半導体ウエハ研磨・研削装置の世界市場（2025年～2035年）

半導体ウエハ研磨・研削装置の市場規模は、予測期間（2025年～2035年）に10.2％でのCAGRで拡大すると予測されています。家電、電気通信、自動車などの産業分野の増加、よりコンパクトで強く、エネルギー消費の少ない半導体の生産の増加などの重要な要因が、超薄型で欠陥のないウエハを要求しています。さらに、5G通信の拡大と展開、より高性能な半導体と3D-IC、システムインパッケージSiPなどの新興先進パッケージ構造によるモノのインターネット（IoT）の拡大と普及なども業界の成長に寄与しています。

半導体ウエハの研磨・研削装置市場の動向の一つは、先進的なCMP（化学的機械的平坦化）装置に対する需要の高まりです。半導体デバイスは複雑さを増しており、メーカーはウエハ表面の要求される均一性を達成するために、高精度で効率的な研磨ソリューションを求めています。CMP装置は、先端ノード技術の厳しい要件を満たすように進化しており、これにより、より小型で高速、エネルギー効率の高いチップの生産が可能になります。さらに、3D NANDやFinFETアーキテクチャ技術の採用が増加したことで、このような複雑な設計に対応するため、より特殊なCMPの開発が必要となっています。各社は研究開発プログラムに多額の投資を続けており、装置の性能を最適化し、生産歩留まりを向上させて不良率を下げることに注力しています。これは、AI、5G、自律走行車など、より高性能なチップをアプリケーションに投入する必要性によるものです。

半導体産業は、大量の生産とより厳格な工程管理に対処しなければなりませんでしたが、自動化はこの点で、効率性と一貫性を実現するものでした。最新の研磨・研削工具は、生産性を向上させるために、リアルタイムの監視、予知保全、機械学習アルゴリズムなどの機能を備えています。これらの開発により、メーカーはダウンタイムを回避し、運用コストを削減し、ウエハ品質を向上させることができます。実際、スマートマニュファクチャリングは、相互接続されたシステムとデータ分析を中核構成要素とする、より大きなインダストリー4.0の動きの一部です。この現象は、わずかなプロセスの最適化でさえ大幅なコスト削減と性能向上につながる大量生産環境において特に重要です。

当レポートでは、世界の半導体ウエハ研磨・研削装置市場について調査し、市場の概要とともに、タイプ別、エンドユーザー別、地域別の動向、および市場に参入する企業のプロファイルなどを提供しています。

目次

第1章 報告書のサマリー

第2章 市場概要と洞察

第3章 市場の決定要因

• 市場促進要因
• 市場の問題点と課題
• 市場機会

第4章 競合情勢

• 競合ダッシュボード- 半導体ウエハ研磨・研削装置市場のメーカー別収益とシェア
• 半導体ウエハ研磨・研削装置製品比較分析
• 市場の主要参入企業のランキングマトリックス
• 主要企業分析
  • Applied Materials, Inc.
  • Tokyo Seimitsu Co., Ltd.
  • JTEKT CORP.
  • Komatsu NTC Ltd.
  • Okamoto Machine Tool Works, Ltd
• 市場参入企業による主な成功戦略
  • 合併と買収
  • 製品発売
  • パートナーシップとコラボレーション

第5章 世界の半導体ウエハ研磨・研削装置市場の売上分析（100万米ドル）、タイプ別

• 半導体ウエハ研磨装置
• 半導体ウエハ研削装置

第6章 世界の半導体ウエハ研磨・研削装置市場の売上分析（100万米ドル）、エンドユーザー別

• 鋳造
• メモリメーカー
• IDM
• その他（テストおよびパッケージングサービスプロバイダー）

第7章 地域分析

• 北米
• 欧州
• アジア太平洋
• その他の地域

第8章 企業プロファイル

• Alpsitec SAS
• Applied Materials, Inc.
• Axus Technology
• Buehler Ltd.
• Daitron Co., Ltd.
• DISCO Corp.
• Engis Corp.
• Grintimate Precision Industry Co., Ltd.
• Henan Chengyi Equipment Science and Technology Co., Ltd.
• Herbert Arnold GmbH & Co. Kg
• Jiangsu Jinggong Semiconductor Equipment Co., Ltd.
• JOEN LIH MACHINERY CO., LTD.
• JTEKT CORP.
• Komatsu NTC Ltd.
• Koyo Machine Industries Co. Ltd
• Lapmaster Wolters India Pvt. Ltd.
• Micro Engineering Inc
• Okamoto Machine Tool Works, Ltd.
• Proportion-Air, Inc.
• Qingdao Gaoce Technology Co., Ltd.
• Revasum, Inc.
• SCREEN Semiconductor Solutions Co., Ltd.
• SHIN NIPPON KOKI CO., LTD.
• Tokyo Seimitsu Co., Ltd.
• WAIDA MFG. Co., Ltd.

LIST OF TABLES

• 1. Global Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by Type, 2024-2035 ($ Million)
• 2. Global Semiconductor Wafer Polishing Equipment Market Research and Analysis by Region, 2024-2035 ($ Million)
• 3. Global Semiconductor Wafer Grinding Equipment Market Research and Analysis by Region, 2024-2035 ($ Million)
• 4. Global Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by End-User, 2024-2035 ($ Million)
• 5. Global Semiconductor Wafer Polishing and Grinding Equipment for Foundries Market Research and Analysis by Region, 2024-2035 ($ Million)
• 6. Global Semiconductor Wafer Polishing and Grinding Equipment for Memory Manufacturers Market Research and Analysis by Region, 2024-2035 ($ Million)
• 7. Global Semiconductor Wafer Polishing and Grinding Equipment for Integrated Device Manufacturers (IDMs) Market Research and Analysis by Region, 2024-2035 ($ Million)
• 8. Global Semiconductor Wafer Polishing and Grinding Equipment for Others End-User Market Research and Analysis by Region, 2024-2035 ($ Million)
• 9. Global Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by Region, 2024-2035 ($ Million)
• 10. North American Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by Country, 2024-2035 ($ Million)
• 11. North American Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by Type, 2024-2035 ($ Million)
• 12. North American Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by End-User, 2024-2035 ($ Million)
• 13. European Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by Country, 2024-2035 ($ Million)
• 14. European Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by Type, 2024-2035 ($ Million)
• 15. European Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by End-User, 2024-2035 ($ Million)
• 16. Asia-Pacific Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by Country, 2024-2035 ($ Million)
• 17. Asia-Pacific Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by Type, 2024-2035 ($ Million)
• 18. Asia-Pacific Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by End-User, 2024-2035 ($ Million)
• 19. Rest Of the World Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by Region, 2024-2035 ($ Million)
• 20. Rest Of the World Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by Type, 2024-2035 ($ Million)
• 21. Rest Of the World Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by End-User, 2024-2035 ($ Million)

LIST OF FIGURES

• 1. Global Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by Type, 2024 Vs 2035 (%)
• 2. Global Semiconductor Wafer Polishing Equipment Market Share by Region, 2024 Vs 2035 (%)
• 3. Global Semiconductor Wafer Grinding Equipment Market Share by Region, 2024 Vs 2035 (%)
• 4. Global Semiconductor Wafer Polishing and Grinding Equipment Market Research and Analysis by End-User, 2024 Vs 2035 (%)
• 5. Global Semiconductor Wafer Polishing and Grinding Equipment for Foundries Market Share by Region, 2024 Vs 2035 (%)
• 6. Global Semiconductor Wafer Polishing and Grinding Equipment for Memory Manufacturers Market Share by Region, 2024 Vs 2035 (%)
• 7. Global Semiconductor Wafer Polishing and Grinding Equipment for Integrated Device Manufacturers (IDMs) Market Share by Region, 2024 Vs 2035 (%)
• 8. Global Semiconductor Wafer Polishing and Grinding Equipment for Others End-User Market Share by Region, 2024 Vs 2035 (%)
• 9. Global Semiconductor Wafer Polishing and Grinding Equipment Market Share by Region, 2024 Vs 2035 (%)
• 10. US Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 11. Canada Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 12. UK Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 13. France Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 14. Germany Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 15. Italy Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 16. Spain Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 17. Russia Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 18. Rest Of Europe Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 19. India Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 20. China Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 21. Japan Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 22. South Korea Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 23. ASEAN Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 24. Australia and New Zealand Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 25. Rest Of Asia-Pacific Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 26. Latin America Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)
• 27. Middle East and Africa Semiconductor Wafer Polishing and Grinding Equipment Market Size, 2024-2035 ($ Million)

Semiconductor Wafer Polishing and Grinding Equipment Market Size, Share & Trends Analysis Report by Type (Semiconductor Wafer Polishing Equipment and Semiconductor Wafer Grinding Equipment), and End-User (Foundries, Memory Manufacturers, Integrated Device Manufacturers (IDMs), and Others) Forecast Period (2025-2035)

Industry Overview

The semiconductor wafer polishing and grinding equipment market is anticipated to grow at a CAGR of 10.2% during the forecast period (2025-2035). Pivotal factors such as rising industrial sectors for consumer electronics, telecom, and auto, and increasing production of more compact stronger, and less energy-consuming semiconductors demand ultra-thin and faultless wafers. Further, the expansion and deployment of 5G communications and expansion and proliferation of the Internet of Things (IoT) with greater performing semiconductors and emerging advanced package structures such as 3D-ICs, and system-in-package SiP, among others also contribute to industry growth.

Market Dynamics

Growing Adoption of Advanced CMP Equipment

One of the trends in the market for semiconductor wafer polishing and grinding equipment is increased demand for advanced chemical mechanical planarization (CMP) equipment. The complexity of the semiconductor device increases, and manufacturers are looking for highly precise and efficient polishing solutions to achieve the required uniformity of the wafer surface. CMP equipment is evolving to meet the stringent requirements of advanced node technologies, thereby enabling the production of smaller, faster, and more energy-efficient chips. In addition, growth in the adoption of 3D NAND and FinFET architecture technologies has fuelled the necessity of developing a range of more specific CMPs suited to meet such complex designs. Companies continue investing heavily in R&D programs, focusing on optimizing equipment performance and lowering defect rates with high production yield improvements. It is a function of the necessity of pushing more performing chips into applications, such as AI, 5G, or autonomous vehicle applications.

Increasing Automation and Smart Manufacturing

The semiconductor industry had to deal with high production volumes and stricter process control, automation has been the efficiency and consistency enabler in this regard. The modern polishing and grinding tools are advanced with such features as real-time monitoring, predictive maintenance, and machine learning algorithms to enhance productivity. These developments enable the manufacturer to avoid downtime, cut operational costs, and increase wafer quality. Smart manufacturing is, in fact, a part of the larger Industry 4.0 movement, with interconnected systems and data analytics as its core constituents. This phenomenon is especially critical in high-volume production environments wherein even minor process optimizations can lead to significant cost savings and performance improvement.

Market Segmentation

• Based on the type, the market is segmented into semiconductor wafer polishing equipment and semiconductor wafer grinding equipment.
• Based on the end-user, the market is segmented into foundries, memory manufacturers, integrated device manufacturers (IDMs), and others (testing and packaging service providers).

Semiconductor Wafer Polishing Equipment Segment to Lead the Market with the Largest Share

There is an increase in the demand for electronic devices, and customers look for performance electronic devices, precise wafer processing has been very crucial in this. Polishing semiconductor wafer processing equipment plays a critical role in wafers, in achieving a flat surface. Furthermore, the growing adoption of advanced materials and miniature-sized chips is driving the need for high-level polishing solutions. Companies are responding with innovations in equipment efficiency to meet the industry's demands.

Foundries: A Key Segment in Market Growth

The demand from foundries is rising sharply, and the growth in the semiconductor wafer polishing and grinding equipment market is mainly led by this. Foundries are manufacturing entities catering to the needs of several IC designers. Advanced nodes and technologies adopted by these foundries require precise and efficient wafer processing solutions. In particular, the demand for high-quality consumer electronics, automotive chips, and IoT devices is still growing at a higher rate.

Regional Outlook

The global semiconductor wafer polishing and grinding equipment market is further divided by geography, including Asia-Pacific (India, China, Japan, South Korea, Australia and New Zealand, ASEAN Countries, and the Rest of Asia-Pacific), North America (the US and Canada), Europe (the UK, Germany, France, Italy, Spain, Russia, and the Rest of Europe), and the Rest of the World (the Middle East & Africa, and Latin America)

Growing Semiconductor Wafer and Substrate Manufacturing in North America

The North American semiconductor wafer polishing and grinding equipment market are experiencing significant growth, primarily owing to integrated device manufacturers. The manufacturers are increasing amounts of investment in various advanced technologies to boost their production facilities and cater to the growing demand for high-performance semiconductors. This growth is a result of the high and rapid growth experienced in the automotive, consumer electronics, and telecommunication sectors. This sector mainly thrives on proper and efficient semiconductor production. For instance, Intel Corp. is continuously developing advanced polishing and grinding technologies, which the corporation uses in enhancing its wafer fabrication process. Such investment results in an efficient production level, thus answering the rising demand for changing technology standards.

Asia-Pacific Region Dominates the Market with Major Share

Several factors are contributing to the Asia-Pacific semiconductor wafer polishing and grinding equipment market. The need for advanced semiconductor manufacturing processes is driven by the increasing demand for advanced consumer electronics & industrial devices. The growing adoption of automation in wafer processing is also fueling market growth. Governments across the region are also pouring money into semiconductor research and development. Technologies such as 5G and IoT are creating huge opportunities for semiconductor manufacturers. The demand for precision equipment is further driven by technological advancements and innovation in the region.

Market Players Outlook

The major companies operating in the global semiconductor wafer polishing and grinding equipment market include Applied Materials, Inc., JTEKT CORP., Tokyo Seimitsu Co., Ltd., Okamoto Machine Tool Works, Ltd., DISCO Corp., Engis Corp., and Komatsu NTC Ltd., among others. Market players are leveraging partnerships, collaborations, mergers and acquisition strategies for business expansion and innovative product development to maintain their market positioning.

Recent Development

• In November 2024, NexGen Wafer Systems introduced SERENO, the company's new multi-chamber platform that it has specifically developed for Wet Etch and Clean applications. The SERENO offers high performance in combination with the highest level of flexibility with onboard chemical supply supporting multiple process chemicals with integrated mixing, blending, and comprehensive analytics for maximum adaptability across a wide range of applications.

The Report Covers:

• Market value data analysis of 2024 and forecast to 2035.
• Annualized market revenues ($ million) for each market segment.
• Country-wise analysis of major geographical regions.
• Key companies operating in the global semiconductor wafer polishing and grinding equipment market. Based on the availability of data, information related to new products, and relevant news is also available in the report.
• Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
• Analysis of market-entry and market expansion strategies.
• Competitive strategies by identifying 'who-stands-where' in the market.

Table of Contents

1. Report Summary

• Current Industry Analysis and Growth Potential Outlook
• Global Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis - Type| End-User ($ Million)
• Semiconductor Wafer Polishing and Grinding Equipment Market Sales Performance of Top Countries
• 1.1. Research Methodology
• Primary Research Approach
• Secondary Research Approach
• 1.2. Market Snapshot

2. Market Overview and Insights

• 2.1. Scope of the Study
• 2.2. Analyst Insight & Current Market Trends
  • 2.2.1. Key Semiconductor Wafer Polishing and Grinding Equipment Industry Trends
  • 2.2.2. Market Recommendations
• 2.3. Porter's Five Forces Analysis for the Semiconductor Wafer Polishing and Grinding Equipment Market
  • 2.3.1. Competitive Rivalry
  • 2.3.2. Threat of New Entrants
  • 2.3.3. Bargaining Power of Suppliers
  • 2.3.4. Bargaining Power of Buyers
  • 2.3.5. Threat of Substitutes

3. Market Determinants

• 3.1. Market Drivers
  • 3.1.1. Drivers For Global Semiconductor Wafer Polishing and Grinding Equipment Market: Impact Analysis
• 3.2. Market Pain Points and Challenges
  • 3.2.1. Restraints For Global Semiconductor Wafer Polishing and Grinding Equipment Market: Impact Analysis
• 3.3. Market Opportunities

4. Competitive Landscape

• 4.1. Competitive Dashboard - Semiconductor Wafer Polishing and Grinding Equipment Market Revenue and Share by Manufacturers
• Semiconductor Wafer Polishing and Grinding Equipment Product Comparison Analysis
• Top Market Player Ranking Matrix
• 4.2. Key Company Analysis
  • 4.2.1. Applied Materials, Inc.
    • 4.2.1.1. Overview
    • 4.2.1.2. Product Portfolio
    • 4.2.1.3. Financial Analysis (Subject to Data Availability)
    • 4.2.1.4. SWOT Analysis
    • 4.2.1.5. Business Strategy
  • 4.2.2. Tokyo Seimitsu Co., Ltd.
    • 4.2.2.1. Overview
    • 4.2.2.2. Product Portfolio
    • 4.2.2.3. Financial Analysis (Subject to Data Availability)
    • 4.2.2.4. SWOT Analysis
    • 4.2.2.5. Business Strategy
  • 4.2.3. JTEKT CORP.
    • 4.2.3.1. Overview
    • 4.2.3.2. Product Portfolio
    • 4.2.3.3. Financial Analysis (Subject to Data Availability)
    • 4.2.3.4. SWOT Analysis
    • 4.2.3.5. Business Strategy
  • 4.2.4. Komatsu NTC Ltd.
    • 4.2.4.1. Overview
    • 4.2.4.2. Product Portfolio
    • 4.2.4.3. Financial Analysis (Subject to Data Availability)
    • 4.2.4.4. SWOT Analysis
    • 4.2.4.5. Business Strategy
  • 4.2.5. Okamoto Machine Tool Works, Ltd
    • 4.2.5.1. Overview
    • 4.2.5.2. Product Portfolio
    • 4.2.5.3. Financial Analysis (Subject to Data Availability)
    • 4.2.5.4. SWOT Analysis
    • 4.2.5.5. Business Strategy
• 4.3. Top Winning Strategies by Market Players
  • 4.3.1. Merger and Acquisition
  • 4.3.2. Product Launch
  • 4.3.3. Partnership And Collaboration

5. Global Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis by Type ($ Million)

• 5.1. Semiconductor Wafer Polishing Equipment
• 5.2. Semiconductor Wafer Grinding Equipment

6. Global Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis by End-User ($ Million)

• 6.1. Foundries
• 6.2. Memory Manufacturer
• 6.3. IDMs
• 6.4. Others (Testing and Packaging Service Providers)

7. Regional Analysis

• 7.1. North American Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis - Type| End-User | Country ($ Million)
• Macroeconomic Factors for North America
  • 7.1.1. United States
  • 7.1.2. Canada
• 7.2. European Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis - Type| End-User | Country ($ Million)
• Macroeconomic Factors for Europe
  • 7.2.1. UK
  • 7.2.2. Germany
  • 7.2.3. Italy
  • 7.2.4. Spain
  • 7.2.5. France
  • 7.2.6. Russia
  • 7.2.7. Rest of Europe
• 7.3. Asia-Pacific Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis - Type| End-User | Country ($ Million)
• Macroeconomic Factors for Asia-Pacific
  • 7.3.1. China
  • 7.3.2. Japan
  • 7.3.3. South Korea
  • 7.3.4. India
  • 7.3.5. Australia & New Zealand
  • 7.3.6. ASEAN Countries (Thailand, Indonesia, Vietnam, Singapore, And Other)
  • 7.3.7. Rest of Asia-Pacific
• 7.4. Rest of the World Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis - Type| End-User | Country ($ Million)
• Macroeconomic Factors for the Rest of the World
  • 7.4.1. Latin America
  • 7.4.2. Middle East and Africa

8. Company Profiles

• 8.1. Alpsitec SAS
  • 8.1.1. Quick Facts
  • 8.1.2. Company Overview
  • 8.1.3. Product Portfolio
  • 8.1.4. Business Strategies
• 8.2. Applied Materials, Inc.
  • 8.2.1. Quick Facts
  • 8.2.2. Company Overview
  • 8.2.3. Product Portfolio
  • 8.2.4. Business Strategies
• 8.3. Axus Technology
  • 8.3.1. Quick Facts
  • 8.3.2. Company Overview
  • 8.3.3. Product Portfolio
  • 8.3.4. Business Strategies
• 8.4. Buehler Ltd.
  • 8.4.1. Quick Facts
  • 8.4.2. Company Overview
  • 8.4.3. Product Portfolio
  • 8.4.4. Business Strategies
• 8.5. Daitron Co., Ltd.
  • 8.5.1. Quick Facts
  • 8.5.2. Company Overview
  • 8.5.3. Product Portfolio
  • 8.5.4. Business Strategies
• 8.6. DISCO Corp.
  • 8.6.1. Quick Facts
  • 8.6.2. Company Overview
  • 8.6.3. Product Portfolio
  • 8.6.4. Business Strategies
• 8.7. Engis Corp.
  • 8.7.1. Quick Facts
  • 8.7.2. Company Overview
  • 8.7.3. Product Portfolio
  • 8.7.4. Business Strategies
• 8.8. Grintimate Precision Industry Co., Ltd.
  • 8.8.1. Quick Facts
  • 8.8.2. Company Overview
  • 8.8.3. Product Portfolio
  • 8.8.4. Business Strategies
• 8.9. Henan Chengyi Equipment Science and Technology Co., Ltd.
  • 8.9.1. Quick Facts
  • 8.9.2. Company Overview
  • 8.9.3. Product Portfolio
  • 8.9.4. Business Strategies
• 8.10. Herbert Arnold GmbH & Co. Kg
  • 8.10.1. Quick Facts
  • 8.10.2. Company Overview
  • 8.10.3. Product Portfolio
  • 8.10.4. Business Strategies
• 8.11. Jiangsu Jinggong Semiconductor Equipment Co., Ltd.
  • 8.11.1. Quick Facts
  • 8.11.2. Company Overview
  • 8.11.3. Product Portfolio
  • 8.11.4. Business Strategies
• 8.12. JOEN LIH MACHINERY CO., LTD.
  • 8.12.1. Quick Facts
  • 8.12.2. Company Overview
  • 8.12.3. Product Portfolio
  • 8.12.4. Business Strategies
• 8.13. JTEKT CORP.
  • 8.13.1. Quick Facts
  • 8.13.2. Company Overview
  • 8.13.3. Product Portfolio
  • 8.13.4. Business Strategies
• 8.14. Komatsu NTC Ltd.
  • 8.14.1. Quick Facts
  • 8.14.2. Company Overview
  • 8.14.3. Product Portfolio
  • 8.14.4. Business Strategies
• 8.15. Koyo Machine Industries Co. Ltd
  • 8.15.1. Quick Facts
  • 8.15.2. Company Overview
  • 8.15.3. Product Portfolio
  • 8.15.4. Business Strategies
• 8.16. Lapmaster Wolters India Pvt. Ltd.
  • 8.16.1. Quick Facts
  • 8.16.2. Company Overview
  • 8.16.3. Product Portfolio
  • 8.16.4. Business Strategies
• 8.17. Micro Engineering Inc
  • 8.17.1. Quick Facts
  • 8.17.2. Company Overview
  • 8.17.3. Product Portfolio
  • 8.17.4. Business Strategies
• 8.18. Okamoto Machine Tool Works, Ltd.
  • 8.18.1. Quick Facts
  • 8.18.2. Company Overview
  • 8.18.3. Product Portfolio
  • 8.18.4. Business Strategies
• 8.19. Proportion-Air, Inc.
  • 8.19.1. Quick Facts
  • 8.19.2. Company Overview
  • 8.19.3. Product Portfolio
  • 8.19.4. Business Strategies
• 8.20. Qingdao Gaoce Technology Co., Ltd.
  • 8.20.1. Quick Facts
  • 8.20.2. Company Overview
  • 8.20.3. Product Portfolio
  • 8.20.4. Business Strategies
• 8.21. Revasum, Inc.
  • 8.21.1. Quick Facts
  • 8.21.2. Company Overview
  • 8.21.3. Product Portfolio
  • 8.21.4. Business Strategies
• 8.22. SCREEN Semiconductor Solutions Co., Ltd.
  • 8.22.1. Quick Facts
  • 8.22.2. Company Overview
  • 8.22.3. Product Portfolio
  • 8.22.4. Business Strategies
• 8.23. SHIN NIPPON KOKI CO., LTD.
  • 8.23.1. Quick Facts
  • 8.23.2. Company Overview
  • 8.23.3. Product Portfolio
  • 8.23.4. Business Strategies
• 8.24. Tokyo Seimitsu Co., Ltd.
  • 8.24.1. Quick Facts
  • 8.24.2. Company Overview
  • 8.24.3. Product Portfolio
  • 8.24.4. Business Strategies
• 8.25. WAIDA MFG. Co., Ltd.
  • 8.25.1. Quick Facts
  • 8.25.2. Company Overview
  • 8.25.3. Product Portfolio
  • 8.25.4. Business Strategies