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半導体ウエハー研磨・研削装置の世界市場：用途別・エンドユーザー別・国別・地域別 - 産業分析、市場規模・シェア、将来予測 (2024年～2032年)

Semiconductor Wafer Polishing and Grinding Equipment Market, By Application, By End-user, By Country, and By Region - Industry Analysis, Market Size, Market Share & Forecast from 2024-2032

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英文 302 Pages
納期
2～3営業日
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半導体ウエハー研磨・研削装置の世界市場：用途別・エンドユーザー別・国別・地域別 - 産業分析、市場規模・シェア、将来予測 (2024年～2032年)
出版日: 2024年12月04日
発行: AnalystView Market Insights
ページ情報: 英文 302 Pages
納期: 2～3営業日
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  • 概要
  • 目次
概要

レポートハイライト

半導体ウエハー研磨・研削装置市場は2023年に4億960万米ドルと評価され、2024年から2032年にかけてCAGR 4.20%で拡大

半導体ウエハー研磨・研削装置の市場力学

民生用電子機器の需要の増加

民生用電子機器に対する需要の増加が、半導体ウエハー研磨・研削装置市場の成長を牽引しています。スマートフォン、タブレット、スマートホームガジェットの人気が高まるにつれ、この技術を支える革新的な半導体への需要も高まっています。これらの半導体はシリコンウエハー上で製造され、最高の性能と純度を保証するために精密な研磨と研削が必要となります。より小さく、より速く、よりエネルギー効率の高いデバイスを追求するためには、ますます複雑で高品質な半導体製造プロセスが必要となり、その結果、高度な研磨・研削装置への投資が増加しています。さらに、5GやIoTのような今後の技術が需要を押し上げています。

半導体ウエハー研磨・研削装置市場：主な考察

当社のリサーチアナリストが共有した分析によると、世界市場は予測期間（2024-2032年）に約4.20%のCAGRで毎年成長すると予測されています。

用途別に見ると、現在、300mmセグメントが半導体ウエハー研磨・研削装置市場を独占しています。

エンドユーザー別では、メモリメーカー市場が大幅に拡大すると予測されています。

地域別では、北米が2023年に最大の収益源となりました。

半導体ウエハー研磨・研削装置市場：セグメンテーション分析

世界の半導体ウエハー研磨・研削装置市場は、用途、エンドユーザー、地域によってセグメント化されます。

市場は用途によって、200mm、300mm、200mm未満の3つのセグメントに区分されます。300 mmセグメントは現在、半導体ウエハー研磨・研削装置市場を独占していますが、その主な理由は、より大きなサイズのウエハーが生産プロセスの歩留まりと効率を向上させるため、より高い厚さのウエハーに対する需要があるためです。300mmは、マイクロプロセッサーやメモリチップなど、より多くの用途で広く使用されています。したがって、需要の高い産業です。

市場はエンドユーザーによって3つのカテゴリーに分けられます：IDM、ファウンドリ、メモリメーカーです。メモリメーカー市場は、民生用電子機器から企業レベルのデータセンターまで、幅広い用途で大容量メモリと高速データ処理速度に対する需要が高まっており、評価期間中に急成長が見込まれています。DRAMやNANDフラッシュなどのメモリチップは、さまざまな電子機器の性能と動作を向上させるために不可欠です。最大限の歩留まりと性能を達成するために、これらのメモリコンポーネントは、非常に精密で信頼性の高いウエハー研磨・研削技術を用いて製造されなければなりません。クラウドコンピューティング、ビッグデータ、コネクテッドデバイスの普及といった動向に後押しされ、世界のデータ消費量とデータ生成量は増加の一途をたどっており、メモリチップの需要も高まることが予想されるため、その製造を可能にする特殊な装置の使用が必要となります。

半導体ウエハー研磨・研削装置市場：地域別分析

市場は地域別に、北米、ラテンアメリカ、欧州、アジア太平洋、中東アフリカに分るされます。これらの地域は、商業をもたらす国に基づいてさらに分割されます。現在、北米が市場を独占していますが、これは同地域に大手企業が存在するためです。さらに、車載用途におけるパワー半導体集積回路への需要の高まりや、電気インフラへの大規模な投資が、予測期間を通じて北米の市場拡大に拍車をかけています。

アジア太平洋は市場で大きく発展すると予測されます。さまざまな種類の装置への応用が増加していることが、この成長を後押ししています。さらに、ファブレス半導体産業における統合の増加は、企業がより効率的で革新的な製造技術を求めるにつれて、将来の市場成長を促進すると予想されます。

半導体ウエハー研磨・研削装置市場：競合情勢

半導体ウエハー研磨・研削装置市場は競争が激しく、多くの主要企業が業界を支配しています。主なプレーヤーには、ALLIED HIGH TECH PRODUCTS, INC.、Applied Materials Inc.、ASM International NV、Axus Technologyなどがあり、半導体製造におけるプロセス制御と歩留まり管理に注力しています。その他、ディスコやストルアスA/Sも精密研削・研磨用の専用装置を提供しています。民生用電子機器や自動車技術など、様々な用途でより高性能の半導体が求められていることが、上記の企業間の競合を後押ししています。

目次

第1章 半導体ウエハー研磨・研削装置市場の概要

  • 調査範囲
  • 市場推定期間

第2章 エグゼクティブサマリー

  • 市場内訳
  • 競合考察

第3章 半導体ウエハー研磨・研削装置の主な市場動向

  • 市場促進要因
  • 市場抑制要因
  • 市場機会
  • 市場の将来動向

第4章 半導体ウエハー研磨・研削装置市場：産業分析

  • PEST分析
  • ポーターのファイブフォース分析
  • 市場成長の見通し：マッピング
  • 規制体制の分析

第5章 半導体ウエハー研磨・研削装置市場：高まる地政学的緊張の影響

  • COVID-19パンデミックの影響
  • ロシア・ウクライナ戦争の影響
  • 中東紛争の影響

第6章 半導体ウエハー研磨・研削装置の市場情勢

  • 半導体ウエハー研磨・研削装置の市場シェア分析 (2023年)
  • 主要メーカー別の内訳データ
    • 既存企業の分析
    • 新興企業の分析

第7章 半導体ウエハー研磨・研削装置市場：用途別

  • 概要
    • セグメント別シェア分析：用途別
    • 200mm
    • 300mm
    • 200mm未満

第8章 半導体ウエハー研磨・研削装置市場：エンドユーザー別

  • 概要
    • セグメント別シェア分析：エンドユーザー別
    • IDM (垂直統合型デバイスメーカー)
    • ファウンドリ
    • メモリメーカー

第9章 半導体ウエハー研磨・研削装置市場：地域別

  • イントロダクション
  • 北米
    • 概要
    • 北米の主要メーカー
    • 米国
    • カナダ
  • 欧州
    • 概要
    • 欧州の主要メーカー
    • ドイツ
    • イタリア
    • 英国
    • フランス
    • ロシア
    • オランダ
    • スウェーデン
    • ポーランド
    • その他
  • アジア太平洋（APAC）
    • 概要
    • アジア太平洋の主要メーカー
    • インド
    • 中国
    • 日本
    • 韓国
    • オーストラリア
    • タイ
    • インドネシア
    • フィリピン
    • その他
  • ラテンアメリカ
    • 概要
    • ラテンアメリカの主要メーカー
    • ブラジル
    • メキシコ
    • アルゼンチン
    • コロンビア
    • その他
  • 中東・アフリカ
    • 概要
    • 中東・アフリカの主要メーカー
    • サウジアラビア
    • アラブ首長国連邦
    • イスラエル
    • トルコ
    • アルジェリア
    • エジプト
    • その他

第10章 主要ベンダー分析：半導体ウエハー研磨・研削装置業界

  • 競合ダッシュボード
    • 競合ベンチマーク
    • 競合ポジショニング
  • 企業プロファイル
    • ALLIED HIGH TECH PRODUCTS, INC
    • Applied Materials Inc
    • ASM International NV
    • Axus Technology
    • G and N GmbH
    • Gigamat Technologies Inc
    • KLA Corp
    • Lapmaster Wolters
    • DISCO Corp
    • Logitech Ltd.
    • Okamoto Corp
    • S Cubed
    • Revasum Inc
    • S3 Alliance
    • Tokyo Electron Ltd
    • TOKYO SEIMITSU CO. LTD
    • ULTRA TEC Manufacturing Inc
    • Amtech Systems Inc.
    • UNITED GRINDING North America, Inc.
    • Ebara Corp.
    • Others

第11章 AnalystViewの全方位的分析

目次
Product Code: ANV4491

REPORT HIGHLIGHT

The Semiconductor Wafer Polishing and Grinding Equipment Market was valued at USD 409.6 million in 2023 and expanded at a CAGR of 4.20% from 2024 to 2032.

Semiconductor wafer polishing and grinding equipment are used during the semiconductor wafer manufacturing process to obtain the needed surface flatness and smoothness. This equipment removes defects and prepares wafers for subsequent processing and manufacture of semiconductor devices.

Semiconductor Wafer Polishing and Grinding Equipment Market- Market Dynamics

Increasing demand for consumer electronics

Increased demand for consumer electronics is driving the growth of the Semiconductor Wafer Polishing and Grinding Equipment Market. As the popularity of smartphones, tablets, and smart home gadgets grows, so does the demand for innovative semiconductors that power this technology. These semiconductors are made on silicon wafers, which require precision polishing and grinding to assure peak performance and purity. The push for smaller, quicker, and more energy-efficient devices necessitates increasingly complex and high-quality semiconductor production processes, resulting in increased investment in advanced polishing and grinding equipment. Furthermore, upcoming technologies like as 5G and IoT drive up demand.

Semiconductor Wafer Polishing and Grinding Equipment Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 4.20% over the forecast period (2024-2032)

Based on Application segmentation, the 300 mm segment currently dominates the Semiconductor Wafer Polishing and Grinding Equipment Market.

Based on End-user segmentation, The memory manufacturers' market is predicted to increase substantially.

In terms of region, North America was the largest revenue generator in 2023.

Semiconductor Wafer Polishing and Grinding Equipment Market- Segmentation Analysis:

The Global Semiconductor Wafer Polishing and Grinding Equipment Market is segmented on the basis of Application, End-user, and Region.

The market is segmented into three segments according to application: 200 mm, 300 mm, and Less than 200 mm. The 300 mm segment currently dominates the Semiconductor Wafer Polishing and Grinding Equipment Market mainly because of the demand for wafers in higher thicknesses, as larger-sized wafers ensure improved yields and efficiency in production processes. The 300 mm is widely used in more applications, such as microprocessors, memory chips, etc. Hence, it is a highly in-demand industry.

The market is divided into three categories based on End-user: IDM, Foundries, and Memory manufacturers. The memory manufacturers market is expected to grow rapidly over the assessment period, driven by rising demand for bigger memory capacity and quicker data processing rates in a wide range of applications, from consumer electronics to enterprise-level data centres. Memory chips, such as DRAM and NAND flash, are essential for improving the performance and operation of different electronic devices. To achieve maximum yield and performance, these memory components must be manufactured using very precise and dependable wafer polishing and grinding techniques. Global data consumption and generation continue to rise, fueled by trends such as cloud computing, big data, and the proliferation of connected devices, and the demand for memory chips is expected to rise, necessitating the use of specialised equipment to enable their manufacturing.

Semiconductor Wafer Polishing and Grinding Equipment Market- Geographical Insights

Geographically, this market is distributed over North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa. These regions are further split based on the nations bringing commerce. North America currently dominates the market, owing to the presence of significant industry players in the area. Furthermore, rising demand for power semiconductor integrated circuits in automotive applications, as well as major investments in electric infrastructure, are likely to fuel market expansion in North America throughout the forecast period.

Asia-Pacific is predicted to develop significantly in the market. The rising number of applications for various equipment kinds drives this growth. Furthermore, increasing consolidation in the fabless semiconductor industry is expected to drive market growth in the future years as companies seek more efficient and innovative manufacturing techniques.

Semiconductor Wafer Polishing and Grinding Equipment Market- Competitive Landscape:

The Semiconductor Wafer Polishing and Grinding Equipment market is highly competitive, with a number of key players dominating the industry. Major players include ALLIED HIGH TECH PRODUCTS, INC, Applied Materials Inc., ASM International NV, and Axus Technology, which focus on process control and yield management in semiconductor fabrication. Other companies like DISCO Corporation and Struers A/S also offer specialised equipment for precision grinding and polishing. The requirements of higher performance semiconductors in various applications - such as consumer electronics and automotive technologies - drive the competition among the players listed above.

Recent Developments:

In March 2023, DISCO Corporation, a supplier of semiconductor production equipment, invented a completely automated dicing saw that supports 8-inch wafers, which is now available on the market.

SCOPE OF THE REPORT

This report's scope includes the following important market segments:

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

  • ALLIED HIGH-TECH PRODUCTS, INC
  • Applied Materials Inc
  • ASM International NV
  • Axus Technology
  • G and N GmbH
  • Gigamat Technologies Inc
  • KLA Corp
  • Lapmaster Wolters
  • DISCO Corp
  • Logitech Ltd.
  • Okamoto Corp
  • S Cubed
  • Revasum Inc
  • S3 Alliance
  • Tokyo Electron Ltd
  • TOKYO SEIMITSU CO. LTD
  • ULTRA TEC Manufacturing Inc
  • Amtech Systems Inc.
  • UNITED GRINDING North America, Inc.
  • Ebara Corp.
  • Others

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET, BY APPLICATION- MARKET ANALYSIS, 2019 - 2032

  • 200 mm
  • 300 mm
  • Less than 200 mm

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET, BY END-USER- MARKET ANALYSIS, 2019 - 2032

  • IDM
  • Foundries
  • Memory manufacturers

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032

  • North America
  • The U.S.
  • Canada
  • Europe
  • Germany
  • France
  • Italy
  • Spain
  • United Kingdom
  • Russia
  • Netherlands
  • Sweden
  • Poland
  • Rest of Europe
  • Asia Pacific
  • India
  • China
  • South Korea
  • Japan
  • Australia
  • Thailand
  • Indonesia
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • United Arab Emirates
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Semiconductor Wafer Polishing and Grinding Equipment Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by Application
    • 2.1.2. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by End-user
    • 2.1.3. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by Country
    • 2.1.4. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by Region
  • 2.2. Competitive Insights

3. Semiconductor Wafer Polishing and Grinding Equipment Key Market Trends

  • 3.1. Semiconductor Wafer Polishing and Grinding Equipment Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Semiconductor Wafer Polishing and Grinding Equipment Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Semiconductor Wafer Polishing and Grinding Equipment Market Opportunities
  • 3.4. Semiconductor Wafer Polishing and Grinding Equipment Market Future Trends

4. Semiconductor Wafer Polishing and Grinding Equipment Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Semiconductor Wafer Polishing and Grinding Equipment Market: Impact of Escalating Geopolitical Tensions

  • 5.1. Impact of COVID-19 Pandemic
  • 5.2. Impact of Russia-Ukraine War
  • 5.3. Impact of Middle East Conflicts

6. Semiconductor Wafer Polishing and Grinding Equipment Market Landscape

  • 6.1. Semiconductor Wafer Polishing and Grinding Equipment Market Share Analysis, 2023
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Semiconductor Wafer Polishing and Grinding Equipment Market - By Application

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Application, 2023 & 2032 (%)
    • 7.1.2. 200 mm
    • 7.1.3. 300 mm
    • 7.1.4. Less than 200 mm

8. Semiconductor Wafer Polishing and Grinding Equipment Market - By End-user

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By End-user, 2023 & 2032 (%)
    • 8.1.2. IDM
    • 8.1.3. Foundries
    • 8.1.4. Memory manufacturers

9. Semiconductor Wafer Polishing and Grinding Equipment Market- By Geography

  • 9.1. Introduction
    • 9.1.1. Segment Share Analysis, By Geography, 2023 & 2032 (%)
  • 9.2. North America
    • 9.2.1. Overview
    • 9.2.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in North America
    • 9.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.2.4. North America Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.2.5. North America Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.2.6. U.S.
      • 9.2.6.1. Overview
      • 9.2.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.2.6.3. U.S. Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.2.6.4. U.S. Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.2.7. Canada
      • 9.2.7.1. Overview
      • 9.2.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.2.7.3. Canada Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.2.7.4. Canada Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.3. Europe
    • 9.3.1. Overview
    • 9.3.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Europe
    • 9.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.3.4. Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.3.5. Europe Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.6. Germany
      • 9.3.6.1. Overview
      • 9.3.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.6.3. Germany Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.6.4. Germany Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.7. Italy
      • 9.3.7.1. Overview
      • 9.3.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.7.3. Italy Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.7.4. Italy Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.8. United Kingdom
      • 9.3.8.1. Overview
      • 9.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.8.3. United Kingdom Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.8.4. United Kingdom Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.9. France
      • 9.3.9.1. Overview
      • 9.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.9.3. France Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.9.4. France Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.10. Russia
      • 9.3.10.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.10.2. Russia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.10.3. Russia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.11. Netherlands
      • 9.3.11.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.11.2. Netherlands Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.11.3. Netherlands Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.12. Sweden
      • 9.3.12.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.12.2. Sweden Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.12.3. Sweden Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.13. Poland
      • 9.3.13.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.13.2. Poland Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.13.3. Poland Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.14. Rest of Europe
      • 9.3.14.1. Overview
      • 9.3.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.14.3. Rest of the Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.14.4. Rest of the Europe Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.4. Asia Pacific (APAC)
    • 9.4.1. Overview
    • 9.4.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Asia Pacific
    • 9.4.3. Asia Pacific Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.4.4. Asia Pacific Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.4.5. Asia Pacific Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.6. India
      • 9.4.6.1. Overview
      • 9.4.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.6.3. India Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.6.4. India Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.7. China
      • 9.4.7.1. Overview
      • 9.4.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.7.3. China Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.7.4. China Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.8. Japan
      • 9.4.8.1. Overview
      • 9.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.8.3. Japan Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.8.4. Japan Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.9. South Korea
      • 9.4.9.1. Overview
      • 9.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.9.3. South Korea Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.9.4. South Korea Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.10. Australia
      • 9.4.10.1. Overview
      • 9.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.10.3. Australia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.10.4. Australia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.11. Thailand
      • 9.4.11.1. Overview
      • 9.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.11.3. Thailand Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.11.4. Thailand Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.12. Indonesia
      • 9.4.12.1. Overview
      • 9.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.12.3. Indonesia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.12.4. Indonesia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.13. Philippines
      • 9.4.13.1. Overview
      • 9.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.13.3. Philippines Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.13.4. Philippines Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.14. Rest of APAC
      • 9.4.14.1. Overview
      • 9.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.14.3. Rest of APAC Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.14.4. Rest of APAC Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.5. Latin America
    • 9.5.1. Overview
    • 9.5.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Latin America
    • 9.5.3. Latin America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.5.4. Latin America Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.5.5. Latin America Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.6. Brazil
      • 9.5.6.1. Overview
      • 9.5.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.6.3. Brazil Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.6.4. Brazil Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.7. Mexico
      • 9.5.7.1. Overview
      • 9.5.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.7.3. Mexico Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.7.4. Mexico Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.8. Argentina
      • 9.5.8.1. Overview
      • 9.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.8.3. Argentina Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.8.4. Argentina Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.9. Colombia
      • 9.5.9.1. Overview
      • 9.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.9.3. Colombia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.9.4. Colombia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.10. Rest of LATAM
      • 9.5.10.1. Overview
      • 9.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.10.3. Rest of LATAM Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.10.4. Rest of LATAM Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.6. Middle East and Africa
    • 9.6.1. Overview
    • 9.6.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Middle East and Africa
    • 9.6.3. Middle East and Africa Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.6.4. Middle East and Africa Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.6.5. Middle East and Africa Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.6. Saudi Arabia
      • 9.6.6.1. Overview
      • 9.6.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.6.3. Saudi Arabia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.6.4. Saudi Arabia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.7. United Arab Emirates
      • 9.6.7.1. Overview
      • 9.6.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.7.3. United Arab Emirates Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.7.4. United Arab Emirates Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.8. Israel
      • 9.6.8.1. Overview
      • 9.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.8.3. Israel Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.8.4. Israel Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.9. Turkey
      • 9.6.9.1. Overview
      • 9.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.9.3. Turkey Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.9.4. Turkey Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.10. Algeria
      • 9.6.10.1. Overview
      • 9.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.10.3. Algeria Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.10.4. Algeria Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.11. Egypt
      • 9.6.11.1. Overview
      • 9.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.11.3. Egypt Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.11.4. Egypt Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.12. Rest of MEA
      • 9.6.12.1. Overview
      • 9.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.12.3. Rest of MEA Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.12.4. Rest of MEA Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)

10. Key Vendor Analysis- Semiconductor Wafer Polishing and Grinding Equipment Industry

  • 10.1. Competitive Dashboard
    • 10.1.1. Competitive Benchmarking
    • 10.1.2. Competitive Positioning
  • 10.2. Company Profiles
    • 10.2.1. ALLIED HIGH TECH PRODUCTS, INC
    • 10.2.2. Applied Materials Inc
    • 10.2.3. ASM International NV
    • 10.2.4. Axus Technology
    • 10.2.5. G and N GmbH
    • 10.2.6. Gigamat Technologies Inc
    • 10.2.7. KLA Corp
    • 10.2.8. Lapmaster Wolters
    • 10.2.9. DISCO Corp
    • 10.2.10. Logitech Ltd.
    • 10.2.11. Okamoto Corp
    • 10.2.12. S Cubed
    • 10.2.13. Revasum Inc
    • 10.2.14. S3 Alliance
    • 10.2.15. Tokyo Electron Ltd
    • 10.2.16. TOKYO SEIMITSU CO. LTD
    • 10.2.17. ULTRA TEC Manufacturing Inc
    • 10.2.18. Amtech Systems Inc.
    • 10.2.19. UNITED GRINDING North America, Inc.
    • 10.2.20. Ebara Corp.
    • 10.2.21. Others

11. 360 Degree Analyst View

12. Appendix

  • 12.1. Research Methodology
  • 12.2. References
  • 12.3. Abbreviations
  • 12.4. Disclaimer
  • 12.5. Contact Us