半導体研磨パッド市場レポート：2030年までの動向、予測、競合分析

半導体研磨パッドの動向と予測

世界の半導体研磨パッド市場は、2024年から2030年までのCAGRが5.7%で、2030年までに推定11億米ドルに達すると予想されています。この市場の主な原動力は、5G、モノのインターネット、人工知能、電子デバイスの小型化の傾向の高まり、さまざまな用途での半導体ウェーハの使用の増加。世界の半導体研磨パッド市場の将来は、300 mmウエハーおよび200 mmウエハー市場での機会があり、有望に見えます。

半導体研磨パッド市場洞察

Lucintelは、ハード cmpパッドは、ポリウレタンなどのより堅牢な材料で構成されているため、予測期間中にさらに高い成長が見込まれ、ウエハー表面から余分な材料を積極的に除去するのに適していると予測しています。

アジア太平洋は、この地域の2大経済国である中国とインドにおける自動車およびエレクトロニクス産業の拡大と、韓国、日本、中国におけるエレクトロニクス産業の拠点の拡大により、予測期間中に最高の成長を遂げると予想されています。

よくある質問

Q1.市場規模は：

A1.世界の半導体研磨パッド市場は、2030年までに推定11億米ドルに達すると予想されています。

Q2.市場の成長予測は：

A2.世界の半導体研磨パッド市場は、2024年から2030年までCAGR 5.7%で成長すると予想されています。

Q3.市場の成長に影響を与える主な促進要因は：

A3.この市場の主な促進要因は、5G、モノのインターネット、人工知能などの最先端技術の普及の増加、電子デバイスの小型化傾向の増大、さまざまな用途での半導体ウェーハの使用の増加です。

Q4.市場の主要セグメントは：

A4.半導体研磨パッド市場の将来は、300 mmウエハーおよび200 mmウエハー市場での機会があり、有望に見えます。

Q5.市場の主要企業は：

A5.主要な半導体研磨パッド会社は次のとおりです。

• DuPont
• 3M
• Cabot Corporation
• Amtech System
• FNS POWER TECHNOLOGY
• Fujibo
• TWI Innovation Network

Q6.今後、最大となる市場セグメントは：

A6.Lucintelは、ハード cmpパッドは、ポリウレタンなどのより堅牢な材料で構成されているため、予測期間中にさらに高い成長が見込まれ、ウエハー表面から余分な材料を積極的に除去するのに適していると予測しています。

Q7.市場において、今後5年間に最大になると予想される地域は：

A7. APACは、この地域の2大経済国である中国とインドにおける自動車およびエレクトロニクス産業の拡大と、韓国、日本、中国におけるエレクトロニクス産業の拠点の拡大により、予測期間中に最高の成長を遂げると予想されています。

Q8.レポートのカスタマイズは可能か：

A8.はい、Lucintelは追加費用なしで10%のカスタマイズを提供します。

目次

第1章 エグゼクティブサマリー

第2章 世界の半導体研磨パッド市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2018年～2030年の市場動向と予測分析

• マクロ経済動向（2018年～2023年）と予測（2024年～2030年）
• 世界の半導体研磨パッド市場動向（2018年～2023年）と予測（2024年～2030年）
• 世界の半導体研磨パッド市場、タイプ別
  • ハードCMPパッド
  • ソフトCMPパッド
• 世界の半導体研磨パッド市場、用途別
  • 300mウエハー
  • 200mmウエハー
  • その他

第4章 2018年～2030年の地域別の市場動向と予測分析

• 地域別の世界の半導体研磨パッド市場
• 北米の半導体研磨パッド市場
• 欧州の半導体研磨パッド市場
• アジア太平洋の半導体研磨パッド市場
• その他地域の半導体研磨パッド市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • タイプ別の世界の半導体研磨パッド市場の成長機会
  • 用途別の世界の半導体研磨パッド市場の成長機会
  • 地域別の世界の半導体研磨パッド市場の成長機会
• 世界の半導体研磨パッド市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界の半導体研磨パッド市場の能力拡大
  • 世界の半導体研磨パッド市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• DuPont
• 3M
• Cabot Corporation
• Amtech System
• FNS POWER TECHNOLOGY
• Fujibo
• TWI Innovation Network

Semiconductor Polishing Pads Trends and Forecast

The future of the global semiconductor polishing pads market looks promising with opportunities in the 300 mm wafer and 200 mm wafer markets. The global semiconductor polishing pads market is expected to reach an estimated $1.1 billion by 2030 with a CAGR of 5.7% from 2024 to 2030. The major drivers for this market are increasing uptake of cutting-edge technology like 5G, the internet of things, and artificial intelligence, growing tendency of electronic device miniaturization, and increasing use of semiconductor wafers in various applications.

A more than 150-page report is developed to help in your business decisions.

Semiconductor Polishing Pads by Segment

The study includes a forecast for the global semiconductor polishing pads by type, application, and region.

Semiconductor Polishing Pads Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Hard CMP Pads
• Soft CMP Pads

Semiconductor Polishing Pads Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• 300M Wafer
• 200Mm Wafer
• Others

Semiconductor Polishing Pads Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Semiconductor Polishing Pads Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor polishing pads companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor polishing pads companies profiled in this report include-

• DuPont
• 3M
• Cabot Corporation
• Amtech System
• FNS POWER TECHNOLOGY
• Fujibo
• TWI Innovation Network

Semiconductor Polishing Pads Market Insights

Lucintel forecasts that hard cmp pads is expected to witness the higher growth over the forecast period because of construction of more robust materials, such as polyurethane, and are appropriate for removing superfluous material from the wafer surface in an aggressive manner.

APAC is expected to witness highest growth over the forecast period due to expansion of the automobile and electronics industries in the region's two largest economies, China and India, as well as the expanding electronics industry hubs in South Korea, Japan, and China.

Features of the Global Semiconductor Polishing Pads Market

Market Size Estimates: Semiconductor polishing pads market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Semiconductor polishing pads market size by type, application, and region in terms of value ($B).

Regional Analysis: Semiconductor polishing pads market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the semiconductor polishing pads market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor polishing pads market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the semiconductor polishing pads market size?

Answer: The global semiconductor polishing pads market is expected to reach an estimated $1.1 billion by 2030.

Q2. What is the growth forecast for semiconductor polishing pads market?

Answer: The global semiconductor polishing pads market is expected to grow with a CAGR of 5.7% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the semiconductor polishing pads market?

Answer: The major drivers for this market are increasing uptake of cutting-edge technology like 5G, the internet of things, and artificial intelligence, growing tendency of electronic device miniaturization and increasing use of semiconductor wafers in various applications.

Q4. What are the major segments for semiconductor polishing pads market?

Answer: The future of the semiconductor polishing pads market looks promising with opportunities in the 300 mm wafer and 200 mm wafer markets.

Q5. Who are the key semiconductor polishing pads market companies?

Answer: Some of the key semiconductor polishing pads companies are as follows:

• DuPont
• 3M
• Cabot Corporation
• Amtech System
• FNS POWER TECHNOLOGY
• Fujibo
• TWI Innovation Network

Q6. Which semiconductor polishing pads market segment will be the largest in future?

Answer: Lucintel forecasts that hard cmp pads is expected to witness the higher growth over the forecast period because of construction of more robust materials, such as polyurethane, and are appropriate for removing superfluous material from the wafer surface in an aggressive manner.

Q7. In semiconductor polishing pads market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to expansion of the automobile and electronics industries in the region's two largest economies, China and India, as well as the expanding electronics industry hubs in South Korea, Japan, and China.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the semiconductor polishing pads market by type (hard cmp pads and soft cmp pads), application (300m wafer, 200mm wafer, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Semiconductor Polishing Pads Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global Semiconductor Polishing Pads Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global Semiconductor Polishing Pads Market by Type
  • 3.3.1: Hard CMP Pads
  • 3.3.2: Soft CMP Pads
• 3.4: Global Semiconductor Polishing Pads Market by Application
  • 3.4.1: 300m Wafer
  • 3.4.2: 200mm Wafer
  • 3.4.3: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global Semiconductor Polishing Pads Market by Region
• 4.2: North American Semiconductor Polishing Pads Market
  • 4.2.2: North American Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others
• 4.3: European Semiconductor Polishing Pads Market
  • 4.3.1: European Semiconductor Polishing Pads Market by Type: Hard CMP Pads and Soft CMP Pads
  • 4.3.2: European Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others
• 4.4: APAC Semiconductor Polishing Pads Market
  • 4.4.1: APAC Semiconductor Polishing Pads Market by Type: Hard CMP Pads and Soft CMP Pads
  • 4.4.2: APAC Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others
• 4.5: ROW Semiconductor Polishing Pads Market
  • 4.5.1: ROW Semiconductor Polishing Pads Market by Type: Hard CMP Pads and Soft CMP Pads
  • 4.5.2: ROW Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Semiconductor Polishing Pads Market by Type
  • 6.1.2: Growth Opportunities for the Global Semiconductor Polishing Pads Market by Application
  • 6.1.3: Growth Opportunities for the Global Semiconductor Polishing Pads Market by Region
• 6.2: Emerging Trends in the Global Semiconductor Polishing Pads Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Semiconductor Polishing Pads Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Semiconductor Polishing Pads Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: DuPont
• 7.2: 3M
• 7.3: Cabot Corporation
• 7.4: Amtech System
• 7.5: FNS POWER TECHNOLOGY
• 7.6: Fujibo
• 7.7: TWI Innovation Network