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米国の半導体組立およびパッケージング機器の市場規模、シェア、動向分析レポート：製品別、最終用途別、セグメント予測、2025年～2033年

U.S. Semiconductor Assembly And Packaging Equipment Market Size, Share & Trends Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type (Flip Chip Packaging Equipment), By End-use (IDMs), And Segment Forecasts, 2025 - 2033

出版日
ページ情報
英文 100 Pages
納期
2～10営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=148.66円
米国の半導体組立およびパッケージング機器の市場規模、シェア、動向分析レポート：製品別、最終用途別、セグメント予測、2025年～2033年
出版日: 2025年07月21日
発行: Grand View Research
ページ情報: 英文 100 Pages
納期: 2～10営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 図表
  • 目次
概要

米国の半導体組立およびパッケージング機器市場のサマリー

米国の半導体組立およびパッケージング機器市場規模は、2024年に4億4,070万米ドルと推計され、2033年には7億7,250万米ドルに達すると予測され、2025年から2033年までのCAGRは6.6%で成長します。2.5D/3D IC、ファンアウト・ウエハーレベル・パッケージング（FOWLP）、システムインパッケージ（SiP）などの先進パッケージング・ソリューションの採用拡大が、米国の市場需要を大きく牽引しています。

これらの技術は、人工知能（AI）、IoT、5Gアプリケーションに不可欠な性能の向上、フォームファクターの縮小、電力効率の改善を実現します。CHIPS and Science Actのようなイニシアチブを通じた連邦政府の強力なバックアップが、国内の半導体製造およびパッケージング・インフラを活性化しています。この支援は海外プロバイダーへの依存を減らし、サプライチェーンの弾力性を高める。地政学的緊張の高まりと世界の供給途絶の中で、現地生産の推進は特に重要です。

目次

第1章 調査手法と範囲

第2章 エグゼクティブサマリー

第3章 米国の半導体組立およびパッケージング機器市場の変数、動向、範囲

  • 市場集中と成長見通しのマッピング
  • 業界バリューチェーン分析
    • 原材料・部品の見通し
    • メーカーの見通し
    • 流通見通し
    • エンドユーザーの見通し
  • 規制の枠組み
  • テクノロジーの概要
  • 市場力学
    • 市場促進要因分析
    • 市場抑制要因分析
    • 市場課題分析
    • 市場機会分析
  • 経済メガ動向分析
  • 業界分析ツール
    • ポーターのファイブフォース分析
    • マクロ環境分析

第4章 米国の半導体組立およびパッケージング機器市場：最終用途別推定・動向分析

  • 最終用途別変動分析と市場シェア、2024年と2033年
  • 最終用途別、2021年から2033年
  • IDM（統合デバイスメーカー）
  • OSAT（アウトソーシング半導体組立・テスト）

第5章 米国の半導体組立およびパッケージング機器市場：パッケージングタイプ別推定・動向分析

  • パッケージングタイプ別変動分析と市場シェア、2024年と2033年
  • パッケージングタイプ別、2021～2033年
  • フリップチップパッケージング装置
  • ウエハーレベルパッケージング（WLP）装置
  • ファンアウト包装装置
  • システムインパッケージ（SiP）機器
  • 3D/2.5Dパッケージング装置
  • その他

第6章 米国の半導体組立およびパッケージング機器市場：製品別推定・動向分析

  • 製品別変動分析と市場シェア、2024年と2033年
  • 製品別、2021年から2033年
  • ダイシング装置
    • スクライバー
    • ダイサー
    • ウエハーマウント装置
  • ボンディング装置
    • ダイボンダー
    • ワイヤーボンダー
    • その他
  • 包装機器
    • 成形装置
    • はんだめっき装置
    • デフラッシャー
    • その他
  • その他

第7章 米国の半導体組立およびパッケージング機器市場：競合情勢

  • 主要市場参入企業による最近の動向と影響分析
  • 企業分類
  • 企業ダッシュボード分析
  • ベンダー情勢
  • 企業市場シェア分析、2024年
  • 2024年の企業ポジショニング分析
  • 企業ヒートマップ分析、2024年
  • 戦略マッピング
  • 企業プロファイル
  • Applied Materials
  • ASM Pacific Technology
  • Besi
  • Disco Corporation
  • Kulicke & Soffa Industries, Inc. (K&S)
  • Lam Research Corporation
  • Nikon Corporation
  • Plasma-Therm
  • Rudolph Technologies, Inc.
  • SCREEN Semiconductor Solutions Co., Ltd.
図表

List of Tables

  • Table 1 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 2 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 3 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 4 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 5 Company Heat Map Analysis, 2024
  • Table 6 Strategy Mapping

List of Figures

  • Fig. 1 Market research process
  • Fig. 2 Data triangulation techniques
  • Fig. 3 Primary research pattern
  • Fig. 4 Market research approaches
  • Fig. 5 QFD modeling for market share assessment
  • Fig. 6 Information Procurement
  • Fig. 7 Market Formulation and Validation
  • Fig. 8 Data Validating & Publishing
  • Fig. 9 Market Segmentation & Scope
  • Fig. 10 U.S. Semiconductor Assembly and Packaging Equipment Market Snapshot
  • Fig. 11 Segment Snapshot
  • Fig. 12 Competitive Landscape Snapshot
  • Fig. 13 Parent market outlook
  • Fig. 14 U.S. Semiconductor Assembly and Packaging Equipment Market Value, 2024 (USD Million)
  • Fig. 15 U.S. Semiconductor Assembly and Packaging Equipment Market - Value Chain Analysis
  • Fig. 16 U.S. Semiconductor Assembly and Packaging Equipment Market - Market Dynamics
  • Fig. 17 U.S. Semiconductor Assembly and Packaging Equipment Market - PORTER's Analysis
  • Fig. 18 U.S. Semiconductor Assembly and Packaging Equipment Market - PESTEL Analysis
  • Fig. 19 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By Packaging Type: Key Takeaways
  • Fig. 20 U.S. Semiconductor Assembly and Packaging Equipment Market Share, By Packaging Type, 2024 & 2033
  • Fig. 21 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Flip Chip Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 22 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wafer Level Packaging (WLP) Equipment, 2021 - 2033 (USD Million)
  • Fig. 23 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Fan-Out Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 24 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By System-in-Package (SiP) Equipment, 2021 - 2033 (USD Million)
  • Fig. 25 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By 3D/2.5D Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 26 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others 2021 - 2033 (USD Million)
  • Fig. 27 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By Product: Key Takeaways
  • Fig. 28 U.S. Semiconductor Assembly and Packaging Equipment Market Share, By Product, 2024 & 2033
  • Fig. 29 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Dicing Equipment, 2021 - 2033 (USD Million)
  • Fig. 30 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Scriber, 2021 - 2033 (USD Million)
  • Fig. 31 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Dicer, 2021 - 2033 (USD Million)
  • Fig. 32 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wafer Mounting Equipment, 2021 - 2033 (USD Million)
  • Fig. 33 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Bonding Equipment, 2021 - 2033 (USD Million)
  • Fig. 34 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Die Bonder, 2021 - 2033 (USD Million)
  • Fig. 35 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wire Bonder, 2021 - 2033 (USD Million)
  • Fig. 36 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 37 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 38 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Molding Equipment, 2021 - 2033 (USD Million)
  • Fig. 39 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Solder Plating Equipment, 2021 - 2033 (USD Million)
  • Fig. 40 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Deflasher, 2021 - 2033 (USD Million)
  • Fig. 41 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 42 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 43 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By End Use: Key Takeaways
  • Fig. 44 U.S. Semiconductor Assembly and Packaging Equipment Market Share, By End Use, 2024 & 2033
  • Fig. 45 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, In IDMs (Integrated Device Manufacturers) 2021 - 2033 (USD Million)
  • Fig. 46 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, In OSAT (Outsourced Semiconductor Assembly and Test) 2021 - 2033 (USD Million)
  • Fig. 47 Key Company Categorization
  • Fig. 48 Company Market Positioning
  • Fig. 49 Key Company Market Share Analysis, 2024
  • Fig. 50 Strategy Mapping
目次
Product Code: GVR-4-68040-676-4

U.S. Semiconductor Assembly And Packaging Equipment Market Summary

The U.S. semiconductor assembly and packaging equipment market size was estimated at USD 440.7 million in 2024 and is projected to reach USD 772.5 million by 2033, growing at a CAGR of 6.6% from 2025 to 2033. The growing adoption of advanced packaging solutions such as 2.5D/3D ICs, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) is significantly driving market demand in the U.S.

These technologies enhance performance, reduce form factor, and improve power efficiency vital for artificial intelligence (AI), IoT, and 5G applications. Strong federal backing through initiatives like the CHIPS and Science Act is catalyzing domestic semiconductor manufacturing and packaging infrastructure. Substantial funding incentives are encouraging companies to establish or expand advanced packaging facilities in the U.S. This support reduces reliance on overseas providers and enhances supply chain resilience. The push toward localized production is especially critical amid rising geopolitical tensions and global supply disruptions.

U.S. Semiconductor Assembly And Packaging Equipment Market Report Segmentation

This report forecasts revenue growth at the U.S. level and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the U.S. semiconductor assembly and packaging equipment market report based on packaging type,end use, and product:

  • Packaging Type Outlook (Revenue, USD Million, 2021 - 2033)
  • Flip Chip Packaging Equipment
  • Wafer Level Packaging (WLP) Equipment
  • Fan-Out Packaging Equipment
  • System-in-Package (SiP) Equipment
  • 3D/2.5D Packaging Equipment
  • Others
  • End Use Outlook (Revenue, USD Million, 2021 - 2033)
  • IDMs (Integrated Device Manufacturers)
  • OSAT (Outsourced Semiconductor Assembly and Test)
  • Product Outlook (Revenue, USD Million, 2021 - 2033)
  • Dicing Equipment
    • Scriber
    • Dicer
    • Wafer Mounting Equipment
  • Bonding Equipment
    • Die Bonder
    • Wire Bonder
    • Others
  • Packaging Equipment
    • Molding Equipment
    • Solder Plating Equipment
    • Deflasher
    • Others
  • Others

Table of Contents

Chapter 1. Methodology and Scope

  • 1.1. Market Segmentation & Scope
  • 1.2. Market Definition
  • 1.3. Information Procurement
    • 1.3.1. Purchased Database
    • 1.3.2. GVR's Internal Database
    • 1.3.3. Secondary Sources & Third-Party Perspectives
    • 1.3.4. Primary Research
  • 1.4. Information Analysis
    • 1.4.1. Data Analysis Models
  • 1.5. Market Formulation & Data Visualization
  • 1.6. Data Validation & Publishing

Chapter 2. Executive Summary

  • 2.1. Market Snapshot
  • 2.2. Segment Snapshot
  • 2.3. Competitive Landscape Snapshot

Chapter 3. U.S. Semiconductor Assembly and Packaging Equipment Market Variables, Trends & Scope

  • 3.1. Market Concentration & Growth Prospect Mapping
  • 3.2. Industry Value Chain Analysis
    • 3.2.1. Raw Material/Component Outlook
    • 3.2.2. Manufacturer Outlook
    • 3.2.3. Distribution Outlook
    • 3.2.4. End User Outlook
  • 3.3. Regulatory Framework
  • 3.4. Technology Overview
  • 3.5. Market Dynamics
    • 3.5.1. Market Driver Analysis
    • 3.5.2. Market Restraint Analysis
    • 3.5.3. Market Challenges Analysis
    • 3.5.4. Market Opportunity Analysis
  • 3.6. Economic Mega-Trend Analysis
  • 3.7. Industry Analysis Tools
    • 3.7.1. Porter's Five Forces Analysis
    • 3.7.2. Macro-environmental Analysis

Chapter 4. U.S. Semiconductor Assembly and Packaging Equipment Market: End Use Estimates & Trend Analysis

  • 4.1. End Use Movement Analysis & Market Share, 2024 & 2033
  • 4.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By End Use, 2021 to 2033 (USD Million)
  • 4.3. IDMs (Integrated Device Manufacturers)
    • 4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.4. OSAT (Outsourced Semiconductor Assembly and Test)
    • 4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 5. U.S. Semiconductor Assembly and Packaging Equipment Market: Packaging Type Estimates & Trend Analysis

  • 5.1. Packaging Type Movement Analysis & Market Share, 2024 & 2033
  • 5.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Distribution Channel, 2021 to 2033 (USD Million)
  • 5.3. Flip Chip Packaging Equipment
    • 5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.4. Wafer Level Packaging (WLP) Equipment
    • 5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.5. Fan-Out Packaging Equipment
    • 5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.6. System-in-Package (SiP) Equipment
    • 5.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.7. 3D/2.5D Packaging Equipment
    • 5.7.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.8. Others
    • 5.8.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 6. U.S. Semiconductor Assembly and Packaging Equipment Market: Product Estimates & Trend Analysis

  • 6.1. Product Movement Analysis & Market Share, 2024 & 2033
  • 6.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Product, 2021 to 2033 (USD Million)
  • 6.3. Dicing Equipment
    • 6.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.2. Scriber
      • 6.3.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.3. Dicer
      • 6.3.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.4. Wafer Mounting Equipment
      • 6.3.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4. Bonding Equipment
    • 6.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.2. Die Bonder
      • 6.4.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.3. Wire Bonder
      • 6.4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.4. Others
      • 6.4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5. Packaging Equipment
    • 6.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.2. Molding Equipment
      • 6.5.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.3. Solder Plating Equipment
      • 6.5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.4. Deflasher
      • 6.5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.5. Others
      • 6.5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.6. Others
    • 6.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 7. U.S. Semiconductor Assembly and Packaging Equipment Market: Competitive Landscape

  • 7.1. Recent Developments & Impact Analysis, By Key Market Participants
  • 7.2. Company Categorization
  • 7.3. Company Dashboard Analysis
  • 7.4. Vendor Landscape
    • 7.4.1. List of Key Raw Material/Component Providers
    • 7.4.2. List of Key Manufacturers
    • 7.4.3. List of Key Distributors
  • 7.5. Company Market Share Analysis, 2024
  • 7.6. Company Positioning Analysis, 2024
  • 7.7. Company Heat Map Analysis, 2024
  • 7.8. Strategy Mapping
  • 7.9. Company Profiles
    • 7.9.1. Applied Materials
      • 7.9.1.1. Participant's overview
      • 7.9.1.2. Financial performance
      • 7.9.1.3. Product benchmarking
      • 7.9.1.4. Recent developments
    • 7.9.2. ASM Pacific Technology
      • 7.9.2.1. Participant's overview
      • 7.9.2.2. Financial performance
      • 7.9.2.3. Product benchmarking
      • 7.9.2.4. Recent developments
    • 7.9.3. Besi
      • 7.9.3.1. Participant's overview
      • 7.9.3.2. Financial performance
      • 7.9.3.3. Product benchmarking
      • 7.9.3.4. Recent developments
    • 7.9.4. Disco Corporation
      • 7.9.4.1. Participant's overview
      • 7.9.4.2. Financial performance
      • 7.9.4.3. Product benchmarking
      • 7.9.4.4. Recent developments
    • 7.9.5. Kulicke & Soffa Industries, Inc. (K&S)
      • 7.9.5.1. Participant's overview
      • 7.9.5.2. Financial performance
      • 7.9.5.3. Product benchmarking
      • 7.9.5.4. Recent developments
    • 7.9.6. Lam Research Corporation
      • 7.9.6.1. Participant's overview
      • 7.9.6.2. Financial performance
      • 7.9.6.3. Product benchmarking
      • 7.9.6.4. Recent developments
    • 7.9.7. Nikon Corporation
      • 7.9.7.1. Participant's overview
      • 7.9.7.2. Financial performance
      • 7.9.7.3. Product benchmarking
      • 7.9.7.4. Recent developments
    • 7.9.8. Plasma-Therm
      • 7.9.8.1. Participant's overview
      • 7.9.8.2. Financial performance
      • 7.9.8.3. Product benchmarking
      • 7.9.8.4. Recent developments
    • 7.9.9. Rudolph Technologies, Inc.
      • 7.9.9.1. Participant's overview
      • 7.9.9.2. Financial performance
      • 7.9.9.3. Product benchmarking
      • 7.9.9.4. Recent developments
    • 7.9.10. SCREEN Semiconductor Solutions Co., Ltd.
      • 7.9.10.1. Participant's overview
      • 7.9.10.2. Financial performance
      • 7.9.10.3. Product benchmarking
      • 7.9.10.4. Recent developments