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市場調査レポート
商品コード
1450088
半導体ウエハー研磨・研削装置の世界市場 2024-2028Global Semiconductor Wafer Polishing and Grinding Equipment Market 2024-2028 |
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カスタマイズ可能
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半導体ウエハー研磨・研削装置の世界市場 2024-2028 |
出版日: 2024年02月28日
発行: TechNavio
ページ情報: 英文 172 Pages
納期: 即納可能
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半導体ウエハー研磨・研削装置市場は2023-2028年に4億4,201万米ドル、予測期間中のCAGRは4.06%で成長すると予測されます。
当レポートでは、半導体ウエハー研磨・研削装置市場の全体的な分析、市場規模・予測、動向、成長促進要因、課題、約25のベンダーを網羅したベンダー分析などを掲載しています。
現在の市場シナリオ、最新動向と促進要因、市場環境全体に関する最新分析を提供しています。市場は、半導体部品の小型化、新規製造工場への投資拡大、エンドユーザーの長期顧客に対する優遇措置や割引などが牽引しています。
市場範囲 | |
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基準年 | 2024 |
終了年 | 2028 |
予測期間 | 2024-2028 |
成長モメンタム | 加速 |
前年比2024年 | 3.94% |
CAGR | 4.06% |
増分額 | 4億4,201万米ドル |
本調査では、今後数年間の半導体ウエハー研磨・研削装置市場成長を牽引する主な要因の1つとしてNEMS利用の増加を挙げています。また、ULSIの成長と3D構造への移行が市場の大きな需要につながります。
Exhibits:
The semiconductor wafer polishing and grinding equipment market is forecasted to grow by USD 442.01 mn during 2023-2028, accelerating at a CAGR of 4.06% during the forecast period. The report on the semiconductor wafer polishing and grinding equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by emergence of miniaturized semiconductor components, growing investment in new fabrication plants, and incentives and discounts for long-term customers of end-users.
Technavio's semiconductor wafer polishing and grinding equipment market is segmented as below:
Market Scope | |
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Base Year | 2024 |
End Year | 2028 |
Series Year | 2024-2028 |
Growth Momentum | Accelerate |
YOY 2024 | 3.94% |
CAGR | 4.06% |
Incremental Value | $442.01mn |
By Application
By End-user
By Geographical Landscape
This study identifies the increasing use of NEMS as one of the prime reasons driving the semiconductor wafer polishing and grinding equipment market growth during the next few years. Also, growth of ULSI and transition toward 3D structures will lead to sizable demand in the market.
The report on the semiconductor wafer polishing and grinding equipment market covers the following areas:
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor wafer polishing and grinding equipment market vendors that include ALLIED HIGH TECH PRODUCTS, INC, Amtech Systems Inc., Applied Materials Inc., ASM International NV, Axus Technology, DISCO Corp., G and N GmbH, Gigamat Technologies Inc, KLA Corp., Lapmaster Wolters, Logitech Ltd., Okamoto Corp, Revasum Inc., S Cubed, S3 Alliance., Tokyo Electron Ltd., TOKYO SEIMITSU CO. LTD, ULTRA TEC Manufacturing Inc., UNITED GRINDING North America, Inc., and Ebara Corp.. Also, the semiconductor wafer polishing and grinding equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.