先進パッケージング市場規模、シェア、成長分析：タイプ別、最終用途別、地域別 - 産業予測 2025～2032年

先進パッケージングの世界市場規模は2023年に324億米ドルとなり、予測期間（2025-2032年）のCAGRは7.1%で、2024年の347億米ドルから2032年には600億7,000万米ドルに成長する見通しです。

先進パッケージング市場は、スマートフォン、IoTデバイス、プレミアムエレクトロニクスの需要増加に後押しされ、特にファンアウトウエハーレベルパッケージングで大きな成長を遂げています。この革新的なパッケージング手法は、シリコンウエハーやチップに不可欠な保護を提供し、物理的な損傷や腐食を緩和しながら回路基板への接続性を確保します。先進パッケージングは運用コストが高いため、主にハイエンドやニッチ用途に使用されていますが、汎用性が高いため、より幅広い集積回路（IC）要件に対応できる可能性があります。メーカーがよりコスト効率の高いプロセスを開発するにつれ、先進パッケージングは従来の方法を凌駕し、優れた機能性を提供し、この分野でのさらなる進歩を促し、今後数年間の投資と技術革新のためのダイナミックな状況を作り出します。

目次

イントロダクション

• 調査の目的
• 調査範囲
• 定義

調査手法

• 情報調達
• 二次と一次データの方法
• 市場規模予測
• 市場の前提条件と制限

エグゼクティブサマリー

• 世界市場の見通し
• 供給と需要の動向分析
• セグメント別機会分析

市場力学と見通し

• 市場概要
• 市場規模
• 市場力学
  • 促進要因と機会
  • 抑制要因と課題
• ポーターの分析

主な市場の考察

• 重要成功要因
• 競合の程度
• 主な投資機会
• 市場エコシステム
• 市場の魅力指数（2024年）
• PESTEL分析
• マクロ経済指標
• バリューチェーン分析
• 価格分析
• 規制情勢
• ケーススタディ
• 技術分析
• 原材料の分析

先進パッケージング市場規模：タイプ別& CAGR（2025-2032）

• 市場概要
• フリップチップCSP
• フリップチップボールグリッドアレイ
• ウエハーレベルCSP
• 5D/3D
• ファンアウトWLP
• その他

先進パッケージング市場規模：最終用途別& CAGR（2025-2032）

• 市場概要
• 家電
• 自動車
• 産業
• ヘルスケア
• 航空宇宙および防衛
• その他

先進パッケージング市場規模：地域別& CAGR（2025-2032）

• 北米
  • 米国
  • カナダ
• 欧州
  • ドイツ
  • スペイン
  • フランス
  • 英国
  • イタリア
  • その他欧州地域
• アジア太平洋地域
  • 中国
  • インド
  • 日本
  • 韓国
  • その他アジア太平洋地域
• ラテンアメリカ
  • ブラジル
  • その他ラテンアメリカ地域
• 中東・アフリカ
  • GCC諸国
  • 南アフリカ
  • その他中東・アフリカ

競合情報

• 上位5社の比較
• 主要企業の市場ポジショニング（2024年）
• 主な市場企業が採用した戦略
• 最近の市場動向
• 企業の市場シェア分析（2024年）
• 主要企業の企業プロファイル
  • 企業の詳細
  • 製品ポートフォリオ分析
  • 企業のセグメント別シェア分析
  • 収益の前年比比較（2022-2024）

主要企業プロファイル

• Gerresheimer（Germany）
• Toray Advanced Composites（United States）
• Veeco Instruments Inc.（United States）
• BE Semiconductor Industries N.V.（Netherlands）
• Sonoco Products Company（United States）
• Flint Group（Luxembourg）
• Amkor Technology（United States）
• ASE Technology Holding Co., Ltd.（Taiwan）
• SPIL（Siliconware Precision Industries Co., Ltd.）（Taiwan）
• JCET Group Co., Ltd.（China）
• Powertech Technology Inc.（Taiwan）
• Hana Micron Inc.（South Korea）
• Unisem Group（Malaysia）
• ChipMOS Technologies Inc.（Taiwan）
• Nepes Corporation（South Korea）
• Tianshui Huatian Technology Co., Ltd.（China）
• Tongfu Microelectronics Co., Ltd.（China）
• UTAC Holdings Ltd.（Singapore）
• Lingsen Precision Industries, Ltd.（Taiwan）
• Formosa Advanced Technologies Co., Ltd.（Taiwan）

結論と提言

Global Advanced Packaging Market size was valued at USD 32.4 billion in 2023 and is poised to grow from USD 34.7 billion in 2024 to USD 60.07 billion by 2032, growing at a CAGR of 7.1% during the forecast period (2025-2032).

The advanced packaging market is experiencing significant growth, particularly in fan-out wafer-level packaging, fueled by rising demand for smartphones, IoT devices, and premium electronics. This innovative packaging method provides essential protection for silicon wafers and chips, ensuring connectivity to circuit boards while mitigating physical damage and corrosion. Although it is primarily used for high-end and niche applications due to higher operational costs, the versatility of advanced packaging presents substantial opportunities to cater to a wider array of integrated circuit (IC) requirements. As manufacturers develop more cost-effective processes, advanced packaging is poised to surpass traditional methods, offering superior functionality and driving further advancements within the sector, creating a dynamic landscape for investment and innovation over the coming years.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Advanced Packaging market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Advanced Packaging Market Segments Analysis

Global Advanced Packaging Market is segmented by Type, End-use and region. Based on Type, the market is segmented into Flip Chip CSP, Flip-Chip Ball Grid Array, Wafer Level CSP, 5D/3D, Fan Out WLP and Others. Based on End-use, the market is segmented into Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Advanced Packaging Market

The global advanced packaging market is significantly driven by the ongoing trend of miniaturization in the electronics industry. As devices become increasingly compact, advanced packaging solutions are crucial for integrating multiple components into a single, efficient unit. This integration enhances overall performance and functionality, enabling manufacturers to meet the growing demand for smaller, more powerful electronic devices. As technology evolves, the need for innovative packaging methods that optimize space and improve electronic performance is paramount, further propelling the growth of the advanced packaging market worldwide.

Restraints in the Global Advanced Packaging Market

Concerns regarding intellectual property and the absence of standardized solutions in advanced packaging can hinder market development by introducing uncertainties. This apprehension may lead companies to be reluctant in investing in proprietary technologies, as they may fear potential intellectual property disputes or lack of industry-wide acceptance. Consequently, this cautious approach can impede innovation and slow the overall growth of the Global Advanced Packaging market, as stakeholders hesitate to commit resources to solutions that may not gain traction or may encounter legal challenges. The need for clearer guidelines and protection mechanisms is essential to foster confidence and encourage investments in this evolving sector.

Market Trends of the Global Advanced Packaging Market

The Global Advanced Packaging market is witnessing a robust trend towards the adoption of Fan-Out Wafer-Level Packaging (FOWLP), driven by the demand for thinner, lighter, and cost-efficient solutions. This innovative packaging technology is particularly favored in the mobile device sector and high-performance computing applications, as it allows for enhanced performance while minimizing footprint. FOWLP's ability to integrate multiple functions within a compact design aligns with the industry's shift towards miniaturization and increased functionality, positioning it as a preferred choice among manufacturers. As consumer electronics continue to evolve, the FOWLP segment is expected to expand significantly, shaping the future of advanced packaging solutions.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2024
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Regulatory Landscape
• Case Studies
• Technology Analysis
• Raw Material Analysis

Global Advanced Packaging Market Size by Type & CAGR (2025-2032)

• Market Overview
• Flip Chip CSP
• Flip-Chip Ball Grid Array
• Wafer Level CSP
• 5D/3D
• Fan Out WLP
• Others

Global Advanced Packaging Market Size by End-use & CAGR (2025-2032)

• Market Overview
• Consumer Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & Defense
• Others

Global Advanced Packaging Market Size & CAGR (2025-2032)

• North America (Type, End-use)
  • US
  • Canada
• Europe (Type, End-use)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Type, End-use)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Type, End-use)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Type, End-use)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2024
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2024
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

• Gerresheimer (Germany)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Toray Advanced Composites (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Veeco Instruments Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• BE Semiconductor Industries N.V. (Netherlands)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Sonoco Products Company (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Flint Group (Luxembourg)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Amkor Technology (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ASE Technology Holding Co., Ltd. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• SPIL (Siliconware Precision Industries Co., Ltd.) (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• JCET Group Co., Ltd. (China)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Powertech Technology Inc. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Hana Micron Inc. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Unisem Group (Malaysia)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ChipMOS Technologies Inc. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Nepes Corporation (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Tianshui Huatian Technology Co., Ltd. (China)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Tongfu Microelectronics Co., Ltd. (China)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• UTAC Holdings Ltd. (Singapore)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Lingsen Precision Industries, Ltd. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Formosa Advanced Technologies Co., Ltd. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations