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半導体ウエハー研磨/研削装置市場レポート：タイプ別、エンドユーザー別、地域別、2025年～2033年

Semiconductor Wafer Polishing and Grinding Equipment Market Report by Type (Semiconductor Wafer Polishing Equipment, Semiconductor Wafer Grinding Equipment), End User (Foundries, Memory Manufacturers, IDMs, and Others), and Region 2025-2033

出版日
発行
IMARC
ページ情報
英文 138 Pages
納期
2～3営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=146.06円
半導体ウエハー研磨/研削装置市場レポート：タイプ別、エンドユーザー別、地域別、2025年～2033年
出版日: 2025年06月02日
発行: IMARC
ページ情報: 英文 138 Pages
納期: 2～3営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 図表
  • 目次
概要

半導体ウエハー研磨/研削装置の世界市場規模は2024年に4億5,070万米ドルに達しました。今後、IMARC Groupは、2033年には6億7,180万米ドルに達し、2025～2033年の成長率（CAGR）は4.31％になると予測しています。スマートフォン、ノートパソコン、タブレットなどの家電製品の需要増加、個人のライフスタイルの変化による電気自動車（EV）の普及拡大、データセンターの拡大、技術の進歩などが市場成長を後押ししています。

研磨/研削装置とは、半導体ウエハーを製造する際に一般的に使用される、高度で不可欠な部品を指します。これらの装置には、蒸着、リソグラフィ、イオン注入、エッチング、洗浄などの標準的な方法が含まれ、金属組織学的ツール、ディスク仕上げ、ラップ盤などの支援を受けて行われます。半導体ウエハー研磨/研削装置は、平滑で損傷のない表面を確保しながら、フィルムから不要な物質を除去し、製品を薄くして精製するのに役立ちます。このような特性から、鋳造メーカーやメモリーメーカーが集積回路を構成するために広く利用しています。

半導体ウエハー研磨/研削装置市場動向：

コンシューマーエレクトロニクス向け需要の増加

スマートフォン、ノートパソコン、ウェアラブル端末など、コンシューマーエレクトロニクスの普及が進んでおり、半導体ウエハー研磨/研削装置市場の見通しは良好です。人々はよりパワフルでコンパクト、かつエネルギー効率の高いデバイスを常に求めており、性能要求を満たすには高度な半導体が必要です。ライフスタイルの変化により、人々は家電製品を購入するようになりました。これらのデバイスは、時間を節約しながら、困難で多くの作業を容易にします。これを実現するために、メーカーは精密な研削と研磨工程によって可能になる、超薄型で滑らかなウェハーに依存しています。エレクトロニクスが小型化するにつれ、ウェーハの欠陥の公差は厳しくなり、高品質の表面加工が不可欠となっています。これに伴い、スマートデバイスの増加が半導体ウエハー研磨/研削装置市場の需要を喚起しています。さらに、次世代エレクトロニクスの生産拡大により、半導体性能を最適化するためにウエハー表面の微細化が必要となっています。

半導体技術の進歩

半導体技術の継続的な進歩、特に人工知能（AI）、第5世代（5G）、モノのインターネット（IoT）などの分野が市場の成長を支えています。これらの最先端アプリケーションでは、高性能、低消費電力、小型の半導体が必要とされるが、これは超平滑で欠陥のないウエハーを製造することによってのみ達成できます。システムオンチップ（SoC）設計や小型ノードアーキテクチャのような新技術は、適切な電気的性能を確保するために極めて精密なウエハー厚さと表面品質を必要とし、これが半導体ウエハー研磨/研削装置の市場規模を拡大させています。先端半導体技術には、複雑な多層構造や3次元（3D）積層も含まれるため、必要な平坦性と平面性を達成するためにウエハーの薄型化と研磨が必要になります。このような半導体設計の複雑化は、最新の電子機器に要求される厳しい品質基準を満たすための高精度研磨/研削装置の需要に直接影響します。

自動車用エレクトロニクスの成長

特に電気自動車（EV）、自律走行技術、ADAS（先進運転支援システム）の台頭により、自動車用エレクトロニクスの使用が拡大していることが、半導体ウエハー研磨/研削装置市場の成長を後押ししています。これに加え、最新の自動車は、ナビゲーション、安全システム、バッテリー管理、インフォテインメントなどの重要な機能で半導体に大きく依存しています。自動車産業が電動化やインテリジェントな運転システムにシフトするにつれ、高性能で耐久性があり、効率的な半導体部品への需要が高まっています。自動車用半導体は、しばしば厳しい信頼性と熱安定性の基準を満たす必要があり、研磨や研削によって製造される高品質のウエハー表面が必要とされます。これとは別に、軽量でエネルギー効率に優れた車載設計へのニーズの高まりが、有利な半導体ウエハー研磨/研削装置市場予測をもたらしています。

目次

第1章 序文

第2章 調査範囲と調査手法

  • 調査の目的
  • ステークホルダー
  • データソース
    • 一次情報
    • 二次情報
  • 市場推定
    • ボトムアップアプローチ
    • トップダウンアプローチ
  • 調査手法

第3章 エグゼクティブサマリー

第4章 イントロダクション

  • 概要
  • 主要業界動向

第5章 世界の半導体ウエハー研磨/研削装置市場

  • 市場概要
  • 市場実績
  • COVID-19の影響
  • 市場予測

第6章 市場内訳：タイプ別

  • 半導体ウエハー研磨装置
  • 半導体ウエハー研削装置

第7章 市場内訳：エンドユーザー別

  • ファウンドリ
  • メモリメーカー
  • IDM
  • その他

第8章 市場内訳：地域別

  • 北米
    • 米国
    • カナダ
  • アジア太平洋地域
    • 中国
    • 日本
    • インド
    • 韓国
    • オーストラリア
    • インドネシア
    • その他
  • 欧州
    • ドイツ
    • フランス
    • 英国
    • イタリア
    • スペイン
    • ロシア
    • その他
  • ラテンアメリカ
    • ブラジル
    • メキシコ
    • その他
  • 中東・アフリカ
    • 市場内訳：国別

第9章 SWOT分析

  • 概要
  • 強み
  • 弱み
  • 機会
  • 脅威

第10章 バリューチェーン分析

第11章 ポーターのファイブフォース分析

  • 概要
  • 買い手の交渉力
  • 供給企業の交渉力
  • 競合の程度
  • 新規参入業者の脅威
  • 代替品の脅威

第12章 価格分析

第13章 競合情勢

  • 市場構造
  • 主要企業
  • 主要企業のプロファイル
    • Accretech（Europe）Gmbh（Tokyo Seimitsu Co. Ltd.）
    • Amtech Systems Inc.
    • Axus Technology
    • BBS Kinmei Co Ltd
    • Disco Corporation
    • Dynavest Pte Ltd
    • Ebara Corporation
    • Gigamat Technologies Inc.
    • Lapmaster Wolters GmbH（Lapmaster International LLC）
    • Logitech Ltd.
    • Okamoto Machine Tool Works Ltd
    • Revasum Inc.
図表

List of Figures

  • Figure 1: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Major Drivers and Challenges
  • Figure 2: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019-2024
  • Figure 3: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 4: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Type (in %), 2024
  • Figure 5: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by End User (in %), 2024
  • Figure 6: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Region (in %), 2024
  • Figure 7: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Polishing Equipment) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 8: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Polishing Equipment) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 9: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Grinding Equipment) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 10: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Grinding Equipment) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 11: Global: Semiconductor Wafer Polishing and Grinding Equipment (Foundries) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 12: Global: Semiconductor Wafer Polishing and Grinding Equipment (Foundries) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 13: Global: Semiconductor Wafer Polishing and Grinding Equipment (Memory Manufacturers) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 14: Global: Semiconductor Wafer Polishing and Grinding Equipment (Memory Manufacturers) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 15: Global: Semiconductor Wafer Polishing and Grinding Equipment (IDMs) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 16: Global: Semiconductor Wafer Polishing and Grinding Equipment (IDMs) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 17: Global: Semiconductor Wafer Polishing and Grinding Equipment (Other End Users) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 18: Global: Semiconductor Wafer Polishing and Grinding Equipment (Other End Users) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 19: North America: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 20: North America: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 21: United States: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 22: United States: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 23: Canada: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 24: Canada: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 25: Asia-Pacific: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 26: Asia-Pacific: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 27: China: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 28: China: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 29: Japan: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 30: Japan: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 31: India: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 32: India: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 33: South Korea: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 34: South Korea: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 35: Australia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 36: Australia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 37: Indonesia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 38: Indonesia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 39: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 40: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 41: Europe: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 42: Europe: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 43: Germany: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 44: Germany: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 45: France: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 46: France: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 47: United Kingdom: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 48: United Kingdom: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 49: Italy: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 50: Italy: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 51: Spain: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 52: Spain: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 53: Russia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 54: Russia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 55: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 56: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 57: Latin America: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 58: Latin America: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 59: Brazil: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 60: Brazil: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 61: Mexico: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 62: Mexico: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 63: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 64: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 65: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 66: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Country (in %), 2024
  • Figure 67: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 68: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: SWOT Analysis
  • Figure 69: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: Value Chain Analysis
  • Figure 70: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Key Industry Highlights, 2024 and 2033
  • Table 2: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by Type (in Million USD), 2025-2033
  • Table 3: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by End User (in Million USD), 2025-2033
  • Table 4: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by Region (in Million USD), 2025-2033
  • Table 5: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Competitive Structure
  • Table 6: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Key Players
目次
Product Code: SR112025A5866

The global semiconductor wafer polishing and grinding equipment market size reached USD 450.7 Million in 2024. Looking forward, IMARC Group expects the market to reach USD 671.8 Million by 2033, exhibiting a growth rate (CAGR) of 4.31% during 2025-2033. The rising demand for consumer electronics like smartphones, laptops, and tablets, increasing adoption of electric vehicles (EVs) on account of changing lifestyles of individuals, expansion of data centers, and technological advancements are propelling the market growth.

Polishing and grinding equipment refer to advanced, indispensable components generally used while fabricating semiconductor wafers. They involve deposition, lithography, Ion implant, etching, and cleaning as some of the standard methods performed with the assistance of metallographic tools, disc finishing, and lapping machines. Semiconductor wafer polishing and grinding equipment aid in removing unwarranted material from a film and thinning and refining the product while ensuring a smooth and damage-free surface. On account of these properties, they are extensively utilized by foundries and memory manufacturers for composing integrated circuits.

Semiconductor Wafer Polishing and Grinding Equipment Market Trends:

Increasing Demand for Consumer Electronics

The growing adoption of consumer electronics, such as smartphones, laptops, and wearables, is offering a favorable semiconductor wafer polishing and grinding equipment market outlook. People are constantly seeking more powerful, compact, and energy-efficient devices, which require advanced semiconductors to meet performance demands. They are purchasing consumer electronics owing to their changing lifestyles. These devices make their difficult and numerous task easier while saving time. To achieve this, manufacturers rely on ultra-thin and smooth wafers, made possible through precise grinding and polishing processes. As electronics become smaller, the tolerances for imperfections in wafers tighten, making high-quality surface processing essential. In line with this, the increasing number of smart devices is catalyzing the semiconductor wafer polishing and grinding equipment market demand. Furthermore, the growing production of next-gen electronics requires the need for wafer surface refinement to optimize semiconductor performance.

Advancements in Semiconductor Technology

The continuous advancement in semiconductor technology, especially in areas like artificial intelligence (AI), fifth generation (5G), and the Internet of Things (IoT), is supporting the market growth. These cutting-edge applications require semiconductors with higher performance, lower power consumption, and smaller sizes, which can only be achieved by manufacturing ultra-smooth and defect-free wafers. New technologies like system-on-chip (SoC) designs and smaller node architectures need extremely precise wafer thickness and surface quality to ensure proper electrical performance, which is leading to a positive semiconductor wafer polishing and grinding equipment market scope. Advanced semiconductor technologies also involve complex multilayer structures and three dimensional (3D) stacking, which necessitate wafer thinning and polishing to achieve the necessary flatness and planarity. This increasing complexity in semiconductor designs directly impacts the demand for high-precision grinding and polishing equipment to meet the stringent quality standards required for modern electronic devices.

Growth in Automotive Electronics

The expanding use of electronics in vehicles, particularly with the rise of electric vehicles (EVs), autonomous driving technologies, and advanced driver-assistance systems (ADAS), is bolstering the semiconductor wafer polishing and grinding equipment market growth. In addition to this, modern automobiles rely heavily on semiconductors for critical functions like navigation, safety systems, battery management, and infotainment. As the automotive industry shifts towards electrification and intelligent driving systems, the demand for high-performance, durable, and efficient semiconductor components increases. Automotive semiconductors often need to meet stringent reliability and thermal stability standards, which require high-quality wafer surfaces produced through polishing and grinding. Apart from this, the growing need for lightweight and energy-efficient automotive designs is offering a favorable semiconductor wafer polishing and grinding equipment market forecast.

Semiconductor Wafer Polishing and Grinding Equipment Market Segmentation:

Breakup by Type:

  • Semiconductor Wafer Polishing Equipment
  • Semiconductor Wafer Grinding Equipment

Breakup by End User:

  • Foundries
  • Memory Manufacturers
  • IDMs
  • Others

Breakup by Region:

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Others
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Others
  • Latin America
    • Brazil
    • Mexico
    • Others
  • Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.), Amtech Systems Inc., Axus Technology, BBS Kinmei Co Ltd, Disco Corporation, Dynavest Pte Ltd, Ebara Corporation, Gigamat Technologies Inc., Lapmaster Wolters GmbH (Lapmaster International LLC), Logitech Ltd., Okamoto Machine Tool Works Ltd and Revasum Inc.

Key Questions Answered in This Report:

  • How has the global semiconductor wafer polishing and grinding equipment market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global semiconductor wafer polishing and grinding equipment market?
  • What are the key regional markets?
  • What is the breakup of the market based on the type?
  • What is the breakup of the market based on the end user?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global semiconductor wafer polishing and grinding equipment market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Semiconductor Wafer Polishing and Grinding Equipment Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Semiconductor Wafer Polishing Equipment
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Semiconductor Wafer Grinding Equipment
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by End User

  • 7.1 Foundries
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Memory Manufacturers
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 IDMs
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Others
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.)
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
    • 13.3.2 Amtech Systems Inc.
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 Financials
    • 13.3.3 Axus Technology
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
    • 13.3.4 BBS Kinmei Co Ltd
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
    • 13.3.5 Disco Corporation
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
    • 13.3.6 Dynavest Pte Ltd
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
    • 13.3.7 Ebara Corporation
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
      • 13.3.7.4 SWOT Analysis
    • 13.3.8 Gigamat Technologies Inc.
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
    • 13.3.9 Lapmaster Wolters GmbH (Lapmaster International LLC)
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
    • 13.3.10 Logitech Ltd.
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
    • 13.3.11 Okamoto Machine Tool Works Ltd
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
    • 13.3.12 Revasum Inc.
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio
      • 13.3.12.3 Financials