先進パッケージングの世界市場：パッケージングタイプ別、用途別、予測（2024～2032年）

世界の先進パッケージングの市場規模は、主要な産業イベントでの企業発表の増加により、2024～2032年にかけてCAGR 10%以上の成長が予測されています。

これらのイベントは、先進材料、設計、製造プロセスなど、パッケージング技術における企業の最新イノベーションを紹介するプラットフォームとして機能します。

例えば、2024年2月、ASAP（Application Specific Advanced Packaging）サービスの大手プロバイダーであるSarcina Technologyは、Chiplet SummitでWIPOサービスを紹介すると発表しました。WIPOは、パッケージング、検査、生産プロセスを合理化し、ハードウェア専門チームの維持に伴うコストを削減します。ウエハーバンピング、パッケージ設計、チップ組立、最終テストなど、さまざまな段階を網羅するWIPOは、半導体産業で台頭しつつあるASAP（Application Specific Advanced Package）サービスの礎石となりました。

持続可能性、効率性、製品保護に焦点を当てたこれらのイノベーションは、飲食品、ヘルスケア、エレクトロニクスなど様々な分野の進化するニーズに対応しています。企業が競争市場で優位に立とうとする中、先進パッケージングソリューションへの需要は高まり続け、市場の成長と技術革新を促進しています。

2024～2032年にかけて、組み込みダイ分野は大きな発展を遂げると思われます。組み込みダイパッケージングは、半導体チップを基板やパッケージに直接組み込むもので、さまざまな用途向けにコンパクトで高性能なソリューションを提供します。スマートフォン、IoT機器、車載電子機器の普及に伴い、小型で効率的な部品を必要とする組み込みダイパッケージングが重要なソリューションとして浮上しています。その利点には、性能の向上、実装面積の縮小、熱管理の強化などがあります。産産業が電子機器内のスペースと機能の最適化を模索する中、組み込みダイパッケージングソリューションの需要は拡大し続けており、市場の拡大と技術革新の原動力となっています。

ヘルスケア分野の先進パッケージング市場規模は、2024～2032年にかけて顕著なCAGRを記録します。医療機器の複雑化・小型化に伴い、先進パッケージング技術は信頼性、小型化、性能の確保において重要な役割を果たします。先進パッケージングソリューションは、埋め込み型機器、診断機器、ドラッグデリバリーシステムなど、さまざまなヘルスケア用途のニーズに対応しています。医療用エレクトロニクスの精度と信頼性が重視される中、先進パッケージングへの需要は高まり続けており、ヘルスケア産業の進化するニーズに対応するための技術革新と市場成長が促進されています。

欧州の先進パッケージング産業は、2024～2032年にかけて顕著なCAGRを示すと思われます。自動車、ヘルスケア、エレクトロニクスなど多様な産業が先進パッケージングソリューションを求めており、欧州は有利な市場機会を提供しています。同地域では持続可能性と効率性が重視されており、スペースの最適化、性能の向上、環境負荷の低減を実現する先進パッケージング技術への需要がさらに高まっています。

欧州の産業が技術革新を優先し続ける中、先進パッケージングソリューションへの需要は引き続き旺盛で、市場の成長と開拓を後押ししています。例えば、2023年12月、Amkor Technology社はアリゾナ州ピオリアに最先端のパッケージングと検査施設の建設を計画し、約20億米ドルを投資し、完成時には約2,000人の従業員を雇用する予定です。米国最大の先進パッケージング外注施設となる見込みのAmkorは、米国の半導体サプライチェーンを強化することを目指しています。

目次

第1章 調査手法と調査範囲

第2章 エグゼクティブサマリー

第3章 先進パッケージングの産業考察

• ロシア・ウクライナ戦争の影響
• エコシステム分析
• ベンダーマトリックス
• 利益率分析
• 技術・イノベーションの展望
• 特許分析
• 主要ニュース・イニシアチブ
  • パートナーシップ/コラボレーション
  • 合併/買収
  • 投資
  • パッケージングタイプ上市・イノベーション
• 規制状況
• 影響要因
  • 促進要因
    • 家電における高度で小型化された半導体部品への需要の高まり
    • 5G技術の普及
    • 車載エレクトロニクスの複雑化
    • 世界のIoTとAI技術への動向の高まり
    • 2.5D/3D技術の発展
  • 産業の潜在的リスク・課題
    • 高コストと複雑性
    • 熱管理における課題
• 成長可能性分析
• ポーター分析
• PESTEL分析

第4章 競合情勢

• イントロダクション
• 各社の市場シェア
• 主要市場プレーヤーの競合分析
  • Amkor Technology
  • ASE Group
  • JCET Group Co., Ltd.
  • Powertech Technology Inc.
  • Taiwan Semiconductor Manufacturing Company Limited
  • TongFu Microelectronics Co., Ltd.
  • UTAC
• 競合のポジショニングマトリックス
• 戦略展望マトリックス

第5章 先進パッケージングの市場推計・予測：パッケージングタイプ別、2018～2032年

• 主要動向：パッケージングタイプ別
• フリップチップ
• ファンインWLP
• 組み込みダイ
• ファンアウト
• 2.5D/3D

第6章 先進パッケージングの市場推計・予測：用途別、2018～2032年

• 主要動向：用途別
• 家電
• 自動車
• 産業用
• ヘルスケア
• 航空宇宙・防衛
• その他

第7章 先進パッケージングの市場推計・予測：地域別、2018～2032年

• 主要動向：地域別
• 北米
  • 米国
  • カナダ
• 欧州
  • 英国
  • ドイツ
  • フランス
  • イタリア
  • スペイン
  • その他の欧州
• アジア太平洋
  • 中国
  • インド
  • 日本
  • 韓国
  • ニュージーランド
  • その他のアジア太平洋
• ラテンアメリカ
  • ブラジル
  • メキシコ
  • その他のラテンアメリカ
• 中東・アフリカ
  • サウジアラビア
  • アラブ首長国連邦
  • 南アフリカ
  • その他の中東・アフリカ

第8章 企業プロファイル

• Amkor Technology
• ASE Group
• Brewer Science, Inc.
• China Wafer Level CSP Co., Ltd.
• Chipbond Technology Corporation
• ChipMOS Technologies Inc.
• Deca Technologies
• Greatek Electronics Inc.
• JCET Group Co., Ltd.
• Powertech Technology Inc.
• Sanmina Corporation
• SFA Semicon
• Siliconware Precision Industries Co., Ltd.
• Taiwan Semiconductor Manufacturing Company Limited (TSMC)
• Tongfu Mikcroelectronics Co. Ltd.
• UTAC

Data Tables

• TABLE 1 Global advanced packaging market 360 degree synopsis, 2018-2032
• TABLE 2 Advanced packaging market, 2018 - 2023, (USD Million)
• TABLE 3 Advanced packaging market, 2024 - 2032, (USD Million)
• TABLE 4 Advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 5 Advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 6 Advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 7 Advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 8 Vendor matrix
• TABLE 9 Patent analysis
• TABLE 10 Industry impact forecast
• TABLE 11 Company market share, 2023
• TABLE 12 Competitive analysis of major market players, 2023
• TABLE 13 Flip-chip market, 2018 - 2023 (USD Million)
• TABLE 14 Flip-chip market, 2024 - 2032 (USD Million)
• TABLE 15 Fan-in WLP market, 2018 - 2023 (USD Million)
• TABLE 16 Fan-in WLP market, 2024 - 2032 (USD Million)
• TABLE 17 Embedded-die market, 2018 - 2023 (USD Million)
• TABLE 18 Embedded-die market, 2024 - 2032 (USD Million)
• TABLE 19 Fan-out market, 2018 - 2023 (USD Million)
• TABLE 20 Fan-out market, 2024 - 2032 (USD Million)
• TABLE 21 2.5D/3D market, 2018 - 2023 (USD Million)
• TABLE 22 2.5D/3D market, 2024 - 2032 (USD Million)
• TABLE 23 Consumer electronics market, 2018 - 2023 (USD Million)
• TABLE 24 Consumer electronics market, 2024 - 2032 (USD Million)
• TABLE 25 Automotive market, 2018 - 2023 (USD Million)
• TABLE 26 Automotive market, 2024 - 2032 (USD Million)
• TABLE 27 Industrial market, 2018 - 2023 (USD Million)
• TABLE 28 Industrial market, 2024 - 2032 (USD Million)
• TABLE 29 Healthcare market, 2018 - 2023 (USD Million)
• TABLE 30 Healthcare market, 2024 - 2032 (USD Million)
• TABLE 31 Aerospace & defense market, 2018 - 2023 (USD Million)
• TABLE 32 Aerospace & defense market, 2024 - 2032 (USD Million)
• TABLE 33 Others market, 2018 - 2023 (USD Million)
• TABLE 34 Others market, 2024 - 2032 (USD Million)
• TABLE 35 North America advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 36 North America advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 37 North America advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 38 North America advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 39 North America advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 40 North America advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 41 U.S. advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 42 U.S. advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 43 U.S. advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 44 U.S. advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 45 U.S. advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 46 U.S. advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 47 Canada advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 48 Canada advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 49 Canada advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 50 Canada advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 51 Canada advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 52 Canada advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 53 Europe advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 54 Europe advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 55 Europe advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 56 Europe advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 57 Europe advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 58 Europe advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 59 UK advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 60 UK advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 61 UK advanced packaging market, by packaging type 2018 - 2023 (USD Million)
• TABLE 62 UK advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 63 UK advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 64 UK advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 65 Germany advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 66 Germany advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 67 Germany advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 68 Germany advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 69 Germany advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 70 Germany advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 71 France advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 72 France advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 73 France advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 74 France advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 75 France advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 76 France advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 77 Italy advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 78 Italy advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 79 Italy advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 80 Italy advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 81 Italy advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 82 Italy advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 83 Spain advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 84 Spain advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 85 Spain advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 86 Spain advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 87 Spain advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 88 Spain advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 89 Rest of Europe advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 90 Rest of Europe advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 91 Rest of Europe advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 92 Rest of Europe advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 93 Rest of Europe advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 94 Rest of Europe advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 95 Asia Pacific advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 96 Asia Pacific advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 97 Asia Pacific advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 98 Asia Pacific advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 99 Asia Pacific advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 100 Asia Pacific advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 101 China advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 102 China advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 103 China advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 104 China advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 105 China advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 106 China advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 107 India advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 108 India advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 109 India advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 110 India advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 111 India advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 112 India advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 113 Japan advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 114 Japan advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 115 Japan advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 116 Japan advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 117 Japan advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 118 Japan advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 119 South Korea advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 120 South Korea advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 121 South Korea advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 122 South Korea advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 123 South Korea advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 124 South Korea advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 125 ANZ advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 126 ANZ advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 127 ANZ advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 128 ANZ advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 129 ANZ advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 130 ANZ advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 131 Rest of Asia Pacific advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 132 Rest of Asia Pacific advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 133 Rest of Asia Pacific advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 134 Rest of Asia Pacific advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 135 Rest of Asia Pacific advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 136 Rest of Asia Pacific advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 137 Latin America advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 138 Latin America advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 139 Latin America advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 140 Latin America advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 141 Latin America advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 142 Latin America advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 143 Brazil advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 144 Brazil advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 145 Brazil advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 146 Brazil advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 147 Brazil advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 148 Brazil advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 149 Mexico advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 150 Mexico advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 151 Mexico advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 152 Mexico advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 153 Mexico advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 154 Mexico advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 155 Rest of Latin America advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 156 Rest of Latin America advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 157 Rest of Latin America advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 158 Rest of Latin America advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 159 Rest of Latin America advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 160 Rest of Latin America advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 161 MEA advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 162 MEA advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 163 MEA advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 164 MEA advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 165 MEA advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 166 MEA advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 167 Saudi Arabia advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 168 Saudi Arabia advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 169 Saudi Arabia advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 170 Saudi Arabia advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 171 Saudi Arabia advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 172 Saudi Arabia advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 173 UAE advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 174 UAE advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 175 UAE advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 176 UAE advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 177 UAE advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 178 UAE advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 179 South Africa advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 180 South Africa Advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 181 South Africa Advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 182 South Africa advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 183 South Africa advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 184 South Africa advanced packaging market, by application, 2024 - 2032 (USD Million)
• TABLE 185 Rest of MEA advanced packaging market, 2018 - 2023 (USD Million)
• TABLE 186 Rest of MEA advanced packaging market, 2024 - 2032 (USD Million)
• TABLE 187 Rest of MEA advanced packaging market, by packaging type, 2018 - 2023 (USD Million)
• TABLE 188 Rest of MEA advanced packaging market, by packaging type, 2024 - 2032 (USD Million)
• TABLE 189 Rest of MEA advanced packaging market, by application, 2018 - 2023 (USD Million)
• TABLE 190 Rest of MEA advanced packaging market, by application, 2024 - 2032 (USD Million)

Charts & Figures

• FIG 1 GMI's report coverage in the global advanced packaging market
• FIG 2 Industry segmentation
• FIG 3 Forecast calculation
• FIG 4 Profile break-up of primary respondents
• FIG 5 Advanced packaging market 360 degree synopsis, 2018 - 2032
• FIG 6 Advanced packaging market ecosystem analysis
• FIG 7 Profit margin analysis
• FIG 8 Growth potential analysis
• FIG 9 Porter's analysis
• FIG 10 PESTEL analysis
• FIG 11 Competitive analysis of major market players, 2023
• FIG 12 Competitive positioning matrix
• FIG 13 Strategic outlook matrix
• FIG 14 Advanced packaging market, by packaging type, 2023 & 2032
• FIG 15 Advanced packaging market, by application, 2023 & 2032
• FIG 16 SWOT Analysis, Amkor Technology
• FIG 17 SWOT Analysis, ASE Group
• FIG 18 SWOT Analysis, Brewer Science, Inc.
• FIG 19 SWOT Analysis, China Wafer Level CSP Co., Ltd.
• FIG 20 SWOT Analysis, Chipbond Technology Corporation
• FIG 21 SWOT Analysis, ChipMOS Technologies Inc.
• FIG 22 SWOT Analysis, Deca Technologies
• FIG 23 SWOT Analysis, Greatek Electronics Inc.
• FIG 24 SWOT Analysis, JCET Group Co., Ltd.
• FIG 25 SWOT Analysis, Powertech Technology Inc.
• FIG 26 SWOT Analysis, Sanmina Corporation
• FIG 27 SWOT Analysis, SFA Semicon
• FIG 28 SWOT Analysis, Siliconware Precision Industries Co., Ltd.
• FIG 29 SWOT Analysis, Taiwan Semiconductor Manufacturing Company Limited (TSMC)
• FIG 30 SWOT Analysis, Tongfu Mikcroelectronics Co. Ltd.
• FIG 31 SWOT Analysis, UTAC

Global Advanced Packaging Market will witness over 10% CAGR between 2024 and 2032 as a result of rising company launches at leading industry events. These events serve as platforms for companies to showcase their latest innovations in packaging technology, including advanced materials, designs, and manufacturing processes.

For instance, in February 2024, Sarcina Technology, a leading provider of Application Specific Advanced Packaging (ASAP) Services, announced that it is set to introduce its WIPO service at the Chiplet Summit. WIPO, or wafer-in, product-out, streamlined packaging, testing, and production processes, reducing costs associated with maintaining dedicated hardware teams. WIPO encompassed various stages, including wafer bumping, package design, chip assembly, and final test, serving as the cornerstone for the emerging Application Specific Advanced Package (ASAP) Service in the semiconductor industry.

With a focus on sustainability, efficiency, and product protection, these innovations cater to the evolving needs of various sectors, such as food and beverage, healthcare, and electronics. As companies vie to stay ahead in a competitive market, the demand for advanced packaging solutions continues to rise, driving market growth and innovation.

The overall Advanced Packaging Market share is classified based on the packaging type, healthcare, and region.

Embedded-die segment will undergo significant development from 2024 to 2032. Embedded-die packaging integrates semiconductor chips directly into substrates or packages, offering compact, high-performance solutions for various applications. With the proliferation of smartphones, IoT devices, and automotive electronics requiring miniaturized and efficient components, embedded-die packaging emerges as a key solution. Its advantages include improved performance, reduced footprint, and enhanced thermal management. As industries seek to optimize space and functionality in electronic devices, the demand for embedded-die packaging solutions continues to grow, driving market expansion and innovation.

Advanced packaging market size from the healthcare segment will register a noteworthy CAGR from 2024 to 2032. As medical devices become more complex and compact, advanced packaging technologies play a crucial role in ensuring reliability, miniaturization, and performance. Advanced packaging solutions cater to the needs of various healthcare applications, including implantable devices, diagnostic equipment, and drug delivery systems. With a focus on precision and reliability in medical electronics, the demand for advanced packaging continues to rise, driving innovation and market growth to meet the evolving needs of the healthcare industry.

Europe advanced packaging industry will showcase a commendable CAGR from 2024 to 2032. With a diverse range of industries, including automotive, healthcare, and electronics, seeking advanced packaging solutions, Europe presents a lucrative market opportunity. The region's emphasis on sustainability and efficiency further fuels demand for advanced packaging technologies that optimize space, enhance performance and reduce environmental impact.

As European industries continue to prioritize innovation, the demand for advanced packaging solutions remains strong, driving market growth and development. For instance, in December 2023, Amkor Technology planned to build a cutting-edge packaging and testing facility in Peoria, Arizona, investing approximately US$2 billion and hiring about 2,000 employees upon completion. Expected to be the largest outsourced advanced packaging facility in the US, Amkor aimed to enhance America's semiconductor supply chain.

Table of Contents

Chapter 1 Methodology & Scope

• 1.1 Market scope & definition
• 1.2 Base estimates & calculations
• 1.3 Forecast calculation
• 1.4 Data sources
  • 1.4.1 Primary
  • 1.4.2 Secondary
    • 1.4.2.1 Paid sources
    • 1.4.2.2 Public sources

Chapter 2 Executive Summary

• 2.1 Advanced packaging market 360 degree synopsis, 2018 - 2032
• 2.2 Business trends
• 2.3 Regional trends
• 2.4 Packaging type trends
• 2.5 Application trends

Chapter 3 Advanced Packaging Industry Insights

• 3.1 Impact of the Russia-Ukraine war
• 3.2 Industry ecosystem analysis
• 3.3 Vendor matrix
• 3.4 Profit margin analysis
• 3.5 Technology & innovation landscape
• 3.6 Patent analysis
• 3.7 Key news and initiatives
  • 3.7.1 Partnership/Collaboration
  • 3.7.2 Merger/Acquisition
  • 3.7.3 Investment
  • 3.7.4 Packaging type launch & innovation
• 3.8 Regulatory landscape
• 3.9 Impact forces
  • 3.9.1 Growth drivers
    • 3.9.1.1 Rising demand for advanced and miniaturized semiconductor components in consumer electronics
    • 3.9.1.2. Penetration of 5G technology
    • 3.9.1.3 Increasing complexities of automotive electronics
    • 3.9.1.4 Increasing trend toward IoT and AI technology around the globe
    • 3.9.1.5. Development of 2.5 D/3 D technology
  • 3.9.2 Industry pitfalls & challenges
    • 3.9.2.1 High cost and complexity
    • 3.9.2.2 Challenges in thermal management
• 3.10 Growth potential analysis
• 3.11 Porter's analysis
• 3.12 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

• 4.1 Introduction
• 4.2 Company market share, 2023
• 4.3 Competitive analysis of major market players, 2023
  • 4.3.1 Amkor Technology
  • 4.3.2 ASE Group
  • 4.3.3 JCET Group Co., Ltd.
  • 4.3.4 Powertech Technology Inc.
  • 4.3.5 Taiwan Semiconductor Manufacturing Company Limited
  • 4.3.6 TongFu Microelectronics Co., Ltd.
  • 4.3.7 UTAC
• 4.4 Competitive positioning matrix, 2023
• 4.5 Strategic outlook matrix, 2023

Chapter 5 Advanced Packaging Market Estimates & Forecast, By Packaging Type, 2018 - 2032 (USD Million)

• 5.1 Key trends, by packaging type
• 5.2 Flip-chip
• 5.3 Fan-in WLP
• 5.4 Embedded-die
• 5.5 Fan-out
• 5.6 2.5D/3D

Chapter 6 Advanced Packaging Market Estimates & Forecast, By Application, 2018 - 2032 (USD Million)

• 6.1 Key trends, by application
• 6.2 Consumer electronics
• 6.3 Automotive
• 6.4 Industrial
• 6.5 Healthcare
• 6.6 Aerospace & defense
• 6.7 Others

Chapter 7 Advanced Packaging Market Estimates & Forecast, By Region, 2018 - 2032 (USD Million)

• 7.1 Key trends, by region
• 7.2 North America
  • 7.2.1 U.S.
  • 7.2.2 Canada
• 7.3 Europe
  • 7.3.1 UK
  • 7.3.2 Germany
  • 7.3.3 France
  • 7.3.4 Italy
  • 7.3.5 Spain
  • 7.3.6 Rest of Europe
• 7.4 Asia Pacific
  • 7.4.1 China
  • 7.4.2 India
  • 7.4.3 Japan
  • 7.4.4 South Korea
  • 7.4.5 ANZ
  • 7.4.6 Rest of Asia Pacific
• 7.5 Latin America
  • 7.5.1 Brazil
  • 7.5.2 Mexico
  • 7.5.3 Rest of Latin America
• 7.6 MEA
  • 7.6.1 Saudi Arabia
  • 7.6.2 UAE
  • 7.6.3 South Africa
  • 7.6.4 Rest of MEA

Chapter 8 Company Profiles (Business Overview, Financial Overview, Packaging type Landscape, Strategic Outlook, SWOT Analysis)

• 8.1 Amkor Technology
• 8.2 ASE Group
• 8.3 Brewer Science, Inc.
• 8.4 China Wafer Level CSP Co., Ltd.
• 8.5 Chipbond Technology Corporation
• 8.6 ChipMOS Technologies Inc.
• 8.7 Deca Technologies
• 8.8 Greatek Electronics Inc.
• 8.9 JCET Group Co., Ltd.
• 8.10 Powertech Technology Inc.
• 8.11 Sanmina Corporation
• 8.12 SFA Semicon
• 8.13 Siliconware Precision Industries Co., Ltd.
• 8.14 Taiwan Semiconductor Manufacturing Company Limited (TSMC)
• 8.15 Tongfu Mikcroelectronics Co. Ltd.
• 8.16 UTAC