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1434631

3D TSV市場：製品別、エンドユーザー別-2024-2030年の世界予測

3D TSV Market by Product (Advanced LED Packaging, CMOS Image Sensors, Imaging & Optoelectronics), End User (Aerospace & Defense, Automotive, Consumer Electronics) - Global Forecast 2024-2030
出版日: | 発行: 360iResearch | ページ情報: 英文 188 Pages | 納期: 即日から翌営業日

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価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.76円
3D TSV市場：製品別、エンドユーザー別-2024-2030年の世界予測
出版日: 2024年01月15日
発行: 360iResearch
ページ情報: 英文 188 Pages
納期: 即日から翌営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 図表
  • 目次
概要

3D TSV市場規模は2023年に267億2,000万米ドルと推計され、2024年には286億8,000万米ドルに達し、CAGR 7.44%で2030年には441億8,000万米ドルに達すると予測されます。

3D TSVの世界市場

主な市場の統計
基準年[2023］ 267億2,000万米ドル
予測年[2024] 286億8,000万米ドル
予測年 [2030] 441億8,000万米ドル
CAGR（%） 7.44%
3D TSV Market-IMG1

FPNVポジショニング・マトリックス

FPNVポジショニングマトリックスは3D TSV市場を評価する上で極めて重要です。事業戦略と製品満足度に関連する主要指標を調査し、ベンダーの包括的な評価を提供します。この綿密な分析により、ユーザーは要件に沿った十分な情報に基づいた意思決定を行うことができます。評価に基づき、ベンダーは成功の度合いが異なる4つの象限に分類されます：フォアフロント（F）、パスファインダー（P）、ニッチ（N）、バイタル（V）です。

市場シェア分析

市場シェア分析は、3D TSV市場におけるベンダーの現状について、洞察に満ちた詳細な調査を提供する包括的なツールです。全体的な収益、顧客基盤、その他の主要指標についてベンダーの貢献度を綿密に比較・分析することで、企業の業績や市場シェア争いの際に直面する課題について理解を深めることができます。さらに、この分析により、調査対象基準年に観察された累積、断片化の優位性、合併の特徴などの要因を含む、この分野の競合特性に関する貴重な考察が得られます。このような詳細レベルの拡大により、ベンダーはより多くの情報に基づいた意思決定を行い、市場で競争優位に立つための効果的な戦略を考案することができます。

本レポートは、以下の側面に関する貴重な洞察を提供しています：

1-市場の浸透度：主要企業が提供する市場に関する包括的な情報を提示しています。

2-市場の開拓度：有利な新興市場を深く掘り下げ、成熟市場セグメントにおける浸透度を分析しています。

3-市場の多様化：新製品の発売、未開拓の地域、最近の開発、投資に関する詳細な情報を提供します。

4-競合の評価と情報：市場シェア、戦略、製品、認証、規制状況、特許状況、主要企業の製造能力などを網羅的に評価します。

5-製品開発およびイノベーション：将来の技術、研究開発活動、画期的な製品開発に関する知的洞察を提供します。

本レポートは、以下のような主要な質問に対応しています：

1-3D TSV市場の市場規模および予測は？

2-3D TSV市場の予測期間中に投資を検討すべき製品、セグメント、用途、分野は何か？

3-3D TSV市場における技術動向と規制の枠組みは？

4-3D TSV市場における主要ベンダーの市場シェアは？

5-3D TSV市場への参入に適した形態や戦略的手段は？

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

  • 市場力学
    • 促進要因
      • 低消費電力や高比などの改善された機能を備えた革新的なチップアーキテクチャに対する需要の高まり
      • データセンターとメモリデバイスの拡張
      • コンピューティングアプリケーションの高性能
    • 抑制要因
      • より高いレベルの統合によって生じる熱の問題
    • 機会
      • 電子機器の小型化ニーズの高まり
      • ダイナミックランダムアクセスメモリ（DRAM）への採用
    • 課題
      • 3D ICパッケージのコストが高い
  • 市場セグメンテーション分析
  • 市場動向分析
  • 高インフレの累積的影響
  • ポーターのファイブフォース分析
  • バリューチェーンとクリティカルパス分析
  • 規制の枠組み

第6章 3D TSV市場：製品別

  • 先進的なLEDパッケージング
  • CMOSイメージセンサー
  • イメージングとオプトエレクトロニクス
  • メモリ
  • MEMS

第7章 3D TSV市場：エンドユーザー別

  • 航空宇宙と防衛
  • 自動車
  • 家電
  • 情報技術と通信

第8章 南北アメリカの3D TSV市場

  • アルゼンチン
  • ブラジル
  • カナダ
  • メキシコ
  • 米国

第9章 アジア太平洋地域の3D TSV市場

  • オーストラリア
  • 中国
  • インド
  • インドネシア
  • 日本
  • マレーシア
  • フィリピン
  • シンガポール
  • 韓国
  • 台湾
  • タイ
  • ベトナム

第10章 欧州・中東・アフリカの3D TSV市場

  • デンマーク
  • エジプト
  • フィンランド
  • フランス
  • ドイツ
  • イスラエル
  • イタリア
  • オランダ
  • ナイジェリア
  • ノルウェー
  • ポーランド
  • カタール
  • ロシア
  • サウジアラビア
  • 南アフリカ
  • スペイン
  • スウェーデン
  • スイス
  • トルコ
  • アラブ首長国連邦
  • 英国

第11章 競合情勢

  • FPNVポジショニングマトリクス
  • 市場シェア分析：主要企業別
  • 競合シナリオ主要企業別の分析

第12章 競争力のあるポートフォリオ

  • 主要な企業プロファイル
    • Advanced Semiconductor Engineering Inc.
    • Amkor Technology, Inc.
    • Broadcom Inc.
    • GlobalFoundries Inc.
    • Infineon Technologies AG
    • Intel Corporation
    • InvenSense, Inc.
    • Micron Technology, Inc.
    • NXP Semiconductors N.V.
    • Samsung Electronics Co., Ltd.
    • STMicroelectronics N.V.
    • Taiwan Semiconductor Manufacturing Company Limited
    • Teledyne Digital Imaging Inc.
    • Tezzaron Semiconductor Corporation
    • Toshiba Corporation
    • United Microelectronics Corporation
  • 主要な製品ポートフォリオ

第13章 付録

  • ディスカッションガイド
  • ライセンスと価格について
図表

LIST OF FIGURES

  • FIGURE 1. 3D TSV MARKET RESEARCH PROCESS
  • FIGURE 2. 3D TSV MARKET SIZE, 2023 VS 2030
  • FIGURE 3. 3D TSV MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. 3D TSV MARKET SIZE, BY REGION, 2023 VS 2030 (%)
  • FIGURE 5. 3D TSV MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. 3D TSV MARKET DYNAMICS
  • FIGURE 7. 3D TSV MARKET SIZE, BY PRODUCT, 2023 VS 2030 (%)
  • FIGURE 8. 3D TSV MARKET SIZE, BY PRODUCT, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 9. 3D TSV MARKET SIZE, BY END USER, 2023 VS 2030 (%)
  • FIGURE 10. 3D TSV MARKET SIZE, BY END USER, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 11. AMERICAS 3D TSV MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 12. AMERICAS 3D TSV MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 13. UNITED STATES 3D TSV MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 14. UNITED STATES 3D TSV MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 15. ASIA-PACIFIC 3D TSV MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 16. ASIA-PACIFIC 3D TSV MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA 3D TSV MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 18. EUROPE, MIDDLE EAST & AFRICA 3D TSV MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 19. 3D TSV MARKET, FPNV POSITIONING MATRIX, 2023
  • FIGURE 20. 3D TSV MARKET SHARE, BY KEY PLAYER, 2023

LIST OF TABLES

  • TABLE 1. 3D TSV MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. 3D TSV MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL 3D TSV MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 6. 3D TSV MARKET SIZE, BY ADVANCED LED PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 7. 3D TSV MARKET SIZE, BY CMOS IMAGE SENSORS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 8. 3D TSV MARKET SIZE, BY IMAGING & OPTOELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. 3D TSV MARKET SIZE, BY MEMORY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. 3D TSV MARKET SIZE, BY MEMS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 12. 3D TSV MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. 3D TSV MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. 3D TSV MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. 3D TSV MARKET SIZE, BY INFORMATION TECHNOLOGY & TELECOMMUNICATION, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. AMERICAS 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 17. AMERICAS 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 18. AMERICAS 3D TSV MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 19. ARGENTINA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 20. ARGENTINA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 21. BRAZIL 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 22. BRAZIL 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 23. CANADA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 24. CANADA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 25. MEXICO 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 26. MEXICO 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 27. UNITED STATES 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 28. UNITED STATES 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 29. UNITED STATES 3D TSV MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 30. ASIA-PACIFIC 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 31. ASIA-PACIFIC 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 32. ASIA-PACIFIC 3D TSV MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 33. AUSTRALIA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 34. AUSTRALIA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 35. CHINA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 36. CHINA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 37. INDIA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 38. INDIA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 39. INDONESIA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 40. INDONESIA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 41. JAPAN 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 42. JAPAN 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 43. MALAYSIA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 44. MALAYSIA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 45. PHILIPPINES 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 46. PHILIPPINES 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 47. SINGAPORE 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 48. SINGAPORE 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 49. SOUTH KOREA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 50. SOUTH KOREA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 51. TAIWAN 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 52. TAIWAN 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 53. THAILAND 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 54. THAILAND 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 55. VIETNAM 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 56. VIETNAM 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 57. EUROPE, MIDDLE EAST & AFRICA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 58. EUROPE, MIDDLE EAST & AFRICA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 59. EUROPE, MIDDLE EAST & AFRICA 3D TSV MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 60. DENMARK 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 61. DENMARK 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 62. EGYPT 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 63. EGYPT 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 64. FINLAND 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 65. FINLAND 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 66. FRANCE 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 67. FRANCE 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 68. GERMANY 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 69. GERMANY 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 70. ISRAEL 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 71. ISRAEL 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 72. ITALY 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 73. ITALY 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 74. NETHERLANDS 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 75. NETHERLANDS 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 76. NIGERIA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 77. NIGERIA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 78. NORWAY 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 79. NORWAY 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 80. POLAND 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 81. POLAND 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 82. QATAR 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 83. QATAR 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 84. RUSSIA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 85. RUSSIA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 86. SAUDI ARABIA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 87. SAUDI ARABIA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 88. SOUTH AFRICA 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 89. SOUTH AFRICA 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 90. SPAIN 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 91. SPAIN 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 92. SWEDEN 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 93. SWEDEN 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 94. SWITZERLAND 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 95. SWITZERLAND 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 96. TURKEY 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 97. TURKEY 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 98. UNITED ARAB EMIRATES 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 99. UNITED ARAB EMIRATES 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 100. UNITED KINGDOM 3D TSV MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 101. UNITED KINGDOM 3D TSV MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 102. 3D TSV MARKET, FPNV POSITIONING MATRIX, 2023
  • TABLE 103. 3D TSV MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 104. 3D TSV MARKET LICENSE & PRICING
目次
Product Code: MRR-436901065C32

[188 Pages Report] The 3D TSV Market size was estimated at USD 26.72 billion in 2023 and expected to reach USD 28.68 billion in 2024, at a CAGR 7.44% to reach USD 44.18 billion by 2030.

Global 3D TSV Market

KEY MARKET STATISTICS
Base Year [2023] USD 26.72 billion
Estimated Year [2024] USD 28.68 billion
Forecast Year [2030] USD 44.18 billion
CAGR (%) 7.44%
3D TSV Market - IMG1

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the 3D TSV Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the 3D TSV Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the 3D TSV Market, highlighting leading vendors and their innovative profiles. These include Advanced Semiconductor Engineering Inc., Amkor Technology, Inc., Broadcom Inc., GlobalFoundries Inc., Infineon Technologies AG, Intel Corporation, InvenSense, Inc., Micron Technology, Inc., NXP Semiconductors N.V., Samsung Electronics Co., Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Teledyne Digital Imaging Inc., Tezzaron Semiconductor Corporation, Toshiba Corporation, and United Microelectronics Corporation.

Market Segmentation & Coverage

This research report categorizes the 3D TSV Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Product
    • Advanced LED Packaging
    • CMOS Image Sensors
    • Imaging & Optoelectronics
    • Memory
    • MEMS
  • End User
    • Aerospace & Defense
    • Automotive
    • Consumer Electronics
    • Information Technology & Telecommunication
  • Region
    • Americas
      • Argentina
      • Brazil
      • Canada
      • Mexico
      • United States
        • California
        • Florida
        • Illinois
        • New York
        • Ohio
        • Pennsylvania
        • Texas
    • Asia-Pacific
      • Australia
      • China
      • India
      • Indonesia
      • Japan
      • Malaysia
      • Philippines
      • Singapore
      • South Korea
      • Taiwan
      • Thailand
      • Vietnam
    • Europe, Middle East & Africa
      • Denmark
      • Egypt
      • Finland
      • France
      • Germany
      • Israel
      • Italy
      • Netherlands
      • Nigeria
      • Norway
      • Poland
      • Qatar
      • Russia
      • Saudi Arabia
      • South Africa
      • Spain
      • Sweden
      • Switzerland
      • Turkey
      • United Arab Emirates
      • United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the 3D TSV Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the 3D TSV Market?

3. What are the technology trends and regulatory frameworks in the 3D TSV Market?

4. What is the market share of the leading vendors in the 3D TSV Market?

5. Which modes and strategic moves are suitable for entering the 3D TSV Market?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Limitations
  • 1.7. Assumptions
  • 1.8. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

  • 4.1. Introduction
  • 4.2. 3D TSV Market, by Region

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing demand for innovative chip architectures with improved features such as low power consumption and high ratio
      • 5.1.1.2. Expansion of the data centers and memory devices
      • 5.1.1.3. High performance of computing applications
    • 5.1.2. Restraints
      • 5.1.2.1. Thermal issues produced by higher levels of integration
    • 5.1.3. Opportunities
      • 5.1.3.1. Rising need for miniaturization of electronic devices
      • 5.1.3.2. Adoption in the dynamic random access memory (DRAM)
    • 5.1.4. Challenges
      • 5.1.4.1. High cost of 3D IC packages
  • 5.2. Market Segmentation Analysis
  • 5.3. Market Trend Analysis
  • 5.4. Cumulative Impact of High Inflation
  • 5.5. Porter's Five Forces Analysis
    • 5.5.1. Threat of New Entrants
    • 5.5.2. Threat of Substitutes
    • 5.5.3. Bargaining Power of Customers
    • 5.5.4. Bargaining Power of Suppliers
    • 5.5.5. Industry Rivalry
  • 5.6. Value Chain & Critical Path Analysis
  • 5.7. Regulatory Framework

6. 3D TSV Market, by Product

  • 6.1. Introduction
  • 6.2. Advanced LED Packaging
  • 6.3. CMOS Image Sensors
  • 6.4. Imaging & Optoelectronics
  • 6.5. Memory
  • 6.6. MEMS

7. 3D TSV Market, by End User

  • 7.1. Introduction
  • 7.2. Aerospace & Defense
  • 7.3. Automotive
  • 7.4. Consumer Electronics
  • 7.5. Information Technology & Telecommunication

8. Americas 3D TSV Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific 3D TSV Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa 3D TSV Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. FPNV Positioning Matrix
  • 11.2. Market Share Analysis, By Key Player
  • 11.3. Competitive Scenario Analysis, By Key Player

12. Competitive Portfolio

  • 12.1. Key Company Profiles
    • 12.1.1. Advanced Semiconductor Engineering Inc.
    • 12.1.2. Amkor Technology, Inc.
    • 12.1.3. Broadcom Inc.
    • 12.1.4. GlobalFoundries Inc.
    • 12.1.5. Infineon Technologies AG
    • 12.1.6. Intel Corporation
    • 12.1.7. InvenSense, Inc.
    • 12.1.8. Micron Technology, Inc.
    • 12.1.9. NXP Semiconductors N.V.
    • 12.1.10. Samsung Electronics Co., Ltd.
    • 12.1.11. STMicroelectronics N.V.
    • 12.1.12. Taiwan Semiconductor Manufacturing Company Limited
    • 12.1.13. Teledyne Digital Imaging Inc.
    • 12.1.14. Tezzaron Semiconductor Corporation
    • 12.1.15. Toshiba Corporation
    • 12.1.16. United Microelectronics Corporation
  • 12.2. Key Product Portfolio

13. Appendix

  • 13.1. Discussion Guide
  • 13.2. License & Pricing