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市場調査レポート
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1313537

半導体組立・テスト受託市場:サービスタイプ、パッケージングタイプ、エンドユーザー別-2023-2030年の世界予測

Outsourced Semiconductor Assembly & Test Services Market by Service Type, Packaging Type, End-User - Cumulative Impact of COVID-19, Russia Ukraine Conflict, and High Inflation - Global Forecast 2023-2030

出版日: | 発行: 360iResearch | ページ情報: 英文 187 Pages | 納期: 即日から翌営業日

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価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=155.76円
半導体組立・テスト受託市場:サービスタイプ、パッケージングタイプ、エンドユーザー別-2023-2030年の世界予測
出版日: 2023年06月12日
発行: 360iResearch
ページ情報: 英文 187 Pages
納期: 即日から翌営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 図表
  • 目次
概要

半導体組立・テスト受託の世界市場は、2023年に333億4,000万米ドル、CAGR 7.51%で大きく成長すると予測され、2030年には557億5,000万米ドルに達すると予測されています。

FPNVポジショニング・マトリックス

FPNVポジショニングマトリックスは世界の半導体組立・テスト受託市場を評価するために不可欠です。事業戦略と製品満足度の主要指標を調査することで、ベンダーの包括的な評価を提供し、ユーザーは特定のニーズに基づいた情報をもとに意思決定を行うことができます。この高度な分析により、ベンダーは成功の度合いが異なる4つの象限に整理されます:フォアフロント(F)、パスファインダー(P)、ニッチ(N)、バイタル(V)です。

市場シェア分析

市場シェア分析では、特定の市場領域におけるベンダーの現状を洞察することができます。全体的な収益、顧客基盤、その他の主要指標に対するベンダーの貢献度を比較することで、企業が市場シェアを争う際に、自社の業績や直面している状況をより深く理解することができます。また、本分析では、調査した基準年において、特定のセクターがどの程度競合しているのか、蓄積、断片化の優位性、合併の特徴についても明らかにしています。

本レポートは、以下のポイントに関する洞察を提供します:

1.市場の浸透度:主要企業が提供する市場に関する包括的な情報を提供します。

2.市場の発展:有利な新興市場に関する詳細情報を提供し、市場の成熟セグメントにおける浸透度を分析します。

3.市場の多様化:新製品の上市、未開発地域、最近の開発、投資に関する詳細情報を提供します。

4.市場の動向:COVID-19、ロシア・ウクライナ紛争、高インフレの累積的な影響を包括的に理解することができます。

5.競合の評価と情報:主要企業の市場シェア、戦略、製品、認証、規制状況、特許状況、製造能力を網羅的に評価します。

6.製品開発およびイノベーション:将来技術、研究開発活動、画期的な製品開発に関する知的洞察を提供します。

本レポートは、以下のような質問にお答えします:

1.半導体組立・テスト受託の世界市場規模および予測は?

2.予測期間中、世界の半導体組立・テスト受託市場を形成するCOVID-19の阻害要因と影響は?

3.半導体組立・テスト受託の世界市場において予測期間中に投資すべき製品/セグメント/アプリケーション/分野は?

4.半導体組立・テスト受託の世界市場における競争戦略は?

5.半導体組立・テスト受託の世界市場における技術動向と規制の枠組みは?

6.半導体組立・テスト受託の世界市場における主要ベンダーの市場シェアは?

7.半導体組立・テスト受託の世界市場への参入には、どのような形態や戦略的な動きが適していると考えられるか?

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

  • 市場力学
    • 促進要因
      • 半導体製造に対する官民の取り組みとインセンティブ
      • 産業用電子機器および医療機器の生産の増加
      • 費用対効果の高いアウトソーシングサービスへの大きな傾向
    • 抑制要因
      • 隠れた予期せぬコストと運用の柔軟性の制限
    • 機会
      • OSATサービスにおけるインテリジェントシステムの導入
      • 先進パッケージングとテストのための投資と技術の増加
    • 課題
      • 運用とデータセキュリティの問題に対する制限された制御
  • 市場動向
    • 政府の戦略的投資が南北アメリカにおける半導体産業と関連サービスの拡大をサポート
    • 強力な競合と継続的な技術進歩により、APAC地域におけるOSAT市場の可能性が広がります。
    • 半導体チップに対するエンドユーザーの需要の拡大とEMEAにおけるIC生産の現地化の可能性
  • COVID-19の累積的な影響
  • ロシア・ウクライナ紛争の累積的影響
  • 高インフレの累積的影響
  • ポーターのファイブフォース分析
  • バリューチェーンとクリティカルパス分析
  • 規制の枠組み
  • 顧客のカスタマイズ

第6章 半導体組立・テスト受託市場:サービスタイプ別

  • 組み立てと梱包
  • テスト

第7章 半導体組立・テスト受託市場:パッケージングタイプ別

  • フリップチップ
  • ウエハーレベル
  • ワイヤーボンド

第8章 半導体組立・テスト受託市場:エンドユーザー別

  • コンピューターネットワーキング
  • 家電
  • 産業用電子機器
  • 通信

第9章 南北アメリカの半導体組立・テスト受託市場

  • アルゼンチン
  • ブラジル
  • カナダ
  • メキシコ
  • 米国

第10章 アジア太平洋地域の半導体組立・テスト受託市場

  • オーストラリア
  • 中国
  • インド
  • インドネシア
  • 日本
  • マレーシア
  • フィリピン
  • シンガポール
  • 韓国
  • 台湾
  • タイ
  • ベトナム

第11章 欧州・中東・アフリカの半導体組立・テスト受託市場

  • デンマーク
  • エジプト
  • フィンランド
  • フランス
  • ドイツ
  • イスラエル
  • イタリア
  • オランダ
  • ナイジェリア
  • ノルウェー
  • ポーランド
  • カタール
  • ロシア
  • サウジアラビア
  • 南アフリカ
  • スペイン
  • スウェーデン
  • スイス
  • トルコ
  • アラブ首長国連邦
  • 英国

第12章 競合情勢

  • FPNVポジショニングマトリクス
  • 市場シェア分析:主要企業別
  • 競合シナリオ分析:主要企業別
    • 合併・買収
    • 契約、コラボレーション、パートナーシップ
    • 新製品発売と機能強化
    • 投資、資金調達
    • 受賞・表彰・拡大

第13章 掲載企業一覧

第14章 付録

  • ディスカッションガイド
  • ライセンスと価格について
図表

LIST OF FIGURES

  • FIGURE 1. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET RESEARCH PROCESS
  • FIGURE 2. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2022 VS 2030
  • FIGURE 3. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2022 VS 2030 (%)
  • FIGURE 5. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2022 VS 2030 (%)
  • FIGURE 6. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2022 VS 2030 (%)
  • FIGURE 7. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY REGION, 2022 VS 2030 (%)
  • FIGURE 8. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET DYNAMICS
  • FIGURE 9. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2022 VS 2023 VS 2030 (USD MILLION)
  • FIGURE 10. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2022 VS 2023 VS 2030 (USD MILLION)
  • FIGURE 11. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2022 VS 2023 VS 2030 (USD MILLION)
  • FIGURE 12. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2022 VS 2023 VS 2030 (USD MILLION)
  • FIGURE 13. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2022 VS 2023 VS 2030 (USD MILLION)
  • FIGURE 14. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2022 VS 2023 VS 2030 (USD MILLION)
  • FIGURE 15. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2022 VS 2023 VS 2030 (USD MILLION)
  • FIGURE 16. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET, FPNV POSITIONING MATRIX, 2022
  • FIGURE 17. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SHARE, BY KEY PLAYER, 2022

LIST OF TABLES

  • TABLE 1. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2022
  • TABLE 3. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 5. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY ASSEMBLY & PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 6. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY TESTING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 7. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY WAFER LEVEL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY WIRE BOND, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 12. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COMPUTER & NETWORKING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY INDUSTRIAL ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 17. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 18. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 19. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 20. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 21. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 22. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 23. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 24. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 25. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 26. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 27. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 28. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 29. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 30. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 31. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 32. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 33. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 34. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 35. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 36. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 37. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 38. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 39. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 40. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 41. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 42. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 43. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 45. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 46. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 47. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 49. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 50. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 51. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 52. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 53. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 54. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 55. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 56. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 57. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 58. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 59. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 60. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 61. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 62. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 63. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 64. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 65. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 66. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 67. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 68. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 69. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 70. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 71. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 72. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 73. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 74. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 75. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 76. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 77. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 78. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 79. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 80. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 81. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 82. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 83. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 84. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 85. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 86. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 87. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 88. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 89. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 90. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 91. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 92. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 93. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 94. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 95. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 96. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 97. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 98. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 99. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 100. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 101. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 102. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 103. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 104. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 105. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 106. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 107. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 108. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 109. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 110. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 111. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 112. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 113. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 114. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 115. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 116. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 117. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 118. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 119. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 120. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 121. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 122. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 123. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 124. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 125. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 126. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 127. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 128. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 129. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 130. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 131. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 132. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 133. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 134. TURKEY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 135. TURKEY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 136. TURKEY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 137. UNITED ARAB EMIRATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 138. UNITED ARAB EMIRATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 139. UNITED ARAB EMIRATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 140. UNITED KINGDOM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 141. UNITED KINGDOM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 142. UNITED KINGDOM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 143. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET, FPNV POSITIONING MATRIX, 2022
  • TABLE 144. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SHARE, BY KEY PLAYER, 2022
  • TABLE 145. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET LICENSE & PRICING
目次
Product Code: MRR-742BD5182FE1

The Global Outsourced Semiconductor Assembly & Test Services Market is forecasted to grow significantly, with a projected USD 33.34 billion in 2023 at a CAGR of 7.51% and expected to reach a staggering USD 55.75 billion by 2030.

The Cumulative Impact of COVID-19, the Russia-Ukraine Conflict, and High Inflation is expected to have significant long-term effects on the Global Outsourced Semiconductor Assembly & Test Services Market. The ongoing research considers the changes in consumer behavior, supply chain disruptions, and government interventions caused by the pandemic. Similarly, the report considers the ongoing political and economic uncertainty in Eastern Europe caused by the Russia-Ukraine Conflict and its potential implications for demand-supply balances, pressure on pricing variants, and import/export and trading. Additionally, the report addresses the impact of High Inflation on the global economy and details fiscal policies measuring and reducing its effects on demand, supply, cash flow, and currency exchange.

Market Segmentation & Coverage:

This research report categorizes the Global Outsourced Semiconductor Assembly & Test Services Market in order to forecast the revenues and analyze trends in each of following sub-markets:

Based on Service Type, market is studied across Assembly & Packaging and Testing. The Assembly & Packaging commanded largest market share of 51.63% in 2022, followed by Testing.

Based on Packaging Type, market is studied across Flip Chip, Wafer Level, and Wire Bond. The Wire Bond commanded largest market share of 37.13% in 2022, followed by Flip Chip.

Based on End-User, market is studied across Computer & Networking, Consumer Electronics, Industrial Electronics, and Telecommunication. The Consumer Electronics commanded largest market share of 28.91% in 2022, followed by Telecommunication.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom. The Asia-Pacific commanded largest market share of 40.23% in 2022, followed by Europe, Middle East & Africa.

Market Statistics:

The report provides market sizing and forecasts across 7 major currencies - USD, EUR, JPY, GBP, AUD, CAD, and CHF; multiple currency support helps organization leaders to make well-informed decisions. In this report, 2018 to 2021 are considered as historical years, 2022 is base year, 2023 is estimated year, and years from 2024 to 2030 are considered as forecast period.

FPNV Positioning Matrix:

The FPNV Positioning Matrix is essential for assessing the Global Outsourced Semiconductor Assembly & Test Services Market. It provides a comprehensive evaluation of vendors by examining key metrics within Business Strategy and Product Satisfaction, allowing users to make informed decisions based on their specific needs. This advanced analysis then organizes these vendors into four distinct quadrants, which represent varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital(V).

Market Share Analysis:

The Market Share Analysis offers an insightful look at the current state of vendors in a particular market space. By comparing vendor contributions to overall revenue, customer base, and other key metrics, we can give companies a greater understanding of their performance and what they are up against when competing for market share. The analysis also sheds light on just how competitive any given sector is about accumulation, fragmentation dominance, and amalgamation traits over the base year period studied.

The report provides insights on the following pointers:

1. Market Penetration: Provides comprehensive information on the market offered by the key players

2. Market Development: Provides in-depth information about lucrative emerging markets and analyzes penetration across mature segments of the markets

3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments

4. Market Trends: Provides comprehensive understanding of the Cumulative Impact of COVID-19, the Russia-Ukraine Conflict, and the High Inflation

5. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players

6. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:

1. What is the market size and forecast of the Global Outsourced Semiconductor Assembly & Test Services Market?

2. What are the inhibiting factors and impact of COVID-19 shaping the Global Outsourced Semiconductor Assembly & Test Services Market during the forecast period?

3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Outsourced Semiconductor Assembly & Test Services Market?

4. What is the competitive strategic window for opportunities in the Global Outsourced Semiconductor Assembly & Test Services Market?

5. What are the technology trends and regulatory frameworks in the Global Outsourced Semiconductor Assembly & Test Services Market?

6. What is the market share of the leading vendors in the Global Outsourced Semiconductor Assembly & Test Services Market?

7. What modes and strategic moves are considered suitable for entering the Global Outsourced Semiconductor Assembly & Test Services Market?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Limitations
  • 1.7. Assumptions
  • 1.8. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

  • 4.1. Introduction
  • 4.2. Outsourced Semiconductor Assembly & Test Services Market, by Service Type, 2022 vs 2030
  • 4.3. Outsourced Semiconductor Assembly & Test Services Market, by Packaging Type, 2022 vs 2030
  • 4.4. Outsourced Semiconductor Assembly & Test Services Market, by End-User, 2022 vs 2030
  • 4.5. Outsourced Semiconductor Assembly & Test Services Market, by Region, 2022 vs 2030

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Public-private initiatives and incentives for semiconductor manufacturing
      • 5.1.1.2. Growth in production of industrial electronics and medical devices
      • 5.1.1.3. Significant inclination toward cost effective outsourced services
    • 5.1.2. Restraints
      • 5.1.2.1. Hidden unforeseen cost and limited flexibility in operations
    • 5.1.3. Opportunities
      • 5.1.3.1. Deployment of intelligent system in OSAT services
      • 5.1.3.2. Rising investments and technologies for advanced packaging and testing
    • 5.1.4. Challenges
      • 5.1.4.1. Limited control over operations and data security concerns
  • 5.2. Market Trends
    • 5.2.1. Strategic government investments support the expansion of the semiconductor industry and related services in the Americas
    • 5.2.2. Powerful competitors and ongoing technological advancements broadens the OSAT market's potential in the APAC region.
    • 5.2.3. Expanding end-user demand for semiconductor chips and potential localization of IC production in EMEA
  • 5.3. Cumulative Impact of COVID-19
  • 5.4. Cumulative Impact of Russia-Ukraine Conflict
  • 5.5. Cumulative Impact of High Inflation
  • 5.6. Porter's Five Forces Analysis
    • 5.6.1. Threat of New Entrants
    • 5.6.2. Threat of Substitutes
    • 5.6.3. Bargaining Power of Customers
    • 5.6.4. Bargaining Power of Suppliers
    • 5.6.5. Industry Rivalry
  • 5.7. Value Chain & Critical Path Analysis
  • 5.8. Regulatory Framework
  • 5.9. Client Customization

6. Outsourced Semiconductor Assembly & Test Services Market, by Service Type

  • 6.1. Introduction
  • 6.2. Assembly & Packaging
  • 6.3. Testing

7. Outsourced Semiconductor Assembly & Test Services Market, by Packaging Type

  • 7.1. Introduction
  • 7.2. Flip Chip
  • 7.3. Wafer Level
  • 7.4. Wire Bond

8. Outsourced Semiconductor Assembly & Test Services Market, by End-User

  • 8.1. Introduction
  • 8.2. Computer & Networking
  • 8.3. Consumer Electronics
  • 8.4. Industrial Electronics
  • 8.5. Telecommunication

9. Americas Outsourced Semiconductor Assembly & Test Services Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Outsourced Semiconductor Assembly & Test Services Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Outsourced Semiconductor Assembly & Test Services Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. FPNV Positioning Matrix
  • 12.2. Market Share Analysis, By Key Player
  • 12.3. Competitive Scenario Analysis, By Key Player
    • 12.3.1. Merger & Acquisition
      • 12.3.1.1. Tuv Nord Group Acquires Majority Stake in HTV
    • 12.3.2. Agreement, Collaboration, & Partnership
      • 12.3.2.1. Siemens Collaborates with SPIL to Deliver a 3D Verification Workflow for Fan-out Wafer-level Packaging
      • 12.3.2.2. Amkor and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
    • 12.3.3. New Product Launch & Enhancement
      • 12.3.3.1. Alchip Technologies Announces 3DFabric Alliance Support Plans
      • 12.3.3.2. TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
    • 12.3.4. Investment & Funding
      • 12.3.4.1. India Close to Getting a USD 1 Billion Micron Technology Semiconductor Plant
    • 12.3.5. Award, Recognition, & Expansion
      • 12.3.5.1. Tata Group's Expansion in Electronics and Semiconductor Business
      • 12.3.5.2. Amkor Expands Power Solutions for Automotive Electrification
      • 12.3.5.3. Amkor Expands Power Solutions for Automotive Electrification
      • 12.3.5.4. Integra Technologies Selects Kansas for Largest OSAT Semiconductor Project
      • 12.3.5.5. Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
      • 12.3.5.6. Worldwide Semiconductor Assembly And Test Facility Database Now Tracks Integrated Device Manufacturers, 475 Facilities

13. List of Company Mentioned

14. Appendix

  • 14.1. Discussion Guide
  • 14.2. License & Pricing