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市場調査レポート
商品コード
1518644

先端IC基板の市場レポート：タイプ、用途、地域別、2024～2032年

Advanced IC Substrate Market Report by Type (FC BGA, FC CSP), Application (Consumer Electronics, Automotive and Transportation, IT and Telecom, and Others), and Region 2024-2032

出版日
発行
IMARC
ページ情報
英文 139 Pages
納期
2～3営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=143.57円
先端IC基板の市場レポート：タイプ、用途、地域別、2024～2032年
出版日: 2024年07月01日
発行: IMARC
ページ情報: 英文 139 Pages
納期: 2～3営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界の先端IC基板の市場規模は2023年に100億米ドルに達しました。今後、市場は2032年までに165億米ドルに達し、2024～2032年にかけて5.6％の成長率（CAGR）を示すと予測されます。高性能電子機器に対する需要の高まり、小型・軽量でエネルギー効率の高い機器の採用の増加、データセンターとクラウドコンピューティングサービスの増加が、市場を推進している主要要因の一部です。

先端集積回路（IC）基板は、電子機器にICを実装し相互接続するための土台となる重要な部品です。最適な電気性能、熱管理、シグナルインテグリティを提供するために、高度な材料と技術を利用しています。スマートフォン、タブレット、コンピューター、その他の電子機器に見られる高性能用途の特定の要件を満たすように設計されています。接続性の向上、消費電力の削減、効率的な放熱を実現するため、先端IC基板の需要は世界中で高まっています。

現在、複雑な電子システムのシームレスな機能を可能にする先端IC基板の採用が増加しており、市場にプラスの影響を与えています。さらに、第5世代（5G）技術の台頭と人工知能（AI）の採用増加が市場の成長を強化しています。これとは別に、より高いデータ転送速度とより複雑な処理タスクに対応できる先端IC基板に対する需要の高まりが、有利な市場展望をもたらしています。さらに、産業用途における遠隔制御電気機器のニーズの高まりは、業界の投資家に有利な成長機会を提供しています。これに加えて、拡大現実（AR）、仮想現実（VR）、高精細（HD）ディスプレイなどの高度な機能に対する消費者の嗜好の高まりが、市場の成長に寄与しています。さらに、世界中でモノのインターネット（IoT）デバイスの利用が増加していることも、市場の成長を後押ししています。

先端IC基板の市場動向/促進要因：

高性能電子機器に対する需要の高まり

スマートフォン、タブレット、パーソナルコンピュータ（PC）、ウェアラブルデバイス、ノートPCなど、高度な電子機器に対する需要の高まりが市場の成長に寄与しています。また、消費者は、シームレスなマルチタスク、高速接続性、強化されたグラフィックス性能を提供する電子機器を好むようになっています。また、没入型体験を個人に提供するデバイスの採用も進んでいます。これとは別に、強力なプロセッサー、メモリーモジュール、通信部品の統合に対応できる高度なIC基板に対する需要も増加しています。その結果、メーカーは電気経路とシグナルインテグリティが最適化された基板に投資し、最小限の待ち時間で効率的なデータ転送を実現しています。

小型化の人気の高まり

小型化、軽量化、エネルギー効率の高いデバイスに対する個人需要の高まりと、世界の小型化人気の高まりが、市場の成長を支えています。これに伴い、小型で高密度の先端IC基板へのニーズが高まっています。これに加えて、これらの基板は、最適な機能を維持しながら、多層コンポーネントの積層を可能にし、デバイスのフットプリントを縮小するという利点があります。さまざまなコンポーネントを1枚の基板に集積できるため、効率が向上し、信号干渉のリスクが減り、デバイス全体の性能が向上します。

データセンターの増加

世界中でデータセンターとクラウドコンピューティングサービスの数が増加していることが、市場の成長を後押ししています。企業や個人は、膨大な量の情報を保存・管理するために、クラウドコンピューティング、ビッグデータ分析、オンラインサービスへの依存度を高めています。データセンターには無数のサーバー、ストレージシステム、ネットワーク機器があり、かなりの熱を発生します。これに伴い、過熱を防ぎ、中断のない動作を保証するために、効率的な放熱が必要とされています。これに加えて、先端IC基板は、熱管理機能を強化し、熱拡散特性を提供することで、これらのシステムの信頼性と寿命の維持を支援します。さらに、熱を効果的に管理できる高性能基板への需要の高まりが、市場の成長を強化しています。

目次

第1章 序文

第2章 調査範囲と調査手法

  • 調査の目的
  • ステークホルダー
  • データソース
    • 一次情報
    • 二次情報
  • 市場推定
    • ボトムアップアプローチ
    • トップダウンアプローチ
  • 調査手法

第3章 エグゼクティブ概要

第4章 イントロダクション

  • 概要
  • 主要業界動向

第5章 世界の先端IC基板市場

  • 市場概要
  • 市場実績
  • COVID-19の影響
  • 市場予測

第6章 市場内訳：タイプ別

  • FC BGA
  • FC CSP

第7章 市場内訳：用途別

  • 民生用電子機器
  • 自動車・輸送
  • ITと通信
  • その他

第8章 市場内訳：地域別

  • 北米
    • 米国
    • カナダ
  • アジア太平洋
    • 中国
    • 日本
    • インド
    • 韓国
    • オーストラリア
    • インドネシア
    • その他
  • 欧州
    • ドイツ
    • フランス
    • 英国
    • イタリア
    • スペイン
    • ロシア
    • その他
  • ラテンアメリカ
    • ブラジル
    • メキシコ
    • その他
  • 中東・アフリカ
    • 市場動向
    • 市場内訳：国別
    • 市場予測

第9章 SWOT分析

  • 概要
  • 強み
  • 弱み
  • 機会
  • 脅威

第10章 バリューチェーン分析

第11章 ポーターのファイブフォース分析

  • 概要
  • 買い手の交渉力
  • 供給企業の交渉力
  • 競合の程度
  • 新規参入業者の脅威
  • 代替品の脅威

第12章 価格分析

第13章 競合情勢

  • 市場構造
  • 主要企業
  • 主要企業のプロファイル
    • ASE Group
    • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Fujitsu Limited
    • Ibiden Co. Ltd.
    • JCET Group Co. Ltd
    • Kinsus Interconnect Technology Corp.
    • Korea Circuit Co. Ltd.
    • KYOCERA Corporation
    • LG Innotek Co. Ltd.
    • Nan Ya PCB Co. Ltd.（Nan Ya Plastics Corporation）
    • TTM Technologies Inc.
    • Unimicron Technology Corporation（United Microelectronics Corporation）
図表

List of Figures

  • Figure 1: Global: Advanced IC Substrate Market: Major Drivers and Challenges
  • Figure 2: Global: Advanced IC Substrate Market: Sales Value (in Billion US$), 2018-2023
  • Figure 3: Global: Advanced IC Substrate Market Forecast: Sales Value (in Billion US$), 2024-2032
  • Figure 4: Global: Advanced IC Substrate Market: Breakup by Type (in %), 2023
  • Figure 5: Global: Advanced IC Substrate Market: Breakup by Application (in %), 2023
  • Figure 6: Global: Advanced IC Substrate Market: Breakup by Region (in %), 2023
  • Figure 7: Global: Advanced IC Substrate (FC BGA) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 8: Global: Advanced IC Substrate (FC BGA) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 9: Global: Advanced IC Substrate (FC CSP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: Advanced IC Substrate (FC CSP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: Advanced IC Substrate (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: Advanced IC Substrate (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: Advanced IC Substrate (Automotive and Transportation) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: Advanced IC Substrate (Automotive and Transportation) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: Advanced IC Substrate (IT and Telecom) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: Advanced IC Substrate (IT and Telecom) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: Advanced IC Substrate (Other Applications) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: Advanced IC Substrate (Other Applications) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: North America: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: North America: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: United States: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: United States: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Canada: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Canada: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Asia-Pacific: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Asia-Pacific: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: China: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: China: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Japan: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Japan: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: India: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: India: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: South Korea: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: South Korea: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Australia: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Australia: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Indonesia: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Indonesia: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: Others: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: Others: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Europe: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Europe: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: Germany: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: Germany: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: France: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: France: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: United Kingdom: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: United Kingdom: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: Italy: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: Italy: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: Spain: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: Spain: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: Russia: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: Russia: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Others: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Others: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: Latin America: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: Latin America: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: Brazil: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: Brazil: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: Mexico: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: Mexico: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: Others: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: Others: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: Middle East and Africa: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: Middle East and Africa: Advanced IC Substrate Market: Breakup by Country (in %), 2023
  • Figure 67: Middle East and Africa: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 68: Global: Advanced IC Substrate Industry: SWOT Analysis
  • Figure 69: Global: Advanced IC Substrate Industry: Value Chain Analysis
  • Figure 70: Global: Advanced IC Substrate Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Advanced IC Substrate Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: Advanced IC Substrate Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: Advanced IC Substrate Market Forecast: Breakup by Application (in Million US$), 2024-2032
  • Table 4: Global: Advanced IC Substrate Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 5: Global: Advanced IC Substrate Market: Competitive Structure
  • Table 6: Global: Advanced IC Substrate Market: Key Players
目次
Product Code: SR112024A5612

The global advanced IC substrate market size reached US$ 10.0 Billion in 2023. Looking forward, the market is expected to reach US$ 16.5 Billion by 2032, exhibiting a growth rate (CAGR) of 5.6% during 2024-2032. The growing demand for high-performance electronic devices, rising adoption of smaller, lighter, and more energy-efficient devices, and increasing number of data centers and cloud computing services are some of the major factors propelling the market.

An advanced integrated circuit (IC) substrate is a crucial component that serves as a foundation for mounting and interconnecting ICs within electronic devices. It utilizes advanced materials and technologies to provide optimal electrical performance, thermal management, and signal integrity. It is designed to meet the specific requirements of high-performance applications that are found in smartphones, tablets, computers, and other electronic devices. As it assists in offering enhanced connectivity, reduced power consumption, and efficient heat dissipation, the demand for advanced IC substrates is rising across the globe.

At present, the increasing adoption of advanced IC substrate, as it enables the seamless functioning of intricate electronic systems, is influencing the market positively. Moreover, the rising emergence of fifth-generation (5G) technology, along with the increasing adoption of artificial intelligence (AI), is strengthening the growth of the market. Apart from this, the growing demand for advanced IC substrates that can accommodate higher data transfer rates and more complex processing tasks is offering a favorable market outlook. Additionally, the rising need for remote-controlled electrical equipment in industrial applications is offering lucrative growth opportunities to industry investors. Besides this, the increasing consumer preferences for advanced features, such as augmented reality (AR), virtual reality (VR), and high-definition (HD) displays, are contributing to the growth of the market. In addition, the rising utilization of the Internet of Things (IoT) devices around the world is impelling the growth of the market.

Advanced IC Substrate Market Trends/Drivers:

Rising demand for high-performance electronic devices

The rising demand for advanced electronic devices, such as smartphones, tablets, personal computers (PCs), wearable devices, and laptops, is contributing to the growth of the market. In addition, consumers are increasingly preferring electronic devices that assist in providing seamless multitasking, high-speed connectivity, and enhanced graphics performance. They are also adopting devices that provide immersive experiences to individuals. Apart from this, there is an increase in the demand for advanced IC substrates that can accommodate the integration of powerful processors, memory modules, and communication components. As a result, manufacturers are investing in substrates with optimized electrical pathways and signal integrity that ensure efficient data transfer with minimal latency.

Increasing popularity of miniaturization

The increasing demand for smaller, lighter, and more energy-efficient devices among individuals, along with the rising popularity of miniaturization around the world, is supporting the growth of the market. In line with this, there is a rise in the need for compact and high-density advanced IC substrates. Besides this, these substrates benefit by enabling the stacking of multiple layers of components and reducing the footprint of devices while maintaining optimal functionality. The ability to integrate various components on a single substrate enhances efficiency, reduces the risk of signal interference, and improves the overall device performance, which is offering a positive market outlook.

Growing number of data centers

The rising number of data centers and cloud computing services across the globe is bolstering the growth of the market. Businesses and individuals rely increasingly on cloud computing, big data analysis, and online services for storing and managing vast volumes of information. Data centers have countless servers, storage systems, and networking equipment that generate substantial heat. In line with this, there is a need for efficient thermal dissipation to prevent overheating and ensure uninterrupted operation. Besides this, advanced IC substrates offer enhanced thermal management capabilities and heat-spreading properties that assist in maintaining the reliability and longevity of these systems. Furthermore, the increasing demand for high-performance substrates that can manage heat effectively is strengthening the growth of the market.

Advanced IC Substrate Industry Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the global advanced IC substrate market report, along with forecasts at the global, regional and country levels for 2024-2032. Our report has categorized the market based on type and application.

Breakup by Type:

FC BGA

FC CSP

FC BGA represents the largest market segment

The report has provided a detailed breakup and analysis of the market based on the type. This includes FC BGA and FC CSP. According to the report, FC BGA represented the largest segment. FC BGA is a packaging technology that facilitates the connection of integrated circuits directly to the substrate and enhances performance. In FC BGA, the IC is flipped, and its active side is connected to the substrate using tiny solder balls, which serve as conductive connections. This configuration offers numerous advantages, such as shorter signal paths, improved electrical performance, and enhanced thermal dissipation due to direct contact with the substrate. FC BGA technology is particularly advantageous in high-density applications where space is limited, such as smartphones, tablets, and high-performance computing systems.

Breakup by Application:

Consumer Electronics

Automotive and Transportation

IT and Telecom

Others

Consumer electronics accounts for the majority of the market share

The report has provided a detailed breakup and analysis of the market based on the application. This includes consumer electronics, automotive and transportation, IT and telecom, and others. According to the report, consumer electronics represented the largest segment. Consumer electronics comprises a wide range of devices, such as smartphones, laptops, tablets, gaming consoles, and wearable gadgets. Advanced IC substrates play a vital role in enhancing the performance and functionality of these devices. In consumer electronics, these substrates enable the integration of powerful processors, memory modules, and connectivity components and ensure seamless multitasking, high-speed data transfer, and immersive user experiences. Additionally, these substrates support advanced features, such as high-definition displays, augmented reality (AR), and artificial intelligence (AI). The rising demand for sleeker designs and extended battery life with efficient thermal management and optimized power consumption is propelling the growth of the market.

Breakup by Region:

North America

United States

Canada

Asia Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Asia Pacific exhibits a clear dominance, accounting for the largest advanced IC substrate market share

The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.

Asia Pacific held the biggest market share due to the presence of improved manufacturing units. In line with this, the rising demand for innovative electronic devices among individuals is bolstering the growth of the market in the Asia Pacific region. Moreover, favorable government initiatives in the region are supporting the growth of the market. Apart from this, the rising popularity of automotive electronics due to the increasing demand for electric vehicles (EVs) is contributing to the growth of the market in the region.

Competitive Landscape:

Major players are consistently investing in research and development (R&D) activities to develop advanced IC substrate materials and technologies. This includes exploring novel materials with improved thermal conductivity, signal integrity, and electrical performance to cater to high-performance applications. Additionally, semiconductor manufacturers and consumer electronics companies are engaging in collaboration that enables the exchange of expertise, technology, and resources, that is leading to the development of tailored solutions that meet specific market needs. Besides this, companies are constantly refining their manufacturing processes to enhance the precision, scalability, and cost-efficiency of producing advanced IC substrates. This includes adopting advanced technologies, such as lithography, laser drilling, and advanced packaging techniques.

The report has provided a comprehensive analysis of the competitive landscape in the market. Detailed profiles of all major companies have also been provided. Some of the key players in the market include:

ASE Group

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Fujitsu Limited

Ibiden Co. Ltd.

JCET Group Co. Ltd

Kinsus Interconnect Technology Corp.

Korea Circuit Co. Ltd.

KYOCERA Corporation

LG Innotek Co. Ltd.

Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)

TTM Technologies Inc.

Unimicron Technology Corporation (United Microelectronics Corporation)

Recent Developments:

In 2023, LG Innotek unveiled the latest FC-BGA for the first time at the 'CES 2023'. It is highly integrated, multi layered, large scaled, and has fine patterning and a lot of micro vias.

In 2021, Advanced Semiconductor Engineering, Inc. (ASE) collaborated with Siemens Digital Industries Software to generate two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.

In 2021, AT&S AG, one of the leading manufacturers of high-end printed circuit boards and IC substrates, announced the development of a new production site for IC substrates in Southeast Asia, subject to the approval of the Supervisory Board.

Key Questions Answered in This Report

  • 1. What was the size of the global advanced IC substrate market in 2023?
  • 2. What is the expected growth rate of the global advanced IC substrate market during 2024-2032?
  • 3. What are the key factors driving the global advanced IC substrate market?
  • 4. What has been the impact of COVID-19 on the global advanced IC substrate market?
  • 5. What is the breakup of the global advanced IC substrate market based on the type?
  • 6. What is the breakup of the global advanced IC substrate market based on the application?
  • 7. What are the key regions in the global advanced IC substrate market?
  • 8. Who are the key players/companies in the global advanced IC substrate market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Advanced IC Substrate Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 FC BGA
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 FC CSP
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by Application

  • 7.1 Consumer Electronics
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Automotive and Transportation
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 IT and Telecom
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Others
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 ASE Group
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
      • 13.3.1.3 Financials
    • 13.3.2 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 Financials
    • 13.3.3 Fujitsu Limited
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
      • 13.3.3.3 Financials
      • 13.3.3.4 SWOT Analysis
    • 13.3.4 Ibiden Co. Ltd.
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
      • 13.3.4.3 Financials
      • 13.3.4.4 SWOT Analysis
    • 13.3.5 JCET Group Co. Ltd
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
    • 13.3.6 Kinsus Interconnect Technology Corp.
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
      • 13.3.6.3 Financials
    • 13.3.7 Korea Circuit Co. Ltd.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
    • 13.3.8 KYOCERA Corporation
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
      • 13.3.8.3 Financials
      • 13.3.8.4 SWOT Analysis
    • 13.3.9 LG Innotek Co. Ltd.
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
      • 13.3.9.4 SWOT Analysis
    • 13.3.10 Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
    • 13.3.11 TTM Technologies Inc.
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
      • 13.3.11.4 SWOT Analysis
    • 13.3.12 Unimicron Technology Corporation (United Microelectronics Corporation)
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio
      • 13.3.12.3 Financials