By Service
    • 16.13.2. By Application
  • 16.14. Japan Semiconductor Assembly and Test Services Market Analysis
    • 16.14.1. By Service
    • 16.14.2. By Application
  • 16.15. South Korea Semiconductor Assembly and Test Services Market Analysis
    • 16.15.1. By Service
    • 16.15.2. By Application
  • 16.16. India Semiconductor Assembly and Test Services Market Analysis
    • 16.16.1. By Service
    • 16.16.2. By Application
  • 16.17. Malaysia Semiconductor Assembly and Test Services Market Analysis
    • 16.17.1. By Service
    • 16.17.2. By Application
  • 16.18. Indonesia Semiconductor Assembly and Test Services Market Analysis
    • 16.18.1. By Service
    • 16.18.2. By Application
  • 16.19. Singapore Semiconductor Assembly and Test Services Market Analysis
    • 16.19.1. By Service
    • 16.19.2. By Application
  • 16.20. Australia and New Zealand Semiconductor Assembly and Test Services Market Analysis
    • 16.20.1. By Service
    • 16.20.2. By Application
  • 16.21. GCC Countries Semiconductor Assembly and Test Services Market Analysis
    • 16.21.1. By Service
    • 16.21.2. By Application
  • 16.22. Turkey Semiconductor Assembly and Test Services Market Analysis
    • 16.22.1. By Service
    • 16.22.2. By Application
  • 16.23. South Africa Semiconductor Assembly and Test Services Market Analysis
    • 16.23.1. By Service
    • 16.23.2. By Application
  • 16.24. Rest of Middle East and Africa Semiconductor Assembly and Test Services Market Analysis
    • 16.24.1. By Service
    • 16.24.2. By Application

17. Market Structure Analysis

  • 17.1. Market Analysis by Tier of Companies
  • 17.2. Market Share Analysis of Top Players
  • 17.3. Market Presence Analysis

18. Competition Analysis

  • 18.1. Competition Dashboard
  • 18.2. Competition Benchmarking
  • 18.3. Competition Deep Dive
    • 18.3.1. ASE Group, Inc.
      • 18.3.1.1. .Business Overview
      • 18.3.1.2. Solution Portfolio
      • 18.3.1.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.1.4. Key Strategy & Developments
    • 18.3.2. Amkor Technology, Inc.
      • 18.3.2.1. Business Overview
      • 18.3.2.2. Solution Portfolio
      • 18.3.2.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.2.4. Key Strategy & Developments
    • 18.3.3. Siliconware Precision Industries Co., Ltd.
      • 18.3.3.1. Business Overview
      • 18.3.3.2. Solution Portfolio
      • 18.3.3.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.3.4. Key Strategy & Developments
    • 18.3.4. Powertech Technology, Inc.
      • 18.3.4.1. Business Overview
      • 18.3.4.2. Solution Portfolio
      • 18.3.4.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.4.4. Key Strategy & Developments
    • 18.3.5. United Test and Assembly Center Ltd.
      • 18.3.5.1. Business Overview
      • 18.3.5.2. Solution Portfolio
      • 18.3.5.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.5.4. Key Strategy & Developments
    • 18.3.6. JCET Group Co Ltd
      • 18.3.6.1. Business Overview
      • 18.3.6.2. Solution Portfolio
      • 18.3.6.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.6.4. Key Strategy & Developments
    • 18.3.7. Chips Technologies, Inc.
      • 18.3.7.1. Business Overview
      • 18.3.7.2. Solution Portfolio
      • 18.3.7.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.7.4. Key Strategy & Developments
    • 18.3.8. Chipbond Technology Corporation.
      • 18.3.8.1. Business Overview
      • 18.3.8.2. Solution Portfolio
      • 18.3.8.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.8.4. Key Strategy & Developments
    • 18.3.9. King Yuan Electronics Co Ltd
      • 18.3.9.1. Business Overview
      • 18.3.9.2. Solution Portfolio
      • 18.3.9.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.9.4. Key Strategy & Developments
    • 18.3.10. .Unisem
      • 18.3.10.1. Business Overview
      • 18.3.10.2. Solution Portfolio
      • 18.3.10.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.10.4. Key Strategy & Developments

19. Assumptions and Acronyms Used

20. Research Methodology