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半導体研磨パッドの世界市場

Semiconductor Polishing Pads

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ページ情報
英文 164 Pages
納期
即日から翌営業日
適宜更新あり
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価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=146.35円
半導体研磨パッドの世界市場
出版日: 2025年06月13日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 164 Pages
納期: 即日から翌営業日
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概要

半導体研磨パッドの世界市場は2030年までに12億米ドルに達する見込み

2024年に8億5,160万米ドルと推定される半導体研磨パッドの世界市場は、分析期間2024-2030年にCAGR 5.8%で成長し、2030年には12億米ドルに達すると予測されます。本レポートで分析したセグメントの1つであるハードCMPパッドは、CAGR 6.7%を記録し、分析期間終了時には7億9,710万米ドルに達すると予測されます。ソフトCMPパッド分野の成長率は、分析期間中CAGR 4.3%と推定されます。

米国市場は2億2,390万米ドルと推定、中国はCAGR 5.6％で成長予測

米国の半導体研磨パッド市場は、2024年に2億2,390万米ドルと推定されます。世界第2位の経済大国である中国は、分析期間2024-2030年のCAGRを5.6%として、2030年までに1億9,100万米ドルの市場規模に達すると予測されています。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ5.3％と4.9％と予測されています。欧州では、ドイツがCAGR 4.6%で成長すると予測されています。

世界の「半導体研磨パッド」市場- 主要動向と促進要因のまとめ

なぜポリッシングパッドが先端チップ表面仕上げの中核なのか？

半導体研磨パッドは、CMP（Chemical Mechanical Planarization、化学的機械的平坦化）工程で使用される重要な消耗品です。チップの小型化、高速化、高性能化の要求が高まる中、ウエハーのトポグラフィーを完璧にする必要性はかつてないほど高まっています。通常、ポリウレタンや複合材料で作られる研磨パッドは、ウエハー1枚あたり数十のCMP工程にわたって、表面の均一性、耐久性、化学的適合性のバランスをとる必要があります。ロジック、メモリー、パワー半導体のいずれにおいても、数ナノメートルの表面偏差がデバイスの性能を低下させる可能性があります。パッドは、スラリーやコンディショナーと連動して、ウェハーに傷を付けたり汚染したりすることなく、余分な材料を除去しなければなりません。その性能は、ダイの歩留まり、線幅制御、平坦化精度に直接影響するため、FEOLとBEOLの両プロセスにおいて不可欠です。

マルチゾーンと特殊パッドが精度と寿命を再定義？

研磨パッドは、新しいデバイスアーキテクチャの微妙な要件を満たすために急速に進化しています。先進的なCMPプロセスでは現在、より優れたスラリー分散、安定した除去率、優れた終点検出を実現するマルチゾーンパッドや溝付きパッドが使用されています。マイクロポーラスやナノ構造のパッド表面は、欠陥を発生させずに表面接触を改善するために導入されています。3D NANDや高度な相互接続では、パッドはより深い層や、タングステン、銅、誘電体複合材料などの多様なマテリアルハンドリングに対応する必要があります。このようなアプリケーションでは、パッド寿命が長く、ウエハー枚数が多くても安定した性能が求められます。さらに、ダウンフォースプロファイルの異なる枚葉CMP装置やバッチ装置に合わせて、パッド設計をカスタマイズする必要があります。研磨がより選択的で用途に特化するようになるにつれ、パッド市場は高性能、低汚染、プロセス最適化製品へとシフトしています。

持続可能性とプロセス効率はパッド革新の次の波を起こせるか？

環境への配慮と総所有コスト（TCO）の圧力により、工場はより持続可能で長寿命の琢磨パッドを求めるようになっています。ベンダーは、より少ないスラリーを必要とし、より長いドレッシング間隔を提供し、全体的なプロセスコストを削減するパッドを開発しています。リサイクル可能なパッド材料や廃棄物削減システムの開発も進んでいます。積極的な研磨を行わずにパッド表面の均一性を長持ちさせるコンディショニング・ディスクは、コスト削減と歩留まり向上を重視する製造工場では標準になりつつあります。RFIDまたは光学スキャンを使用した統合パッド監視システムにより、ファブはパッドの摩耗をリアルタイムで追跡し、使用サイクルを最適化することができます。このような技術革新は、環境への影響を低減するだけでなく、パッドの早期交換による操業中断を低減します。工場が利益率の向上とともにグリーン製造を推進する中、琢磨パッド設計は持続可能な半導体製造における重要なテコになりつつあります。

何が世界の半導体研磨パッド市場の成長を牽引しているのか？

世界の半導体研磨パッド市場の成長は、ノードの微細化、3Dアーキテクチャ、ウエハスループットの向上など、いくつかの要因によって牽引されています。チップメーカーが3nm以降に移行するにつれて、ロジック、メモリ、ミックスドシグナルデバイス全体で平坦化がより重要になります。3D NANDと先進パッケージング技術の爆発的な成長により、ウエハーあたりのCMP工程数が増加し、高性能パッドへの需要が高まっています。中国、韓国、米国、台湾で工場が急速に拡張され、パッドの消費量が大幅に増加しています。同時に、化合物半導体やパワーIC製造におけるCMP採用の増加により、市場は新たな分野へと拡大しています。ウエハー当たりのコスト、プロセスの歩留まり、環境コンプライアンスが重視されるようになり、工場では耐久性、エコ・スラリーとの互換性、精密なプロセス制御を実現するパッドが好まれています。パッドとスラリーの相乗効果が実証され、長年のOEM関係を持つベンダーは、特に市場をリードする立場にあります。

セグメント

タイプ（ハードCMPパッド、ソフトCMPパッド）;アプリケーション（300Mウエハー、200Mウエハー、その他のアプリケーション）

調査対象企業の例（注目32社）

  • 3M
  • AGC Inc.
  • Atotech
  • Cabot Microelectronics
  • DuPont
  • Entegris
  • Ferro Corporation
  • FNS TECH Co., Ltd.
  • Fujibo Holdings, Inc.
  • Fujimi Incorporated
  • Hubei Dinglong Co., Ltd.
  • Kuraray Co., Ltd.
  • Mipox Corporation
  • Nitta Haas Incorporated
  • Pureon
  • Rodel（a DuPont company）
  • Saniwave Technology Co., Ltd.
  • SK enpulse
  • Spartan Felt Company
  • Topco Scientific Co., Ltd.

関税影響係数

Global Industry Analystsは、本社の国、製造拠点、輸出入（完成品とOEM）に基づく企業の競争力の変化を予測しています。この複雑で多面的な市場力学は、人為的な売上原価の増加、収益性の低下、サプライチェーンの再構築など、ミクロおよびマクロの市場力学の中でも特に競合他社に影響を与える見込みです。

Global Industry Analystsは、世界の主要なチーフ・エコノミスト（1万4,949人）、シンクタンク（62団体）、貿易・産業団体（171団体）の専門家の意見に熱心に従いながら、エコシステムへの影響を評価し、新たな市場の現実に対処しています。あらゆる主要国の専門家やエコノミストが、関税とそれが自国に与える影響についての意見を追跡調査しています。

Global Industry Analystsは、この混乱が今後2-3ヶ月で収束し、新しい世界秩序がより明確に確立されると予想しています。Global Industry Analystsは、これらの開発をリアルタイムで追跡しています。

2025年4月：交渉フェーズ

4月のリリースでは、世界市場全体に対する関税の影響を取り上げ、地域別の市場調整について紹介します。当社の予測は、過去のデータと進化する市場影響要因に基づいています。

2025年7月：最終関税リセット

お客様には、各国間で最終リセットが発表された後、7月に無料アップデート版をお届けします。最終アップデート版には、明確に定義された関税影響分析が組み込まれています。

相互および二国間貿易と関税の影響分析：

アメリカ <>中国<>メキシコ <>カナダ <>EU <>日本<>インド <>その他176カ国

業界をリードするエコノミスト：Global Industry Analystsの知識ベースは、国家、シンクタンク、貿易・産業団体、大企業、そして世界の計量経済状況におけるこの前例のないパラダイムシフトの影響を共有する領域の専門家など、最も影響力のあるチーフエコノミストの厳選されたグループを含む1万4,949人のエコノミストを追跡しています。当社の16,491を超えるレポートのほとんどは、マイルストーンに基づくこの2段階のリリーススケジュールを取り入れています。

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他欧州
  • アジア太平洋
  • その他の地域

第4章 競合

目次
Product Code: MCP35727

Global Semiconductor Polishing Pads Market to Reach US$1.2 Billion by 2030

The global market for Semiconductor Polishing Pads estimated at US$851.6 Million in the year 2024, is expected to reach US$1.2 Billion by 2030, growing at a CAGR of 5.8% over the analysis period 2024-2030. Hard CMP Pads, one of the segments analyzed in the report, is expected to record a 6.7% CAGR and reach US$797.1 Million by the end of the analysis period. Growth in the Soft CMP Pads segment is estimated at 4.3% CAGR over the analysis period.

The U.S. Market is Estimated at US$223.9 Million While China is Forecast to Grow at 5.6% CAGR

The Semiconductor Polishing Pads market in the U.S. is estimated at US$223.9 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$191.0 Million by the year 2030 trailing a CAGR of 5.6% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.3% and 4.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 4.6% CAGR.

Global "Semiconductor Polishing Pads" Market - Key Trends & Drivers Summarized

Why Are Polishing Pads at the Heart of Advanced Chip Surface Finishing?

Semiconductor polishing pads are crucial consumables used in Chemical Mechanical Planarization (CMP), a process that ensures ultra-flat wafer surfaces before lithography and metal layer deposition. With rising demand for smaller, faster, and more powerful chips, the need for flawless wafer topography has never been greater. Polishing pads-typically made from polyurethane or composite materials-must balance surface uniformity, durability, and chemical compatibility across dozens of CMP steps per wafer. In logic, memory, and power semiconductors alike, even a few nanometers of surface deviation can degrade device performance. Pads must work in tandem with slurries and conditioners to remove excess material without scratching or contaminating the wafer. Their performance directly impacts die yield, line-width control, and planarization accuracy, making them indispensable across both FEOL and BEOL processes.

Are Multi-Zone and Specialty Pads Redefining Precision and Lifespan?

Polishing pads are evolving rapidly to meet the nuanced requirements of newer device architectures. Advanced CMP processes now use multi-zone or grooved pads that provide better slurry distribution, consistent removal rates, and superior endpoint detection. Micro-porous and nanostructured pad surfaces are being introduced to improve surface contact without generating defects. In 3D NAND and advanced interconnects, pads must handle deeper layers and varied materials like tungsten, copper, or dielectric composites. These applications require longer pad life and stable performance over high wafer counts. Additionally, pad design is being customized to suit single-wafer CMP tools and batch tools with different downforce profiles. As polishing becomes more selective and application-specific, the pad market is witnessing a shift toward high-performance, low-contamination, and process-optimized products.

Can Sustainability and Process Efficiency Drive the Next Wave of Pad Innovation?

Environmental considerations and total cost of ownership (TCO) pressures are pushing fabs to seek more sustainable and longer-lasting polishing pads. Vendors are developing pads that require less slurry and offer longer dressing intervals, reducing overall process costs. Recyclable pad materials and waste-reduction systems are also in development. Conditioning disks that prolong pad surface consistency without aggressive abrasion are becoming standard in fabs focused on cost savings and yield enhancement. Integrated pad monitoring systems-using RFID or optical scanning-allow fabs to track pad wear in real time and optimize usage cycles. These innovations not only reduce environmental impact but also lower operational interruptions caused by premature pad replacement. As fabs push for green manufacturing alongside better margins, polishing pad design is becoming a key lever in sustainable semiconductor fabrication.

What’s Driving Growth in the Global Semiconductor Polishing Pad Market?

The growth in the global semiconductor polishing pads market is driven by several factors including node shrinkage, 3D architectures, and higher wafer throughput. As chipmakers move to 3nm and beyond, planarization becomes more critical across logic, memory, and mixed-signal devices. The explosive growth of 3D NAND and advanced packaging technologies is increasing the number of CMP steps per wafer, amplifying demand for high-performance pads. Rapid fab expansions across China, South Korea, the U.S., and Taiwan are scaling up pad consumption volumes significantly. At the same time, increasing adoption of CMP in compound semiconductor and power IC production is expanding the market into new verticals. The growing emphasis on cost per wafer, process yield, and environmental compliance is driving fabs to favor pads that offer durability, compatibility with eco-slurries, and precise process control. Vendors with proven pad-slurry synergy and long-standing OEM relationships are particularly well-positioned for market leadership.

SCOPE OF STUDY:

The report analyzes the Semiconductor Polishing Pads market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Hard CMP Pads, Soft CMP Pads); Application (300M Wafer, 200Mm Wafer, Other Applications)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 32 Featured) -

  • 3M
  • AGC Inc.
  • Atotech
  • Cabot Microelectronics
  • DuPont
  • Entegris
  • Ferro Corporation
  • FNS TECH Co., Ltd.
  • Fujibo Holdings, Inc.
  • Fujimi Incorporated
  • Hubei Dinglong Co., Ltd.
  • Kuraray Co., Ltd.
  • Mipox Corporation
  • Nitta Haas Incorporated
  • Pureon
  • Rodel (a DuPont company)
  • Saniwave Technology Co., Ltd.
  • SK enpulse
  • Spartan Felt Company
  • Topco Scientific Co., Ltd.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Semiconductor Polishing Pads - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increased CMP Complexity in Advanced Nodes Drives Innovation in Pad Material Design
    • Growth in 3D NAND and FinFET Architectures Spurs Demand for High-Performance Polishing Pads
    • Rising Focus on Surface Defect Reduction Strengthens Business Case for Next-Gen Pads
    • Integration with Low-k and Ultra Low-k Materials Requires Customized Pad Properties
    • Advanced Packaging Trends Propel Demand for Planarization Pads in Wafer-Level Processing
    • Push for Cost-Effective Consumables Expands Market for Long-Life, Reconditionable Pads
    • Eco-Friendly and Low Particle Generation Pads Gain Traction Amid Regulatory Pressure
    • CMP Process Optimization in Smart Fabs Throws Spotlight on Pad-Wafer Interaction Models
    • Increase in CMP Tool Installations Worldwide Drives Volume Growth in Pad Consumption
    • Collaborative Development Between Pad and Slurry Vendors Enhances Process Synergies
    • Growing Use in MEMS and Sensor Wafer Fabrication Opens New Market Frontiers
    • R&D in Nanocomposite Pads Expands Performance Capabilities in Ultrafine Planarization
    • Global Supply Chain Diversification Creates New Opportunities for Regional Pad Manufacturers
    • AI and Machine Learning Integration in CMP Tools Spurs Demand for Predictable Pad Behavior
    • Emergence of Advanced Interconnect Materials Propels Innovation in Application-Specific Pads
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Semiconductor Polishing Pads Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Semiconductor Polishing Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for Semiconductor Polishing Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Hard CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Hard CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for Hard CMP Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Soft CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Soft CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for Soft CMP Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for 300M Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for 300M Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for 300M Wafer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for 200Mm Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for 200Mm Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for 200Mm Wafer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 20: USA Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 21: USA Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 22: USA 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 23: USA Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 24: USA Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 25: USA 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 26: Canada Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 27: Canada Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 28: Canada 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 29: Canada Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 30: Canada Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 31: Canada 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • JAPAN
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 32: Japan Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Japan Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 34: Japan 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 35: Japan Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 36: Japan Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 37: Japan 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • CHINA
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 38: China Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 39: China Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 40: China 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 41: China Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 42: China Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 43: China 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • EUROPE
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 44: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 45: Europe Historic Review for Semiconductor Polishing Pads by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 46: Europe 15-Year Perspective for Semiconductor Polishing Pads by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 47: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Europe Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 49: Europe 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 50: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 52: Europe 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • FRANCE
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 53: France Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 54: France Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 55: France 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 56: France Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: France Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 58: France 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • GERMANY
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 59: Germany Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Germany Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 61: Germany 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 62: Germany Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Germany Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 64: Germany 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 65: Italy Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Italy Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 67: Italy 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 68: Italy Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Italy Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 70: Italy 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 71: UK Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 72: UK Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 73: UK 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 74: UK Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: UK Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 76: UK 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 77: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Rest of Europe Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 79: Rest of Europe 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 80: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Rest of Europe Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 82: Rest of Europe 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 83: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Asia-Pacific Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 85: Asia-Pacific 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 86: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Asia-Pacific Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 88: Asia-Pacific 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • REST OF WORLD
    • TABLE 89: Rest of World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 90: Rest of World Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 91: Rest of World 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 92: Rest of World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Rest of World Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 94: Rest of World 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030

IV. COMPETITION