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市場調査レポート
商品コード
1448367
先進パッケージングの世界市場規模、シェア、成長分析：タイプ別、最終用途別 - 産業予測（2024～2031年）Global Advanced Packaging Market Size, Share, Growth Analysis, By Type(Flip Chip CSP, and Flip-Chip Ball Grid Array), By End-Use(Consumer Electronics, and Automotive) - Industry Forecast 2024-2031 |
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| 先進パッケージングの世界市場規模、シェア、成長分析：タイプ別、最終用途別 - 産業予測（2024～2031年） |
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出版日: 2024年03月01日
発行: SkyQuest
ページ情報: 英文 184 Pages
納期: 3～5営業日
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- 全表示
- 概要
- 目次
世界の先進パッケージングの市場規模は、2022年に306億米ドルとなり、2023年の330億米ドルから、2031年までには603億6,000万米ドルに成長し、予測期間中（2024～2031年）のCAGRは7.84%で成長する見通しです。
先進パッケージングは、半導体製造の最終段階において、シリコンウエハー、ロジックユニット、メモリーを物理的な損傷や腐食から守る保護筐体として重要な役割を果たすと同時に、2.5D、3D-IC、ファンアウトウエハーレベルパッケージング、システムインパッケージなどの革新的な技術によって、チップと回路基板との接続を容易にします。先進パッケージング、特にファンアウトウエハーレベルパッケージング市場は、スマートフォン、IoTデバイス、ハイエンド製品の需要急増に牽引されて急拡大しており、業界サプライヤーは業務効率向上のためにコスト効率の高いプロセスを開発する必要に迫られています。現在、先進パッケージングは、運用コストが高いため、ハイエンドやニッチ市場のアプリケーションに主に利用されているもの、様々な集積回路（IC）の多様なパッケージングニーズに対応できる大きな可能性を秘めており、従来のパッケージング手法を上回る成長機会を提供しています。先進パッケージングは、その能力において従来のパッケージングソリューションを凌駕することが期待されており、今後数年間で、この分野における有利な市場動向とさらなる進歩を促進する態勢が整っています。
目次
エグゼクティブサマリー
- 市場概要
- 運命の輪
調査手法
- 情報調達
- 二次・一次情報源
- 市場規模の推定
- 市場の前提条件と制限
親市場の分析
- 市場概要
- 市場規模
- 市場力学
- 促進要因
- 機会
- 抑制要因
- 課題
主な市場の考察
- 技術分析
- 価格分析
- サプライチェーン分析
- バリューチェーン分析
- 市場のエコシステム
- IP分析
- 貿易分析
- スタートアップ分析
- 原材料の分析
- イノベーションマトリクス
- パイプライン製品の分析
- マクロ経済指標
- 主な投資の分析
- 主な成功要因
- 競合の程度
市場力学と見通し
- 市場力学
- 促進要因
- 機会
- 抑制要因
- 課題
- 規制情勢
- ポーターの分析
- 将来の混乱についての特別な考察
先進パッケージングの世界市場：タイプ別
- 市場概要
- フリップチップCSP
- フリップチップボールグリッドアレイ
先進パッケージングの世界市場：最終用途別
- 市場概要
- コンシューマーエレクトロニクス
- 自動車
先進パッケージングの世界市場規模：地域別
- 市場概要
- 北米
- 米国
- カナダ
- 欧州
- ドイツ
- スペイン
- フランス
- 英国
- その他欧州地域
- アジア太平洋
- 中国
- インド
- 日本
- 韓国
- その他アジア太平洋
- ラテンアメリカ
- ブラジル
- その他ラテンアメリカ地域
- 中東・アフリカ（MEA）
- GCC諸国
- 南アフリカ
- その他中東・アフリカ地域
競合情勢
- 上位5社の比較
- 主要企業の市場ポジショニング（2021年）
- 主な市場企業が採用した戦略
- 主要成功戦略
- 市場における最近の活動
- 主要企業の市場シェア（2021年）
主要企業プロファイル
- Intel Corporation（United States）
- Advanced Micro Devices（AMD）（United States）
- Taiwan Semiconductor Manufacturing Company（TSMC）（Taiwan）
- Samsung Electronics（South Korea）
- ASE Group（Taiwan）
- Amkor Technology（United States）
- JCET Group（China）
- Powertech Technology（Taiwan）
- Siliconware Precision Industries Co., Ltd.（SPIL）（Taiwan）
- ChipMOS Technologies Inc.（Taiwan）
- UTAC Holdings Ltd.（Singapore）
- Tokyo Electron Limited（Japan）
- SCHOTT AG（Germany）
- Palomar Technologies（United States）
- Rudolph Technologies（United States）
- BESI Group（Netherlands）
- STATS ChipPAC Ltd.（Singapore）
Global Advanced Packaging Market size was valued at USD 30.60 billion in 2022 and is poised to grow from USD 33 billion in 2023 to USD 60.36 billion by 2031, growing at a CAGR of 7.84% during the forecast period (2024-2031).
Advanced packaging plays a crucial role as a protective enclosure safeguarding silicon wafers, logic units, and memory from physical damage and corrosion during semiconductor manufacturing's final stage, while also facilitating chip connection to circuit boards through innovative techniques like 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package. The market for advanced packaging, particularly fan-out wafer level packaging, has experienced rapid expansion driven by the surging demand for smartphones, IoT devices, and high-end products, prompting industry suppliers to develop cost-effective processes for improved operational efficiency. Despite currently being predominantly utilized for high-end and niche-market applications due to higher operational costs, advanced packaging holds significant potential for accommodating the diverse packaging needs of various integrated circuits (ICs), offering growth opportunities that surpass traditional packaging methods. With expectations to surpass conventional packaging solutions in capabilities, advanced packaging is poised to foster lucrative market trends and further advancements in the field in the forthcoming years.
Top-down and bottom-up approaches were used to estimate and validate the size of the Global Advanced Packaging Market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
Global Advanced Packaging Market Segmental Analysis
The Global Advanced Packaging Market is segmented on the basis of Type, End - Use, and Region. By Type the market is segmented into Flip Chip CSP, Flip-Chip Ball Grid Array. By End - User, the market is segmented into Consumer Electronics, Automotive. By Region, the market is segmented into North America, Europe, Latin America, Asia- Pacific, Middle East and Africa.
Drivers of the Global Advanced Packaging Market
In today's electronics landscape, the ongoing push for miniaturization underscores the vital role of advanced packaging methods. These techniques are indispensable for seamlessly integrating numerous components into a singular package, thereby enhancing the device's performance and functionality on a comprehensive scale.
Restraints in the Global Advanced Packaging Market
Intellectual property issues, coupled with the absence of uniform advanced packaging solutions, can introduce uncertainties and impede market expansion by deterring companies from committing to proprietary technologies.
Market Trends of the Global Advanced Packaging Market
Fan-Out Wafer-Level Packaging (FOWLP) has surged in popularity thanks to its capacity for producing thinner, more economical packages, rendering it an appealing option for mobile devices and high-performance applications.
Table of Contents
Executive Summary
- Market Overview
- Wheel of Fortune
Research Methodology
- Information Procurement
- Secondary & Primary Data Sources
- Market Size Estimation
- Market Assumptions & Limitations
Parent Market Analysis
- Market Overview
- Market Size
- Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges
Key Market Insights
- Technology Analysis
- Pricing Analysis
- Supply Chain Analysis
- Value Chain Analysis
- Ecosystem of the Market
- IP Analysis
- Trade Analysis
- Startup Analysis
- Raw Material Analysis
- Innovation Matrix
- Pipeline Product Analysis
- Macroeconomic Indicators
- Top Investment Analysis
- Key Success Factor
- Degree of Competition
Market Dynamics & Outlook
- Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges
- Regulatory Landscape
- Porters Analysis
- Competitive rivalry
- Threat of Substitute Products
- Bargaining Power of Buyers
- Threat of New Entrants
- Bargaining Power of Suppliers
- Skyquest Special Insights on Future Disruptions
- Political Impact
- Economic Impact
- Social Impact
- Technical Impact
- Environmental Impact
- Legal Impact
Global Advanced Packaging Market by Type
- Market Overview
- Flip Chip CSP
- and Flip-Chip Ball Grid Array
Global Advanced Packaging Market by End-Use
- Market Overview
- Consumer Electronics
- and Automotive
Global Advanced Packaging Market Size by Region
- Market Overview
- North America
- USA
- Canada
- Europe
- Germany
- Spain
- France
- UK
- Rest of Europe
- Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- Latin America
- Brazil
- Rest of Latin America
- Middle East & Africa (MEA)
- GCC Countries
- South Africa
- Rest of MEA
Competitive Landscape
- Top 5 Player Comparison
- Market Positioning of Key Players, 2021
- Strategies Adopted by Key Market Players
- Top Winning Strategies
- By Development
- By Company
- By Year
- Recent Activities in the Market
- Key Companies Market Share (%), 2021
Key Company Profiles
- Intel Corporation (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Advanced Micro Devices (AMD) (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Taiwan Semiconductor Manufacturing Company (TSMC) (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Samsung Electronics (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- ASE Group (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Amkor Technology (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- JCET Group (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Powertech Technology (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- ChipMOS Technologies Inc. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- UTAC Holdings Ltd. (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Tokyo Electron Limited (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- SCHOTT AG (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Palomar Technologies (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Rudolph Technologies (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- BESI Group (Netherlands)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- STATS ChipPAC Ltd. (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
