先進パッケージング技術の世界市場レポート 2025年

先進パッケージング技術の市場規模は、今後数年で急成長が見込まれます。2029年にはCAGR14.9％で142億2,000万米ドルに成長します。予測期間の成長は、ヘテロジニアス・インテグレーション、量子コンピューティング、フレキシブルでストレッチャブルなエレクトロニクス、サプライチェーンの回復力、スマート・マニュファクチャリングに起因しています。予測期間の主要動向には、先進相互接続技術、ファンアウトウエハーレベルパッケージング、システムインパッケージング、熱管理ソリューション、IoTデバイス用組み込みパッケージングなどが含まれます。

民生用電子機器への需要の高まりが、今後の先進パッケージング市場の成長を促進すると予測されています。民生用電子機器には、消費者が非商業的または専門的な目的で定期的に購入し使用するために設計されたあらゆる電子機器、ガジェット、装置が含まれます。コンシューマーエレクトロニクスが高度化することで、先進パッケージングのニーズが生まれ、製品のプレゼンテーションに大きな影響を与えます。例えば、2023年5月、日本の業界団体である電子情報技術産業協会は、日本の電子機器生産台数が77万1,457台に達したと報告しました。さらに、家電製品の生産台数は2022年5月の2万5,268台から2023年5月には3万2,099台に増加しました。このように、民生用電子機器の需要増加が先進パッケージング市場の成長を後押ししています。

データセンターの増加は、今後数年間、先進パッケージング技術市場を押し上げると予想されます。データセンターは、膨大な量のデータを保存、処理、管理、発信するためのコンピューティングや通信リソースを収容する集中型の施設です。データセンターの先進パッケージング技術は、より高い集積密度、より優れた熱管理、半導体部品の性能向上を可能にすることで効率を改善し、データ処理システムの全体的なスケーラビリティと有効性に貢献します。例えば、2024年9月、米国政府機関である国家通信情報局は、米国には約5,000のデータセンターがあり、国内需要は2030年まで毎年約9％増加すると予測していると指摘しました。従って、データセンター数の拡大が先進パッケージング技術市場の成長を後押ししています。

目次

第1章 エグゼクティブサマリー

第2章 市場の特徴

第3章 市場動向と戦略

第4章 市場- マクロ経済シナリオ金利、インフレ、地政学、コロナ禍、回復が市場に与える影響を含むマクロ経済シナリオ

第5章 世界の成長分析と戦略分析フレームワーク

• 世界の先進パッケージング技術 PESTEL分析（政治、社会、技術、環境、法的要因、促進要因、抑制要因）
• 最終用途産業の分析
• 世界の先進パッケージング技術市場：成長率分析
• 世界の先進パッケージング技術市場の実績：規模と成長, 2019-2024
• 世界の先進パッケージング技術市場の予測：規模と成長, 2024-2029, 2034F
• 世界の先進パッケージング技術総アドレス可能市場（TAM）

第6章 市場セグメンテーション

• 世界の先進パッケージング技術市場：タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 3D集積回路
• 2D集積回路
• D集積回路
• その他のタイプ
• 世界の先進パッケージング技術市場：製品別、実績と予測, 2019-2024, 2024-2029F, 2034F
• アクティブパッケージング
• スマートでインテリジェントなパッケージング
• 世界の先進パッケージング技術市場：最終用途産業別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 自動車と輸送
• 家電
• 産業
• IT・通信
• その他の最終用途産業
• 世界の先進パッケージング技術市場、タイプ別サブセグメンテーション：3D集積回路、実績と予測, 2019-2024, 2024-2029F, 2034F
• シリコン貫通ビア（TSV）
• モノリシック 3D IC
• 世界の先進パッケージング技術市場、タイプ別サブセグメンテーション：2D集積回路、実績と予測, 2019-2024, 2024-2029F, 2034F
• フラットパッケージ
• チップオンボード（CoB）
• 世界の先進パッケージング技術市場、タイプ別サブセグメンテーション：2.5D集積回路、実績と予測, 2019-2024, 2024-2029F, 2034F
• インターポーザベースのパッケージング
• シリコンブリッジテクノロジーズ
• 世界の先進パッケージング技術市場、タイプ別サブセグメンテーション：その他のタイプ、実績と予測, 2019-2024, 2024-2029F, 2034F
• ファンアウトウエハーレベルパッケージング（FOWLP）
• システムインパッケージ（SiP）
• マルチチップモジュール（MCM）

第7章 地域別・国別分析

• 世界の先進パッケージング技術市場：地域別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 世界の先進パッケージング技術市場：国別、実績と予測, 2019-2024, 2024-2029F, 2034F

第8章 アジア太平洋市場

第9章 中国市場

第10章 インド市場

第11章 日本市場

第12章 オーストラリア市場

第13章 インドネシア市場

第14章 韓国市場

第15章 西欧市場

第16章 英国市場

第17章 ドイツ市場

第18章 フランス市場

第19章 イタリア市場

第20章 スペイン市場

第21章 東欧市場

第22章 ロシア市場

第23章 北米市場

第24章 米国市場

第25章 カナダ市場

第26章 南米市場

第27章 ブラジル市場

第28章 中東市場

第29章 アフリカ市場

第30章 競合情勢と企業プロファイル

• 先進パッケージング技術市場：競合情勢
• 先進パッケージング技術市場：企業プロファイル
  • Samsung Electronics Overview, Products and Services, Strategy and Financial Analysis
  • Taiwan Semiconductor Manufacturing Company Overview, Products and Services, Strategy and Financial Analysis
  • Intel Corporation Overview, Products and Services, Strategy and Financial Analysis
  • International Business Machines Overview, Products and Services, Strategy and Financial Analysis
  • Qualcomm Technologies Overview, Products and Services, Strategy and Financial Analysis

第31章 その他の大手企業と革新的企業

• Advanced Semiconductor Engineering（ASE）
• ASE Technology Holding Co. Ltd.
• Texas Instruments
• Shin-Etsu Chemical Co. Ltd.
• Renesas Electronics Corporation
• GlobalFoundries Inc.
• Sanmina Corporation
• Amkor Technology
• Jiangsu Changjiang Electronics Technology
• STATS ChipPAC
• Tongfu Microelectronics
• Powertech Technology
• ChipMOS Technologies Inc.
• United Test and Assembly Center Holdings Ltd.
• Unisem（M）Berhad.

第32章 世界の市場競合ベンチマーキングとダッシュボード

第33章 主要な合併と買収

第34章 最近の市場動向

第35章 市場の潜在力が高い国、セグメント、戦略

• 先進パッケージング技術市場2029：新たな機会を提供する国
• 先進パッケージング技術市場2029：新たな機会を提供するセグメント
• 先進パッケージング技術市場2029：成長戦略
  • 市場動向に基づく戦略
  • 競合の戦略

第36章 付録

Advanced packaging technologies encompass the methodologies associated with aggregating and interconnecting components prior to conventional electronic packaging processes. These technologies facilitate the encapsulation of integrated circuits within a protective casing, shielding metallic parts from corrosion and physical damage.

The primary types of advanced packaging technologies comprise 3D integrated circuits, 2D integrated circuits, 2.5D integrated circuits, and other related methods. 3D integrated circuits, in particular, offer attributes such as high bandwidth, compact form factors, and comprehensive multi-function integration within packaging. Three-Dimensional Integrated Circuit (3DIC) technology involves vertically stacking homogeneous or heterogeneous dies into Multi-Chip Modules (MCM) utilizing Through-Silicon-Via (TSV) connections. These advancements enable enhanced performance and efficiency. Various product categories arising from these technologies include active packaging, smart and intelligent packaging, and they find applications across multiple industries such as automotive and transport, consumer electronics, industrial sectors, IT and telecommunications, and other diverse verticals.

The advanced packaging technologies market research report is one of a series of new reports from The Business Research Company that provides advanced packaging technologies market statistics, including advanced packaging technologies industry global market size, regional shares, competitors with a advanced packaging technologies market share, detailed advanced packaging technologies market segments, market trends and opportunities, and any further data you may need to thrive in the advanced packaging technologies industry. This advanced packaging technologies market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The advanced packaging technologies market size has grown rapidly in recent years. It will grow from $7.24 billion in 2024 to $8.16 billion in 2025 at a compound annual growth rate (CAGR) of 12.6%. The growth in the historic period can be attributed to consumer electronics growth, mobile computing, enhanced thermal management, automotive electronics, environmental considerations.

The advanced packaging technologies market size is expected to see rapid growth in the next few years. It will grow to $14.22 billion in 2029 at a compound annual growth rate (CAGR) of 14.9%. The growth in the forecast period can be attributed to heterogeneous integration, quantum computing, flexible and stretchable electronics, supply chain resilience, smart manufacturing. Major trends in the forecast period include advanced interconnect technologies, fan-out wafer-level packaging, system-in-package, thermal management solutions, embedded packaging for IoT devices.

The increasing demand for consumer electronics is anticipated to drive growth in the advanced packaging market in the future. Consumer electronics encompass any electronic devices, gadgets, or equipment designed for regular purchase and use by consumers for non-commercial or professional purposes. The sophistication of consumer electronics creates a need for advanced packaging, which significantly impacts product presentation. For instance, in May 2023, the Japan Electronics and Information Technology Industries Association, a trade association based in Japan, reported that Japan's electronic equipment output reached 771,457 units. Additionally, consumer electronics production rose to 32,099 units in May 2023, up from 25,268 units in May 2022. Thus, the increasing demand for consumer electronics is fueling the growth of the advanced packaging market.

The growing number of data centers is expected to boost the advanced packaging technologies market in the coming years. A data center is a centralized facility that houses computing and telecommunications resources for storing, processing, managing, and disseminating vast amounts of data. Advanced packaging technologies in data centers improve efficiency by enabling higher integration density, better thermal management, and enhanced semiconductor component performance, thereby contributing to the overall scalability and effectiveness of data processing systems. For example, in September 2024, the National Telecommunications and Information Administration, a U.S. government agency, indicated that the United States has around 5,000 data centers, with domestic demand projected to increase by approximately nine percent annually through 2030. Therefore, the expanding number of data centers is propelling the growth of the advanced packaging technologies market.

Major companies in the advanced packaging technologies sector are concentrating on creating technological solutions to enhance their leadership in semiconductor solutions. These technological solutions involve utilizing innovative methods, materials, and equipment to boost packaging efficiency, product protection, and functionality, often incorporating smart features, automation, or improved sustainability. For example, in October 2023, ASE Group, a semiconductor engineering firm based in Taiwan, introduced the Integrated Design Ecosystem, which allows for silicon package design efficiencies and reduces cycle time by half. This ecosystem fosters collaboration and optimization in the design process, enabling faster iterations and better performance in advanced packaging solutions. This advancement aligns with the growing demand for high-density packaging in areas such as artificial intelligence (AI), high-performance computing, and data centers.

Major companies within the advanced packaging technologies market are increasingly prioritizing the introduction of high-performance glass substrates as a strategic move to gain a competitive edge. Glass substrates refer to flat, rigid sheets or panels made of glass that function as a foundational base for various electronic devices, displays, sensors, or technologies requiring a smooth and transparent surface. In a notable example, in June 2023, Intel Corporation, a prominent US-based technology company, unveiled glass substrates designed for advanced packaging, aiming to secure several advantages. These glass substrates exhibit the capability to withstand higher temperatures, present a 50% reduction in pattern distortion, and possess ultra-low flatness for improved depth of focus. When compared to organic substrates, glass offers superior properties, including ultra-low flatness and enhanced thermal and mechanical characteristics, resulting in a significantly higher interconnect density within a substrate. This strategic focus on high-performance glass substrates highlights the companies' commitment to innovation and gaining a competitive advantage in the advanced packaging technologies market.

In November 2022, Lam Research Corporation, a semiconductor company headquartered in the US, completed the acquisition of Semsysco GmbH for an undisclosed sum. This acquisition is poised to facilitate Lam Research Corporation's expansion of its advanced packaging capabilities, with a specific focus on enhancing solutions for cutting-edge logic chips and chipset-based offerings tailored for high-performance computing (HPC), artificial intelligence (AI), and various data-intensive applications. Semsysco GmbH, based in Austria, specializes in manufacturing advanced plastic packaging products, adding complementary expertise to Lam Research's portfolio in this domain.

Major companies operating in the advanced packaging technologies market include Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, International Business Machines, Qualcomm Technologies, Advanced Semiconductor Engineering (ASE), ASE Technology Holding Co. Ltd., Texas Instruments, Shin-Etsu Chemical Co. Ltd., Renesas Electronics Corporation, GlobalFoundries Inc., Sanmina Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology, STATS ChipPAC, Tongfu Microelectronics, Powertech Technology, ChipMOS Technologies Inc., United Test and Assembly Center Holdings Ltd., Unisem (M) Berhad., Greatek Electronics, Nepes Corporation, SFA Semicon, SUSS Microtec, China WLCSP Co. LTD., Universal Instruments Corporation, Brewer Science, Chipbond Technology Corporation, Deca Technologies, Siliconware Precision Industries, Lam Research Corporation, Toshiba Electronic Devices & Storage Corporation, King Yuan Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Hana Micron Inc., IBIDEN Engineering CO. LTD., Aehr Test Systems

Asia-Pacific was the largest region in global advanced packaging technologies market in 2024. The regions covered in the advanced packaging technologies market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the advanced packaging technologies market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The advanced packaging technologies market consists of revenues earned by entities by providing packaging services such as fan-out wafer-level packaging and system-in-package used during the process. The market value includes the value of related goods sold by the service provider or included within the service offering. The advanced packaging technologies market also includes sales of image sensor, microelectronics, complementary metal oxide semiconductor, light-emitting diode, design package, external cavity, ultraviolet light, and others which are used in providing packaging services. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Advanced Packaging Technologies Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on advanced packaging technologies market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for advanced packaging technologies ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The advanced packaging technologies market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

• The market characteristics section of the report defines and explains the market.
• The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
• The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.

• Market segmentations break down the market into sub markets.
• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
• The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
• The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

• Markets Covered:1) By Type: 3D Integrated Circuit; 2D Integrated Circuit; 2.5D Integrated Circuit; Other Types
• 2) By Product: Active Packaging; Smart And Intelligent Packaging
• 3) By End Use Industry: Automotive And Transport; Consumer Electronics; Industrial; IT And Telecommunication; Other End Use Industries
• Subsegments:
• 1) By 3D Integrated Circuit: Through-Silicon Vias (TSVs); Monolithic 3D ICs
• 2) By 2D Integrated Circuit: Flat Packaging; Chip-on-Board (CoB)
• 3) By 2.5D Integrated Circuit: Interposer-Based Packaging; Silicon Bridge Technologies
• 4) By Other Types: Fan-Out Wafer Level Packaging (FOWLP); System-in-Package (SiP); Multi-Chip Modules (MCM)
• Companies Mentioned: Samsung Electronics; Taiwan Semiconductor Manufacturing Company; Intel Corporation; International Business Machines; Qualcomm Technologies
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
• Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
• Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Advanced Packaging Technologies Market Characteristics

3. Advanced Packaging Technologies Market Trends And Strategies

4. Advanced Packaging Technologies Market - Macro Economic Scenario Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics And Covid And Recovery On The Market

5. Global Advanced Packaging Technologies Growth Analysis And Strategic Analysis Framework

• 5.1. Global Advanced Packaging Technologies PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
• 5.2. Analysis Of End Use Industries
• 5.3. Global Advanced Packaging Technologies Market Growth Rate Analysis
• 5.4. Global Advanced Packaging Technologies Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
• 5.5. Global Advanced Packaging Technologies Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
• 5.6. Global Advanced Packaging Technologies Total Addressable Market (TAM)

6. Advanced Packaging Technologies Market Segmentation

• 6.1. Global Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 3D Integrated Circuit
• 2D Integrated Circuit
• 2.5D Integrated Circuit
• Other Types
• 6.2. Global Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Active Packaging
• Smart And Intelligent Packaging
• 6.3. Global Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Automotive And Transport
• Consumer Electronics
• Industrial
• IT And Telecommunication
• Other End Use Industries
• 6.4. Global Advanced Packaging Technologies Market, Sub-Segmentation Of 3D Integrated Circuit, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Through-Silicon Vias (TSVs)
• Monolithic 3D ICs
• 6.5. Global Advanced Packaging Technologies Market, Sub-Segmentation Of 2D Integrated Circuit, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Flat Packaging
• Chip-on-Board (CoB)
• 6.6. Global Advanced Packaging Technologies Market, Sub-Segmentation Of 2.5D Integrated Circuit, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Interposer-Based Packaging
• Silicon Bridge Technologies
• 6.7. Global Advanced Packaging Technologies Market, Sub-Segmentation Of Other Types, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Fan-Out Wafer Level Packaging (FOWLP)
• System-in-Package (SiP)
• Multi-Chip Modules (MCM)

7. Advanced Packaging Technologies Market Regional And Country Analysis

• 7.1. Global Advanced Packaging Technologies Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 7.2. Global Advanced Packaging Technologies Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Advanced Packaging Technologies Market

• 8.1. Asia-Pacific Advanced Packaging Technologies Market Overview
• Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
• 8.2. Asia-Pacific Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.3. Asia-Pacific Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.4. Asia-Pacific Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Advanced Packaging Technologies Market

• 9.1. China Advanced Packaging Technologies Market Overview
• 9.2. China Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.3. China Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.4. China Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Advanced Packaging Technologies Market

• 10.1. India Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.2. India Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.3. India Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Advanced Packaging Technologies Market

• 11.1. Japan Advanced Packaging Technologies Market Overview
• 11.2. Japan Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.3. Japan Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.4. Japan Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Advanced Packaging Technologies Market

• 12.1. Australia Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.2. Australia Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.3. Australia Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Advanced Packaging Technologies Market

• 13.1. Indonesia Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.2. Indonesia Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.3. Indonesia Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Advanced Packaging Technologies Market

• 14.1. South Korea Advanced Packaging Technologies Market Overview
• 14.2. South Korea Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.3. South Korea Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.4. South Korea Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Advanced Packaging Technologies Market

• 15.1. Western Europe Advanced Packaging Technologies Market Overview
• 15.2. Western Europe Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.3. Western Europe Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.4. Western Europe Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Advanced Packaging Technologies Market

• 16.1. UK Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.2. UK Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.3. UK Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Advanced Packaging Technologies Market

• 17.1. Germany Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.2. Germany Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.3. Germany Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Advanced Packaging Technologies Market

• 18.1. France Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.2. France Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.3. France Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Advanced Packaging Technologies Market

• 19.1. Italy Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.2. Italy Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.3. Italy Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Advanced Packaging Technologies Market

• 20.1. Spain Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.2. Spain Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.3. Spain Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Advanced Packaging Technologies Market

• 21.1. Eastern Europe Advanced Packaging Technologies Market Overview
• 21.2. Eastern Europe Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.3. Eastern Europe Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.4. Eastern Europe Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Advanced Packaging Technologies Market

• 22.1. Russia Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.2. Russia Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.3. Russia Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Advanced Packaging Technologies Market

• 23.1. North America Advanced Packaging Technologies Market Overview
• 23.2. North America Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.3. North America Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.4. North America Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Advanced Packaging Technologies Market

• 24.1. USA Advanced Packaging Technologies Market Overview
• 24.2. USA Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.3. USA Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.4. USA Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Advanced Packaging Technologies Market

• 25.1. Canada Advanced Packaging Technologies Market Overview
• 25.2. Canada Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.3. Canada Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.4. Canada Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Advanced Packaging Technologies Market

• 26.1. South America Advanced Packaging Technologies Market Overview
• 26.2. South America Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.3. South America Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.4. South America Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Advanced Packaging Technologies Market

• 27.1. Brazil Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.2. Brazil Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.3. Brazil Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Advanced Packaging Technologies Market

• 28.1. Middle East Advanced Packaging Technologies Market Overview
• 28.2. Middle East Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.3. Middle East Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.4. Middle East Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Advanced Packaging Technologies Market

• 29.1. Africa Advanced Packaging Technologies Market Overview
• 29.2. Africa Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.3. Africa Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.4. Africa Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Advanced Packaging Technologies Market Competitive Landscape And Company Profiles

• 30.1. Advanced Packaging Technologies Market Competitive Landscape
• 30.2. Advanced Packaging Technologies Market Company Profiles
  • 30.2.1. Samsung Electronics Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.2. Taiwan Semiconductor Manufacturing Company Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.3. Intel Corporation Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.4. International Business Machines Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.5. Qualcomm Technologies Overview, Products and Services, Strategy and Financial Analysis

31. Advanced Packaging Technologies Market Other Major And Innovative Companies

• 31.1. Advanced Semiconductor Engineering (ASE)
• 31.2. ASE Technology Holding Co. Ltd.
• 31.3. Texas Instruments
• 31.4. Shin-Etsu Chemical Co. Ltd.
• 31.5. Renesas Electronics Corporation
• 31.6. GlobalFoundries Inc.
• 31.7. Sanmina Corporation
• 31.8. Amkor Technology
• 31.9. Jiangsu Changjiang Electronics Technology
• 31.10. STATS ChipPAC
• 31.11. Tongfu Microelectronics
• 31.12. Powertech Technology
• 31.13. ChipMOS Technologies Inc.
• 31.14. United Test and Assembly Center Holdings Ltd.
• 31.15. Unisem (M) Berhad.

32. Global Advanced Packaging Technologies Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Advanced Packaging Technologies Market

34. Recent Developments In The Advanced Packaging Technologies Market

35. Advanced Packaging Technologies Market High Potential Countries, Segments and Strategies

• 35.1 Advanced Packaging Technologies Market In 2029 - Countries Offering Most New Opportunities
• 35.2 Advanced Packaging Technologies Market In 2029 - Segments Offering Most New Opportunities
• 35.3 Advanced Packaging Technologies Market In 2029 - Growth Strategies
  • 35.3.1 Market Trend Based Strategies
  • 35.3.2 Competitor Strategies

36. Appendix

• 36.1. Abbreviations
• 36.2. Currencies
• 36.3. Historic And Forecast Inflation Rates
• 36.4. Research Inquiries
• 36.5. The Business Research Company
• 36.6. Copyright And Disclaimer