半導体組立・テスト受託サービス市場：サービスタイプ、パッケージングタイプ、エンドユーザー別-2024-2030年の世界予測

半導体組立・テスト受託サービス市場規模は2023年に333億4,000万米ドルと推定され、2024年には356億2,000万米ドル、CAGR 7.62%で2030年には557億5,000万米ドルに達すると予測されています。

サードパーティー・ベンダーへのアウトソーシングにより、半導体企業は自社でコストのかかるインフラに投資するよりも、ベンダーの設備や知識ベースを活用することができます。アウトソーシングの動向は、組立、テスト、パッケージング設備のオフショアリングから始まり、ベンダーとの世界なパートナーシップへと拡大し、半導体組立・テスト受託サービス（OSAT）市場の予測期間中の成長を促進しています。エレクトロニクス製品に対する需要の増加、半導体設計の複雑化、コスト効率の高い生産ソリューションにつながる技術の進歩、従来のサービス提供モデルからより専門的なサービス提供モデルへの移行が、市場の成長をさらに後押ししています。しかし、OSAT市場は、先進パッケージング技術に対する需要の増加や、コスト削減と品質向上のための自動化推進など、いくつかの動向の影響を受けています。さらに、半導体不足が続いていることから、多くのチップメーカーは生産能力を強化するためにアウトソーシングを進めています。しかし、新製品開発と技術革新に伴う高コストと偽造部品の存在は、業界が直面するいくつかの大きな課題です。OSATサービス・プロバイダーは、個々の顧客のニーズに合わせたサービスを提供することに注力し、ウエハー製造やパッケージングなどの専門的な作業を行う有能な専門家を確保するため、人材トレーニングや開発プログラムに投資することで競争力を高める必要があります。

サービスの種類製品の耐久性と性能を向上させるアセンブリ＆パッケージング・サービスへのニーズが高まる

アセンブリー＆パッケージング・サービスは、半導体の製造プロセスにおいて非常に重要であり、裸の半導体を機能的で市場投入可能な製品に変換します。このサービスには、ダイの準備、基板の取り付け、ワイヤーボンディング、封止、最終検査などが含まれます。企業は、製品の耐久性、性能、小型化を向上させるために、先進的な組立・パッケージングサービスを選択することができます。その選択は、民生用電子機器、自動車、高性能コンピューティングなど、アプリケーション分野によって大きく異なります。テストサービスには、出荷前に半導体デバイスに対して行われる一連のチェックが含まれ、必要な仕様や性能基準を満たしていることを確認します。これにはウエハープロービング、最終テスト、検査が含まれます。テストサービスの優先順位は、最終アプリケーションの信頼性要件によって異なります。自動車や医療機器などの高信頼性分野では、より厳格で包括的なテストが求められることが多いです。

エンドユーザー：スマートフォンやウェアラブルデバイスなど、コンシューマーエレクトロニクスの所有拡大

コンピューター・ネットワーク部門には、コンピューター、サーバー、ネットワーク機器を中心に、コンピューター・ネットワーク業界向けのメーカーやサービスプロバイダーが含まれます。この分野では、高性能、高信頼性、統合機能に対するニーズが高いです。イノベーションとコラボレーションは、計算能力とエネルギー効率の向上を中心に展開されることが多いです。コンシューマー・エレクトロニクスは、スマートフォンから家庭用電化製品まで、幅広い製品をカバーしています。この分野の主なニーズは、小型化、エネルギー効率、大量生産能力などです。この分野のプレーヤーは、モバイル機器やその他のコンシューマー・エレクトロニクス用チップのサイズと消費電力を大幅に削減することを目的とした、新しい半導体パッケージング技術を絶えず導入しています。産業用エレクトロニクス産業用エレクトロニクスは、製造、エネルギー、その他の産業分野で使用されるデバイスとシステムで構成されます。耐久性、堅牢性、長期信頼性が、この分野の半導体に対する重要なニーズです。通信セクターは、5G技術を含む通信ネットワークのインフラとデバイスに焦点を当てています。この分野では、高速、高周波、高信頼性の半導体が求められています。

地域別インサイト

世界の半導体組立・テスト受託サービス（OSAT）市場は、先端半導体部品への需要の増加とコネクテッド・テクノロジーの採用増加により、今後数年で大きく拡大すると予想されます。アジア太平洋地域はOSATサービスの支配的な市場として浮上しており、半導体産業の革新と成長を推進することを目的とした広範な技術投資と政府の取り組みにより、中国がリードしています。この地域は人件費と原材料費が安く、熟練した労働力が揃っているため、半導体製造のアウトソーシングを検討している企業にとって魅力的な市場となっています。北米もOSATサービスの重要な市場であり、インテルコーポレーションをはじめとする大手企業がこの地域の成長に貢献しています。この地域は研究開発活動に力を入れており、最近の技術進歩が今後数年の成長を促進すると予想されます。欧州は、政府が半導体製造部門における技術革新の奨励に投資しているため、他の地域に追いつきつつあります。ドイツ、英国、フランスなどの国々がこうしたイニシアチブを主導しており、地域事業の拡大を期待する企業に有利な環境を提供しています。南米には、最先端のチップセットや、半導体の組立やテスト工程で使用されるその他のコンポーネントを製造するための既存のインフラを持つ国がいくつかあり、OSATサービスにとって計り知れない可能性があります。同地域ではデジタル化の重要性が高まっており、こうしたサービスの需要が高まることが予想され、事業拡大を目指す企業にとって魅力的な市場となっています。

FPNVポジショニング・マトリックス

FPNVポジショニングマトリックスは、半導体組立・テスト受託サービス市場の評価において極めて重要です。事業戦略や製品満足度に関連する主要指標を調査し、ベンダーの包括的な評価を提供します。この綿密な分析により、ユーザーは各自の要件に沿った十分な情報に基づいた意思決定を行うことができます。評価に基づき、ベンダーは成功の度合いが異なる4つの象限に分類されます：フォアフロント（F）、パスファインダー（P）、ニッチ（N）、バイタル（V）です。

市場シェア分析

市場シェア分析は、半導体組立・テスト受託サービス市場におけるベンダーの現状について、洞察に満ちた詳細な調査を提供する包括的なツールです。全体的な収益、顧客基盤、その他の主要指標についてベンダーの貢献度を綿密に比較・分析することで、企業の業績や市場シェア争いの際に直面する課題について理解を深めることができます。さらに、この分析により、調査対象基準年に観察された累積、断片化の優位性、合併の特徴などの要因を含む、この分野の競合特性に関する貴重な考察が得られます。このような詳細レベルの拡大により、ベンダーはより多くの情報に基づいた意思決定を行い、市場で競争優位に立つための効果的な戦略を考案することができます。

本レポートは、以下の側面に関する貴重な洞察を提供しています：

1.市場の浸透度：主要企業が提供する市場に関する包括的な情報を提示しています。

2.市場の開拓度：有利な新興市場を深く掘り下げ、成熟市場セグメントにおける浸透度を分析しています。

3.市場の多様化：新製品の発売、未開拓の地域、最近の開発、投資に関する詳細な情報を提供します。

4.競合の評価と情報：市場シェア、戦略、製品、認証、規制状況、特許状況、主要企業の製造能力について徹底的な評価を行います。

5.製品開発およびイノベーション：将来の技術、研究開発活動、画期的な製品開発に関する知的洞察を提供します。

本レポートは、以下のような主要な質問に対応しています：

1.半導体組立・テスト受託サービス市場の市場規模および予測は？

2.半導体組立・テスト受託サービス市場の予測期間中に投資を検討すべき製品、セグメント、用途、分野は何か？

3.半導体組立・テスト受託サービス市場の技術動向と規制枠組みは？

4.半導体組立・テスト受託サービス市場における主要ベンダーの市場シェアは？

5.半導体組立・テスト受託サービス市場への参入に適した形態や戦略的手段は？

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

• 市場力学
  • 促進要因
    • 半導体製造における官民連携の取り組みとインセンティブ
    • 産業用電子機器および医療機器の生産増加
    • コスト効率の高いアウトソーシングサービスへの大きな傾向
  • 抑制要因
    • 予期せぬ隠れたコストと運用の柔軟性の制限
  • 機会
    • OSATサービスにおけるインテリジェントシステムの導入
    • 先進パッケージングとテストへの投資と技術の増加
  • 課題
    • 運用管理の制限とデータセキュリティの懸念
• 市場セグメンテーション分析
  • サービスタイプ：製品の耐久性と性能を向上させるための組み立ておよび梱包サービスの新たなニーズ
  • エンドユーザー：スマートフォンやウェアラブルデバイスなどの家電製品の所有拡大
• 市場動向分析
  • 政府の戦略的な投資は、南北アメリカにおける半導体産業と関連サービスの拡大を支援します。
  • 強力な競争相手と継続的な技術進歩により、APAC地域におけるOSAT市場の可能性は拡大しています。
  • 半導体チップに対するエンドユーザーの需要拡大とEMEAにおけるIC生産の現地化の可能性
• ロシア・ウクライナ紛争の累積的影響
• 高インフレの累積的影響
• ポーターのファイブフォース分析
• バリューチェーンとクリティカルパス分析
• 規制枠組みの分析
• 顧客のカスタマイズ

第6章 半導体組立・テスト受託サービス市場：サービスタイプ別

• 組み立てと梱包
• テスト

第7章 半導体組立・テスト受託サービス市場：パッケージングタイプ別

• フリップチップ
• ウエハーレベル
• ワイヤーボンド

第8章 半導体組立・テスト受託サービス市場：エンドユーザー別

• コンピューターネットワーキング
• 家電
• 産業用電子機器
• 通信

第9章 南北アメリカの半導体組立・テスト受託サービス市場

• アルゼンチン
• ブラジル
• カナダ
• メキシコ
• 米国

第10章 アジア太平洋地域の半導体組立・テスト受託サービス市場

• オーストラリア
• 中国
• インド
• インドネシア
• 日本
• マレーシア
• フィリピン
• シンガポール
• 韓国
• 台湾
• タイ
• ベトナム

第11章 欧州・中東・アフリカの半導体組立・テスト受託サービス市場

• デンマーク
• エジプト
• フィンランド
• フランス
• ドイツ
• イスラエル
• イタリア
• オランダ
• ナイジェリア
• ノルウェー
• ポーランド
• カタール
• ロシア
• サウジアラビア
• 南アフリカ
• スペイン
• スウェーデン
• スイス
• トルコ
• アラブ首長国連邦
• 英国

第12章 競合情勢

• 市場シェア分析2023
• FPNVポジショニングマトリックス、2023
• 競合シナリオ分析
  • シーメンス、SPILと提携してファンアウト型ウェーハレベルパッケージング向け3D検証ワークフローを提供
  • タタ・グループのエレクトロニクスおよび半導体事業の拡大
  • アルチップテクノロジーズ、3DFabricアライアンスのサポート計画を発表
  • インド、10億米ドル規模のマイクロンテクノロジー半導体工場の建設に迫る
  • アムコー、自動車の電動化に向けた電源ソリューションを拡大
  • アムコー、自動車の電動化に向けた電源ソリューションを拡大
  • AmkorとGlobalFoundries、欧州で大規模な半導体テストおよび組立サービスを提供
  • テュフ・ノルド・グループがHTVの過半数株式を取得
  • インテグラテクノロジーズ、OSAT最大の半導体プロジェクトにカンザス州を選択
  • TSMC、半導体とシステムイノベーションの未来を形作るOIP 3DFabricアライアンスを設立
  • サムスン電子、サムスンファウンドリーフォーラム2022で1.4nmプロセス技術と生産能力への投資計画を発表
  • 世界中の半導体組立・試験施設データベースが統合デバイスメーカー475施設を追跡

第13章 競合ポートフォリオ

• 主要企業プロファイル
• 主要製品ポートフォリオ

LIST OF FIGURES

• FIGURE 1. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET RESEARCH PROCESS
• FIGURE 2. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2023 VS 2030
• FIGURE 3. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2018-2030 (USD MILLION)
• FIGURE 4. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY REGION, 2023 VS 2030 (%)
• FIGURE 5. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 6. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET DYNAMICS
• FIGURE 7. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2023 VS 2030 (%)
• FIGURE 8. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 9. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2023 VS 2030 (%)
• FIGURE 10. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 11. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2023 VS 2030 (%)
• FIGURE 12. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 13. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 14. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 15. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2023 VS 2030 (%)
• FIGURE 16. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 17. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 18. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 19. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 20. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 21. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SHARE, BY KEY PLAYER, 2023
• FIGURE 22. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

• TABLE 1. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SEGMENTATION & COVERAGE
• TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
• TABLE 3. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2018-2023 (USD MILLION)
• TABLE 4. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2024-2030 (USD MILLION)
• TABLE 5. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY REGION, 2018-2023 (USD MILLION)
• TABLE 6. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY REGION, 2024-2030 (USD MILLION)
• TABLE 7. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 8. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 9. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY ASSEMBLY & PACKAGING, BY REGION, 2018-2023 (USD MILLION)
• TABLE 10. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY ASSEMBLY & PACKAGING, BY REGION, 2024-2030 (USD MILLION)
• TABLE 11. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY TESTING, BY REGION, 2018-2023 (USD MILLION)
• TABLE 12. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY TESTING, BY REGION, 2024-2030 (USD MILLION)
• TABLE 13. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 14. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 15. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2023 (USD MILLION)
• TABLE 16. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY FLIP CHIP, BY REGION, 2024-2030 (USD MILLION)
• TABLE 17. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY WAFER LEVEL, BY REGION, 2018-2023 (USD MILLION)
• TABLE 18. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY WAFER LEVEL, BY REGION, 2024-2030 (USD MILLION)
• TABLE 19. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY WIRE BOND, BY REGION, 2018-2023 (USD MILLION)
• TABLE 20. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY WIRE BOND, BY REGION, 2024-2030 (USD MILLION)
• TABLE 21. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 22. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 23. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COMPUTER & NETWORKING, BY REGION, 2018-2023 (USD MILLION)
• TABLE 24. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COMPUTER & NETWORKING, BY REGION, 2024-2030 (USD MILLION)
• TABLE 25. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2023 (USD MILLION)
• TABLE 26. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2024-2030 (USD MILLION)
• TABLE 27. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY INDUSTRIAL ELECTRONICS, BY REGION, 2018-2023 (USD MILLION)
• TABLE 28. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY INDUSTRIAL ELECTRONICS, BY REGION, 2024-2030 (USD MILLION)
• TABLE 29. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2023 (USD MILLION)
• TABLE 30. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2024-2030 (USD MILLION)
• TABLE 31. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 32. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 33. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 34. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 35. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 36. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 37. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
• TABLE 38. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
• TABLE 39. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 40. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 41. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 42. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 43. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 44. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 45. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 46. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 47. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 48. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 49. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 50. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 51. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 52. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 53. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 54. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 55. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 56. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 57. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 58. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 59. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 60. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 61. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 62. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 63. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 64. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 65. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 66. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 67. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 68. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 69. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2018-2023 (USD MILLION)
• TABLE 70. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2024-2030 (USD MILLION)
• TABLE 71. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 72. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 73. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 74. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 75. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 76. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 77. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
• TABLE 78. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
• TABLE 79. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 80. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 81. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 82. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 83. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 84. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 85. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 86. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 87. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 88. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 89. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 90. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 91. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 92. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 93. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 94. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 95. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 96. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 97. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 98. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 99. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 100. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 101. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 102. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 103. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 104. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 105. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 106. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 107. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 108. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 109. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 110. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 111. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 112. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 113. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 114. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 115. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 116. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 117. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 118. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 119. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 120. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 121. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 122. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 123. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 124. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 125. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 126. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 127. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 128. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 129. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 130. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 131. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 132. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 133. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 134. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 135. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 136. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 137. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 138. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 139. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 140. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 141. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 142. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 143. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 144. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 145. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 146. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 147. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 148. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 149. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 150. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 151. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 152. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 153. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 154. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 155. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 156. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 157. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
• TABLE 158. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
• TABLE 159. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 160. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 161. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 162. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 163. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 164. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 165. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 166. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 167. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 168. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 169. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 170. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 171. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 172. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 173. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 174. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 175. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 176. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 177. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 178. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 179. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 180. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 181. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 182. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 183. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 184. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 185. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 186. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 187. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 188. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 189. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 190. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 191. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 192. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 193. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 194. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 195. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 196. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 197. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 198. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 199. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 200. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 201. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 202. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 203. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 204. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 205. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 206. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 207. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 208. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 209. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 210. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 211. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 212. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 213. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 214. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 215. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 216. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 217. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 218. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 219. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 220. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 221. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 222. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 223. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 224. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 225. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 226. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 227. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 228. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 229. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 230. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 231. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 232. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 233. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 234. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 235. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 236. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 237. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 238. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 239. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 240. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 241. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 242. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 243. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 244. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 245. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 246. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 247. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 248. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 249. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 250. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 251. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 252. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 253. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 254. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 255. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 256. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 257. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 258. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 259. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 260. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2024-2030 (USD MILLION)
• TABLE 261. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2023 (USD MILLION)
• TABLE 262. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2024-2030 (USD MILLION)
• TABLE 263. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2023 (USD MILLION)
• TABLE 264. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2024-2030 (USD MILLION)
• TABLE 265. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2023 (USD MILLION)
• TABLE 266. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY &

[189 Pages Report] The Outsourced Semiconductor Assembly & Test Services Market size was estimated at USD 33.34 billion in 2023 and expected to reach USD 35.62 billion in 2024, at a CAGR 7.62% to reach USD 55.75 billion by 2030.

Outsourcing to third-party vendors allows semiconductor companies to leverage the vendor's equipment and knowledge base rather than investing in costly infrastructure themselves. The trend of outsourcing began with offshoring assembly, testing, and packaging facilities, which expanded to global partnerships with vendors and has facilitated the Outsourced Semiconductor Assembly & Test Services (OSAT) market to grow over the forecasted period. Increasing demand for electronics products, rising complexity of semiconductor designs and technological advancements leading to cost-effective production solutions, and a shift from traditional to more specialized service delivery models further drive the market growth. However, the market for OSAT has been impacted by several trends, including increased demand for advanced packaging techniques and the push toward more automation to reduce costs and elevate quality. Moreover, the ongoing semiconductor shortage has driven many chipmakers toward outsourcing to bolster production capacity. However, high costs associated with new product development and innovation and the presence of counterfeit components are some major challenges the industry faces. OSAT service providers should focus on providing services that are tailored to their individual customer's needs and develop a competitive edge by investing in personnel training and development programs to ensure they have qualified professionals performing specialized tasks such as wafer fabrication and packaging.

Service Type: Emerging need for assembly & packaging services for improving product durability and performance

Assembly and packaging services are critical in the semiconductor manufacturing process, transforming bare semiconductors into functional, market-ready products. This service includes die preparation, substrate attachment, wire bonding, encapsulation, and final inspection. Companies may opt for advanced assembly and packaging services to enhance product durability, performance, and miniaturization. The choice largely depends on the application field, whether it be consumer electronics, automotive, or high-performance computing. Testing services encompass a series of checks performed on semiconductor devices before they are shipped out, ensuring they meet the required specifications and performance standards. This includes wafer probing, final tests, and inspections. Preference for testing services varies, depending on the reliability requirements of the end application. High-reliability sectors such as automotive and medical devices often require more rigorous and comprehensive testing.

End-User: Expanding ownership of consumer electronics such as smartphones and wearable devices

The computer and networking sector includes manufacturers and service providers catering to the computing and networking industry, focusing on personal computers, servers, and networking equipment. The need-based preference here leans towards high performance, reliability, and integration capabilities. Innovations and collaborations often revolve around enhancing computational power and energy efficiency. Consumer electronics cover a wide range of products, from smartphones to home appliances. The primary needs in this sector include compactness, energy efficiency, and high-volume manufacturing capabilities. Players in this realm are constantly introducing new semiconductor packaging technologies intended to significantly reduce the size and power consumption of chips for mobile devices and other consumer electronics. Industrial electronics comprises devices and systems used in manufacturing, energy, and other industrial sectors. Durability, robustness, and long-term reliability are the critical needs for semiconductors in this sector. The telecommunication sector focuses on infrastructure and devices for communication networks, including 5G technologies. The demand here is for high-speed, high-frequency, and high-reliability semiconductors.

Regional Insights

The global outsourced semiconductor assembly & test services (OSAT) market is expected to expand significantly in the coming years with the increasing demand for advanced semiconductor components and rising adoption of connected technologies. Asia-Pacific has emerged as the dominant market for OSAT services, with China leading the way due to its extensive technological investments and government initiatives aimed at propelling innovation and growth in the semiconductor industry. The region's low cost of labor and raw materials, coupled with the availability of a skilled workforce, has made it an attractive destination for companies looking to outsource their semiconductor manufacturing activities. North America is another significant market for OSAT services, with major players, including Intel Corporation contributing to the region's growth. The region's focus on research and development activities and recent technological advancements are expected to drive growth in the coming years. Europe is catching up with other regions as its governments are investing in encouraging innovation within the semiconductor manufacturing sectors. Countries such as Germany, the UK, and France are heading these initiatives, providing a favorable environment for businesses expecting to expand their regional operations. South America offers immense potential for OSAT services, with several countries with existing infrastructure for creating advanced chipsets and other components used in semiconductor assemblies and testing processes. The region's growing importance of digitalization is expected to drive demand for these services, making it an attractive market for companies trying to expand their operations.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Outsourced Semiconductor Assembly & Test Services Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Outsourced Semiconductor Assembly & Test Services Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Outsourced Semiconductor Assembly & Test Services Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology, Inc., ASE Technology Holding Co, Ltd., AT Semicon Co., Ltd., Bluetest Testservice GmbH, Carsem (M) Sdn Bhd, Chipbond Technology Corporation, Chipmos Technologies Inc., Doosan Corporation, EV Group, Formosa Advanced Technologies Co., Ltd., GEM Electronics (Shanghai) Co., Ltd., Greatek Electronics Inc., HANA Micron Inc., Inari Amertron Berhad, Integra Technologies, Integrated Micro-electronics Inc., Jiangsu Changdian Technology Co., Ltd., King Yuan ELECTRONICS CO., LTD., LB Semicon, Lingsen Precision Industries , LTD., LIPAC Co., Ltd., Natronix Semiconductor Technology Pte Ltd., Nepes Corporation, ORIENT SEMICONDUCTOR ELECTRONICS LIMITED, Powertech Technology Inc., Samsung Electronics Co., Ltd., Sanmina Corporation, Tongfu Microelectronics Co., Ltd., Unisem Group, UTAC Holdings Ltd., Walton Advanced Engineering, Inc., and yieldwerx.

Market Segmentation & Coverage

This research report categorizes the Outsourced Semiconductor Assembly & Test Services Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Service Type
  • Assembly & Packaging
  • Testing

• Packaging Type
  • Flip Chip
  • Wafer Level
  • Wire Bond

• End-User
  • Computer & Networking
  • Consumer Electronics
  • Industrial Electronics
  • Telecommunication

• Region
  • Americas
    • Argentina
    • Brazil
    • Canada
    • Mexico
    • United States
      • California
      • Florida
      • Illinois
      • New York
      • Ohio
      • Pennsylvania
      • Texas
  • Asia-Pacific
    • Australia
    • China
    • India
    • Indonesia
    • Japan
    • Malaysia
    • Philippines
    • Singapore
    • South Korea
    • Taiwan
    • Thailand
    • Vietnam

• Europe, Middle East & Africa
  • Denmark
  • Egypt
  • Finland
  • France
  • Germany
  • Israel
  • Italy
  • Netherlands
  • Nigeria
  • Norway
  • Poland
  • Qatar
  • Russia
  • Saudi Arabia
  • South Africa
  • Spain
  • Sweden
  • Switzerland
  • Turkey
  • United Arab Emirates
  • United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Outsourced Semiconductor Assembly & Test Services Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Outsourced Semiconductor Assembly & Test Services Market?

3. What are the technology trends and regulatory frameworks in the Outsourced Semiconductor Assembly & Test Services Market?

4. What is the market share of the leading vendors in the Outsourced Semiconductor Assembly & Test Services Market?

5. Which modes and strategic moves are suitable for entering the Outsourced Semiconductor Assembly & Test Services Market?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Public-private initiatives and incentives for semiconductor manufacturing
    • 5.1.1.2. Growth in production of industrial electronics and medical devices
    • 5.1.1.3. Significant inclination toward cost effective outsourced services
  • 5.1.2. Restraints
    • 5.1.2.1. Hidden unforeseen cost and limited flexibility in operations
  • 5.1.3. Opportunities
    • 5.1.3.1. Deployment of intelligent system in OSAT services
    • 5.1.3.2. Rising investments and technologies for advanced packaging and testing
  • 5.1.4. Challenges
    • 5.1.4.1. Limited control over operations and data security concerns
• 5.2. Market Segmentation Analysis
  • 5.2.1. Service Type: Emerging need for assembly & packaging services for improving product durability and performance
  • 5.2.2. End-User: Expanding ownership of consumer electronics such as smartphones and wearable devices
• 5.3. Market Trend Analysis
  • 5.3.1. Strategic government investments support the expansion of the semiconductor industry and related services in the Americas
  • 5.3.2. Powerful competitors and ongoing technological advancements broadens the OSAT market's potential in the APAC region.
  • 5.3.3. Expanding end-user demand for semiconductor chips and potential localization of IC production in EMEA
• 5.4. Cumulative Impact of Russia-Ukraine Conflict
• 5.5. Cumulative Impact of High Inflation
• 5.6. Porter's Five Forces Analysis
  • 5.6.1. Threat of New Entrants
  • 5.6.2. Threat of Substitutes
  • 5.6.3. Bargaining Power of Customers
  • 5.6.4. Bargaining Power of Suppliers
  • 5.6.5. Industry Rivalry
• 5.7. Value Chain & Critical Path Analysis
• 5.8. Regulatory Framework Analysis
• 5.9. Client Customization

6. Outsourced Semiconductor Assembly & Test Services Market, by Service Type

• 6.1. Introduction
• 6.2. Assembly & Packaging
• 6.3. Testing

7. Outsourced Semiconductor Assembly & Test Services Market, by Packaging Type

• 7.1. Introduction
• 7.2. Flip Chip
• 7.3. Wafer Level
• 7.4. Wire Bond

8. Outsourced Semiconductor Assembly & Test Services Market, by End-User

• 8.1. Introduction
• 8.2. Computer & Networking
• 8.3. Consumer Electronics
• 8.4. Industrial Electronics
• 8.5. Telecommunication

9. Americas Outsourced Semiconductor Assembly & Test Services Market

• 9.1. Introduction
• 9.2. Argentina
• 9.3. Brazil
• 9.4. Canada
• 9.5. Mexico
• 9.6. United States

10. Asia-Pacific Outsourced Semiconductor Assembly & Test Services Market

• 10.1. Introduction
• 10.2. Australia
• 10.3. China
• 10.4. India
• 10.5. Indonesia
• 10.6. Japan
• 10.7. Malaysia
• 10.8. Philippines
• 10.9. Singapore
• 10.10. South Korea
• 10.11. Taiwan
• 10.12. Thailand
• 10.13. Vietnam

11. Europe, Middle East & Africa Outsourced Semiconductor Assembly & Test Services Market

• 11.1. Introduction
• 11.2. Denmark
• 11.3. Egypt
• 11.4. Finland
• 11.5. France
• 11.6. Germany
• 11.7. Israel
• 11.8. Italy
• 11.9. Netherlands
• 11.10. Nigeria
• 11.11. Norway
• 11.12. Poland
• 11.13. Qatar
• 11.14. Russia
• 11.15. Saudi Arabia
• 11.16. South Africa
• 11.17. Spain
• 11.18. Sweden
• 11.19. Switzerland
• 11.20. Turkey
• 11.21. United Arab Emirates
• 11.22. United Kingdom

12. Competitive Landscape

• 12.1. Market Share Analysis, 2023
• 12.2. FPNV Positioning Matrix, 2023
• 12.3. Competitive Scenario Analysis
  • 12.3.1. Siemens Collaborates with SPIL to Deliver a 3D Verification Workflow for Fan-out Wafer-level Packaging
  • 12.3.2. Tata Group's Expansion in Electronics and Semiconductor Business
  • 12.3.3. Alchip Technologies Announces 3DFabric Alliance Support Plans
  • 12.3.4. India Close to Getting a USD 1 Billion Micron Technology Semiconductor Plant
  • 12.3.5. Amkor Expands Power Solutions for Automotive Electrification
  • 12.3.6. Amkor Expands Power Solutions for Automotive Electrification
  • 12.3.7. Amkor and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
  • 12.3.8. Tuv Nord Group Acquires Majority Stake in HTV
  • 12.3.9. Integra Technologies Selects Kansas for Largest OSAT Semiconductor Project
  • 12.3.10. TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
  • 12.3.11. Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
  • 12.3.12. Worldwide Semiconductor Assembly And Test Facility Database Now Tracks Integrated Device Manufacturers, 475 Facilities

13. Competitive Portfolio

• 13.1. Key Company Profiles
• 13.2. Key Product Portfolio