ファンアウトパッケージ市場レポート：動向、予測、競合分析 (2031年まで)

世界のファンアウトパッケージ市場の将来は、OSAT、ファウンダリ、IDM市場に機会があり、有望です。世界のファンアウトパッケージ市場は、2025年から2031年までのCAGRが15.7%で、2031年までに推定79億米ドルに達すると予想されています。この市場の主な促進要因は、高性能でエネルギー効率に優れ、薄型でフォームファクタの小さいパッケージへの要求から、スマートフォンのような実装面積が重視されるデバイスでの用途が拡大していることです。

• Lucintel社は、種類別では高密度ファンアウトが予測期間中も最大セグメントであり続けると予測しています。高密度ファンアウトは、ウエハーレベルプロセッシングの製造能力を通じて小型化の要件を満たすのに役立つほか、トール銅（Cu）ピラー、スルーパッケージビア（TPV）、先進フリップチップパッケージング技術などのスルーモールド相互接続を利用した3D構造を開発できるためです。
• ビジネスモデルのカテゴリーでは、ファウンダリが最大のセグメントであり続けると思われます。
• 地域別では、主要半導体メーカーが存在するAPACが予測期間中に最も高い成長が見込まれます。

ファンアウトパッケージ市場の戦略的成長機会

ファンアウトパッケージ市場には、数多くのアプリケーションの中で戦略的に成長する機会がいくつか存在します。これらの機会は、市場の成長と業界内の技術進歩に役立つため、特定し、利用する価値があります。

• コンシューマーエレクトロニクス：より小型で高性能な民生用電子機器に対する需要の高まりは、ファンアウトパッケージに大きな機会をもたらしています。さらに、近い将来のパッケージング技術は、デバイスの性能と小型化を強化し、スマートフォン、タブレット、ウェアラブル技術の成長を促進することができます。
• 自動車産業：自動車分野では、車載電子機器の強化により、ファンアウトパッケージが高い成長率を示す見込みです。ファンアウトパッケージは、安全システムやインフォテインメントシステムなど、車載アプリケーションの信頼性と性能の要求を満たすことができます。
• 産業オートメーション：産業オートメーションの成長により、より効率的で堅牢なファンアウトパッケージ技術に対する需要が高まっています。先進オートメーションやロボットアプリケーションでは、パッケージは高密度で信頼性の高い先進センサー、制御、通信システムをサポートする必要があります。
• 通信：5G通信ネットワークの出現により、通信セクターは急成長しています。ファンアウトパッケージを使用して5Gシステムアプリケーションの高周波と高性能に対応できるパッケージング構成は、さらなるイノベーションと市場成長の道を提供します。
• 医療機器：医療機器の複雑化と小型化が同時に進む中、洗練されたファンアウトパッケージソリューションへの要求が高まっています。このようなパッケージングの変化は、診断や治療に使用される小型で信頼性が高く効率的な医療製品の構築に役立ちます。

消費者向けガジェット、自動車、産業、通信機器、さらには医療機器をターゲットとするファンアウトパッケージソリューションによって、戦略的成長の新たな分野が出現しつつあります。これらの機会に関連するリスクは、活用されれば、市場の成長を促進し、技術を向上させ、それによって近代的でハイテクな電子システムの進歩を促進することができます。

ファンアウトパッケージ市場促進要因・課題

ファンアウトパッケージ市場は、技術進歩や市場成長に影響を与える促進要因・課題として知られるいくつかの要素に影響されます。その中には、技術進歩への傾斜、経済的要因、法的側面などが含まれます。

ファンアウトパッケージ市場の促進要因は以下の通り：

• 技術の進歩：技術進歩：ファンアウトパッケージ市場の成長は、ファンアウトパッケージの背後にある技術の絶え間ない進化によって推進され、より高いレベルの統合と新素材が組み込まれています。こうした進化により、最新の電子機器が必要とする性能を実現しながら、システムの小型化が容易になります。
• 高性能エレクトロニクスに対する需要の増加：ファンアウトパッケージの使用が増加しているのは、消費者向け製品、車載用電子機器、電気通信製品の性能要件が高まっているためです。通信におけるハイパワーで信頼性の高いパッケージングソリューションは、高密度アプリケーションの性能目標を満たします。
• 5G技術の拡大：5G技術の展開により、ファンアウトパッケージソリューションに対する需要が高まっています。先進パッケージングは、5Gインフラやネットワーク機器の高周波数および速度要件に対応するために必要です。
• コスト削減戦略：パネルレベルパッケージングや製造プロセスの改善などのイノベーションを通じて製造コストを削減する取り組みは、市場開拓に有益です。ベンダー内の効果的な戦略により、より多くのツールや機器のファンアウトが可能になります。
• 自動車および産業用アプリケーションの成長：自動車および産業用アプリケーションにおけるエレクトロニクスの普及が進んでいることが、ファンアウトパッケージの成長を支えています。また、これらの分野で効果的かつ効率的なパッケージングソリューションに対するニーズが高まっていることも、市場成長を後押ししています。

ファンアウトパッケージ市場の課題は以下の通り：

• 高い製造コスト：高度なファンアウトパッケージ技術に関連する高コストは、特に製造業者やエンドユーザーにとって負担となる可能性があります。ファンアウトパッケージは優れたパッケージ形態ですが、製造コストが高いため、採用が阻害される可能性が高いです。
• 複雑な製造工程：ファンアウトパッケージには複雑な製造工程が必要であり、これが過剰なリードタイムと品質問題につながる可能性があります。洗練された手順は高度な技術と専門知識を必要とし、効率と効果の両方に影響を及ぼします。
• 材料とサプライチェーンの制約：設計段階で直面する制約のひとつは、ファンアウトパッケージシステムに使用される先進材料の入手可能性とコストです。サプライチェーンにおける不足、あるいは必要な材料の不足は、生産に支障をきたし、コストを上昇させる可能性があります。

ファンアウトパッケージ市場の進化にはいくつかの力と要因が影響しています。技術の急速な進歩と、より高機能な電子機器に対する需要の増加が成長の原動力となる一方で、高い製造コスト、製造上の困難、規制遵守が大きな障害となります。これらの要因を踏まえてこの技術を改善し、新たな市場を模索することが不可欠となります。

目次

第1章 エグゼクティブサマリー

第2章 世界のファンアウトパッケージ市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 市場動向と予測分析 (2019年～2031年)

• マクロ経済動向 (2019～2024年) と予測 (2025～2031年)
• 世界のファンアウトパッケージ市場の動向 (2019～2024年) と予測 (2025～2031年)
• 世界のファンアウトパッケージ市場：種類別
  • コアファンアウト
  • 高密度ファンアウト
  • 超高密度ファンアウト
• 世界のファンアウトパッケージ市場：キャリアの種類別
  • 200ミリメートル
  • 300ミリメートル
  • パネル
• 世界のファンアウトパッケージ市場：ビジネスモデル別
  • OSAT
  • ファウンダリ
  • IDM

第4章 地域別の市場動向と予測分析 (2019年～2031年)

• 世界のファンアウトパッケージ市場：地域別
• 北米のファンアウトパッケージ市場
• 欧州のファンアウトパッケージ市場
• アジア太平洋のファンアウトパッケージ市場
• その他地域のファンアウトパッケージ市場

第5章 競合分析

• 製品ポートフォリオ分析
• 運用統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略分析

• 成長機会分析
  • 世界のファンアウトパッケージ市場の成長機会：種類別
  • 世界のファンアウトパッケージ市場の成長機会：キャリアの種類別
  • 世界のファンアウトパッケージ市場の成長機会：ビジネスモデル別
  • 世界のファンアウトパッケージ市場の成長機会：地域別
• 世界のファンアウトパッケージ市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界のファンアウトパッケージ市場の生産能力拡大
  • 世界のファンアウトパッケージ市場における企業合併・買収 (M&A)、合弁事業
  • 認証とライセンシング

第7章 主要企業のプロファイル

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

The future of the global fan out packaging market looks promising with opportunities in the OSAT, foundary, and IDM markets. The global fan out packaging market is expected to reach an estimated $7.9 billion by 2031 with a CAGR of 15.7% from 2025 to 2031. The major drivers for this market are the growing applications in footprint-sensitive devices like smartphones, owing to the requirement for high-performing, energy-efficient, thin, and small form-factor packages.

• Lucintel forecast that, within the type category, high-density fan out will remain the largest segment over the forecast period, as it helps meet the requirements of miniaturization through the fabrication capabilities of wafer-level processing, along with its ability to develop 3D structures utilizing through-mold interconnects, such as tall copper (Cu) pillars, through-package vias (TPVs), and advanced flip-chip packaging technologies.
• Within the business model category, foundary will remain the largest segment.
• In terms of regions, APAC is expected to witness the highest growth over the forecast period due to the presence of major semiconductor manufacturers in the region.

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Emerging Trends in the Fan Out Packaging Market

These fan-out packaging technology trends are several that have recently appeared on the scene and are changing how the industry operates. These trends revolve around performance enhancement, cost minimization, and promoting integration across the board.

• Increased Integration Density: In fan-out packaging, the higher the integration in functional systems, the more different features can be packed into less space. This trend helps to miniaturize electronic devices and improves their performance by minimizing the size and weight of the packages.
• Advanced Materials: While high dielectrics consist of resin, advanced materials including low K dielectrics and high-Tg resins enhance the thermal and electrical performance of fan-out packages. Thus, these materials help tackle the problems of higher power densities and fast processing speeds.
• Cost Reduction Techniques: Design innovations aimed at cutting production costs are coming to the forefront. The industry affirms that panel-level packaging and optimization of process flows have assisted in decreasing manufacturing costs while maintaining high quality, thus making fan-out packaging increasingly affordable.
• Thermal Management Solutions: The adaptation of new thermal management strategies is necessary for overcoming issues of heat dissipation in high-performance applications. Advanced cooling solutions incorporated into fan-out packages help ensure the reliability and operational lifetime of electronic devices.
• Expansion into New Markets: Fan-out packaging is penetrating other markets, such as automotive and industrial applications. This trend is supported by the increasing demand for efficient and dependable packaging solutions in markets with high-performance electronics systems for safety and functionality.

These new fan-out packaging methods primarily address core concerns that are likely to change industry dynamics positively, specifically performance enhancement, cost reductions, and application expansion. The development of new and efficient materials, integration, and process technology have induced fresh ideas and opened new markets.

Recent Developments in the Fan Out Packaging Market

The key features of fan-out packaging developments include considerable advancements in technology and production processes. These advances improve the performance, reliability, and affordability of packaging products in diverse industries.

• Advanced Manufacturing Techniques: New manufacturing techniques, such as fan-out wafer-level packaging (FO-WLP), are improving efficiency and yield. This method allows for much higher integration density and better performance, satisfying the requirements of modern electronic devices.
• Advanced Materials Incorporation: The introduction of advanced materials such as high-dielectric constant materials and electrically conductive epoxies enhances the thermal and electrical functionalities of fan-out packaging types. These materials improve the efficiency and effectiveness of the devices.
• Panel-Level Packaging Innovations: Emerging trends in panel-level fan-out packaging are enabling wider applications at a lower cost. This method is ideal for manufacturing large quantities and provides viable options for computers and other applications where demand is high.
• Improved Thermal Management Solutions: New designs and strategies for heat management have been incorporated into fan-out packaging, such as the use of better thermal spreaders and thermal vias. These features allow for efficient heat disposal, maintaining the operation of high drawers in the devices.
• Expansion into Automotive Applications: Fan-out packaging is finding more applications in the automotive industry due to the benefits it offers in high-density packaging and reliability. This development meets the current demand for sophisticated electronics in vehicle safety and entertainment systems.

These changes are improving fan-out packaging technology in terms of performance and efficiency, in addition to reducing costs. Advancements in technologies, materials, and thermal management are enabling mass proliferation and new uses that will span many industries.

Strategic Growth Opportunities for Fan Out Packaging Market

The fan-out packaging space holds several opportunities for strategic growth within numerous applications. These opportunities are worth identifying and exploiting as they will aid market growth and technological advancement within the industry.

• Consumer Electronics: The increasing demand for smaller and better-performing consumer electronics devices presents fan-out packaging as a significant opportunity. Furthermore, packaging technologies in the near future can enhance the performance and miniaturization of devices, facilitating the growth of smartphones, tablets, and wearable technology.
• Automotive Industry: The automotive sector presents prospects for high growth rates in fan-out packaging due to the enhancement of electronics in vehicles. Fan-out packaging can meet the reliability and performance demands of automotive applications, such as safety and infotainment systems.
• Industrial Automation: The growth of industrial automation is driving demand for more efficient and robust fan-out packaging techniques. For advanced automation and robotics applications, the packages must support dense and reliable advanced sensors, controls, and communication systems.
• Telecommunications: With the advent of 5G telecommunication networks, there has been rapid growth in the telecommunications sector. Packaging configurations that can handle high frequency and high performance of 5G system applications using fan-out packaging will provide avenues for further innovation and market growth.
• Medical Devices: As the complexity and size of medical devices are increasing and shrinking simultaneously, there is a growing requirement for sophisticated fan-out packaging solutions. These packaging changes can assist in building small-sized, highly reliable, and efficient medical products used in diagnosis and treatment.

New areas of strategic growth are emerging with fan-out packaging solutions targeting consumer gadgets, automotive, industrial, telecommunications devices, and even medical devices. Risks associated with these opportunities, when harnessed, can propel market growth and improve technology, thereby facilitating the advancement of modern and high-tech electronic systems.

Fan Out Packaging Market Driver and Challenges

The fan-out packaging market is influenced by several components known as drivers and challenges that affect technological progress and market growth. Some of these include the inclination toward technological advancement, economic factors, and legal aspects.

The factors driving the fan-out packaging market include:

• Technological Advancements: The growth of the fan-out packaging market is propelled by the constant evolution of the technology behind fan-out packaging, incorporating higher levels of integration and new materials. These advancements make it easier to reduce the size of systems while enabling the performance that modern electronic devices require.
• Increased Demand for High-Performance Electronics: The growing use of fan-out packaging is attributed to the increasing performance requirements of consumer products, automotive electronic devices, and telecom products. High-power and reliable packaging solutions in telecommunications fulfill the performance targets of dense applications.
• Expansion of 5G Technology: There is a high demand for fan-out packaging solutions due to the rollout of 5G technology. Advanced packaging is needed to accommodate the high frequency and speed requirements of 5G infrastructure and network equipment.
• Cost Reduction Strategies: Efforts to reduce manufacturing costs through innovations such as panel-level packaging and improved manufacturing processes are beneficial for market development. Effective strategies within the vendor base can enable more tools and equipment to be fan out.
• Growth in Automotive and Industrial Applications: The increasing prevalence of electronics in automotive and industrial applications supports the growth of fan-out packaging. Additional support for market growth comes from the rising need for effective and efficient packaging solutions in these sectors.

Challenges in the fan-out packaging market include:

• High Production Costs: The high costs associated with advanced fan-out packaging technology could be burdensome, particularly for manufacturers and end-users. Although it is an excellent packaging variant, the adoption of fan-out packaging is likely to be inhibited by these high production costs.
• Complex Manufacturing Process: Fan-out packaging entails a complex manufacturing process that may lead to excessive lead times and quality issues. Sophisticated procedures require advanced technologies and expertise, affecting both efficiency and effectiveness.
• Material and Supply Chain Constraints: One limitation encountered at the design stage is the availability and cost of advanced materials used in fan-out packaging systems. Shortages in the supply chain or a lack of necessary materials can disrupt production and increase costs.

Several forces and factors affect the evolution of the fan-out packaging market. Rapid technological progress and increasing demand for electronics with higher functional capabilities act as growth drivers, while high production costs, manufacturing difficulties, and regulatory compliance pose significant obstacles. Improving this technology and seeking new markets in light of these factors will be essential.

List of Fan Out Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies fan out packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the fan out packaging companies profiled in this report include-

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

Fan Out Packaging by Segment

The study includes a forecast for the global fan out packaging market by type, carrier type, business model, and region

Fan Out Packaging Market by Type [Analysis by Value from 2019 to 2031]:

• Core Fan-Out
• High-Density Fan-Out
• Ultra High-density Fan Out

Fan Out Packaging Market by Carrier Type [Analysis by Value from 2019 to 2031]:

• 200 mm
• 300 mm
• Panel

Fan Out Packaging Market by Business Model [Analysis by Value from 2019 to 2031]:

• OSAT
• Foundary
• IDM

Fan Out Packaging Market by Region [Analysis by Value from 2019 to 2031]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

Country Wise Outlook for the Fan Out Packaging Market

Major players in the market are expanding their operations and forming strategic partnerships to strengthen their positions. The following highlights recent developments by major fan-out packaging producers in key regions: the USA, China, India, Japan, and Germany.

• United States: Recent improvements in the United States target fan-out packaging, focusing on scalability and performance. Companies are investing in new materials and processes related to thermal management and signal integrity due to the demand for high-performing electronics in computing and communication systems.
• China: China's manufacturing experts are supplying mass-producible solutions for fan-out packaging. Improved manufacturing methods enable better yields and lower costs. Consumer electronics and mobile device manufacturers are aggressively pursuing the incorporation of fan-out packaging, aligning with China's technology strategy.
• Germany: By leveraging advanced materials and process technologies, Germany is making significant progress in fan-out packaging technology. German companies have focused on improving package reliability and reducing size for high-precision and high-durability automotive and industrial applications.
• India: Recent fan-out packaging innovations in India show an increasing trend toward low-cost effective solutions and local fabrication. Indian companies are developing low-cost packaging with better performance metrics to keep pace with the growing electronics and domestic manufacturing markets.
• Japan: Japan has taken the lead in fan-out packaging by enhancing high-density integration and thermal management. Increasing numbers of Japanese companies are also exploring new materials and techniques to improve package performance for high-end applications such as semiconductor devices and premium consumer electronics.

Features of the Global Fan Out Packaging Market

Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.

Segmentation Analysis: Fan out packaging market size by type, carrier type, business model, and region in terms of value ($B).

Regional Analysis: Fan out packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, carrier types, business models, and regions for the fan out packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the fan out packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

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This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the fan out packaging market by type (core fan-out, high-density fan-out, and ultra high-density fan out), carrier type (200 mm, 300 mm, and panel), business model (OSAT, foundary, and IDM), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Fan Out Packaging Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2019 to 2031

• 3.1. Macroeconomic Trends (2019-2024) and Forecast (2025-2031)
• 3.2. Global Fan Out Packaging Market Trends (2019-2024) and Forecast (2025-2031)
• 3.3: Global Fan Out Packaging Market by Type
  • 3.3.1: Core Fan-Out
  • 3.3.2: High-Density Fan-Out
  • 3.3.3: Ultra High-density Fan Out
• 3.4: Global Fan Out Packaging Market by Carrier Type
  • 3.4.1: 200 mm
  • 3.4.2: 300 mm
  • 3.4.3: Panel
• 3.5: Global Fan Out Packaging Market by Business Model
  • 3.5.1: OSAT
  • 3.5.2: Foundary
  • 3.5.3: IDM

4. Market Trends and Forecast Analysis by Region from 2019 to 2031

• 4.1: Global Fan Out Packaging Market by Region
• 4.2: North American Fan Out Packaging Market
  • 4.2.1: North American Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.2.2: North American Market by Business Model: OSAT, Foundary, and IDM
• 4.3: European Fan Out Packaging Market
  • 4.3.1: European Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.3.2: European Market by Business Model: OSAT, Foundary, and IDM
• 4.4: APAC Fan Out Packaging Market
  • 4.4.1: APAC Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.4.2: APAC Market by Business Model: OSAT, Foundary, and IDM
• 4.5: ROW Fan Out Packaging Market
  • 4.5.1: ROW Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.5.2: ROW Market by Business Model: OSAT, Foundary, and IDM

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Fan Out Packaging Market by Type
  • 6.1.2: Growth Opportunities for the Global Fan Out Packaging Market by Carrier Type
  • 6.1.3: Growth Opportunities for the Global Fan Out Packaging Market by Business Model
  • 6.1.4: Growth Opportunities for the Global Fan Out Packaging Market by Region
• 6.2: Emerging Trends in the Global Fan Out Packaging Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Fan Out Packaging Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Fan Out Packaging Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Taiwan Semiconductor
• 7.2: Jiangsu Changjiang Electronics
• 7.3: Samsung Electro-Mechanics
• 7.4: Powertech Technology
• 7.5: Amkor Technology
• 7.6: Advanced Semiconductor
• 7.7: Nepes Corporation