サンプル依頼リスト カート
  • English
  • Korean
  • Traditional Chinese
  • Simplified Chinese
市場調査レポート
商品コード
1435632

先進パッケージング技術の世界市場レポート 2024

Advanced Packaging Technologies Global Market Report 2024
出版日: 受注後更新 | 発行: The Business Research Company | ページ情報: 英文 200 Pages | 納期: 2～10営業日

● お客様のご希望に応じて、既存データの加工や未掲載情報（例：国別セグメント）の追加などの対応が可能です。　 詳細はお問い合わせください。
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=157.14円
先進パッケージング技術の世界市場レポート 2024
出版日: 受注後更新
発行: The Business Research Company
ページ情報: 英文 200 Pages
納期: 2～10営業日
  • 全表示
  • 概要
  • 目次
概要

先進パッケージング技術の市場規模は、今後数年間で急速に成長すると予想されています。 2028年には14.0%の年間複合成長率（CAGR）で123億3,000万米ドルに成長すると予想されます。予測期間中に予想される成長は、ヘテロジニアス統合、量子コンピューティングの発展、柔軟で伸縮性のあるエレクトロニクスの進歩、サプライチェーンの回復力への焦点、スマート製造慣行の導入などの要因に起因すると考えられます。予測期間中に予想される主要な動向には、高度な相互接続技術の採用、ファンアウトウェーハレベルパッケージングの利用、システムインパッケージ（SiP）アプローチの統合、熱管理ソリューションの実装、およびIoTデバイス用の組み込みダイパッケージングなどが挙げられます。

家庭用電化製品に対する予想される需要の急増は、将来の先進パッケージング市場の成長の重要な推進力として機能する態勢が整っています。家庭用電化製品には、個人が通常の非商業的または専門的に使用するために設計された幅広い電子機器、ガジェット、およびデバイスが含まれます。家庭用電化製品の需要の高まりは、先進パッケージングが製品の洗練さと保護を定義する上で重要な役割を果たすため、そのニーズに直接影響を与えています。実例として、2021年 6月、リトアニアに拠点を置くeコマースプラットフォームであるOberloは、世界の64億人によるスマートフォンの使用を報告しました。この驚くべき統計は、家庭用電化製品の普及の性質を強調し、先進パッケージング市場の成長を促進する上で家庭用電化製品が果たす重要な役割を浮き彫りにしています。

データセンターの予想される急増により、今後数年間で先進パッケージング技術市場の成長が促進されると予想されます。データセンターは、コンピューティングリソースと通信リソースを備えた集中施設として機能し、膨大な量のデータの保存、処理、管理、配布に対応します。 先進パッケージング技術は、集積密度の向上、熱管理の改善、半導体コンポーネントのパフォーマンスの向上を促進することにより、データセンターの効率を高める上で重要な役割を果たします。これらの進歩は、データ処理システムの拡張性と全体的なパフォーマンスに大きく貢献します。一例として、2021年 8月、韓国に本拠を置く企業であるサヴィルズコリアは、IT負荷に関してデータセンターの総容量が2020年末までに430 MWに達すると報告しました。商用データの総量は700 MW増加するとの予測2021年から2023年にかけての韓国のセンターIT負荷は、アジア太平洋（APAC）総容量の15%に相当し、先進パッケージング技術市場におけるデータセンターの大幅な成長と影響を浮き彫りにしています。

目次

第1章 エグゼクティブサマリー

第2章 市場の特徴

第3章 市場動向と戦略

第4章 マクロ経済シナリオ

  • 高インフレが市場に与える影響
  • ウクライナ・ロシア戦争が市場に与える影響
  • COVID-19による市場への影響

第5章 世界市場規模と成長

  • 世界の市場促進要因と抑制要因
    • 市場促進要因
    • 市場抑制要因
  • 世界の市場規模実績と成長、2018年～2023年
  • 世界の市場規模予測と成長、2023年～2028年、2033年

第6章 市場セグメンテーション

  • 世界の先進パッケージング技術市場、タイプ別セグメンテーション、実績および予測、2018-2023、2023-2028年、2033年
  • 3D集積回路
  • 2D集積回路
  • 2.5D集積回路
  • その他のタイプ
  • 世界の先進パッケージング技術市場、製品別セグメンテーション、実績および予測、2018-2023、2023-2028年、2033年
  • アクティブパッケージング
  • スマートおよびインテリジェントパッケージング
  • 世界の先進パッケージング技術市場、最終用途産業別のセグメンテーション、実績および予測、2018-2023年、2023-2028年、2033年
  • 自動車と輸送
  • 家電
  • 産業用
  • IT・通信
  • その他の最終用途産業

第7章 地域および国の分析

  • 世界の先進パッケージング技術市場、地域別、実績および予測、2018-2023年、2023-2028年、2033年
  • 世界の先進パッケージング技術市場、国別、実績および予測、2018年から2023年、2023年から2028年、2033年

第8章 アジア太平洋市場

第9章 中国市場

第10章 インド市場

第11章 日本市場

第12章 オーストラリア市場

第13章 インドネシア市場

第14章 韓国市場

第15章 西欧市場

第16章 英国市場

第17章 ドイツ市場

第18章 フランス市場

第19章 イタリア市場

第20章 スペイン市場

第21章 東欧市場

第22章 ロシア市場

第23章 北米市場

第24章 米国市場

第25章 カナダ市場

第26章 南米市場

第27章 ブラジル市場

第28章 中東市場

第29章 アフリカ市場

第30章 競合情勢と企業プロファイル

  • 先進パッケージング技術市場の競合情勢
  • 先進パッケージング技術市場の企業プロファイル
    • Samsung Electronics
    • Taiwan Semiconductor Manufacturing Company
    • Intel Corporation
    • International Business Machines
    • Qualcomm Technologies

第31章 その他の大手および革新的な企業

  • Advanced Semiconductor Engineering（ASE）
  • ASE Technology Holding Co. Ltd.
  • Texas Instruments
  • Shin-Etsu Chemical Co. Ltd.
  • Renesas Electronics Corporation
  • GlobalFoundries Inc.
  • Sanmina Corporation
  • Amkor Technology
  • Jiangsu Changjiang Electronics Technology
  • STATS ChipPAC
  • Tongfu Microelectronics
  • Powertech Technology
  • ChipMOS Technologies Inc.
  • United Test and Assembly Center Holdings Ltd.
  • Unisem（M）Berhad.

第32章 競合ベンチマーキング

第33章 競合ダッシュボード

第34章 主要な合併と買収

第35章 将来の見通しと可能性の分析

第36章 付録

目次
Product Code: r15341

Advanced packaging technologies encompass the methodologies associated with aggregating and interconnecting components prior to conventional electronic packaging processes. These technologies facilitate the encapsulation of integrated circuits within a protective casing, shielding metallic parts from corrosion and physical damage.

The primary types of advanced packaging technologies comprise 3D integrated circuits, 2D integrated circuits, 2.5D integrated circuits, and other related methods. 3D integrated circuits, in particular, offer attributes such as high bandwidth, compact form factors, and comprehensive multi-function integration within packaging. Three-Dimensional Integrated Circuit (3DIC) technology involves vertically stacking homogeneous or heterogeneous dies into Multi-Chip Modules (MCM) utilizing Through-Silicon-Via (TSV) connections. These advancements enable enhanced performance and efficiency. Various product categories arising from these technologies include active packaging, smart and intelligent packaging, and they find applications across multiple industries such as automotive and transport, consumer electronics, industrial sectors, IT and telecommunications, and other diverse verticals.

The advanced packaging technologies market research report is one of a series of new reports from The Business Research Company that provides advanced packaging technologies market statistics, including advanced packaging technologies industry global market size, regional shares, competitors with a advanced packaging technologies market share, detailed advanced packaging technologies market segments, market trends and opportunities, and any further data you may need to thrive in the advanced packaging technologies industry. This advanced packaging technologies market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The advanced packaging technologies market size has grown rapidly in recent years. It will grow from $6.46 billion in 2023 to $7.3 billion in 2024 at a compound annual growth rate (CAGR) of 12.9%. The growth observed in the historical period can be attributed to the expansion of consumer electronics, the rise of mobile computing, efforts in enhanced thermal management, the development of automotive electronics, and increasing considerations for environmental impact.

The advanced packaging technologies market size is expected to see rapid growth in the next few years. It will grow to $12.33 billion in 2028 at a compound annual growth rate (CAGR) of 14.0%. The anticipated growth in the forecast period can be attributed to factors such as heterogeneous integration, the development of quantum computing, advancements in flexible and stretchable electronics, a focus on supply chain resilience, and the implementation of smart manufacturing practices. Key trends expected in the forecast period encompass the adoption of advanced interconnect technologies, the utilization of fan-out wafer-level packaging, the integration of system-in-package (SiP) approaches, the implementation of thermal management solutions, and the use of embedded die packaging for IoT devices.

The anticipated surge in demand for consumer electronics is poised to act as a significant driver for the growth of the advanced packaging market in the future. Consumer electronics encompass a wide range of electronic equipment, gadgets, and devices designed for regular non-commercial or professional use by individuals. The increasing demand for consumer electronics has a direct impact on the need for advanced packaging, as it plays a crucial role in defining the sophistication and protection of these products. As an illustration, in June 2021, Oberlo, a Lithuania-based e-commerce platform, reported a global usage of smartphones by 6.4 billion people. This staggering statistic underscores the pervasive nature of consumer electronics and highlights the consequential role it plays in propelling the growth of the advanced packaging market.

The anticipated proliferation of data centers is expected to drive the growth of the advanced packaging technologies market in the coming years. A data center serves as a centralized facility equipped with computing and telecommunications resources, catering to the storage, processing, management, and distribution of vast amounts of data. Advanced packaging technologies play a crucial role in enhancing the efficiency of data centers by facilitating higher integration density, improved thermal management, and enhanced performance of semiconductor components. These advancements contribute significantly to the scalability and overall performance of data processing systems. As an example, in August 2021, Savills Korea, a Korea-based firm, reported that the total capacity of data centers reached 430 MW in terms of IT load by the end of 2020. The projection of a 700 MW increase in total commercial data center IT load in Korea during 2021-2023, representing 15% of the total Asia-Pacific (APAC) capacity, underscores the substantial growth and impact of data centers on the advanced packaging technologies market.

The advancing landscape of technology is significantly shaping the advanced packaging technologies market. Major players within the advanced packaging technologies sector are strategically directing their efforts towards developing technological solutions, aiming to strengthen their leadership in the semiconductor solutions domain. As an illustration, in May 2021, Samsung Electronics, a South Korea-based electronics company, introduced the Interposer-Cube4 (I-Cube4), an advanced chip packaging technology tailored for high-performance applications. The I-Cube4, a 2.5D packaging technology, enhances communication and power efficiency between logic and memory chips. It is anticipated to find widespread applications in sectors such as high-performance computing, artificial intelligence (AI), 5G, cloud computing, and large-scale data centers. This strategic move exemplifies the commitment of major companies to driving innovation and technological advancements within the advanced packaging technologies market, positioning themselves at the forefront of semiconductor solutions.

Major companies within the advanced packaging technologies market are increasingly prioritizing the introduction of high-performance glass substrates as a strategic move to gain a competitive edge. Glass substrates refer to flat, rigid sheets or panels made of glass that function as a foundational base for various electronic devices, displays, sensors, or technologies requiring a smooth and transparent surface. In a notable example, in June 2023, Intel Corporation, a prominent US-based technology company, unveiled glass substrates designed for advanced packaging, aiming to secure several advantages. These glass substrates exhibit the capability to withstand higher temperatures, present a 50% reduction in pattern distortion, and possess ultra-low flatness for improved depth of focus. When compared to organic substrates, glass offers superior properties, including ultra-low flatness and enhanced thermal and mechanical characteristics, resulting in a significantly higher interconnect density within a substrate. This strategic focus on high-performance glass substrates highlights the companies' commitment to innovation and gaining a competitive advantage in the advanced packaging technologies market.

In November 2022, Lam Research Corporation, a semiconductor company headquartered in the US, completed the acquisition of Semsysco GmbH for an undisclosed sum. This acquisition is poised to facilitate Lam Research Corporation's expansion of its advanced packaging capabilities, with a specific focus on enhancing solutions for cutting-edge logic chips and chipset-based offerings tailored for high-performance computing (HPC), artificial intelligence (AI), and various data-intensive applications. Semsysco GmbH, based in Austria, specializes in manufacturing advanced plastic packaging products, adding complementary expertise to Lam Research's portfolio in this domain.

Major companies operating in the advanced packaging technologies market report are Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, International Business Machines, Qualcomm Technologies, Advanced Semiconductor Engineering (ASE), ASE Technology Holding Co. Ltd., Texas Instruments, Shin-Etsu Chemical Co. Ltd., Renesas Electronics Corporation, GlobalFoundries Inc., Sanmina Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology, STATS ChipPAC, Tongfu Microelectronics, Powertech Technology, ChipMOS Technologies Inc., United Test and Assembly Center Holdings Ltd., Unisem (M) Berhad., Greatek Electronics, Nepes Corporation, SFA Semicon, SUSS Microtec, China WLCSP Co. LTD., Universal Instruments Corporation, Brewer Science, Chipbond Technology Corporation, Deca Technologies, Siliconware Precision Industries, Silicon Mobility SAS., Lam Research Corporation, Toshiba Electronic Devices & Storage Corporation, King Yuan Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Chip One Stop Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Hana Micron Inc., IBIDEN Engineering CO. LTD., Aehr Test Systems

Asia-Pacific was the largest region in global advanced packaging technologies market in 2023. The regions covered in the advanced packaging technologies market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the advanced packaging technologies market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The advanced packaging technologies market consists of revenues earned by entities by providing packaging services such as fan-out wafer-level packaging and system-in-package used during the process. The market value includes the value of related goods sold by the service provider or included within the service offering. The advanced packaging technologies market also includes sales of image sensor, microelectronics, complementary metal oxide semiconductor, light-emitting diode, design package, external cavity, ultraviolet light, and others which are used in providing packaging services. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Advanced Packaging Technologies Global Market Report 2024 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on advanced packaging technologies market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

  • Gain a truly global perspective with the most comprehensive report available on this market covering 50+ geographies.
  • Understand how the market has been affected by the coronavirus and how it is responding as the impact of the virus abates.
  • Assess the Russia - Ukraine war's impact on agriculture, energy and mineral commodity supply and its direct and indirect impact on the market.
  • Measure the impact of high global inflation on market growth.
  • Create regional and country strategies on the basis of local data and analysis.
  • Identify growth segments for investment.
  • Outperform competitors using forecast data and the drivers and trends shaping the market.
  • Understand customers based on the latest market shares.
  • Benchmark performance against key competitors.
  • Suitable for supporting your internal and external presentations with reliable high quality data and analysis
  • Report will be updated with the latest data and delivered to you within 3-5 working days of order along with an Excel data sheet for easy data extraction and analysis.
  • All data from the report will also be delivered in an excel dashboard format.

Where is the largest and fastest growing market for advanced packaging technologies ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The advanced packaging technologies market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.

The impact of higher inflation in many countries and the resulting spike in interest rates.

The continued but declining impact of covid 19 on supply chains and consumption patterns.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

Markets Covered:

  • 1) By Type: 3D Integrated Circuit; 2D Integrated Circuit; 2.5D Integrated Circuit; Other Types
  • 2) By Product: Active Packaging; Smart And Intelligent Packaging
  • 3) By End Use Industry: Automotive And Transport; Consumer Electronics; Industrial; IT And Telecommunication; Other End Use Industries
  • Companies Mentioned: Samsung Electronics; Taiwan Semiconductor Manufacturing Company; Intel Corporation; International Business Machines; Qualcomm Technologies
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Advanced Packaging Technologies Market Characteristics

3. Advanced Packaging Technologies Market Trends And Strategies

4. Advanced Packaging Technologies Market - Macro Economic Scenario

  • 4.1. Impact Of High Inflation On The Market
  • 4.2. Ukraine-Russia War Impact On The Market
  • 4.3. COVID-19 Impact On The Market

5. Global Advanced Packaging Technologies Market Size and Growth

  • 5.1. Global Advanced Packaging Technologies Market Drivers and Restraints
    • 5.1.1. Drivers Of The Market
    • 5.1.2. Restraints Of The Market
  • 5.2. Global Advanced Packaging Technologies Historic Market Size and Growth, 2018 - 2023, Value ($ Billion)
  • 5.3. Global Advanced Packaging Technologies Forecast Market Size and Growth, 2023 - 2028, 2033F, Value ($ Billion)

6. Advanced Packaging Technologies Market Segmentation

  • 6.1. Global Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 3D Integrated Circuit
  • 2D Integrated Circuit
  • 2.5D Integrated Circuit
  • Other Types
  • 6.2. Global Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Active Packaging
  • Smart And Intelligent Packaging
  • 6.3. Global Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Automotive And Transport
  • Consumer Electronics
  • Industrial
  • IT And Telecommunication
  • Other End Use Industries

7. Advanced Packaging Technologies Market Regional And Country Analysis

  • 7.1. Global Advanced Packaging Technologies Market, Split By Region, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 7.2. Global Advanced Packaging Technologies Market, Split By Country, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

8. Asia-Pacific Advanced Packaging Technologies Market

  • 8.1. Asia-Pacific Advanced Packaging Technologies Market Overview
  • Region Information, Impact Of COVID-19, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.3. Asia-Pacific Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.4. Asia-Pacific Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

9. China Advanced Packaging Technologies Market

  • 9.1. China Advanced Packaging Technologies Market Overview
  • 9.2. China Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.3. China Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.4. China Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion

10. India Advanced Packaging Technologies Market

  • 10.1. India Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.2. India Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.3. India Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

11. Japan Advanced Packaging Technologies Market

  • 11.1. Japan Advanced Packaging Technologies Market Overview
  • 11.2. Japan Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.3. Japan Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.4. Japan Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

12. Australia Advanced Packaging Technologies Market

  • 12.1. Australia Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.2. Australia Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.3. Australia Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

13. Indonesia Advanced Packaging Technologies Market

  • 13.1. Indonesia Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.2. Indonesia Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.3. Indonesia Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

14. South Korea Advanced Packaging Technologies Market

  • 14.1. South Korea Advanced Packaging Technologies Market Overview
  • 14.2. South Korea Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.3. South Korea Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.4. South Korea Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

15. Western Europe Advanced Packaging Technologies Market

  • 15.1. Western Europe Advanced Packaging Technologies Market Overview
  • 15.2. Western Europe Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.3. Western Europe Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.4. Western Europe Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

16. UK Advanced Packaging Technologies Market

  • 16.1. UK Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.2. UK Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.3. UK Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

17. Germany Advanced Packaging Technologies Market

  • 17.1. Germany Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.2. Germany Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.3. Germany Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

18. France Advanced Packaging Technologies Market

  • 18.1. France Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.2. France Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.3. France Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

19. Italy Advanced Packaging Technologies Market

  • 19.1. Italy Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.2. Italy Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.3. Italy Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

20. Spain Advanced Packaging Technologies Market

  • 20.1. Spain Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.2. Spain Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.3. Spain Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

21. Eastern Europe Advanced Packaging Technologies Market

  • 21.1. Eastern Europe Advanced Packaging Technologies Market Overview
  • 21.2. Eastern Europe Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.3. Eastern Europe Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.4. Eastern Europe Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

22. Russia Advanced Packaging Technologies Market

  • 22.1. Russia Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.2. Russia Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.3. Russia Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

23. North America Advanced Packaging Technologies Market

  • 23.1. North America Advanced Packaging Technologies Market Overview
  • 23.2. North America Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.3. North America Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.4. North America Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

24. USA Advanced Packaging Technologies Market

  • 24.1. USA Advanced Packaging Technologies Market Overview
  • 24.2. USA Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.3. USA Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.4. USA Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

25. Canada Advanced Packaging Technologies Market

  • 25.1. Canada Advanced Packaging Technologies Market Overview
  • 25.2. Canada Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.3. Canada Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.4. Canada Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

26. South America Advanced Packaging Technologies Market

  • 26.1. South America Advanced Packaging Technologies Market Overview
  • 26.2. South America Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.3. South America Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.4. South America Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

27. Brazil Advanced Packaging Technologies Market

  • 27.1. Brazil Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.2. Brazil Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.3. Brazil Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

28. Middle East Advanced Packaging Technologies Market

  • 28.1. Middle East Advanced Packaging Technologies Market Overview
  • 28.2. Middle East Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.3. Middle East Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.4. Middle East Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

29. Africa Advanced Packaging Technologies Market

  • 29.1. Africa Advanced Packaging Technologies Market Overview
  • 29.2. Africa Advanced Packaging Technologies Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.3. Africa Advanced Packaging Technologies Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.4. Africa Advanced Packaging Technologies Market, Segmentation By End Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

30. Advanced Packaging Technologies Market Competitive Landscape And Company Profiles

  • 30.1. Advanced Packaging Technologies Market Competitive Landscape
  • 30.2. Advanced Packaging Technologies Market Company Profiles
    • 30.2.1. Samsung Electronics
      • 30.2.1.1. Overview
      • 30.2.1.2. Products and Services
      • 30.2.1.3. Strategy
      • 30.2.1.4. Financial Performance
    • 30.2.2. Taiwan Semiconductor Manufacturing Company
      • 30.2.2.1. Overview
      • 30.2.2.2. Products and Services
      • 30.2.2.3. Strategy
      • 30.2.2.4. Financial Performance
    • 30.2.3. Intel Corporation
      • 30.2.3.1. Overview
      • 30.2.3.2. Products and Services
      • 30.2.3.3. Strategy
      • 30.2.3.4. Financial Performance
    • 30.2.4. International Business Machines
      • 30.2.4.1. Overview
      • 30.2.4.2. Products and Services
      • 30.2.4.3. Strategy
      • 30.2.4.4. Financial Performance
    • 30.2.5. Qualcomm Technologies
      • 30.2.5.1. Overview
      • 30.2.5.2. Products and Services
      • 30.2.5.3. Strategy
      • 30.2.5.4. Financial Performance

31. Advanced Packaging Technologies Market Other Major And Innovative Companies

  • 31.1. Advanced Semiconductor Engineering (ASE)
  • 31.2. ASE Technology Holding Co. Ltd.
  • 31.3. Texas Instruments
  • 31.4. Shin-Etsu Chemical Co. Ltd.
  • 31.5. Renesas Electronics Corporation
  • 31.6. GlobalFoundries Inc.
  • 31.7. Sanmina Corporation
  • 31.8. Amkor Technology
  • 31.9. Jiangsu Changjiang Electronics Technology
  • 31.10. STATS ChipPAC
  • 31.11. Tongfu Microelectronics
  • 31.12. Powertech Technology
  • 31.13. ChipMOS Technologies Inc.
  • 31.14. United Test and Assembly Center Holdings Ltd.
  • 31.15. Unisem (M) Berhad.

32. Global Advanced Packaging Technologies Market Competitive Benchmarking

33. Global Advanced Packaging Technologies Market Competitive Dashboard

34. Key Mergers And Acquisitions In The Advanced Packaging Technologies Market

35. Advanced Packaging Technologies Market Future Outlook and Potential Analysis

  • 35.1 Advanced Packaging Technologies Market In 2028 - Countries Offering Most New Opportunities
  • 35.2 Advanced Packaging Technologies Market In 2028 - Segments Offering Most New Opportunities
  • 35.3 Advanced Packaging Technologies Market In 2028 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer