市場調査レポート
商品コード
1263833

半導体組立・検査受託の世界市場 (2023-2028年):動向・成長機会・競合分析

Outsourced Semiconductor Assembly and Testing Market: Trends, Opportunities and Competitive Analysis [2023-2028]

出版日: | 発行: Lucintel | ページ情報: 英文 150 Pages | 納期: 3営業日

● お客様のご希望に応じて、既存データの加工や未掲載情報(例:国別セグメント)の追加などの対応が可能です。  詳細はお問い合わせください。

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=154.09円

ご注意: DRM (デジタル著作権管理システム) 付PDFになります。
制限内容は、上記ライセンスの[詳細]アイコンをクリックしてご確認ください。

半導体組立・検査受託の世界市場 (2023-2028年):動向・成長機会・競合分析
出版日: 2023年03月01日
発行: Lucintel
ページ情報: 英文 150 Pages
納期: 3営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

世界の半導体組立・検査受託の市場規模は、2023年から2028年にかけて6.3%のCAGRで推移し、2028年には368億米ドルの規模に成長すると予測されています。

より高機能で高レベルなパフォーマンスを提供するためのエレクトロニクス製品への半導体コンテンツの組み込みの増加、スマートフォンやインターネットコネクテッドデバイスの需要の増加、セーフティ、ナビゲーション、燃費、排出低減、エンターテインメントシステムなどのための自動車内の電子コンテンツの増加などの要因が同市場の成長を推進しています。

当レポートでは、世界の半導体組立・検査受託の市場を調査し、市場背景・概要、市場影響因子の分析、市場規模の推移・予測、各種区分・地域/主要国別の内訳、競合情勢、成長機会・戦略分析、主要企業のプロファイルなどをまとめています。

目次

第1章 エグゼクティブサマリー

第2章 世界の半導体組立・検査受託市場:市場力学

  • イントロダクション・背景・分類
  • サプライチェーン
  • 産業の推進因子と課題

第3章 市場動向・予測分析

  • マクロ経済の動向・予測
  • 世界の半導体組立・検査受託市場の動向・予測
  • 世界の半導体組立・検査受託市場:サービスタイプ別
    • 組立て・パッケージング
    • 検査
  • 世界の半導体組立・検査受託市場:パッケージタイプ別
    • ワイヤーボンド
    • フリップチップ
    • ウエハレベル
    • その他
  • 世界の半導体組立・検査受託市場:用途別
    • 自動車
    • 通信
    • コンピューティング・ネットワーキング
    • CE製品
    • 工業

第4章 市場動向・予測分析:地域別

  • 世界の半導体組立・検査受託市場:地域別
  • 北米
  • 欧州
  • アジア太平洋
  • その他の地域

第5章 競合企業の分析

  • 製品ポートフォリオ分析
  • 運用統合
  • ポーターのファイブフォース分析

第6章 成長機会と戦略分析

  • 成長機会分析
  • 新たな動向
  • 戦略分析

第7章 主要企業プロファイル

  • Advanced Semiconductor
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries
  • PTI(Powertech Technology Inc.)
  • United test and assembly center
  • King Yuan Electronics
  • ChipMOS
目次

Outsourced Semiconductor Assembly and Testing Market Trends and Forecast

The future of the global outsourced semiconductor assembly and testing (OSAT) market looks promising with opportunities in the automotive, telecommunication, computing & networking, consumer electronic, and industrial industries. The global outsourced semiconductor assembly and testing market is expected to reach an estimated $36.8 billion by 2028 with a CAGR of 6.3% from 2023 to 2028. The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Outsourced Semiconductor Assembly and Testing Market (OSAT) by Segment

The study includes a forecast for the global outsourced semiconductor assembly and testing market by service type, packaging type, application, and region, as follows:

OSAT Market by Service Type [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Assembly & Packaging
  • Testing

OSAT Market by Packaging Type [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Wire Bond
  • Flip Chip
  • Wafer Level
  • Others

OSAT Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Automotive
  • Telecommunications
  • Computing & Networking
  • Consumer Electronics
  • Industrial

OSAT Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Outsourced Semiconductor Assembly and Testing (OSAT) Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies outsourced semiconductor assembly and testing companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the outsourced semiconductor assembly and testing companies profiled in this report includes.

  • Advanced Semiconductor
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries
  • PTI (Powertech Technology Inc.)
  • United test and assembly center
  • King Yuan Electronics
  • ChipMOS

OSAT Market Insights

  • Lucintel forecast that assembly & packaging will remain the largest segment over the forecast period due to growing demand for telecom infrastructure and electronic products across the globe.
  • Within this market, consumer electronics segment is projected to record the highest growth due to growing acceptance of 5G technologies and increasing consumption of smart televisions, tablets, and smartphones.
  • Asia Pacific is expected to witness the highest growth during the forecast period due to growing adoption of IoT (internet of things), increasing electronic content per vehicle, and growing industrial automation in countries, such as China, Taiwan, and India.

Features of the OSAT Market

  • Market Size Estimates:Outsourced semiconductor assembly and testing market size estimation in terms of value ($B)
  • Trend And Forecast Analysis:Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis:Outsourced semiconductor assembly and testing market size by various segments, such as by service type, packaging type, application, and region
  • Regional Analysis:Outsourced semiconductor assembly and testing market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities:Analysis on growth opportunities in different by service type, packaging type, application, and regions for the outsourced semiconductor assembly and testing market.
  • Strategic Analysis:This includes M&A, new product development, and competitive landscape for the outsourced semiconductor assembly and testing market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the outsourced semiconductor assembly and testing (OSAT) market size?

Answer: The global outsourced semiconductor assembly and testing (OSAT) market is expected to reach an estimated $36.8 billion by 2028.

Q2. What is the growth forecast for the OSAT market?

Answer: The global outsourced semiconductor assembly and testing market is expected to grow with a CAGR of 6.3% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the OSAT market?

Answer: The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.

Q4. What are the major segments for OSAT market?

Answer: The future of the outsourced semiconductor assembly and testing market looks promising with opportunities in the automotive, telecommunication, computing & networking, consumer electronic, and industrial application industries.

Q5. Who are the key outsourced semiconductor assembly and testing companies?

Answer: Some of the key outsourced semiconductor assembly and testing companies are as follows:

  • Advanced Semiconductor
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries
  • PTI (Powertech Technology Inc.)
  • United test and assembly center
  • King Yuan Electronics
  • ChipMOS

Q6. Which OSAT segment will be the largest in future?

Answer:Lucintel forecast that assembly & packaging will remain the largest segment over the forecast period due to growing demand for telecom infrastructure and electronic products across the globe.

Q7. In outsourced semiconductor assembly and testing market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to witness the highest growth during the forecast period due to growing adoption of IoT (internet of things), increasing electronic content per vehicle, and growing industrial automation in countries, such as China, Taiwan, and India.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1. What are some of the most promising, high-growth opportunities for the global outsourced semiconductor assembly and testing market by service type (assembly & packaging and testing), packaging type (wire bond, flip chip, wafer level, and others), application (automotive, telecommunications, computing & networking, consumer electronics, and industrial), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Outsourced Semiconductor Assembly and Testing Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global Outsourced Semiconductor Assembly and Testing Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global Outsourced Semiconductor Assembly and Testing Market by Service Type
    • 3.3.1: Assembly & Packaging
    • 3.3.2: Testing
  • 3.4: Global Outsourced Semiconductor Assembly and Testing Market by Packaging Type
    • 3.4.1: Wire Bond
    • 3.4.2: Flip Chip
    • 3.4.3: Wafer Level
    • 3.4.4: Others
  • 3.5: Global Outsourced Semiconductor Assembly and Testing Market by Application
    • 3.5.1: Automotive
    • 3.5.2: Telecommunications
    • 3.5.3: Computing & Networking
    • 3.5.4: Consumer Electronics
    • 3.5.5: Industrial

4. Market Trends and Forecast Analysis by Region from 2017-2028

  • 4.1: Global Outsourced Semiconductor Assembly and Testing Market by Region
  • 4.2: North American Outsourced Semiconductor Assembly and Testing Market
    • 4.2.1: North American Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.2.2: North American Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
  • 4.3: European Outsourced Semiconductor Assembly and Testing Market
    • 4.3.1: European Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.3.2: European Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
  • 4.4: APAC Outsourced Semiconductor Assembly and Testing Market
    • 4.4.1: APAC Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.4.2: APAC Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
  • 4.5: ROW Outsourced Semiconductor Assembly and Testing Market
    • 4.5.1: ROW Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.5.2: ROW Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Service Type
    • 6.1.2: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Packaging Type
    • 6.1.3: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Application
    • 6.1.5: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Region
  • 6.2: Emerging Trends in the Global Outsourced Semiconductor Assembly and Testing Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Outsourced Semiconductor Assembly and Testing Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Outsourced Semiconductor Assembly and Testing Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Advanced Semiconductor
  • 7.2: Amkor
  • 7.3: Jiangsu Changjiang Electronics Technology
  • 7.4: Siliconware Precision Industries
  • 7.5: PTI (Powertech Technology Inc.)
  • 7.6: United test and assembly center
  • 7.7: King Yuan Electronics
  • 7.8: ChipMOS