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半導体組立・パッケージング装置の市場規模、シェア、動向分析レポート：製品タイプ別、パッケージングタイプ別、最終用途別、地域別、セグメント別予測、2025～2033年

Semiconductor Assembly And Packaging Equipment Market Size, Share & Trends Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End-use, By Region, And Segment Forecasts, 2025 - 2033

出版日
ページ情報
英文 100 Pages
納期
2～10営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=149.53円
半導体組立・パッケージング装置の市場規模、シェア、動向分析レポート：製品タイプ別、パッケージングタイプ別、最終用途別、地域別、セグメント別予測、2025～2033年
出版日: 2025年07月24日
発行: Grand View Research
ページ情報: 英文 100 Pages
納期: 2～10営業日
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  • 概要
  • 図表
  • 目次
概要

半導体組立・パッケージング装置市場のサマリー

半導体組立・パッケージング装置の世界市場規模は、2024年に44億2,100万米ドルと推計され、2025年から2033年にかけてCAGR 8.4%で成長し、2030年には92億900万米ドルに達すると予測されます。この成長の原動力となっているのは、小型で高性能な電子機器に対する需要の高まりです。

民生用電子機器やモバイル機器の小型化と高性能化に伴い、性能、効率、小型化の要件を満たすための先進パッケージング技術へのニーズが高まり続けています。市場成長の重要な促進要因は、ファブレス半導体企業によるアウトソーシングの増加傾向です。このシフトにより、OSAT（半導体組立・テストアウトソーシング）企業が提供する組立・パッケージングサービスに対する需要が高まっています。これに対応して、OSATプロバイダーは、進化する顧客ニーズに対応するため、先進アセンブリ・パッケージング機器への投資を積極的に行っています。

さらに、米国、中国、欧州などの地域では、政府の取り組みや半導体刺激策が、チップ生産とパッケージング・インフラへの設備投資をさらに加速させています。これらの要因が相まって、半導体アセンブリ・パッケージング装置産業の力強い成長軌道を後押ししています。

目次

第1章 調査手法と範囲

第2章 エグゼクティブサマリー

第3章 世界の半導体組立・パッケージング装置市場の変数、動向、範囲

  • 市場集中と成長見通しのマッピング
  • 業界バリューチェーン分析
    • 原材料・部品の見通し
    • メーカーの見通し
    • 流通の見通し
    • エンドユーザーの見通し
  • 規制の枠組み
  • テクノロジーの概要
  • 市場力学
    • 市場促進要因分析
    • 市場抑制要因分析
    • 市場課題分析
    • 市場機会分析
  • 経済メガ動向分析
  • 業界分析ツール
    • ポーターのファイブフォース分析
    • マクロ環境分析

第4章 世界の半導体組立・パッケージング装置市場：最終用途別の推定・動向分析

  • 最終用途別の変動分析と市場シェア、2024年と2033年
  • 最終用途別、2021年から2033年
  • IDM（統合デバイスメーカー）
  • OSAT（アウトソーシング半導体組立・テスト）

第5章 世界の半導体組立・パッケージング装置市場：パッケージングタイプ別の推定・動向分析

  • パッケージングタイプ別の変動分析と市場シェア、2024年と2033年
  • パッケージングタイプ別、2021～2033年
  • フリップチップパッケージング装置
  • ウエハーレベルパッケージング（WLP）装置
  • ファンアウトパッケージング装置
  • システムインパッケージ（SiP）機器
  • 3D/2.5Dパッケージング装置
  • その他

第6章 世界の半導体組立・パッケージング装置市場：製品別の推定・動向分析

  • 製品別の変動分析と市場シェア、2024年と2033年
  • 製品別、2021年から2033年
  • ダイシング装置
    • スクライバー
    • ダイサー
    • ウエハーマウント装置
  • ボンディング装置
    • ダイボンダー
    • ワイヤーボンダー
    • その他
  • パッケージング装置
    • 成形装置
    • はんだめっき装置
    • デフラッシャー
    • その他
  • その他

第7章 世界の半導体組立・パッケージング装置市場：地域別の推定・動向分析

  • 地域別の変動分析と市場シェア、2024年と2033年
  • 北米
    • パッケージングタイプ別、2021年～2033年
    • 最終用途別、2021年～2033年
    • 製品別、2021年～2033年
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • パッケージングタイプ別、2021年～2033年
    • 最終用途別、2021年～2033年
    • 製品別、2021年～2033年
    • ドイツ
    • フランス
    • 英国
    • イタリア
    • スペイン
    • オランダ
  • アジア太平洋
    • パッケージングタイプ別、2021年～2033年
    • 最終用途別、2021年～2033年
    • 製品別、2021年～2033年
    • 中国
    • インド
    • 日本
    • 台湾
    • 韓国
  • ラテンアメリカ
    • パッケージングタイプ別、2021年～2033年
    • 最終用途別、2021年～2033年
    • 製品別、2021年～2033年
    • ブラジル
  • 中東・アフリカ
    • パッケージングタイプ別、2021年～2033年
    • 最終用途別、2021年～2033年
    • 製品別、2021年～2033年
    • イスラエル
    • 南アフリカ

第8章 世界の半導体組立・パッケージング装置市場-競合情勢

  • 主要市場参入企業による最近の動向と影響分析
  • 企業分類
  • 企業ダッシュボード分析
  • ベンダー情勢
    • 主要な原材料/部品供給業者一覧
    • 主要メーカー一覧
    • 主要販売代理店リスト
  • 企業市場シェア分析、2024年
  • 企業ポジショニング分析、 2024年
  • 企業ヒートマップ分析、2024年
  • 戦略マッピング
  • 企業プロファイル
    • Applied Materials
    • ASM Pacific Technology
    • Veeco Instruments Inc.
    • Besi
    • Disco Corporation
    • Kulicke &Soffa Industries, Inc.（K&S）
    • Lam Research Corporation
    • Nikon Corporation
    • Plasma-Therm
    • Rudolph Technologies, Inc.
    • SCREEN Semiconductor Solutions Co., Ltd.
    • SUSS MicroTec SE
    • Teradyne, Inc.
    • Tokyo Electron Limited（TEL）
    • Ultratech, Inc.
図表

List of Tables

  • Table 1 Global semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 2 Global semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 3 Global semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 4 Global semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 5 Global semiconductor assembly and packaging equipment market estimates and forecasts, by region, 2021 - 2033 (USD Million)
  • Table 6 North America semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 7 North America semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 8 North America semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 9 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 10 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 11 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 12 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 13 Canada semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 14 Canada semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 15 Canada semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 16 Canada semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 17 Mexico semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 18 Mexico semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 19 Mexico semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 20 Mexico semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 21 Europe semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 22 Europe semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 23 Europe semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 24 Europe semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 25 Germany semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 26 Germany semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 27 Germany semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 28 France semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 29 France semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 30 France semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 31 Italy semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 32 Italy semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 33 Italy semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 34 Spain semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 35 Spain semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 36 Spain semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 37 Netherlands semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 38 Netherlands semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 39 Netherlands semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 40 U.K. semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 41 U.K. semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 42 U.K. semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 43 Asia Pacific semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 44 Asia Pacific semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 45 Asia Pacific semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 46 China semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 47 China semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 48 China semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 49 India semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 50 India semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 51 India semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 52 Japan semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 53 Japan semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 54 Japan semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 55 South Korea semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 56 South Korea semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 57 South Korea semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 58 Taiwan semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 59 Taiwan semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 60 Taiwan semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 61 Latin America semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 62 Latin America semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 63 Latin America semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 64 Brazil semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 65 Brazil semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 66 Brazil semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 67 Middle East & Africa semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 68 Middle East & Africa semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 69 Middle East & Africa semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 70 Israel semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 71 Israel semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 72 Israel semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 73 South Africa semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 74 South Africa semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 75 South Africa semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 76 Company Heat Map Analysis, 2024
  • Table 77 Strategy Mapping

List of Figures

  • Fig. 1 Market research process
  • Fig. 2 Data triangulation techniques
  • Fig. 3 Primary research pattern
  • Fig. 4 Market research approaches
  • Fig. 5 QFD modeling for market share assessment
  • Fig. 6 Information Procurement
  • Fig. 7 Market Formulation and Validation
  • Fig. 8 Data Validating & Publishing
  • Fig. 9 Market Segmentation & Scope
  • Fig. 10 Global Semiconductor Assembly and Packaging Equipment Market Snapshot
  • Fig. 11 Segment Snapshot
  • Fig. 12 Competitive Landscape Snapshot
  • Fig. 13 Parent market outlook
  • Fig. 14 Global Semiconductor Assembly and Packaging Equipment Market Value, 2024 (USD Million)
  • Fig. 15 Global Semiconductor Assembly and Packaging Equipment Market - Value Chain Analysis
  • Fig. 16 Global Semiconductor Assembly and Packaging Equipment Market - Market Dynamics
  • Fig. 17 Global Semiconductor Assembly and Packaging Equipment Market - PORTER's Analysis
  • Fig. 18 Global Semiconductor Assembly and Packaging Equipment Market - PESTEL Analysis
  • Fig. 19 Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By Packaging Type: Key Takeaways
  • Fig. 20 Global Semiconductor Assembly and Packaging Equipment Market Share, By Packaging Type, 2024 & 2033
  • Fig. 21 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Flip Chip Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 22 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wafer Level Packaging (WLP) Equipment, 2021 - 2033 (USD Million)
  • Fig. 23 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Fan-Out Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 24 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By System-in-Package (SiP) Equipment, 2021 - 2033 (USD Million)
  • Fig. 25 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By 3D/25D Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 26 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others 2021 - 2033 (USD Million)
  • Fig. 27 Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By Product: Key Takeaways
  • Fig. 28 Global Semiconductor Assembly and Packaging Equipment Market Share, By Product, 2024 & 2033
  • Fig. 29 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Dicing Equipment, 2021 - 2033 (USD Million)
  • Fig. 30 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Scriber, 2021 - 2033 (USD Million)
  • Fig. 31 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Dicer, 2021 - 2033 (USD Million)
  • Fig. 32 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wafer Mounting Equipment, 2021 - 2033 (USD Million)
  • Fig. 33 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Bonding Equipment, 2021 - 2033 (USD Million)
  • Fig. 34 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Die Bonder, 2021 - 2033 (USD Million)
  • Fig. 35 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wire Bonder, 2021 - 2033 (USD Million)
  • Fig. 36 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 37 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 38 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Molding Equipment, 2021 - 2033 (USD Million)
  • Fig. 39 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Solder Plating Equipment, 2021 - 2033 (USD Million)
  • Fig. 40 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Deflasher, 2021 - 2033 (USD Million)
  • Fig. 41 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 42 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 43 Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By End Use: Key Takeaways
  • Fig. 44 Global Semiconductor Assembly and Packaging Equipment Market Share, By End Use, 2024 & 2033
  • Fig. 45 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, In IDMs (Integrated Device Manufacturers) 2021 - 2033 (USD Million)
  • Fig. 46 Global Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, In OSAT (Outsourced Semiconductor Assembly and Test) 2021 - 2033 (USD Million)
  • Fig. 47 North America Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 48 US Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 49 Canada Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 50 Mexico Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 51 Europe Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 52 Germany Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 53 France Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 54 UK Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 55 Italy Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 56 Spain Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 57 Netherlands Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 58 Asia Pacific Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 59 China Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 60 Japan Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 61 India Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 62 Taiwan Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 63 South Korea Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 64 Taiwan Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 65 Latin America Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 66 Brazil Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 67 Argentina Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 68 Middle East & Africa Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 69 Saudi Arabia Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 70 South Africa Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 71 Israel Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, 2021 - 2033 (USD Million)
  • Fig. 72 Key Company Categorization
  • Fig. 73 Company Market Positioning
  • Fig. 74 Key Company Market Share Analysis, 2024
  • Fig. 75 Strategy Mapping
目次
Product Code: GVR-4-68040-685-9

Semiconductor Assembly & Packaging Equipment Market Summary

The global semiconductor assembly and packaging equipment market size was estimated at USD 4,421.0 million in 2024 and is projected to reach USD 9,209.0 million by 2030, growing at a CAGR of 8.4% from 2025 to 2033. This growth is driven by rising demand for compact, high-performance electronic devices.

As consumer electronics and mobile devices become smaller yet more powerful, the need for advanced packaging technologies continues to grow to meet performance, efficiency, and miniaturization requirements. A significant driver of market growth is the increasing trend of outsourcing by fabless semiconductor companies. This shift has resulted in rising demand for assembly and packaging services provided by OSAT (Outsourced Semiconductor Assembly and Test) companies. In response, OSAT providers are heavily investing in advanced assembly and packaging equipment to meet evolving customer needs.

In addition, government initiatives and semiconductor stimulus programs in regions such as the U.S., China, and Europe are further accelerating capital investments in chip production and packaging infrastructure. Collectively, these factors are propelling the robust growth trajectory of the semiconductor assembly and packaging equipment industry.

Global Semiconductor Assembly & Packaging Equipment Market Report Segmentation

This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the global semiconductor assembly and packaging equipment market report based on packaging type,end-use, product and region.

  • Packaging Type Outlook (Revenue, USD Million, 2021 - 2033)
  • Flip Chip Packaging Equipment
  • Wafer Level Packaging (WLP) Equipment
  • Fan-Out Packaging Equipment
  • System-in-Package (SiP) Equipment
  • 3D/2.5D Packaging Equipment
  • Others
  • End-use Outlook (Revenue, USD Million, 2021 - 2033)
  • IDMs (Integrated Device Manufacturers)
  • OSAT (Outsourced Semiconductor Assembly and Test)
  • Product Outlook (Revenue, USD Million, 2021 - 2033)
  • Dicing Equipment
    • Scriber
    • Dicer
    • Wafer Mounting Equipment
  • Bonding Equipment
    • Die Bonder
    • Wire Bonder
    • Others
  • Packaging Equipment
    • Molding Equipment
    • Solder Plating Equipment
    • Deflasher
    • Others
  • Others
  • Regional Outlook (Revenue, USD Million, 2021 - 2033)
  • North America
    • U.S.
    • Canada
  • Mexico
    • Europe
    • Germany
    • France
    • Italy
    • Spain
    • UK
    • Netherlands
  • Asia Pacific
    • China
    • India
    • Japan
    • South Korea
    • Taiwan
  • Latin America
    • Brazil
  • Middle East and Africa
    • Israel
    • South Africa

Table of Contents

Chapter 1. Methodology and Scope

  • 1.1. Market Segmentation & Scope
  • 1.2. Market Definition
  • 1.3. Information Procurement
    • 1.3.1. Purchased Database
    • 1.3.2. GVR's Internal Database
    • 1.3.3. Secondary Sources & Third-Party Perspectives
    • 1.3.4. Primary Research
  • 1.4. Information Analysis
    • 1.4.1. Data Analysis Models
  • 1.5. Market Formulation & Data Visualization
  • 1.6. Data Validation & Publishing

Chapter 2. Executive Summary

  • 2.1. Market Snapshot
  • 2.2. Segment Snapshot
  • 2.3. Competitive Landscape Snapshot

Chapter 3. Global Semiconductor Assembly and Packaging Equipment Market Variables, Trends & Scope

  • 3.1. Market Concentration & Growth Prospect Mapping
  • 3.2. Industry Value Chain Analysis
    • 3.2.1. Raw Material/Component Outlook
    • 3.2.2. Manufacturer Outlook
    • 3.2.3. Distribution Outlook
    • 3.2.4. End User Outlook
  • 3.3. Regulatory Framework
  • 3.4. Technology Overview
  • 3.5. Market Dynamics
    • 3.5.1. Market Driver Analysis
    • 3.5.2. Market Restraint Analysis
    • 3.5.3. Market Challenges Analysis
    • 3.5.4. Market Opportunity Analysis
  • 3.6. Economic Mega-Trend Analysis
  • 3.7. Industry Analysis Tools
    • 3.7.1. Porter's Five Forces Analysis
    • 3.7.2. Macro-environmental Analysis

Chapter 4. Global Semiconductor Assembly and Packaging Equipment Market: End Use Estimates & Trend Analysis

  • 4.1. End Use Movement Analysis & Market Share, 2024 & 2033
  • 4.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By End Use, 2021 to 2033 (USD Million)
  • 4.3. IDMs (Integrated Device Manufacturers)
    • 4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.4. OSAT (Outsourced Semiconductor Assembly and Test)
    • 4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 5. Global Semiconductor Assembly and Packaging Equipment Market: Packaging Type Estimates & Trend Analysis

  • 5.1. Packaging Type Movement Analysis & Market Share, 2024 & 2033
  • 5.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Packaging Type, 2021 to 2033 (USD Million)
  • 5.3. Flip Chip Packaging Equipment
    • 5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.4. Wafer Level Packaging (WLP) Equipment
    • 5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.5. Fan-Out Packaging Equipment
    • 5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.6. System-in-Package (SiP) Equipment
    • 5.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.7. 3D/2.5D Packaging Equipment
    • 5.7.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.8. Others
    • 5.8.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 6. Global Semiconductor Assembly and Packaging Equipment Market: Product Estimates & Trend Analysis

  • 6.1. Product Movement Analysis & Market Share, 2024 & 2033
  • 6.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Product, 2021 to 2033 (USD Million)
  • 6.3. Dicing Equipment
    • 6.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.2. Scriber
      • 6.3.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.3. Dicer
      • 6.3.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.4. Wafer Mounting Equipment
      • 6.3.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4. Bonding Equipment
    • 6.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.2. Die Bonder
      • 6.4.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.3. Wire Bonder
      • 6.4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.4. Others
      • 6.4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5. Packaging Equipment
    • 6.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.2. Molding Equipment
      • 6.5.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.3. Solder Plating Equipment
      • 6.5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.4. Deflasher
      • 6.5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.5. Others
      • 6.5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.6. Others
    • 6.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 7. Global Semiconductor Assembly and Packaging Equipment Market: Regional Estimates & Trend Analysis

  • 7.1. Regional Movement Analysis & Market Share, 2024 & 2033
  • 7.2. North America
    • 7.2.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.2.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.2.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.2.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.2.5. U.S.
      • 7.2.5.1. Key country dynamics
      • 7.2.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.2.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.2.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.2.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.2.6. Canada
      • 7.2.6.1. Key country dynamics
      • 7.2.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.2.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.2.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.2.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.2.7. Mexico
      • 7.2.7.1. Key country dynamics
      • 7.2.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.2.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.2.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.2.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.3. Europe
    • 7.3.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.3.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.3.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.3.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.5. Germany
      • 7.3.5.1. Key country dynamics
      • 7.3.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.6. France
      • 7.3.6.1. Key country dynamics
      • 7.3.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.7. UK
      • 7.3.7.1. Key country dynamics
      • 7.3.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.8. Italy
      • 7.3.8.1. Key country dynamics
      • 7.3.8.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.8.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.8.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.8.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.9. Spain
      • 7.3.9.1. Key country dynamics
      • 7.3.9.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.9.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.9.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.9.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.3.10. Netherlands
      • 7.3.10.1. Key country dynamics
      • 7.3.10.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.3.10.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.3.10.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.3.10.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.4. Asia Pacific
    • 7.4.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.4.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.4.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.4.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.4.5. China
      • 7.4.5.1. Key country dynamics
      • 7.4.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.4.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.4.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.4.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.4.6. India
      • 7.4.6.1. Key country dynamics
      • 7.4.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.4.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.4.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.4.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.4.7. Japan
      • 7.4.7.1. Key country dynamics
      • 7.4.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.4.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.4.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.4.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.4.8. Taiwan
      • 7.4.8.1. Key country dynamics
      • 7.4.8.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.4.8.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.4.8.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.4.8.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.4.9. South Korea
      • 7.4.9.1. Key country dynamics
      • 7.4.9.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.4.9.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.4.9.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.4.9.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.5. Latin America
    • 7.5.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.5.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.5.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.5.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.5.5. Brazil
      • 7.5.5.1. Key country dynamics
      • 7.5.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.5.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.5.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.5.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.6. Middle East & Africa
    • 7.6.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.6.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.6.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.6.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.6.5. Israel
      • 7.6.5.1. Key country dynamics
      • 7.6.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.6.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.6.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.6.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
    • 7.6.6. South Africa
      • 7.6.6.1. Key country dynamics
      • 7.6.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
      • 7.6.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
      • 7.6.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
      • 7.6.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)

Chapter 8. Global Semiconductor Assembly and Packaging Equipment Market - Competitive Landscape

  • 8.1. Recent Developments & Impact Analysis, By Key Market Participants
  • 8.2. Company Categorization
  • 8.3. Company Dashboard Analysis
  • 8.4. Vendor Landscape
    • 8.4.1. List of Key Raw Material/Component Providers
    • 8.4.2. List of Key Manufacturers
    • 8.4.3. List of Key Distributors
  • 8.5. Company Market Share Analysis, 2024
  • 8.6. Company Positioning Analysis, 2024
  • 8.7. Company Heat Map Analysis, 2024
  • 8.8. Strategy Mapping
  • 8.9. Company Profiles
    • 8.9.1. Applied Materials
      • 8.9.1.1. Participant's overview
      • 8.9.1.2. Financial performance
      • 8.9.1.3. Product benchmarking
      • 8.9.1.4. Recent developments
    • 8.9.2. ASM Pacific Technology
      • 8.9.2.1. Participant's overview
      • 8.9.2.2. Financial performance
      • 8.9.2.3. Product benchmarking
      • 8.9.2.4. Recent developments
    • 8.9.3. Veeco Instruments Inc.
      • 8.9.3.1. Participant's overview
      • 8.9.3.2. Financial performance
      • 8.9.3.3. Product benchmarking
      • 8.9.3.4. Recent developments
    • 8.9.4. Besi
      • 8.9.4.1. Participant's overview
      • 8.9.4.2. Financial performance
      • 8.9.4.3. Product benchmarking
      • 8.9.4.4. Recent developments
    • 8.9.5. Disco Corporation
      • 8.9.5.1. Participant's overview
      • 8.9.5.2. Financial performance
      • 8.9.5.3. Product benchmarking
      • 8.9.5.4. Recent developments
    • 8.9.6. Kulicke & Soffa Industries, Inc. (K&S)
      • 8.9.6.1. Participant's overview
      • 8.9.6.2. Financial performance
      • 8.9.6.3. Product benchmarking
      • 8.9.6.4. Recent developments
    • 8.9.7. Lam Research Corporation
      • 8.9.7.1. Participant's overview
      • 8.9.7.2. Financial performance
      • 8.9.7.3. Product benchmarking
      • 8.9.7.4. Recent developments
    • 8.9.8. Nikon Corporation
      • 8.9.8.1. Participant's overview
      • 8.9.8.2. Financial performance
      • 8.9.8.3. Product benchmarking
      • 8.9.8.4. Recent developments
    • 8.9.9. Plasma-Therm
      • 8.9.9.1. Participant's overview
      • 8.9.9.2. Financial performance
      • 8.9.9.3. Product benchmarking
      • 8.9.9.4. Recent developments
    • 8.9.10. Rudolph Technologies, Inc.
      • 8.9.10.1. Participant's overview
      • 8.9.10.2. Financial performance
      • 8.9.10.3. Product benchmarking
      • 8.9.10.4. Recent developments
    • 8.9.11. SCREEN Semiconductor Solutions Co., Ltd.
      • 8.9.11.1. Participant's overview
      • 8.9.11.2. Financial performance
      • 8.9.11.3. Product benchmarking
      • 8.9.11.4. Recent developments
    • 8.9.12. SUSS MicroTec SE
      • 8.9.12.1. Participant's overview
      • 8.9.12.2. Financial performance
      • 8.9.12.3. Product benchmarking
      • 8.9.12.4. Recent developments
    • 8.9.13. Teradyne, Inc.
      • 8.9.13.1. Participant's overview
      • 8.9.13.2. Financial performance
      • 8.9.13.3. Product benchmarking
      • 8.9.13.4. Recent developments
    • 8.9.14. Tokyo Electron Limited (TEL)
      • 8.9.14.1. Participant's overview
      • 8.9.14.2. Financial performance
      • 8.9.14.3. Product benchmarking
      • 8.9.14.4. Recent developments
    • 8.9.15. Ultratech, Inc.
      • 8.9.15.1. Participant's overview
      • 8.9.15.2. Financial performance
      • 8.9.15.3. Product benchmarking
      • 8.9.15.4. Recent developments