半導体組立および検査アウトソーシングの世界市場レポート 2025年

半導体組立および検査アウトソーシング市場規模は、今後数年間で力強い成長が見込まれます。2029年にはCAGR（複合年間成長率）9.7％で679億6,000万米ドルに成長します。予測期間の成長は、自動車産業、サイバーセキュリティ、世界サプライチェーン、アウトソーシング製造、環境規制に起因しています。予測期間の主な動向には、3D IC技術、5g技術、人工知能（AI）と機械学習、高性能コンピューティング、先進パッケージングなどがあります。

民生用電子機器の需要急増が半導体組立および検査アウトソーシング市場の成長を牽引すると予測されます。この需要の高まりは、可処分所得の増加、顧客のライフスタイルの進化、中間層の人口増加、電子機器の価格低下などの要因によるものです。半導体組立および検査アウトソーシングは、電子機器の性能、処理速度、効率を向上させ、スペースの利用を最適化する上で重要な役割を果たしています。例えば、電子情報技術産業協会のデータによると、2023年5月の日本の電子機器生産額は67億2,200万米ドル（7,714億5,700万円）に達しました。さらに、家電製品の生産は顕著な伸びを示し、2022年5月の2億3,090万米ドル（252億6,800万円）に比べ、2億8,000万米ドル（320億9,900万円）に達しました。このように、家電製品に対する需要の増加は、半導体組立および検査アウトソーシング市場を推進すると予想されます。

拡大する自動車産業は、近い将来、半導体組立および検査アウトソーシング市場の重要な促進要因になると考えられています。自動車の設計、開発、製造、マーケティング、販売をカバーする自動車セクターは、スケーラブルなソリューション、厳格な品質管理対策、コスト削減、高価なインフラの回避、コアコンピタンスへの集中を提供することで、半導体組立および検査アウトソーシングのメリットを享受しています。欧州自動車工業会によると、2022年の世界自動車生産台数は8,540万台に達し、2021年比で5.7％の大幅増となります。Brand Finance plcによると、2022年の自動車セクターの販売台数は約7,800万台に達し、10％の大幅増となった。したがって、成長する自動車産業は半導体組立および検査アウトソーシング市場の主要な促進要因です。

目次

第1章 エグゼクティブサマリー

第2章 市場の特徴

第3章 市場動向と戦略

第4章 市場：金利、インフレ、地政学、コロナ禍、回復が市場に与える影響を含むマクロ経済シナリオ

第5章 世界の成長分析と戦略分析フレームワーク

• 世界の半導体組立および検査アウトソーシング PESTEL分析（政治、社会、技術、環境、法的要因、促進要因、抑制要因）
• 最終用途産業の分析
• 世界の半導体組立および検査アウトソーシング市場：成長率分析
• 世界の半導体組立および検査アウトソーシング市場の実績：規模と成長, 2019-2024
• 世界の半導体組立および検査アウトソーシング市場の予測：規模と成長, 2024-2029, 2034F
• 世界の半導体組立および検査アウトソーシング総アドレス可能市場（TAM）

第6章 市場セグメンテーション

• 世界の半導体組立および検査アウトソーシング市場：タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 検査サービス
• 組立サービス
• 世界の半導体組立および検査アウトソーシング市場：プロセス別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 鋸引き
• ソート
• 検査
• 組み立て
• 世界の半導体組立および検査アウトソーシング市場：パッケージングタイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• ボールグリッドアレイ
• チップスケールパッケージ
• マルチパッケージ
• スタックダイ
• クアッドとデュアル
• 世界の半導体組立および検査アウトソーシング市場：用途別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 通信
• 家電
• コンピューティングとネットワーク
• 自動車
• 産業
• その他の用途
• 世界の半導体組立および検査アウトソーシング市場：検査サービスのサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• ウエハー検査
• パッケージ検査
• 最終検査
• 信頼性検査
• 特性検査
• 世界の半導体組立および検査アウトソーシング市場：組立サービスのサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• ウェーハレベルパッケージング（WLP）
• チップオンボード（COB）アセンブリ
• ボールグリッドアレイ（BGA）アセンブリ
• フリップチップアセンブリ
• ダイアタッチサービス

第7章 地域別・国別分析

• 世界の半導体組立および検査アウトソーシング市場：地域別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 世界の半導体組立および検査アウトソーシング市場：国別、実績と予測, 2019-2024, 2024-2029F, 2034F

第8章 アジア太平洋市場

第9章 中国市場

第10章 インド市場

第11章 日本市場

第12章 オーストラリア市場

第13章 インドネシア市場

第14章 韓国市場

第15章 西欧市場

第16章 英国市場

第17章 ドイツ市場

第18章 フランス市場

第19章 イタリア市場

第20章 スペイン市場

第21章 東欧市場

第22章 ロシア市場

第23章 北米市場

第24章 米国市場

第25章 カナダ市場

第26章 南米市場

第27章 ブラジル市場

第28章 中東市場

第29章 アフリカ市場

第30章 競合情勢と企業プロファイル

• 半導体組立および検査アウトソーシング市場：競合情勢
• 半導体組立および検査アウトソーシング市場：企業プロファイル
  • Advanced Semiconductor Engineering Inc. Overview, Products and Services, Strategy and Financial Analysis
  • Amkor Technology Inc. Overview, Products and Services, Strategy and Financial Analysis
  • Jiangsu Changjiang Electronics Tech Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • King Yuan Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • Alphacore Inc. Overview, Products and Services, Strategy and Financial Analysis

第31章 その他の大手企業と革新的企業

• Device Engineering Inc.
• HMT Microelectronic AG
• Presto Engineering Group
• Sencio BV
• ShortLink AB
• SiFive Inc.
• Powertech Technology Inc.
• Tianshui Huatian Technology Co. Ltd.
• Nantong Fujitsu Microelectronics Co. Ltd.
• UTAC Holdings Ltd.
• Chipbond Technology Corporation
• ChipMOS Technologies Inc.
• Huatian Technology Sdn. Bhd.
• Walton Advanced Engineering Inc.
• Signetics Corporation

第32章 世界の市場競合ベンチマーキングとダッシュボード

第33章 主要な合併と買収

第34章 最近の市場動向

第35章 市場の潜在力が高い国、セグメント、戦略

• 半導体組立および検査アウトソーシング市場2029：新たな機会を提供する国
• 半導体組立および検査アウトソーシング市場2029：新たな機会を提供するセグメント
• 半導体組立および検査アウトソーシング市場2029：成長戦略
  • 市場動向に基づく戦略
  • 競合の戦略

第36章 付録

Outsourced semiconductor assembly and testing (OSAT) refers to a third-party service that encompasses semiconductor assembly, packaging, and testing of integrated circuits (ICs). These services are provided by vendors or suppliers who are contracted by semiconductor design companies.

The main types of services in the outsourced semiconductor assembly and testing market include test services and assembly services. Test services involve semiconductor testing, a process conducted through semiconductor test equipment (IC tester). This equipment sends electrical signals to a semiconductor device, comparing the output signals to expected values to ensure the device performs as intended. The processes involved in outsourced semiconductor assembly and testing include sawing, sorting, testing, and assembly. Various packaging types are employed, including ball grid array, chip scale package, multi-package, stacked die, quad, and dual. Outsourced semiconductor assembly and testing find applications in communication, consumer electronics, computing and networking, automotive, industrial, and other sectors.

The outsourced semiconductor assembly and testing market research report is one of a series of new reports from The Business Research Company that provides outsourced semiconductor assembly and testing market statistics, including outsourced semiconductor assembly and testing industry global market size, regional shares, competitors with a outsourced semiconductor assembly and testing market share, detailed outsourced semiconductor assembly and testing market segments, market trends and opportunities, and any further data you may need to thrive in the outsourced semiconductor assembly and testing industry. This outsourced semiconductor assembly and testing market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The outsourced semiconductor assembly and testing market size has grown strongly in recent years. It will grow from $42.84 billion in 2024 to $46.87 billion in 2025 at a compound annual growth rate (CAGR) of 9.4%. The growth in the historic period can be attributed to integrated circuits demand, semiconductor miniaturization, cost efficiency, consumer electronics growth, regulatory compliance.

The outsourced semiconductor assembly and testing market size is expected to see strong growth in the next few years. It will grow to $67.96 billion in 2029 at a compound annual growth rate (CAGR) of 9.7%. The growth in the forecast period can be attributed to automotive industry, cybersecurity, global supply chain, outsourced manufacturing, environmental regulations. Major trends in the forecast period include 3D ic technology, 5g technology, artificial intelligence (ai) and machine learning, high-performance computing, advanced packaging.

The anticipated surge in the demand for consumer electronics is set to drive the growth of the outsourced semiconductor assembly and testing market. This heightened demand is attributed to factors such as increased disposable income, evolving customer lifestyles, a growing middle-class population, and decreasing prices of electronic devices. Outsourced semiconductor assembly and testing play a crucial role in enhancing the performance, processing speeds, and efficiency of electronic devices, all while optimizing space utilization. For instance, data from the Japan Electronics and Information Technology Industries Association reveals that electronic equipment production in Japan reached $6,722 million (¥771,457 million) in May 2023. Moreover, consumer electronics production experienced notable growth, reaching $280 million (¥32,099 million) compared to $230.9 million (¥25,268 million) in May 2022. Thus, the increasing demand for consumer electronics is expected to propel the outsourced semiconductor assembly and testing market.

The expanding automotive industry is poised to be a significant driver of the outsourced semiconductor assembly and testing market in the foreseeable future. The automotive sector, covering the design, development, manufacturing, marketing, and sales of vehicles, benefits from outsourced semiconductor assembly and testing by offering scalable solutions, rigorous quality control measures, cost reduction, avoidance of expensive infrastructure, and a focus on core competencies. According to the European Automobile Manufacturers Association, global motor vehicle production reached 85.4 million units in 2022, reflecting a significant 5.7% increase compared to 2021. Additionally, in 2022, the automobile sector achieved approximately 78 million unit sales, marking a substantial 10% increase, according to Brand Finance plc. Therefore, the growing automotive industry is a key driver of the outsourced semiconductor assembly and testing market.

Strategic partnerships are a significant trend in the outsourced semiconductor assembly and testing (OSAT) market. Technology and software companies are collaborating with OSAT firms to create new design platforms and enable technological advancements for next-generation package designs. These collaborations aim to utilize each other's expertise and resources while gaining a competitive advantage in the market. For example, in April 2024, Infineon Technologies AG, a semiconductor manufacturer based in Germany, announced plans to enhance its outsourced backend manufacturing presence in Europe through a multi-year partnership with Amkor Technology, Inc., a US-based semiconductor packaging and testing service provider. This partnership will focus on establishing a dedicated packaging and testing unit at Amkor's Porto facility, with operations anticipated to begin in early 2025. This long-term arrangement will reinforce the collaboration between Infineon and Amkor while modernizing the traditional OSAT business model. Amkor will expand its Porto facilities and manage the production line, which will include a dedicated clean room, while Infineon will provide engineering and development support through onsite staff.

Major companies in the outsourced semiconductor assembly and testing market are strategically investing to enhance their profitability. Investments in OSAT represent a calculated move by semiconductor companies to boost production capabilities, reduce costs, and enhance overall efficiency in the semiconductor manufacturing process. For instance, in October 2023, Kaynes Technology India Private Limited, an India-based electronic manufacturing services (EMS) provider, announced an investment of Rs 2,800 crore ($37.84 million) to establish a compound semiconductor facility and semiconductor OSAT production facility in Telangana. This investment is expected to strengthen Telangana's position in the semiconductor industry, with Kaynes Semicon focusing on power device package types for its global customers.

In May 2024, Kaynes Technology, an electronics manufacturing company based in India, acquired Digicom Electronics for an undisclosed sum. This acquisition aims to strengthen Kaynes' entry into the U.S. market and enhance its strategy in artificial intelligence (AI) and high-performance computing infrastructure. By leveraging Digicom's extensive expertise in New Product Introduction (NPI), small-batch production, and prototype manufacturing of complex printed circuit board assemblies (PCBAs) and box constructions, Kaynes seeks to enhance its offerings. Digicom Electronics is a U.S.-based electronics manufacturing services (EMS) provider located in Oakland, California.

Major companies operating in the outsourced semiconductor assembly and testing market include Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Jiangsu Changjiang Electronics Tech Co. Ltd., King Yuan Electronics Co. Ltd., Alphacore Inc., Device Engineering Inc., HMT microelectronic AG, Presto Engineering Group, Sencio BV, ShortLink AB, SiFive Inc., Powertech Technology Inc., Tianshui Huatian Technology Co. Ltd., Nantong Fujitsu Microelectronics Co. Ltd., UTAC Holdings Ltd., Chipbond Technology Corporation, ChipMOS Technologies Inc., Huatian Technology Sdn. Bhd., Walton Advanced Engineering Inc., Signetics Corporation, Hana Micron Inc., NEPES Corporation, Sunrise Memory Corp., Tongfu Microelectronics Co. Ltd., Integrated Micro-electronics Inc., Formosa Advanced Technologies Co Ltd., Lingsen Precision Industries Ltd., Shenzhen CPET Electronics Co. Ltd.

Asia-Pacific was the largest region in the outsourced semiconductor assembly and testing market in 2024. The regions covered in the outsourced semiconductor assembly and testing market analysis report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.

The countries covered in the outsourced semiconductor assembly and testing market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK and USA.

The outsourced semiconductor assembly and testing market include revenues earned by entities by providing various outsourced semiconductor assemblies and testing services such as Pure-Play Foundries (FABs) and OSATs services to transform the design files into real silicon wafers, testing, assembly, and logistics of semiconductors. outsourced semiconductor assembly and testing help semiconductor manufacturers with operational efficiency and optimization of internal resources. The market value includes the value of related goods sold by the service provider or included within the service offering. Only goods and services traded between entities or sold to end consumers are included.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Outsourced Semiconductor Assembly And Testing Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on outsourced semiconductor assembly and testing market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for outsourced semiconductor assembly and testing ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The outsourced semiconductor assembly and testing market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

• The market characteristics section of the report defines and explains the market.
• The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
• The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.

• Market segmentations break down the market into sub markets.
• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
• The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
• The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

• Markets Covered:1) By Type: Test Service; Assembly Service
• 2) By Process: Sawing; Sorting; Testing; Assembly
• 3) By Packaging Type: Ball Grid Array; Chip Scale Package; Multi Package; Stacked Die; Quad And Dual
• 4) By Application: Communication; Consumer Electronics; Computing And Networking; Automotive; Industrial; Other Applications
• Subsegments:
• 1) By Test Service: Wafer Testing; Package Testing; Final Testing; Reliability Testing; Characterization Testing
• 2) By Assembly Service: Wafer-Level Packaging (WLP); Chip-On-Board (COB) Assembly; Ball Grid Array (BGA) Assembly; Flip Chip Assembly; Die Attach Services
• Companies Mentioned: Advanced Semiconductor Engineering Inc.; Amkor Technology Inc.; Jiangsu Changjiang Electronics Tech Co. Ltd.; King Yuan Electronics Co. Ltd.; Alphacore Inc.
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
• Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
• Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Outsourced Semiconductor Assembly And Testing Market Characteristics

3. Outsourced Semiconductor Assembly And Testing Market Trends And Strategies

4. Outsourced Semiconductor Assembly And Testing Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics And Covid And Recovery On The Market

5. Global Outsourced Semiconductor Assembly And Testing Growth Analysis And Strategic Analysis Framework

• 5.1. Global Outsourced Semiconductor Assembly And Testing PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
• 5.2. Analysis Of End Use Industries
• 5.3. Global Outsourced Semiconductor Assembly And Testing Market Growth Rate Analysis
• 5.4. Global Outsourced Semiconductor Assembly And Testing Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
• 5.5. Global Outsourced Semiconductor Assembly And Testing Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
• 5.6. Global Outsourced Semiconductor Assembly And Testing Total Addressable Market (TAM)

6. Outsourced Semiconductor Assembly And Testing Market Segmentation

• 6.1. Global Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Test Service
• Assembly Service
• 6.2. Global Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Sawing
• Sorting
• Testing
• Assembly
• 6.3. Global Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Ball Grid Array
• Chip Scale Package
• Multi Package
• Stacked Die
• Quad And Dual
• 6.4. Global Outsourced Semiconductor Assembly And Testing Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Communication
• Consumer Electronics
• Computing And Networking
• Automotive
• Industrial
• Other Applications
• 6.5. Global Outsourced Semiconductor Assembly And Testing Market, Sub-Segmentation Of Test Service, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Wafer Testing
• Package Testing
• Final Testing
• Reliability Testing
• Characterization Testing
• 6.6. Global Outsourced Semiconductor Assembly And Testing Market, Sub-Segmentation Of Assembly Service, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Wafer-Level Packaging (WLP)
• Chip-On-Board (COB) Assembly
• Ball Grid Array (BGA) Assembly
• Flip Chip Assembly
• Die Attach Services

7. Outsourced Semiconductor Assembly And Testing Market Regional And Country Analysis

• 7.1. Global Outsourced Semiconductor Assembly And Testing Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 7.2. Global Outsourced Semiconductor Assembly And Testing Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Outsourced Semiconductor Assembly And Testing Market

• 8.1. Asia-Pacific Outsourced Semiconductor Assembly And Testing Market Overview
• Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
• 8.2. Asia-Pacific Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.3. Asia-Pacific Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.4. Asia-Pacific Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Outsourced Semiconductor Assembly And Testing Market

• 9.1. China Outsourced Semiconductor Assembly And Testing Market Overview
• 9.2. China Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.3. China Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.4. China Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Outsourced Semiconductor Assembly And Testing Market

• 10.1. India Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.2. India Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.3. India Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Outsourced Semiconductor Assembly And Testing Market

• 11.1. Japan Outsourced Semiconductor Assembly And Testing Market Overview
• 11.2. Japan Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.3. Japan Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.4. Japan Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Outsourced Semiconductor Assembly And Testing Market

• 12.1. Australia Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.2. Australia Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.3. Australia Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Outsourced Semiconductor Assembly And Testing Market

• 13.1. Indonesia Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.2. Indonesia Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.3. Indonesia Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Outsourced Semiconductor Assembly And Testing Market

• 14.1. South Korea Outsourced Semiconductor Assembly And Testing Market Overview
• 14.2. South Korea Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.3. South Korea Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.4. South Korea Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Outsourced Semiconductor Assembly And Testing Market

• 15.1. Western Europe Outsourced Semiconductor Assembly And Testing Market Overview
• 15.2. Western Europe Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.3. Western Europe Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.4. Western Europe Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Outsourced Semiconductor Assembly And Testing Market

• 16.1. UK Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.2. UK Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.3. UK Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Outsourced Semiconductor Assembly And Testing Market

• 17.1. Germany Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.2. Germany Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.3. Germany Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Outsourced Semiconductor Assembly And Testing Market

• 18.1. France Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.2. France Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.3. France Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Outsourced Semiconductor Assembly And Testing Market

• 19.1. Italy Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.2. Italy Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.3. Italy Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Outsourced Semiconductor Assembly And Testing Market

• 20.1. Spain Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.2. Spain Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.3. Spain Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Outsourced Semiconductor Assembly And Testing Market

• 21.1. Eastern Europe Outsourced Semiconductor Assembly And Testing Market Overview
• 21.2. Eastern Europe Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.3. Eastern Europe Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.4. Eastern Europe Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Outsourced Semiconductor Assembly And Testing Market

• 22.1. Russia Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.2. Russia Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.3. Russia Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Outsourced Semiconductor Assembly And Testing Market

• 23.1. North America Outsourced Semiconductor Assembly And Testing Market Overview
• 23.2. North America Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.3. North America Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.4. North America Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Outsourced Semiconductor Assembly And Testing Market

• 24.1. USA Outsourced Semiconductor Assembly And Testing Market Overview
• 24.2. USA Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.3. USA Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.4. USA Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Outsourced Semiconductor Assembly And Testing Market

• 25.1. Canada Outsourced Semiconductor Assembly And Testing Market Overview
• 25.2. Canada Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.3. Canada Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.4. Canada Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Outsourced Semiconductor Assembly And Testing Market

• 26.1. South America Outsourced Semiconductor Assembly And Testing Market Overview
• 26.2. South America Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.3. South America Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.4. South America Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Outsourced Semiconductor Assembly And Testing Market

• 27.1. Brazil Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.2. Brazil Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.3. Brazil Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Outsourced Semiconductor Assembly And Testing Market

• 28.1. Middle East Outsourced Semiconductor Assembly And Testing Market Overview
• 28.2. Middle East Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.3. Middle East Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.4. Middle East Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Outsourced Semiconductor Assembly And Testing Market

• 29.1. Africa Outsourced Semiconductor Assembly And Testing Market Overview
• 29.2. Africa Outsourced Semiconductor Assembly And Testing Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.3. Africa Outsourced Semiconductor Assembly And Testing Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.4. Africa Outsourced Semiconductor Assembly And Testing Market, Segmentation By Packaging Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Outsourced Semiconductor Assembly And Testing Market Competitive Landscape And Company Profiles

• 30.1. Outsourced Semiconductor Assembly And Testing Market Competitive Landscape
• 30.2. Outsourced Semiconductor Assembly And Testing Market Company Profiles
  • 30.2.1. Advanced Semiconductor Engineering Inc. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.2. Amkor Technology Inc. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.3. Jiangsu Changjiang Electronics Tech Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.4. King Yuan Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.5. Alphacore Inc. Overview, Products and Services, Strategy and Financial Analysis

31. Outsourced Semiconductor Assembly And Testing Market Other Major And Innovative Companies

• 31.1. Device Engineering Inc.
• 31.2. HMT Microelectronic AG
• 31.3. Presto Engineering Group
• 31.4. Sencio BV
• 31.5. ShortLink AB
• 31.6. SiFive Inc.
• 31.7. Powertech Technology Inc.
• 31.8. Tianshui Huatian Technology Co. Ltd.
• 31.9. Nantong Fujitsu Microelectronics Co. Ltd.
• 31.10. UTAC Holdings Ltd.
• 31.11. Chipbond Technology Corporation
• 31.12. ChipMOS Technologies Inc.
• 31.13. Huatian Technology Sdn. Bhd.
• 31.14. Walton Advanced Engineering Inc.
• 31.15. Signetics Corporation

32. Global Outsourced Semiconductor Assembly And Testing Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Outsourced Semiconductor Assembly And Testing Market

34. Recent Developments In The Outsourced Semiconductor Assembly And Testing Market

35. Outsourced Semiconductor Assembly And Testing Market High Potential Countries, Segments and Strategies

• 35.1 Outsourced Semiconductor Assembly And Testing Market In 2029 - Countries Offering Most New Opportunities
• 35.2 Outsourced Semiconductor Assembly And Testing Market In 2029 - Segments Offering Most New Opportunities
• 35.3 Outsourced Semiconductor Assembly And Testing Market In 2029 - Growth Strategies
  • 35.3.1 Market Trend Based Strategies
  • 35.3.2 Competitor Strategies

36. Appendix

• 36.1. Abbreviations
• 36.2. Currencies
• 36.3. Historic And Forecast Inflation Rates
• 36.4. Research Inquiries
• 36.5. The Business Research Company
• 36.6. Copyright And Disclaimer