![]() |
市場調査レポート
商品コード
1525916
先進パッケージングの世界市場:タイプ・エンドユーザー・地域別の予測 (~2030年)Global Advanced Packaging Market Research Report Information by Type, by End-user, and by Region -Forecast Till 2030 |
||||||
|
先進パッケージングの世界市場:タイプ・エンドユーザー・地域別の予測 (~2030年) |
出版日: 2024年07月15日
発行: Market Research Future
ページ情報: 英文 124 Pages
納期: 即納可能
![]() |
先進パッケージングの市場規模は、2023年の353億3,670万米ドルから、予測期間中は5.6%のCAGRで成長すると予測されています。
先進パッケージング市場を牽引する主な要因は、エレクトロニクス産業の爆発的な拡大と、ウェアラブル、ラップトップ、デスクトップ、スマートフォン、小型ガジェットなど、さまざまなCE製品に対する需要の高まりです。
地域別展望
アジア太平洋地域は2022年に最大のシェアを占め、2030年には365億2,858万米ドルに成長すると予測されています。同地域には非常に多くの半導体製造施設があるため、同地域の市場シェアは非常に大きいです。ファブレスサプライヤーからの需要増に対応するため、この地域のメーカーは生産能力を拡大しており、中国は基板製造事業を統合しようとしています。
いくつかの理由から、北米の先進パッケージング市場も大きく拡大しています。第一に、この市場はCE製品の需要拡大に直接影響を受けています。人々は、コミュニケーション、レジャー、仕事関連のタスクのために電子ガジェットをますます使用するようになっており、これらのデバイスの複雑で小さな設計に適合する高度なパッケージングソリューションが求められています。また、高級チップに対する需要の高まりにより、市場も拡大しています。
欧州の先進パッケージング市場では、スマートフォン、エレクトロニクス、IoTの需要の高まりによって、特にウエハレベルパッケージングが急速に拡大していることが成長の要因となっています。先進パッケージングのプロバイダーは、この拡大する需要を満たすために、先進パッケージングの総コストを下げ、最大限の運用効果を保証する手順や計画を積極的に策定しています。
当レポートでは、世界の先進パッケージングの市場を調査し、市場の定義と概要、市場成長への影響因子および市場機会の分析、市場規模の推移・予測、各種区分・地域/主要国別の内訳、競合環境、主要企業のプロファイルなどをまとめています。
Global Advanced Packaging Market Research Report Information by Type (Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-level Packaging and Others), by End-user (Consumer Electronics, Healthcare, Industrial, Aerospace and Defense, Automotive and Other), and by Region (North America, Europe, Asia Pacific, South America, and Middle East & Africa) -Forecast Till 2030
In 2023, the advanced packaging market was estimated to be worth USD 35,336.7 million. Over the course of the projection period, the Advanced Packaging industry is expected to increase at a compound annual growth rate (CAGR) of 5.6%. The collection and linking of Types prior to conventional integrated circuit packaging is known as advanced packaging. Multiple devices can be combined and packed as a single electrical device thanks to advanced packaging. The industrial segment that deals with creating, designing, and producing sophisticated and novel packaging solutions for a range of products is known as the advanced packaging market. Modern packaging methods are used to improve the performance, usefulness, and dependability of packaged items while guaranteeing its preservation, protection, and appearance. The increased need for embedded die packaging can also be attributed to the increasing downsizing of devices and the increasing use of micro-electromechanical systems (MEMS) in manufacturing. Although the technology has been available for some time, its low yields and high costs have restricted its applicability to specialized fields.
As technology develops, producers are moving toward producing small electronic devices for a variety of markets, including consumer electronics, healthcare, automotive, and semiconductor IC manufacture.
The main factors driving the Advanced Packaging Market are the electronics industry's explosive expansion and the rising demand for a range of consumer electronics, including wearables, laptops, desktops, smartphones, and tiny gadgets.
The Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-level Packaging, and Others are the segments of the Advanced Packaging Market based on type.
The Advanced Packaging Market has been divided into Consumer Electronics, Healthcare, Industrial, Aerospace and Defense, Automotive, and Other segments based on the end-user.
Regional Perspectives
The Asia-Pacific region is predicted to account for the largest share in 2022 and grow to USD 36,528.58 million by 2030. Because there are so many semiconductor production facilities in the Asia-Pacific region, the market share is substantial in that area. In order to fulfill the increased demand from fabless suppliers, manufacturers in this region are expanding their production capacity, and China is attempting to consolidate its substrate manufacturing business.
For several reasons, the advanced packaging market in North America is expanding significantly. First, the market is directly impacted by the growing demand for consumer electronics. People are using electronic gadgets more and more for communication, leisure, and work-related tasks, which means that sophisticated packaging solutions are required to fit the intricate and small designs of these devices. The market is also expanding due to the rising demand for premium chips.
The rapid expansion of the advanced packaging market, especially in wafer level packaging, driven by the rising demand for smartphones, electronics, and the Internet of Things (IoT), is responsible for the growth of the Europe Advanced Packaging Market. Providers of advanced packaging are actively creating procedures and plans to lower the total cost of advanced packaging and guarantee maximum operational effectiveness to satisfy this expanding demand.
South America's market for innovative packaging materials is expanding gradually due to a number of factors. The need for improved packaging solutions is being driven by the rising demand for sophisticated electronic gadgets like wearables, tablets, and smartphones. Advanced packaging technologies enable the production of semiconductor chips that are more compact, powerful, and energy-efficient-all necessary for these devices.
The market for advanced packaging semiconductor materials is expanding significantly in the Middle East and Africa (MEA) region. In order to enable more performance and usefulness in electronic devices, advanced packaging refers to the compact and efficient integration and encapsulation of semiconductor chips.
Principal Players
Amkor Technology Inc., ASE Technology Holding Co. Ltd., China Wafer Level CSP Co. Ltd., ChipMOS Technologies Inc., FlipChip International LLC, HANA Micron Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., King Yuan Electronics Corp., Nepes Corporation, Powertech Technology Inc., and numerous other notable businesses are among those that lead the advanced packaging market.