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半導体組立・パッケージング装置の世界市場、規模、シェア、動向、産業分析レポート：製品別、パッケージングタイプ別、最終用途別、地域別 - 市場予測、2025年～2034年

Semiconductor Assembly and Packaging Equipment Market Size, Share, Trends, Industry Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End Use, By Region - Market Forecast, 2025-2034

出版日
ページ情報
英文 129 Pages
納期
即日から翌営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=148.66円
半導体組立・パッケージング装置の世界市場、規模、シェア、動向、産業分析レポート：製品別、パッケージングタイプ別、最終用途別、地域別 - 市場予測、2025年～2034年
出版日: 2025年07月01日
発行: Polaris Market Research
ページ情報: 英文 129 Pages
納期: 即日から翌営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 図表
  • 目次
概要

Polaris Market Researchの最新調査によると、半導体組立・パッケージング装置市場規模は2034年までに84億8,000万米ドルに達する見込みです。この調査レポートは、現在の市場力学を詳細に洞察し、将来の市場成長に関する分析を提供しています。

半導体組立・パッケージング装置とは、半導体製造の最終段階で使用される精密機械のことで、個々のチップを接続、保護し、電子システムに統合するための準備を行います。この市場を牽引しているのは、チップの性能、電力効率、小型化を高めることを目的とした軟質パッケージング技術の急速な進化です。2.5D/3D統合やSiPなどの技術の採用は、最終用途がより小さなフォームファクターでより高機能を要求するにつれて加速しており、装置メーカーはこうした複雑なパッケージング要件を満たすために技術革新と能力拡張を進めています。

組立・パッケージングプロセスの自動化とデジタル化の進展は、半導体組立・パッケージング装置の需要をさらに押し上げます。半導体製造が複雑化し規模が拡大し続ける中、企業は正確なアライメント、リアルタイムのモニタリング、データ駆動型の最適化をサポートするインテリジェントな高スループット装置に投資しています。このシフトは、生産効率と歩留まりを向上させると同時に、業界のスマート製造環境への移行にも合致しています。その結果、競争力を維持し、急速に進化する新興技術の需要に対応することを目指す企業にとって、自動化は中核戦略となりつつあります。

半導体組立・パッケージング装置市場レポートハイライト

パッケージングタイプ別では、ボンディング装置が半導体デバイスの微細化と性能の先進パッケージングに大きな役割を果たすため、2024年に最大の収益シェアを占めました。

最終用途別では、ファブレス半導体企業の台頭や後工程のアウトソーシングへのシフトに後押しされ、OSATセグメントが最も急成長すると予測されます。

北米の半導体組立・パッケージング装置市場は、技術革新とハイテク製造能力への注力に支えられ、大幅な成長が見込まれています。

アジア太平洋地域は、堅牢な半導体エコシステムと次世代パッケージングインフラへの重点投資により、2024年の世界市場をリードします。

半導体組立・パッケージング装置市場における世界の主要企業には、Applied Materials、ASM Pacific Technology、Besi、Disco Corporation、Kulicke & Soffa Industries, Inc. (K&S)、Nikon Corporation、Plasma-Therm、Rudolph Technologies, Inc.、SCREEN Semiconductor Solutions Co., Ltd.、SUSS MicroTec SEなどが含まれます。

目次

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 調査手法

第4章 世界の半導体組立・パッケージング装置市場の洞察

  • 市場スナップショット
  • 半導体組立・パッケージング装置市場力学
    • 促進要因と機会
      • 先進性と自動化への投資の増加
      • AI、IoT、5G対応デバイスの導入増加
    • 抑制要因と課題
      • 高額な資本投資と技術的な複雑さ
    • 世論とプライバシーに関する判例
  • PESTEL分析
  • 半導体組立・パッケージング装置市場動向
  • バリューチェーン分析

第5章 世界の半導体組立・パッケージング装置市場：製品別

  • 主な調査結果
  • イントロダクション
  • ダイシング装置
  • ボンディング装置
  • パッケージング装置
  • その他

第6章 世界の半導体組立・パッケージング装置市場：パッケージングタイプ別

  • 主な調査結果
  • イントロダクション
  • フリップチップパッケージング装置
  • WLP装置
  • FOパッケージング装置
  • SiP装置
  • 3D/2.5Dパッケージング装置
  • その他

第7章 世界の半導体組立・パッケージング装置市場：最終用途別

  • 主な調査結果
  • イントロダクション
  • IDM
  • OSAT

第8章 世界の半導体組立・パッケージング装置市場：地域別

  • 主な調査結果
  • イントロダクション
    • 半導体組立・パッケージング装置市場分析：地域別、2020～2034年
  • 北米
    • 北米：製品別、2020～2034年
    • 北米：パッケージングタイプ別、2020～2034年
    • 北米：最終用途別、2020～2034年
    • 米国
    • カナダ
  • 欧州
    • 欧州：製品別、2020～2034年
    • 欧州：パッケージングタイプ別、2020～2034年
    • 欧州：最終用途別、2020～2034年
    • 英国
    • フランス
    • ドイツ
    • イタリア
    • スペイン
    • オランダ
    • ロシア
    • その他欧州
  • アジア太平洋地域
    • アジア太平洋地域：製品別、2020～2034年
    • アジア太平洋地域：パッケージングタイプ別、2020～2034年
    • アジア太平洋地域：最終用途別、2020～2034年
    • 中国
    • インド
    • マレーシア
    • 日本
    • インドネシア
    • 韓国
    • オーストラリア
    • その他アジア太平洋地域
  • 中東・アフリカ
    • 中東・アフリカ：製品別、2020～2034年
    • 中東・アフリカ：パッケージングタイプ別、2020～2034年
    • 中東・アフリカ：最終用途別、2020～2034年
    • サウジアラビア
    • アラブ首長国連邦
    • イスラエル
    • 南アフリカ
    • その他中東・アフリカ
  • ラテンアメリカ
    • ラテンアメリカ：製品別、2020～2034年
    • ラテンアメリカ：パッケージングタイプ別、2020～2034年
    • ラテンアメリカ：最終用途別、2020～2034年
    • メキシコ
    • ブラジル
    • アルゼンチン
    • その他ラテンアメリカ

第9章 競合情勢

  • 拡大と買収の分析
    • 拡大
    • 買収
  • 提携/協業/合意/公開

第10章 企業プロファイル

  • Applied Materials
  • ASM Pacific Technology
  • Besi
  • Disco Corporation
  • Kulicke & Soffa Industries, Inc.（K&S）
  • Nikon Corporation
  • Plasma-Therm
  • Rudolph Technologies, Inc.
  • SCREEN Semiconductor Solutions Co., Ltd.
  • SUSS MicroTec SE
図表

List of Tables:

  • Table 1 Global Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 2 Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 3 Global Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 4 North America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 5 North America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 6 North America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 7 US: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 8 US: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 9 US: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 10 Canada: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 11 Canada: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 12 Canada: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 13 Europe: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 14 Europe: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 15 Europe: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 16 UK: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 17 UK: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 18 UK: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 19 France: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 20 France: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 21 France: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 22 Germany: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 23 Germany: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 24 Germany: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 25 Italy: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 26 Italy: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 27 Italy: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 28 Spain: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 29 Spain: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 30 Spain: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 31 Netherlands: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 32 Netherlands: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 33 Netherlands: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 34 Russia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 35 Russia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 36 Russia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 37 Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 38 Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 39 Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 40 Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 41 Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 42 Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 43 China: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 44 China: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 45 China: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 46 India: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 47 India: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 48 India: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 49 Malaysia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 50 Malaysia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 51 Malaysia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 52 Japan: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 53 Japan: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 54 Japan: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 55 Indonesia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 56 Indonesia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 57 Indonesia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 58 South Korea: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 59 South Korea: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 60 South Korea: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 61 Australia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 62 Australia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 63 Australia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 64 Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 65 Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 66 Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 67 Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 68 Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 69 Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 70 Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 71 Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 72 Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 73 UAE: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 74 UAE: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 75 UAE: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 76 Israel: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 77 Israel: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 78 Israel: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 79 South Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 80 South Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 81 South Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 82 Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 83 Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 84 Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 85 Latin America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 86 Latin America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 87 Latin America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 88 Mexico: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 89 Mexico: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 90 Mexico: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 91 Brazil: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 92 Brazil: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 93 Brazil: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 94 Argentina: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 95 Argentina: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 96 Argentina: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 97 Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 98 Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 99 Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)

List of Figures:

  • Figure 1. Global Semiconductor Assembly and Packaging Equipment Market, 2020-2034 (USD Billion)
  • Figure 2. Integrated Ecosystem
  • Figure 3. Research Methodology: Top-Down & Bottom-Up Price
  • Figure 4. Market by Geography
  • Figure 5. Porter's Five Forces
  • Figure 6. Market By Product
  • Figure 7. Global Semiconductor Assembly and Packaging Equipment Market, By Product, 2024 & 2034 (USD Billion)
  • Figure 8. Market by Packaging Type
  • Figure 9. Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2024 & 2034 (USD Billion)
  • Figure 10. Market by End Use
  • Figure 11. Global Semiconductor Assembly and Packaging Equipment Market, by End Use, 2024 & 2034 (USD Billion)
目次
Product Code: PM6134

The semiconductor Assembly and Packaging Equipment market size is expected to reach USD 8.48 billion by 2034, according to a new study by Polaris Market Research. The report "Semiconductor Assembly and Packaging Equipment Market Share, Size, Trends, Industry Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End Use, By Region; Market Forecast, 2025-2034" gives a detailed insight into current market dynamics and provides analysis on future market growth.

Semiconductor assembly and packaging equipment refers to precision machinery used in the final stages of semiconductor manufacturing, where individual chips are connected, protected, and prepared for integration into electronic systems. This market is driven by the rapid evolution of flexible packaging techniques that aim to enhance chip performance, power efficiency, and miniaturization. The adoption of technologies such as 2.5D/3D integration and system-in-package is accelerating as end-use applications demand greater functionality in smaller form factors, driving equipment manufacturers to innovate and expand their capabilities to meet these complex packaging requirements.

The increasing automation and digitalization of assembly and packaging processes further drive demand for semiconductor assembly and packaging equipment. Companies are investing in intelligent, high-throughput equipment that supports precise alignment, real-time monitoring, and data-driven optimization as semiconductor manufacturing continues to grow in complexity and scale. This shift enhances production efficiency and yield while also aligning with the industry's transition toward smart manufacturing environments. As a result, automation is becoming a core strategy for players aiming to maintain competitiveness and meet the rapidly evolving demands of emerging technologies.

Semiconductor Assembly and Packaging Equipment Market Report Highlights

In terms of packaging type, the bonding equipment segment held the largest revenue share in 2024, as it plays a major role in advancing semiconductor device miniaturization and performance.

Based on end use, the OSAT segment is projected to grow the fastest, fueled by the rise of fabless semiconductor companies and the shift toward outsourcing back-end processes.

The North America semiconductor assembly and packaging equipment market is set for significant growth, supported by its focus on innovation and high-tech manufacturing capabilities.

Asia Pacific led the global market in 2024, owing to its robust semiconductor ecosystem and heavy investments in next-gen packaging infrastructure.

A few global key players in the semiconductor assembly and packaging equipment market include Applied Materials; ASM Pacific Technology; Besi; Disco Corporation; Kulicke & Soffa Industries, Inc. (K&S); Nikon Corporation; Plasma-Therm; Rudolph Technologies, Inc.; SCREEN Semiconductor Solutions Co., Ltd.; and SUSS MicroTec SE.

Polaris Market Research has segmented the semiconductor assembly and packaging equipment market report on the basis of product, packaging type, end use, and region:

By Product Outlook (Revenue, USD Billion, 2020-2034)

Dicing Equipment

Scriber

Dicer

Wafer Mounting Equipment

Bonding Equipment

Die Bonder

Wire Bonder

Others

Packaging Equipment

Molding Equipment

Solder Plating Equipment

Deflasher

Others

Others

By Packaging Type Outlook (Revenue, USD Billion, 2020-2034)

Flip Chip Packaging Equipment

Wafer Level Packaging (WLP) Equipment

Fan-Out Packaging Equipment

System-in-Package (SiP) Equipment

3D/2.5D Packaging Equipment

Others

By End Use Outlook (Revenue, USD Billion, 2020-2034)

IDMs (Integrated Device Manufacturers)

OSAT (Outsourced Semiconductor Assembly and Test)

By Regional Outlook (Revenue, USD Billion, 2020-2034)

North America

U.S.

Canada

Europe

Germany

UK

France

Italy

Spain

Russia

Netherlands

Rest of Europe

Asia Pacific

China

India

Japan

South Korea

Indonesia

Malaysia

Vietnam

Australia

Rest of Asia Pacific

Latin America

Argentina

Brazil

Mexico

Rest of Latin America

Middle East & Africa

UAE

Saudi Arabia

Israel

South Africa

Rest of Middle East & Africa

Table of Contents

1. Introduction

  • 1.1. Report Description
    • 1.1.1. Objectives of the Study
    • 1.1.2. Market Scope
    • 1.1.3. Assumptions
  • 1.2. Stakeholders

2. Executive Summary

  • 2.1. Market Highlights

3. Research Methodology

  • 3.1. Overview
    • 3.1.1. Data Mining
  • 3.2. Data Sources
    • 3.2.1. Primary Sources
    • 3.2.2. Secondary Sources

4. Global Semiconductor Assembly and Packaging Equipment Market Insights

  • 4.1. Semiconductor Assembly and Packaging Equipment Market - Market Snapshot
  • 4.2. Semiconductor Assembly and Packaging Equipment Market Dynamics
    • 4.2.1. Drivers and Opportunities
      • 4.2.1.1. Increasing Investment in Advancement and Automation
      • 4.2.1.2. Rising Adoption of AI, IoT, and 5G-Enabled Devices
    • 4.2.2. Restraints and Challenges
      • 4.2.2.1. High Capital Investment and Technological Complexity
    • 4.2.3. Public opinion and privacy legal precedents
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers (Moderate)
    • 4.3.2. Threats of New Entrants: (Low)
    • 4.3.3. Bargaining Power of Buyers (Moderate)
    • 4.3.4. Threat of Substitute (Moderate)
    • 4.3.5. Rivalry among existing firms (High)
  • 4.4. PESTEL Analysis
  • 4.5. Semiconductor Assembly and Packaging Equipment Market Trends
  • 4.6. Value Chain Analysis

5. Global Semiconductor Assembly and Packaging Equipment Market, By Product

  • 5.1. Key Findings
  • 5.2. Introduction
    • 5.2.1. Global Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • 5.3. Dicing Equipment
    • 5.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Dicing Equipment, by Region, 2020-2034 (USD Billion)
    • 5.3.2. Scriber
      • 5.3.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Scriber, by Region, 2020-2034 (USD Billion)
    • 5.3.3. Dicer
      • 5.3.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Dicer, by Region, 2020-2034 (USD Billion)
    • 5.3.4. Wafer Mounting Equipment
      • 5.3.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Wafer Mounting Equipment, by Region, 2020-2034 (USD Billion)
  • 5.4. Bonding Equipment
    • 5.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Bonding Equipment, by Region, 2020-2034 (USD Billion)
    • 5.4.2. Die Bonder
      • 5.4.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Die Bonder, by Region, 2020-2034 (USD Billion)
    • 5.4.3. Wire Bonder
      • 5.4.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Wire Bonder, by Region, 2020-2034 (USD Billion)
    • 5.4.4. Others
      • 5.4.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)
  • 5.5. Packaging Equipment
    • 5.5.1. Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Equipment, by Region, 2020-2034 (USD Billion)
    • 5.5.2. Molding Equipment
      • 5.5.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Molding Equipment, by Region, 2020-2034 (USD Billion)
    • 5.5.3. Solder Plating Equipment
      • 5.5.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Solder Plating Equipment, by Region, 2020-2034 (USD Billion)
    • 5.5.4. Deflasher
      • 5.5.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Deflasher, by Region, 2020-2034 (USD Billion)
    • 5.5.5. Others
      • 5.5.5.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)
  • 5.6. Others
    • 5.6.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)

6. Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Type

  • 6.1. Key Findings
  • 6.2. Introduction
    • 6.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • 6.3. Flip Chip Packaging Equipment
    • 6.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Flip Chip Packaging Equipment, by Region, 2020-2034 (USD Billion)
  • 6.4. Wafer Level Packaging (WLP) Equipment
    • 6.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Wafer Level Packaging (WLP) Equipment, by Region, 2020-2034 (USD Billion)
  • 6.5. Fan-Out Packaging Equipment
    • 6.5.1. Global Semiconductor Assembly and Packaging Equipment Market, by Fan-Out Packaging Equipment, by Region, 2020-2034 (USD Billion)
  • 6.6. System-in-Package (SiP) Equipment
    • 6.6.1. Global Semiconductor Assembly and Packaging Equipment Market, by System-in-Package (SiP) Equipment, by Region, 2020-2034 (USD Billion)
  • 6.7. 3D/2.5D Packaging Equipment
    • 6.7.1. Global Semiconductor Assembly and Packaging Equipment Market, by 3D/2.5D Packaging Equipment, by Region, 2020-2034 (USD Billion)
  • 6.8. Others
    • 6.8.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)

7. Global Semiconductor Assembly and Packaging Equipment Market, by End Use

  • 7.1. Key Findings
  • 7.2. Introduction
    • 7.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 7.3. IDMs (Integrated Device Manufacturers)
    • 7.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by IDMs (Integrated Device Manufacturers), by Region, 2020-2034 (USD Billion)
  • 7.4. OSAT (Outsourced Semiconductor Assembly and Test)
    • 7.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by OSAT (Outsourced Semiconductor Assembly and Test), by Region, 2020-2034 (USD Billion)

8. Global Semiconductor Assembly and Packaging Equipment Market, by Geography

  • 8.1. Key Findings
  • 8.2. Introduction
    • 8.2.1. Semiconductor Assembly and Packaging Equipment Market Assessment, By Geography, 2020-2034 (USD Billion)
  • 8.3. Semiconductor Assembly and Packaging Equipment Market - North America
    • 8.3.1. North America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.3.2. North America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.3.3. North America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.3.4. Semiconductor Assembly and Packaging Equipment Market - US
      • 8.3.4.1. US: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.3.4.2. US: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.3.4.3. US: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.3.5. Semiconductor Assembly and Packaging Equipment Market - Canada
      • 8.3.5.1. Canada: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.3.5.2. Canada: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.3.5.3. Canada: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.4. Semiconductor Assembly and Packaging Equipment Market - Europe
    • 8.4.1. Europe: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.4.2. Europe: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.4.3. Europe: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.4. Semiconductor Assembly and Packaging Equipment Market - UK
      • 8.4.4.1. UK: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.4.2. UK: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.4.3. UK: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.5. Semiconductor Assembly and Packaging Equipment Market - France
      • 8.4.5.1. France: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.5.2. France: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.5.3. France: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.6. Semiconductor Assembly and Packaging Equipment Market - Germany
      • 8.4.6.1. Germany: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.6.2. Germany: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.6.3. Germany: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.7. Semiconductor Assembly and Packaging Equipment Market - Italy
      • 8.4.7.1. Italy: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.7.2. Italy: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.7.3. Italy: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.8. Semiconductor Assembly and Packaging Equipment Market - Spain
      • 8.4.8.1. Spain: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.8.2. Spain: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.8.3. Spain: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.9. Semiconductor Assembly and Packaging Equipment Market - Netherlands
      • 8.4.9.1. Netherlands: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.9.2. Netherlands: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.9.3. Netherlands: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.10. Semiconductor Assembly and Packaging Equipment Market - Russia
      • 8.4.10.1. Russia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.10.2. Russia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.10.3. Russia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.11. Semiconductor Assembly and Packaging Equipment Market - Rest of Europe
      • 8.4.11.1. Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.11.2. Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.11.3. Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.5. Semiconductor Assembly and Packaging Equipment Market - Asia Pacific
    • 8.5.1. Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.5.2. Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.5.3. Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.4. Semiconductor Assembly and Packaging Equipment Market - China
      • 8.5.4.1. China: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.4.2. China: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.4.3. China: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.5. Semiconductor Assembly and Packaging Equipment Market - India
      • 8.5.5.1. India: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.5.2. India: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.5.3. India: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.6. Semiconductor Assembly and Packaging Equipment Market - Malaysia
      • 8.5.6.1. Malaysia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.6.2. Malaysia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.6.3. Malaysia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.7. Semiconductor Assembly and Packaging Equipment Market - Japan
      • 8.5.7.1. Japan: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.7.2. Japan: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.7.3. Japan: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.8. Semiconductor Assembly and Packaging Equipment Market - Indonesia
      • 8.5.8.1. Indonesia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.8.2. Indonesia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.8.3. Indonesia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.9. Semiconductor Assembly and Packaging Equipment Market - South Korea
      • 8.5.9.1. South Korea: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.9.2. South Korea: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.9.3. South Korea: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.10. Semiconductor Assembly and Packaging Equipment Market - Australia
      • 8.5.10.1. Australia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.10.2. Australia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.10.3. Australia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.11. Semiconductor Assembly and Packaging Equipment Market - Rest of Asia Pacific
      • 8.5.11.1. Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.11.2. Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.11.3. Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.6. Semiconductor Assembly and Packaging Equipment Market - Middle East & Africa
    • 8.6.1. Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.6.2. Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.6.3. Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.6.4. Semiconductor Assembly and Packaging Equipment Market - Saudi Arabia
      • 8.6.4.1. Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.6.4.2. Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.6.4.3. Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.6.5. Semiconductor Assembly and Packaging Equipment Market - UAE
      • 8.6.5.1. UAE: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.6.5.2. UAE: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.6.5.3. UAE: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.6.6. Semiconductor Assembly and Packaging Equipment Market - Israel
      • 8.6.6.1. Israel: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.6.6.2. Israel: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.6.6.3. Israel: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.6.7. Semiconductor Assembly and Packaging Equipment Market - South Africa
      • 8.6.7.1. South Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.6.7.2. South Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.6.7.3. South Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.6.8. Semiconductor Assembly and Packaging Equipment Market - Rest of Middle East & Africa
      • 8.6.8.1. Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.6.8.2. Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.6.8.3. Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.7. Semiconductor Assembly and Packaging Equipment Market - Latin America
    • 8.7.1. Latin America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.7.2. Latin America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.7.3. Latin America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.7.4. Semiconductor Assembly and Packaging Equipment Market - Mexico
      • 8.7.4.1. Mexico: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.7.4.2. Mexico: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.7.4.3. Mexico: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.7.5. Semiconductor Assembly and Packaging Equipment Market - Brazil
      • 8.7.5.1. Brazil: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.7.5.2. Brazil: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.7.5.3. Brazil: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.7.6. Semiconductor Assembly and Packaging Equipment Market - Argentina
      • 8.7.6.1. Argentina: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.7.6.2. Argentina: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.7.6.3. Argentina: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.7.7. Semiconductor Assembly and Packaging Equipment Market - Rest of Latin America
      • 8.7.7.1. Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.7.7.2. Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.7.7.3. Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)

9. Competitive Landscape

  • 9.1. Expansion and Acquisition Analysis
    • 9.1.1. Expansion
    • 9.1.2. Acquisitions
  • 9.2. Partnerships/Collaborations/Agreements/Exhibitions

10. Company Profiles

  • 10.1. Applied Materials
    • 10.1.1. Company Overview
    • 10.1.2. Financial Performance
    • 10.1.3. Product Benchmarking
    • 10.1.4. Recent Development
  • 10.2. ASM Pacific Technology
    • 10.2.1. Company Overview
    • 10.2.2. Financial Performance
    • 10.2.3. Product Benchmarking
    • 10.2.4. Recent Development
  • 10.3. Besi
    • 10.3.1. Company Overview
    • 10.3.2. Financial Performance
    • 10.3.3. Product Benchmarking
    • 10.3.4. Recent Development
  • 10.4. Disco Corporation
    • 10.4.1. Company Overview
    • 10.4.2. Financial Performance
    • 10.4.3. Product Benchmarking
    • 10.4.4. Recent Development
  • 10.5. Kulicke & Soffa Industries, Inc. (K&S)
    • 10.5.1. Company Overview
    • 10.5.2. Financial Performance
    • 10.5.3. Product Benchmarking
    • 10.5.4. Recent Development
  • 10.6. Nikon Corporation
    • 10.6.1. Company Overview
    • 10.6.2. Financial Performance
    • 10.6.3. Product Benchmarking
    • 10.6.4. Recent Development
  • 10.7. Plasma-Therm
    • 10.7.1. Company Overview
    • 10.7.2. Financial Performance
    • 10.7.3. Product Benchmarking
    • 10.7.4. Recent Development
  • 10.8. Rudolph Technologies, Inc.
    • 10.8.1. Company Overview
    • 10.8.2. Financial Performance
    • 10.8.3. Product Benchmarking
    • 10.8.4. Recent Development
  • 10.9. SCREEN Semiconductor Solutions Co., Ltd.
    • 10.9.1. Company Overview
    • 10.9.2. Financial Performance
    • 10.9.3. Product Benchmarking
    • 10.9.4. Recent Development
  • 10.10. SUSS MicroTec SE
    • 10.10.1. Company Overview
    • 10.10.2. Financial Performance
    • 10.10.3. Product Benchmarking
    • 10.10.4. Recent Development