FE・先進パッケージング向け金属化学品の世界市場の分析 (2023～2024年)

当レポートでは、先進パッケージング（ウエハーレベル）や半導体デバイス製造（ダマシン工程）に適用される金属化学品の市場動向とサプライチェーンについて分析しております。また、銅めっき・添加剤の動向や、市場シェア構造、技術動向、サプライヤーのプロファイルなどの情報も含まれています。また付録として、先進パッケージングに使用されるメッキ製品について、一般に入手可能な情報をまとめたサプライヤー製品の比較表も掲載しています。

金属化学品市場の最新情報とレポートハイライトに関する注目のプレスリリース：

目次

第1章 エグゼクティブサマリー

第2章 調査範囲、目的、および調査手法

第3章 半導体産業市場の現状と展望

• 世界経済
  • 半導体産業と世界経済の連動
  • 半導体の販売増加率
  • 台湾の月次販売動向
  • 2023年の不確実性の高さ - 半導体の収益成長は、鈍化からマイナスになる見通し
• 電子製品市場
  • スマートフォン
  • PCユニットの出荷台数
  • サーバー/IT市場
• 半導体製造の成長と拡大
  • ファウンドリの拡張発表：概要
  • 世界各国でのファウンドリ拡張による成長促進
  • 設備支出の動向
  • 技術ロードマップ
  • ファウンドリ投資の評価
• 政策と貿易の動向と影響
• 半導体材料の概要
  • 材料の生産能力によってチップの生産スケジュールが制限される可能性
  • 物流問題の継続：西側世界への悪影響
  • Techcetウエハーは2026年までの予測を開始
  • Techcetの材料予測

第4章 金属化学品市場：セグメント別

• 定義
• 金属めっき用化学品市場：概要
  • 概要：先進パッケージングとダマシンメタライゼーション
  • 概要：めっき市場の移行動向
• 先進パッケージング・メタライゼーション：市場促進要因
  • 先進パッケージング：銅めっき用添加剤の収益
  • 先進パッケージング：銅化学品の収益
  • 先進パッケージング用添加剤の量
  • 先進パッケージング用のその他のめっき材料
  • Sn/Sn-Agメッキ
• ダマシンの成長動向
  • ダマシンの促進要因
  • ダマシン銅めっきの収益
  • ダマシンの添加量

第5章 技術動向

• パッケージング技術の動向
  • 包装の技術的課題
• 技術動向
  • 市場による技術動向の促進
  • ADVロジック相互接続配線技術の進化
  • CUダマシンの品質要件
  • ロジックメタライゼーションのロードマップ
  • ADVロジック埋め込みパワーレール
  • 技術ロードマップ：MOまたはRUを備えたDRAM
  • 前駆体技術ロードマップ：MOまたはRUを使用した3D NAND
  • ロジックプロセスフローの例：20～32NM ロジックPVD
  • 技術的要件の概要 1/2　

第6章 競合情勢

• 先進パッケージング・ダマシンの全体的市場シェア
• OEMの市場シェア：めっき装置
• 用途別の市場シェア：先進パッケージング用のCUめっき
• 地域別・その他の企業
• 企業合併・買収 (M&A) 活動

第7章 アナリストの評価

• 先進的な金属めっきの活用：市場評価

第8章 サプライヤーのプロファイル

• BASF
• DUPONT
• CHANG CHUN GROUP
• INCHEON CHEMICAL COMPANY
• ISHIHARA CHEMICAL/UNICON
• JX NIPPON MINING AND METALS
• その他

第9章 付録A：パッケージング技術の動向

LIST OF FIGURES

• FIGURE 1: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M'S)
• FIGURE 2: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
• FIGURE 3: ADVANCED LOGIC DEVICES GROWTH FORECAST
• FIGURE 4: COPPER PLATING CHEMICALS REVENUES ($M'S) FOR ADVANCED PACKAGING & FE/DAMASCENE
• FIGURE 5: TOTAL PLATING MARKET SHARES FOR ADVANCED PACKAGING AND SEMICONDUCTOR DEVICE MFG. 2022
• FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2021)
• FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES
• FIGURE 8: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX*
• FIGURE 9: 2022 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
• FIGURE 10: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
• FIGURE 11: SEMICONDUCTOR CHIP APPLICATIONS
• FIGURE 12: MOBILE PHONE SHIPMENTS WW ESTIMATES
• FIGURE 13: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3
• FIGURE 14: GLOBAL EV TRENDS
• FIGURE 15: SEMICONDUCTOR SPEND PER VEHICLE TYPE
• FIGURE 16: TSMC CONSTRUCTION SITE IN ARIZONA
• FIGURE 17: CHIP EXPANSIONS 2021-2026 > US$460 B
• FIGURE 18: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
• FIGURE 19: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT BILLINGS
• FIGURE 20: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP
• FIGURE 21: EUROPE CHIP EXPANSION UPSIDE
• FIGURE 22: TECHCET WAFER START FORECAST BY NODE
• FIGURE 23: TECHCET MATERIALS FORECAST
• FIGURE 24: PACKAGING METALLIZATION APPLICATIONS
• FIGURE 25: USE OF SILICON INTERPOSER
• FIGURE 26: VERSIONS OF TSV & PROCESS FLOW EXAMPLE
• FIGURE 27: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M'S)
• FIGURE 28: CU PLATING CHEMICALS 5-YEAR FORECAST
• FIGURE 29: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
• FIGURE 30: CU PLATING ADVANCED PACKAGING REVENUE FORECAST ESTIMATES
• FIGURE 31: CU PILLAR & CU RDL SEGMENTED FORECAST
• FIGURE 32: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST
• FIGURE 33: ADV. PACKAGING CU PLATING ADDITIVES VOLUME DEMAND FORECAST
• FIGURE 34: MATERIALS STACK USING CU PILLAR (< 40 UM PITCH)
• FIGURE 35: SN AND SNAG PLATING REVENUE
• FIGURE 36: NICKEL PLATING REVENUE
• FIGURE 37: ADVANCED LOGIC DEVICES GROWTH FORECAST
• FIGURE 38: ADV LOGIC METAL PLATING WAFER PASSES
• FIGURE 39: WW DAMASCENE REVENUE FORECAST ESTIMATES
• FIGURE 40: DAMASCENE CU VMS VOLUME DEMAND FORECAST ESTIMATES
• FIGURE 41: DAMASCENE CU PLATING ADDITIVES CHEMICAL VOLUME DEMAND FORECAST
• FIGURE 42: KEY TRENDS IN ADVANCED PACKAGING
• FIGURE 43: CHALLENGES OF ELECTROPLATING VIA FILL
• FIGURE 44: METAL LEVELS PER LOGIC NODE
• FIGURE 45: INTERCONNECT METAL COMPARISON BY RESISTIVITY
• FIGURE 46: CU DAMASCENE QUALIFICATION
• FIGURE 47: LEADING EDGE LOGIC POWER RAIL SCHEMES
• FIGURE 48: DRAM STRUCTURE
• FIGURE 49: 3D NAND STRUCTURE
• FIGURE 50: TOTAL PLATING FOR ADV. PACKAGING AND SEMICONDUCTOR DEVICE MANUFACTURING 2022
• FIGURE 51: PLATING EQUIPMENT OEM MARKET SHARES 2020%
• FIGURE 52: PLATING CHEMICAL SUPPLIER FOR DAMASCENE AND ADVANCED PACKAGING APPLICATIONS
• FIGURE 53: CLEANING COMPLEXITY
• FIGURE 54: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND
• FIGURE 55: WAFER LEVEL PLATING
• FIGURE 56: ADVANCED PACKAGING MARKET DRIVERS AND APPLICATIONS.
• FIGURE 57: COMPARISON WITH DAMASCENE-TYPE RDL
• FIGURE 58: USE OF SILICON INTERPOSER
• FIGURE 59: APPLE EXAMPLE INTERPOSERS
• FIGURE 60: TSV PROCESS FLOW EXAMPLE

LIST OF TABLES

• TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
• TABLE 2: IMF ECONOMIC OUTLOOK*
• TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES FORECAST 2021
• TABLE 4: IRDS 2022 LOGIC CORE INTERCONNECT ROADMAP
• TABLE 5: LOGIC DEVICE ROADMAP FOR METALS
• TABLE 6: METALS REQUIRED FOR DEVICE FEATURES
• TABLE 7: DRAM USE OF MO OR RU PRESENT & FUTURE
• TABLE 8: GENERAL PROCESS FLOW ADVANCED DRAM
• TABLE 9: 3D NAND MATERIAL CHANGES PRESENT & FUTURE
• TABLE 10: NUMBER OF STACKS (S) & LAYERS (L) PER GENERATION OF 3DNAND
• TABLE 11: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD
• TABLE 12: TECHNICAL REQUIREMENTS SUMMARY 1/2
• TABLE 13: TECHNICAL REQUIREMENTS SUMMARY 2/2
• TABLE 14: REGIONAL PLAYERS-MARKET LEADER AND "OTHERS"
• TABLE 15: CU PACKAGING APPLICATIONS AND REQUIREMENTS

This report covers the Metal Chemicals market trends and supply-chain as it applied to Advanced Packaging (wafer level) and Semiconductor Device Manufacturing (damascene process). Included are forecasts for copper plating and additives, market shares, technical trends, and supplier profiles. Also included in the appendix is a supplier product comparison table of publicly available information on plating products used for advanced packaging.

This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

• 1.1. EXECUTIVE SUMMARY
• 1.2. ADVANCED PACKAGING PER WAFER STARTS
• 1.3. DEVICE DEMAND DRIVERS-LOGIC
• 1.4. CU PLATING FORECAST FOR DAMASCENE (FE) AND ADVANCED PACKAGING
• 1.5. MARKET SHARES
• 1.6. SUPPLIER ACTIVITIES-VARIOUS ANNOUNCEMENTS
• 1.7. RISK FACTORS
• 1.8. ANALYST ASSESSMENT

2. SCOPE, PURPOSE AND METHODOLOGY

• 2.1. SCOPE
• 2.2. PURPOSE
• 2.3. METHODOLOGY
• 2.4. OVERVIEW OF OTHER TECHCET CMR™ 2022 REPORTS

3. SEMICONDUCTOR INDUSTRY MARKET OUTLOOK

• 3.1. WORLDWIDE ECONOMY
  • 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
  • 3.1.2. SEMICONDUCTOR SALES GROWTH
  • 3.1.3. TAIWAN MONTHLY SALES TRENDS
  • 3.1.4. UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023-SLOWER TO NEGATIVE SEMI REVENUE GROWTH EXPECTED
• 3.2. ELECTRONIC GOODS MARKET
  • 3.2.1. SMARTPHONES
  • 3.2.2. PC UNIT SHIPMENTS
    • 3.2.2.1. ELECTRIC VEHICLE (EV) MARKET TRENDS
    • 3.2.2.2. INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
  • 3.2.3. SERVERS / IT MARKET
• 3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
  • 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
  • 3.3.2. WW FAB EXPANSION DRIVING GROWTH
  • 3.3.3. EQUIPMENT SPENDING TRENDS
  • 3.3.4. TECHNOLOGY ROADMAPS
  • 3.3.5. FAB INVESTMENT ASSESSMENT
• 3.4. POLICY & TRADE TRENDS AND IMPACT
  • 3.4.1. POLICY AND TRADE ISSUES
• 3.5. SEMICONDUCTOR MATERIALS OUTLOOK
  • 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
  • 3.5.2. CONTINUED LOGISTICS ISSUES PLAGUE THE WESTERN WORLD
  • 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2026
    • 3.5.3.1. TECHCET WAFER START MODELING METHODOLOGY
  • 3.5.4. TECHCET'S MATERIAL FORECAST

4. METAL CHEMICALS MARKET BY SEGMENT

• 4.1. DEFINITIONS
• 4.2. METAL PLATING CHEMICALS MARKET OVERVIEW
  • 4.2.1. OVERVIEW-ADVANCED PACKAGING AND DAMASCENE METALLIZATION
  • 4.2.2. OVERVIEW-PLATING MARKET TRANSITIONAL TRENDS
• 4.3. ADVANCED PACKAGING METALLIZATION-MARKET DRIVERS
  • 4.3.1. ADVANCED PACKAGING-ADDITIVES FOR CU PLATING REVENUE
  • 4.3.2. ADVANCED PACKAGING-COPPER CHEMICALS REVENUE
  • 4.3.3. ADVANCED PACKAGING ADDITIVE VOLUMES
  • 4.3.4. OTHER PLATING MATERIALS FOR ADVANCED PACKAGING
  • 4.3.5. SN / SNAG PLATING
    • 4.3.5.1. WW NI PLATING MARKET FORECAST
• 4.4. DAMASCENE GROWTH TRENDS
  • 4.4.1. DAMASCENE GROWTH DRIVERS
  • 4.4.2. DAMASCENE CU PLATING REVENUES
  • 4.4.3. DAMASCENE ADDITIVE VOLUMES

5. TECHNICAL TRENDS

• 5.1. PACKAGING TECH TRENDS
  • 5.1.1. PACKAGING TECHNICAL CHALLENGES
• 5.2. TECH TRENDS
  • 5.2.1. MARKET DRIVES TECHNOLOGY TRENDS
  • 5.2.2. ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION
    • 5.2.2.1. TRENDS-MOL AND BEOL IRDS ROADMAP
  • 5.2.3. CU DAMASCENE QUALIFICATION REQUIREMENTS
  • 5.2.4. LOGIC METALLIZATION ROADMAP
    • 5.2.4.1. INTERCONNECT FOR ADVANCED LOGIC
  • 5.2.5. ADV LOGIC BURIED POWER RAIL
  • 5.2.6. TECHNOLOGY ROADMAP: DRAM WITH MO OR RU
    • 5.2.6.1. GENERAL PROCESS FLOW ADVANCED DRAM
  • 5.2.7. PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU
    • 5.2.7.1. 3D-NAND GENERATIONS 2020-2025
  • 5.2.8. EXAMPLE OF LOGIC PRO CESS FLOW 20 NM TO 32 NM LOGIC PVD
  • 5.2.8. TECHNICAL REQUIREMENTS SUMMARY 1/2
    • 5.2.8.1. TECHNICAL REQUIREMENTS SUMMARY 2/2

6. COMPETITIVE LANDSCAPE

• 6.1. TOTAL ADVANCED PACKAGING AND DAMASCENE MARKET SHARES
• 6.2. OEM MARKET SHARE-PLATING EQUIPMENT
• 6.3. MARKET SHARE BY APPLICATION-CU PLATING FOR ADVANCED PACKAGING
• 6.4. REGIONAL PLAYERS AND OTHERS
• 6.5. M&A ACTIVITY

7. ANALYST ASSESSMENT

• 7.1. ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT

8. SUPPLIER PROFILES

• BASF
• DUPONT
• CHANG CHUN GROUP
• INCHEON CHEMICAL COMPANY
• ISHIHARA CHEMICAL/UNICON
• JX NIPPON MINING AND METALS
• AND MORE...

9. APPENDIX A: PACKAGING TECH TRENDS