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先進パッケージング市場レポート：タイプ別、最終用途別、地域別、2024-2032

Advanced Packaging Market Report by Type, End Use, and Region 2024-2032

出版日
発行
IMARC
ページ情報
英文 143 Pages
納期
2～3営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=143.57円
先進パッケージング市場レポート：タイプ別、最終用途別、地域別、2024-2032
出版日: 2024年03月02日
発行: IMARC
ページ情報: 英文 143 Pages
納期: 2～3営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 図表
  • 目次
概要

先進パッケージングの世界市場規模は2023年に415億米ドルに達しました。今後、IMARC Groupは、2032年には983億米ドルに達し、2024年から2032年の間に10％の成長率（CAGR）を示すと予測しています。同市場は、高性能チップから発生する熱を放散し、過熱を防止するための熱管理ソリューションに対するニーズの高まり、半導体技術の継続的な進歩、環境への影響に対する懸念の高まりなどを背景に力強い成長を遂げています。

先進パッケージング市場の分析：

市場の成長と規模：小型化・集積化された電子機器や電子部品に対する需要の高まりに後押しされ、市場は大きな成長を遂げています。

半導体技術の継続的進歩：先進材料の開発、3Dスタッキング、異種集積化など、半導体技術における継続的な進歩が、先進パッケージング分野の技術革新と成長を促進しています。

産業用途：家電、自動車、ヘルスケア、通信など、先進パッケージングソリューションが性能と効率に不可欠な多様な産業から高い需要が寄せられています。

地域別動向：アジア太平洋地域は、特に台湾や韓国のような先進パッケージングの主要拠点であり、強固な半導体製造エコシステムによって市場を牽引しています。

競合情勢：市場の競争は激しく、複数の主要企業が研究開発、戦略的パートナーシップ、製品の差別化に注力し、競争力を高めています。

課題と機会：3Dパッケージングの複雑さや環境問題などの課題に直面する一方で、高性能でエネルギー効率の高いデバイスに対する需要の高まりに対応する機会もあります。

将来の展望：先進パッケージング市場の将来は有望であり、5G技術、人工知能（AI）、モノのインターネット（IoT）などのアプリケーションの潜在的成長が、革新的で効率的なパッケージングソリューションの必要性を促進しています。

先進パッケージング市場の動向：

小型化と集積化の新たな動向

小型化と統合に対する需要の高まりは、先進パッケージング市場の重要な原動力となっており、エレクトロニクス業界の状況を形成しています。より小型で携帯性に優れ、効率的な電子機器に対する消費者の嗜好が、メーカーに先進パッケージング・ソリューションの探求を促しています。これらのソリューションにより、複数の機能を単一の合理化されたパッケージに統合することが容易になると同時に、電子部品のコンパクト化が可能になります。先進パッケージングの主な利点の1つは、電子機器の性能を損なうことなく、物理的な設置面積を縮小できることです。これは、スマートフォン、ノートパソコン、ウェアラブル端末など、洗練された軽量で携帯性の高いガジェットへの需要がますます高まっていることと完全に一致しています。3D積層やシステム・イン・パッケージ（SiP）技術を含む先進パッケージング技術は、この小型化を実現する上で極めて重要な役割を果たしています。さらに、先進パッケージングにおける統合は、単なる省スペース化にとどまらないです。さまざまな機能やコンポーネントを1つのチップやパッケージに統合することが容易になります。これにより、電子機器全体の性能が向上し、エネルギー効率と消費電力の削減に貢献するため、市場の成長が促進されます。

急速な技術進歩

エレクトロニクス業界において革新的なパッケージング・ソリューションのニーズが高まっている背景には、半導体技術の絶え間ない進歩が大きな原動力となっています。こうした継続的な進歩は、先端材料の開発、3D積層技術の実装、異種集積アプローチの採用など、さまざまな側面を包含しています。さらに、半導体の複雑化と高性能化が製品需要を増大させています。半導体デバイスがより複雑で強力になるにつれ、その性能を補完し強化できるパッケージング・ソリューションの必要性が極めて重要になっています。高性能基板や熱管理コンパウンドなどの先端材料は、半導体が厳しい条件下で効率的かつ確実に動作するために不可欠です。3D積層技術もまた、半導体パッケージングを一変させた重要な進歩です。この技術により、複数の半導体層を1つのパッケージ内に垂直に統合することが可能になり、スペース利用が最適化され、電子デバイスの全体的な性能が向上します。この技術は、より高い演算能力を可能にし、エネルギー効率にも貢献するため、市場の成長に拍車をかけています。

多様な産業用途

先進パッケージング市場の特徴は、さまざまな業界にまたがる多様で広範なアプリケーションであり、それぞれが独自の要求と要件を備えていることです。コンシューマーエレクトロニクス、自動車、ヘルスケア、通信など、いくつかの主要セクターは、製品の性能、熱管理、信頼性を高めるために、先進パッケージングソリューションに大きく依存しています。民生用電子機器分野では、先進パッケージングは、より小型で、より高性能で、エネルギー効率に優れた機器を求める消費者の要望に応える上で重要な役割を果たしています。複雑な半導体部品の統合を可能にし、スマートフォン、ノートパソコン、ウェアラブルガジェットをよりコンパクトにすると同時に、全体的な性能を向上させる。自動車産業は、信頼性と耐久性の向上という点で、先進パッケージングから大きな恩恵を受けています。先進パッケージング・ソリューションは過酷な動作条件に耐えることができるため、ADAS（先進運転支援システム）や電気自動車（EV）などで使用される自動車用電子機器の寿命と効率を確保することができます。

ヘルスケアは、精密で信頼性の高い医療機器のための先進パッケージングに依存しており、正確な診断と患者のケアを保証しています。これらのパッケージング・ソリューションは、医療用画像機器、監視装置、埋め込み型医療機器において重要な役割を果たしています。より高速なデータ処理と通信への需要が高まっている通信では、高性能なネットワーキングとデータセンター機器をサポートする先進パッケージングが市場の成長を促進しています。

目次

第1章 序文

第2章 調査範囲と調査手法

  • 調査目的
  • 利害関係者
  • データソース
    • 一次情報
    • 二次情報
  • 市場推定
    • ボトムアップアプローチ
    • トップダウンアプローチ
  • 調査手法

第3章 エグゼクティブサマリー

第4章 イントロダクション

  • 概要
  • 主要産業動向

第5章 先進パッケージングの世界市場

  • 市場概要
  • 市場実績
  • COVID-19の影響
  • 市場予測

第6章 市場内訳：タイプ別

  • フリップチップボールグリッドアレイ
    • 市場動向
    • 市場展望
  • フリップチップCSP
    • 市場動向
    • 市場展望
  • ウエハーレベルCSP
    • 市場動向
    • 市場展望
  • 5D/3D
    • 市場動向
    • 市場予測
  • ファンアウトWLP
    • 市場動向
    • 市場予測
  • その他
    • 市場動向
    • 市場予測

第7章 市場内訳：最終用途別

  • コンシューマーエレクトロニクス
    • 市場動向
    • 市場予測
  • 自動車
    • 市場動向
    • 市場予測
  • 産業
    • 市場動向
    • 市場予測
  • ヘルスケア
    • 市場動向
    • 市場予測
  • 航空宇宙・防衛
    • 市場動向
    • 市場予測
  • その他
    • 市場動向
    • 市場予測

第8章 市場内訳：地域別

  • 北米
    • 米国
      • 市場動向
      • 市場予測
    • カナダ
      • 市場動向
      • 市場予測
  • アジア太平洋
    • 中国
      • 市場動向
      • 市場予測
    • 日本
      • 市場動向
      • 市場予測
    • インド
      • 市場動向
      • 市場予測
    • 韓国
      • 市場動向
      • 市場予測
    • オーストラリア
      • 市場動向
      • 市場予測
    • インドネシア
      • 市場動向
      • 市場予測
    • その他
      • 市場動向
      • 市場予測
  • 欧州
    • ドイツ
      • 市場動向
      • 市場予測
    • フランス
      • 市場動向
      • 市場予測
    • 英国
      • 市場動向
      • 市場予測
    • イタリア
      • 市場動向
      • 市場予測
    • スペイン
      • 市場動向
      • 市場予測
    • ロシア
      • 市場動向
      • 市場予測
    • その他
      • 市場動向
      • 市場予測
  • ラテンアメリカ
    • ブラジル
      • 市場動向
      • 市場予測
    • メキシコ
      • 市場動向
      • 市場予測
    • その他
      • 市場動向
      • 市場予測
  • 中東・アフリカ地域
    • 市場動向
    • 市場内訳：国別
    • 市場予測

第9章 SWOT分析

  • 概要
  • 強み
  • 弱み
  • 機会
  • 脅威

第10章 バリューチェーン分析

第11章 ポーターのファイブフォース分析

  • 概要
  • 買い手の交渉力
  • 供給企業の交渉力
  • 競合の程度
  • 新規参入業者の脅威
  • 代替品の脅威

第12章 価格分析

第13章 競合情勢

  • 市場構造
  • 主要企業
  • 主要企業のプロファイル
    • Advanced Semiconductor Engineering Inc.
    • Amkor Technology Inc.
    • Analog Devices Inc.
    • Brewer Science
    • ChipMOS Technologies Inc.
    • Microchip Technology Inc.
    • Powertech Technology Inc.
    • Samsung Electronics Co. Ltd
    • SUSS MicroTec SE
    • Taiwan Semiconductor Manufacturing Company Limited
    • Texas Instruments Incorporated
    • Universal Instruments Corporation（CBA Group Inc.）
図表

List of Figures

  • Figure 1: Global: Advanced Packaging Market: Major Drivers and Challenges
  • Figure 2: Global: Advanced Packaging Market: Sales Value (in Billion US$), 2018-2023
  • Figure 3: Global: Advanced Packaging Market Forecast: Sales Value (in Billion US$), 2024-2032
  • Figure 4: Global: Advanced Packaging Market: Breakup by Type (in %), 2023
  • Figure 5: Global: Advanced Packaging Market: Breakup by End Use (in %), 2023
  • Figure 6: Global: Advanced Packaging Market: Breakup by Region (in %), 2023
  • Figure 7: Global: Advanced Packaging (Flip-Chip Ball Grid Array) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 8: Global: Advanced Packaging (Flip-Chip Ball Grid Array) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 9: Global: Advanced Packaging (Flip Chip CSP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: Advanced Packaging (Flip Chip CSP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: Advanced Packaging (Wafer Level CSP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: Advanced Packaging (Wafer Level CSP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: Advanced Packaging (5D/3D) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: Advanced Packaging (5D/3D) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: Advanced Packaging (Fan Out WLP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: Advanced Packaging (Fan Out WLP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: Advanced Packaging (Other Types) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: Advanced Packaging (Other Types) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: Global: Advanced Packaging (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: Global: Advanced Packaging (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: Global: Advanced Packaging (Automotive) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: Global: Advanced Packaging (Automotive) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Global: Advanced Packaging (Industrial) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Global: Advanced Packaging (Industrial) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Global: Advanced Packaging (Healthcare) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Global: Advanced Packaging (Healthcare) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: Global: Advanced Packaging (Aerospace and Defense) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: Global: Advanced Packaging (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Global: Advanced Packaging (Other End Uses) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Global: Advanced Packaging (Other End Uses) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: North America: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: North America: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: United States: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: United States: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Canada: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Canada: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Asia-Pacific: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Asia-Pacific: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: China: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: China: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Japan: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Japan: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: India: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: India: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: South Korea: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: South Korea: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: Australia: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: Australia: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: Indonesia: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: Indonesia: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: Others: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: Others: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: Europe: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: Europe: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Germany: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Germany: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: France: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: France: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: United Kingdom: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: United Kingdom: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: Italy: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: Italy: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: Spain: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: Spain: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: Russia: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: Russia: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 67: Others: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 68: Others: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 69: Latin America: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 70: Latin America: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 71: Brazil: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 72: Brazil: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 73: Mexico: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 74: Mexico: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 75: Others: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 76: Others: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 77: Middle East and Africa: Advanced Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 78: Middle East and Africa: Advanced Packaging Market: Breakup by Country (in %), 2023
  • Figure 79: Middle East and Africa: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 80: Global: Advanced Packaging Industry: SWOT Analysis
  • Figure 81: Global: Advanced Packaging Industry: Value Chain Analysis
  • Figure 82: Global: Advanced Packaging Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Advanced Packaging Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: Advanced Packaging Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: Advanced Packaging Market Forecast: Breakup by End Use (in Million US$), 2024-2032
  • Table 4: Global: Advanced Packaging Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 5: Global: Advanced Packaging Market: Competitive Structure
  • Table 6: Global: Advanced Packaging Market: Key Players
目次
Product Code: SR112024A6250

The global advanced packaging market size reached US$ 41.5 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 98.3 Billion by 2032, exhibiting a growth rate (CAGR) of 10% during 2024-2032. The market is experiencing strong growth driven by the rising need for improved thermal management solutions to dissipate heat generated by high-performance chips and prevent overheating, ongoing advancements in semiconductor technology, and heightening concerns about environmental impact.

Advanced Packaging Market Analysis:

Market Growth and Size: The market is witnessing significant growth, fueled by the increasing demand for miniaturized and integrated electronic devices and components.

Ongoing Advancements in Semiconductor Technology: Ongoing advancements in semiconductor technology, such as the development of advanced materials, 3D stacking, and heterogeneous integration, are fostering innovation and growth in the advanced packaging sector.

Industry Applications: The market is experiencing high demand from diverse industries, including consumer electronics, automotive, healthcare, and telecommunications, where advanced packaging solutions are essential for performance and efficiency.

Geographical Trends: Asia Pacific leads the market, propelled by its robust semiconductor manufacturing ecosystem, particularly in countries like Taiwan and South Korea, which are major hubs for advanced packaging.

Competitive Landscape: The market is characterized by intense competition, with several key players focusing on research and development, strategic partnerships, and product differentiation to gain a competitive edge.

Challenges and Opportunities: While the market faces challenges, such as the complexity of 3D packaging and environmental concerns, it also offers opportunities in addressing the growing demand for high-performance, energy-efficient devices.

Future Outlook: The future of the advanced packaging market looks promising, with potential growth in applications like 5G technology, artificial intelligence (AI), and the Internet of Things (IoT), driving the need for innovative and efficient packaging solutions.

Advanced Packaging Market Trends:

Emerging trend of miniaturization and integration

The rising demand for miniaturization and integration represents a significant driver in the advanced packaging market, shaping the landscape of the electronics industry. Consumers' preferences for smaller, more portable, and efficient electronic devices have prompted manufacturers to explore advanced packaging solutions. These solutions allow for the compacting of electronic components while facilitating the integration of multiple functions into a single, streamlined package. One of the primary advantages of advanced packaging is its ability to reduce the physical footprint of electronic devices without compromising their performance. This aligns perfectly with the ever-growing demand for sleek, lightweight, and highly portable gadgets, such as smartphones, laptops, and wearables. Advanced packaging techniques, including 3D stacking and System-in-Package (SiP) technologies, play a pivotal role in achieving this miniaturization. Furthermore, the integration within advanced packaging goes beyond just space-saving. It facilitates the consolidation of various functionalities and components onto a single chip or package. This enhances the overall performance of electronic devices and contributes to energy efficiency and reduced power consumption, thereby propelling market growth.

Rapid technological advancements

The relentless pace of technological advancements in semiconductor technology is a major driving force behind the growing need for innovative packaging solutions in the electronics industry. These ongoing advancements encompass various aspects, including the development of advanced materials, the implementation of 3D stacking techniques, and the adoption of heterogeneous integration approaches. Moreover, the increasing complexity and power of semiconductors has augmented the product demand. As semiconductor devices become more intricate and powerful, the need for packaging solutions that can complement and enhance their performance becomes crucial. Advanced materials, such as high-performance substrates and thermal management compounds, are essential to ensuring that semiconductors operate efficiently and reliably under demanding conditions. 3D stacking technology is another key advancement that has reshaped the landscape of semiconductor packaging. It allows multiple semiconductor layers to be vertically integrated within a single package, optimizing space utilization and enhancing the overall performance of electronic devices. This technology enables higher computing power and contributes to energy efficiency, thus fueling market growth.

Diverse industry applications

The advanced packaging market is characterized by its diverse and extensive applications across a range of industries, each with unique demands and requirements. Several key sectors, including consumer electronics, automotive, healthcare, and telecommunications, heavily depend on advanced packaging solutions to enhance the performance, thermal management, and reliability of their products. In the consumer electronics sector, advanced packaging is instrumental in meeting consumers' desires for smaller, more powerful, and energy-efficient devices. It enables the integration of complex semiconductor components, making smartphones, laptops, and wearable gadgets more compact while improving their overall performance. The automotive industry significantly benefits from advanced packaging in terms of enhanced reliability and durability. Advanced packaging solutions can withstand harsh operating conditions, ensuring the longevity and efficiency of automotive electronics, including those used in advanced driver-assistance systems (ADAS) and electric vehicles (EVs).

Healthcare relies on advanced packaging for precise and reliable medical devices, ensuring accurate diagnostics and patient care. These packaging solutions play a crucial role in medical imaging equipment, monitoring devices, and implantable medical devices. Telecommunications, with the escalating demand for faster data processing and communication, relies on advanced packaging to support high-performance networking and data center equipment, thereby fostering market growth.

Advanced Packaging Industry Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the market, along with forecasts at the global, regional, and country levels for 2024-2032. Our report has categorized the market based on type and end use.

Breakup by Type:

Flip-Chip Ball Grid Array

Flip Chip CSP

Wafer Level CSP

5D/3D

Fan Out WLP

Others

Flip-chip ball grid array accounts for the majority of the market share

The report has provided a detailed breakup and analysis of the market based on the type. This includes flip-chip ball grid array, flip chip CSP, wafer level CSP, 5D/3D, fan out WLP, and others. According to the report, flip-chip ball grid array represented the largest segment.

Flip-Chip Ball Grid Array (FCBGA) is a packaging technology where semiconductor chips are flipped upside down and connected to a substrate using solder balls. It dominates the market as it offers excellent thermal performance, high interconnect density, and is widely used in applications requiring high processing power, such as CPUs and GPUs. FCBGA is highly preferred due to its ability to meet the demands of power-hungry, high-performance electronic devices. Its efficient heat dissipation and robust electrical connections make it indispensable in data centers and high-end computing.

Flip Chip Chip Scale Package (FCCSP) is a compact packaging solution, known for its small footprint and improved electrical performance. It is gaining immense traction owing to the need for miniaturization in portable devices like smartphones, where space is limited. FCCSP's small form factor also contributes to improved signal integrity and faster data transfer rates, making it ideal for high-speed communication devices.

Wafer Level Chip Scale Package (WLCSP) involves packaging individual semiconductor dies at the wafer level, offering size and cost advantages. It is witnessing growth on account of the rising demand for compact, cost-effective solutions in mobile and IoT devices. WLCSP's cost-efficiency makes it a preferred choice for applications where reducing manufacturing costs without compromising functionality is crucial.

5D/3D packaging involves stacking multiple semiconductor dies vertically or horizontally, enabling increased functionality in a smaller footprint. It is experiencing a rise in the adoption, with the growing desire for improved performance and functionality in compact devices like wearables and IoT sensors. 5D/3D packaging allows for the integration of diverse components, such as memory, logic, and sensors, in a single package, enhancing the capabilities of devices with limited space.

Fan-Out Wafer Level Packaging (FOWLP) is known for its flexibility and cost-efficiency. It is gaining popularity due to the heightened need for advanced packaging solutions in various applications, from consumer electronics to automotive, to achieve a balance between performance and cost-effectiveness. FOWLP's versatility allows for the integration of different functions, such as RF components and power management, in a single package, catering to the evolving requirements of diverse industries.

Breakup by End Use:

Consumer Electronics

Automotive

Industrial

Healthcare

Aerospace and Defense

Others

Consumer electronics holds the largest share in the industry

A detailed breakup and analysis of the market based on the end use have also been provided in the report. This includes consumer electronics, automotive, industrial, healthcare, aerospace and defense, and others. According to the report, consumer electronics accounted for the largest market share.

Consumer electronics dominate the market as they demand advanced packaging for miniaturization, improved performance, and energy efficiency. Rapid technological advancements and consumer preferences for smaller, high-performance devices drive innovation in this sector. Additionally, the competitive landscape in the consumer electronics market encourages manufacturers to adopt advanced packaging to differentiate their products and gain a competitive edge. The constant push for thinner, lighter, and more feature-rich devices further fuels the demand for advanced packaging solutions.

In the automotive sector, advanced packaging is crucial for ensuring the reliability of electronic components in vehicles. The growth of electric vehicles (EVs), autonomous driving technology, and connected car systems creates a demand for advanced packaging solutions to support these innovations. Moreover, the automotive industry's focus on reducing emissions and enhancing fuel efficiency strengthens the need for advanced power electronics and thermal management solutions, amplifying the role of advanced packaging in this sector.

The industrial sector requires advanced packaging to enhance the durability and reliability of electronics used in machinery, automation, and control systems. Robust packaging solutions are essential for harsh environments and extended product lifecycles. Furthermore, various Industry 4.0 initiatives, which involve the integration of digital technologies into industrial processes, catalyze the adoption of advanced sensors and components, thus augmenting the demand for advanced packaging to ensure consistent and reliable operation in industrial settings.

In healthcare, the adoption of advanced packaging is driven by the need for miniaturized medical devices, improved diagnostics, and patient monitoring systems. Precision and reliability in packaging are critical to meet stringent regulatory requirements. Additionally, the aging population and the increasing prevalence of chronic diseases underscore the importance of advanced packaging solutions in supporting the development of innovative medical devices that enhance patient care and diagnostics accuracy.

The aerospace and defense sector relies on advanced packaging for space-constrained applications, ruggedized electronics, and military-grade systems. Reliability, durability, and the ability to withstand extreme conditions are key drivers. Moreover, advancements in satellite technology, communication systems, and unmanned aerial vehicles (UAVs) necessitate compact and reliable advanced packaging solutions that can withstand the rigors of aerospace and defense applications.

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Asia Pacific leads the market, accounting for the largest advanced packaging market share

The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.

Asia Pacific hols the largest market share due to its proactive government policies supporting the semiconductor industry. The region's growing middle-class population fuels consumer electronics demand, further propelling the advanced packaging market forward. Moreover, Asia Pacific benefits from a well-established network of semiconductor foundries, enabling efficient production and supply chain management.

North America boasts a strong startup ecosystem and venture capital investment in semiconductor technology. This fosters a culture of innovation, leading to the development of cutting-edge advanced packaging solutions. Additionally, the region's stringent quality standards propel the demand for high-reliability advanced packaging in aerospace and defense applications.

Europe's commitment to fostering collaborative research and development (R&D) initiatives in semiconductor packaging ensures a steady stream of innovations. The region's focus on environmental sustainability encourages the development of eco-friendly packaging materials, aligning with global sustainability goals. Furthermore, Europe's automotive sector leverages advanced packaging to improve vehicle safety and performance.

Latin America also represents an emerging market for advanced packaging, with countries such as Brazil and Mexico witnessing increased consumer spending on electronics and appliances. The region's strategic location for electronics assembly and manufacturing further drives demand for advanced packaging technologies. Additionally, the adoption of advanced packaging in medical devices and pharmaceuticals bolsters the healthcare sector in Latin America.

The Middle East's initiatives for digital transformation, including smart city projects and IoT implementations, create significant opportunities for advanced packaging in sensor technology and data management. Africa's youthful population and growing mobile connectivity drive the demand for affordable and efficient consumer electronics, boosting the advanced packaging market. Additionally, the rising focus of region on renewable energy technologies fuels the development of advanced packaging solutions for clean energy applications.

Leading Key Players in the Advanced Packaging Industry:

Numerous key players in the market are actively increasing their research and development efforts to introduce innovative packaging solutions. They are also investing heavily in technologies like 3D integration, advanced materials, and heterogeneous integration to meet the evolving demands of high-performance applications, such as 5G, AI, and IoT. Additionally, these industry leaders are expanding their manufacturing capabilities to ensure efficient production and supply chain management. Collaborations and strategic partnerships with semiconductor manufacturers and end-user industries are on the rise to co-create tailored packaging solutions. Moreover, a focus on sustainability is fostering the development of eco-friendly packaging materials and processes to align with global environmental goals. In summary, these players are continuously pushing the boundaries of advanced packaging to stay competitive and address the diverse needs of various industries.

The market research report has provided a comprehensive analysis of the competitive landscape. Detailed profiles of all major companies have also been provided. Some of the key players in the market include:

Advanced Semiconductor Engineering Inc.

Amkor Technology Inc.

Analog Devices Inc.

Brewer Science

ChipMOS Technologies Inc.

Microchip Technology Inc.

Powertech Technology Inc.

Samsung Electronics Co. Ltd

SUSS MicroTec SE

Taiwan Semiconductor Manufacturing Company Limited

Texas Instruments Incorporated

Universal Instruments Corporation (CBA Group Inc.)

(Please note that this is only a partial list of the key players, and the complete list is provided in the report.)

Latest News:

August 10, 2023: Samsung Electronics Co. Ltd collaborated with Intel marks for delivering state-of-the-art virtual Radio Access Network (vRAN) solutions designed to address the increasing capacity demands in the telecommunications industry. This partnership aims to leverage Intel's expertise in hardware and Samsung's prowess in network solutions to develop innovative vRAN technologies that can enhance network performance and efficiency, ultimately benefiting consumers and businesses by ensuring seamless connectivity and improved network capabilities.

July 3, 2023: Microchip Technology Inc. launched a $300 million multi-year investment initiative for expanding its presence in India. This strategic move aims to strengthen Microchip's foothold in the Indian market by fostering research and development activities, expanding production capacities, and bolstering its workforce. By making such substantial investments, Microchip aims to capitalize on the growing opportunities in India's semiconductor and electronics industry, aligning with the nation's push for digitalization and technology advancement.

November 30, 2023: Texas Instruments (TI) Incorporated expanded its low-power Gallium Nitride (GaN) portfolio, paving the way for significant advancements in AC/DC power adapters. With this expansion, TI aims to achieve a remarkable 50% reduction in the size of power adapters. GaN technology offers superior power conversion efficiency, allowing for smaller and more efficient power delivery solutions. This development aligns with the growing demand for compact and energy-efficient electronic devices, providing a crucial solution for consumer electronics and various applications where space and power efficiency are crucial.

Key Questions Answered in This Report

  • 1. What was the size of the global advanced packaging market in 2023?
  • 2. What is the expected growth rate of the global advanced packaging market during 2024-2032?
  • 3. What has been the impact of COVID-19 on the global advanced packaging market?
  • 4. What are the key factors driving the global advanced packaging market?
  • 5. What is the breakup of the global advanced packaging market based on the type?
  • 6. What is the breakup of the global advanced packaging market based on the end use?
  • 7. What are the key regions in the global advanced packaging market?
  • 8. Who are the key players/companies in the global advanced packaging market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Advanced Packaging Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Flip-Chip Ball Grid Array
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Flip Chip CSP
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 Wafer Level CSP
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast
  • 6.4 5D/3D
    • 6.4.1 Market Trends
    • 6.4.2 Market Forecast
  • 6.5 Fan Out WLP
    • 6.5.1 Market Trends
    • 6.5.2 Market Forecast
  • 6.6 Others
    • 6.6.1 Market Trends
    • 6.6.2 Market Forecast

7 Market Breakup by End Use

  • 7.1 Consumer Electronics
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Automotive
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Industrial
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Healthcare
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Aerospace and Defense
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast
  • 7.6 Others
    • 7.6.1 Market Trends
    • 7.6.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 Advanced Semiconductor Engineering Inc.
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
    • 13.3.2 Amkor Technology Inc.
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 Financials
      • 13.3.2.4 SWOT Analysis
    • 13.3.3 Analog Devices Inc.
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
      • 13.3.3.3 Financials
      • 13.3.3.4 SWOT Analysis
    • 13.3.4 Brewer Science
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
    • 13.3.5 ChipMOS Technologies Inc.
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
    • 13.3.6 Microchip Technology Inc.
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
      • 13.3.6.3 Financials
      • 13.3.6.4 SWOT Analysis
    • 13.3.7 Powertech Technology Inc.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
      • 13.3.7.4 SWOT Analysis
    • 13.3.8 Samsung Electronics Co. Ltd
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
      • 13.3.8.3 Financials
      • 13.3.8.4 SWOT Analysis
    • 13.3.9 SUSS MicroTec SE
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
    • 13.3.10 Taiwan Semiconductor Manufacturing Company Limited
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
      • 13.3.10.4 SWOT Analysis
    • 13.3.11 Texas Instruments Incorporated
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
      • 13.3.11.4 SWOT Analysis
    • 13.3.12 Universal Instruments Corporation (CBA Group Inc.)
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio