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成形相互接続装置（MID）の世界市場レポート2025年

Molded Interconnect Device (MID) Global Market Report 2025

出版日
ページ情報
英文 250 Pages
納期
2～10営業日
カスタマイズ可能
適宜更新あり
成形相互接続装置（MID）の世界市場レポート2025年
出版日: 2025年08月29日
発行: The Business Research Company
ページ情報: 英文 250 Pages
納期: 2～10営業日
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概要

成形相互接続装置（MID）の市場規模は、今後数年で急成長が見込まれます。2029年にはCAGR15.4％で35億5,000万米ドルに成長します。予測期間の成長は、コンシューマーエレクトロニクスの継続的な進化、医療機器統合の増加、自動車エレクトロニクスの成長、迅速なプロトタイピングと製造革新に起因しています。予測期間の主な動向には、規制遵守と品質基準、カスタマイズと設計の柔軟性、ラピッドプロトタイピングと製造技術、持続可能性と材料の革新、インダストリー4.0とスマート製造が含まれます。

今後5年間の成長率15.4%という予測は、この市場の前回予測から0.7%の小幅な減少を反映しています。この減少は主に米国と他国との間の関税の影響によるものです。これは、ドイツや日本から大量に輸入される3D回路部品の入手が制限され、高度な自動車用センサーや医療機器の生産が中断されることを通じて、米国に直接影響を及ぼす可能性が高いです。また、相互関税や、貿易緊張の高まりと制限による世界経済と貿易への悪影響により、その影響はより広範囲に及ぶと思われます。

IoTデバイスに対する需要の高まりは、成形相互接続デバイス市場の成長を牽引する構えです。IoTデバイスには、インターネットに接続され、デバイスやシステム間でデータをやり取りする多数の物理的アイテムが含まれます。この急増は、主に半導体・エレクトロニクス業界における、より高い計算速度、効率性、低消費電力デバイス、インテリジェントチップセットへの需要に後押しされています。2022年8月にTechjuryがIoT Analyticsから得た情報をもとに報告したように、企業のIoTイニシアチブは、スマートシティ（23％）、コネクテッド・インダストリー（17％）、コネクテッド・ビルディング（12％）に特に重点を置いています。しかし、IoT関連データからの価値抽出は依然として97%の企業にとって課題であり、市場の潜在的な成長が浮き彫りになっています。

目次

第1章 エグゼクティブサマリー

第2章 市場の特徴

第3章 市場動向と戦略

第4章 市場：金利、インフレ、地政学、貿易戦争と関税、そしてコロナ禍と回復が市場に与える影響を含むマクロ経済シナリオ

第5章 世界の成長分析と戦略分析フレームワーク

  • 世界の成形相互接続装置（MID）：PESTEL分析（政治、社会、技術、環境、法的要因、促進要因と抑制要因）
  • 最終用途産業の分析
  • 世界の成形相互接続装置（MID）市場：成長率分析
  • 世界の成形相互接続装置（MID）市場の実績：規模と成長, 2019-2024
  • 世界の成形相互接続装置（MID）市場の予測：規模と成長, 2024-2029, 2034F
  • 世界の成形相互接続装置（MID）：総潜在市場規模（TAM）

第6章 市場セグメンテーション

  • 世界の成形相互接続装置（MID）市場：製品別、実績と予測, 2019-2024, 2024-2029F, 2034F
  • アンテナおよび接続モジュール
  • コネクタとスイッチ
  • センサー
  • ライティング
  • 世界の成形相互接続装置（MID）市場：プロセス別、実績と予測, 2019-2024, 2024-2029F, 2034F
  • レーザーダイレクトストラクチャリング（LDS）
  • 2ショット成形
  • その他のプロセス
  • 世界の成形相互接続装置（MID）市場：用途別、実績と予測, 2019-2024, 2024-2029F, 2034F
  • 自動車
  • 消費財
  • ヘルスケア
  • 産業
  • 軍事および航空宇宙
  • 通信とコンピューティング
  • 世界の成形相互接続装置（MID）市場、アンテナおよび接続モジュール、タイプ別サブセグメンテーション：実績と予測, 2019-2024, 2024-2029F, 2034F
  • 統合アンテナ
  • RFモジュール
  • 世界の成形相互接続装置（MID）市場、コネクタとスイッチ、タイプ別サブセグメンテーション：実績と予測, 2019-2024, 2024-2029F, 2034F
  • 電気コネクタ
  • メカニカルスイッチ
  • 世界の成形相互接続装置（MID）市場、センサー、タイプ別サブセグメンテーション：実績と予測, 2019-2024, 2024-2029F, 2034F
  • 温度センサー
  • 圧力センサー
  • 近接センサー
  • 世界の成形相互接続装置（MID）市場、照明、タイプ別サブセグメンテーション：実績と予測, 2019-2024, 2024-2029F, 2034F
  • LED照明モジュール
  • 装飾照明ソリューション

第7章 地域別・国別分析

  • 世界の成形相互接続装置（MID）市場：地域別、実績と予測, 2019-2024, 2024-2029F, 2034F
  • 世界の成形相互接続装置（MID）市場：国別、実績と予測, 2019-2024, 2024-2029F, 2034F

第8章 アジア太平洋市場

第9章 中国市場

第10章 インド市場

第11章 日本市場

第12章 オーストラリア市場

第13章 インドネシア市場

第14章 韓国市場

第15章 西欧市場

第16章 英国市場

第17章 ドイツ市場

第18章 フランス市場

第19章 イタリア市場

第20章 スペイン市場

第21章 東欧市場

第22章 ロシア市場

第23章 北米市場

第24章 米国市場

第25章 カナダ市場

第26章 南米市場

第27章 ブラジル市場

第28章 中東市場

第29章 アフリカ市場

第30章 競合情勢と企業プロファイル

  • 成形相互接続装置（MID）市場：競合情勢
  • 成形相互接続装置（MID）市場：企業プロファイル
    • Molex LLC Overview, Products and Services, Strategy and Financial Analysis
    • TE Connectivity Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • Amphenol Corporation Overview, Products and Services, Strategy and Financial Analysis
    • LPKF Laser & Electronics AG Overview, Products and Services, Strategy and Financial Analysis
    • 2E mechatronic GmbH & Co. KG Overview, Products and Services, Strategy and Financial Analysis

第31章 その他の大手企業と革新的企業

  • Harting Technologiegruppe
  • Arlington Plating Company
  • MID Solutions LLC
  • MacDermid Inc.
  • JOHNAN Corporation
  • TactoTek Oy
  • Axon'Cable S.A.S
  • S2P Solutions
  • Suzhou Cicor Technology Co. Ltd
  • Chogori Technology Co. Ltd.
  • Mitsubishi Engineering-Plastics Corporation
  • Galtronics Corporation Ltd.
  • RTP Company
  • BASF SE
  • EMS-Chemie Holding AG

第32章 世界の市場競合ベンチマーキングとダッシュボード

第33章 主要な合併と買収

第34章 最近の市場動向

第35章 市場の潜在力が高い国、セグメント、戦略

  • 成形相互接続装置（MID）市場2029：新たな機会を提供する国
  • 成形相互接続装置（MID）市場2029：新たな機会を提供するセグメント
  • 成形相互接続装置（MID）市場2029：成長戦略
    • 市場動向に基づく戦略
    • 競合の戦略

第36章 付録

目次
Product Code: r22792u

Molded Interconnect Devices (MIDs) represent sophisticated electromechanical components integrating mechanical and electrical engineering principles in three dimensions. They amalgamate traditional product interfaces-circuit boards, housing, connectors, and wiring-into a singular, compact, and fully functional unit. MIDs typify a production method utilizing selectively plated plastic pieces.

The primary processes employed in Molded Interconnect Devices encompass Laser Direct Structuring (LDS), Two-Shot Molding, and other relevant techniques. Laser Direct Structuring stands out as an environmentally friendly, precise, and pioneering manufacturing method for three-dimensional molded connector devices. These products include antenna and connectivity modules, connectors and switches, sensors, lighting, and other relevant items. Applications span across automotive, consumer products, healthcare, industrial, military and aerospace, as well as telecommunication and computing sectors.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

The sharp escalation of U.S. tariffs and resulting trade tensions in spring 2025 are significantly affecting the electrical and electronics sector. Key components such as semiconductors, display panels, and rare-earth metals crucial for batteries and motors are now facing heavy duties. Consumer electronics companies are seeing profit margins shrink, as fierce competition makes it difficult to pass on rising costs to consumers. At the same time, industrial electronics firms are experiencing project delays due to shortages of tariff-impacted parts like printed circuit boards. In response, businesses are shifting assembly operations to tariff-exempt nations, building up inventory reserves, and redesigning products to reduce reliance on restricted materials.

The molded interconnected device market research report is one of a series of new reports from The Business Research Company that provides molded interconnected device market statistics, including molded interconnected device industry global market size, regional shares, competitors with a molded interconnected device market share, detailed molded interconnected device market segments, market trends and opportunities, and any further data you may need to thrive in the molded interconnected device industry. This molded interconnected device market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The molded interconnect device (mid) market size has grown rapidly in recent years. It will grow from $1.75 billion in 2024 to $2 billion in 2025 at a compound annual growth rate (CAGR) of 14.4%. The growth in the historic period can be attributed to miniaturization trends, consumer electronics evolution, automotive electronics development, medical device innovations, shift towards smart manufacturing.

The molded interconnect device (mid) market size is expected to see rapid growth in the next few years. It will grow to $3.55 billion in 2029 at a compound annual growth rate (CAGR) of 15.4%. The growth in the forecast period can be attributed to ongoing evolution of consumer electronics, rise in medical device integration, automotive electronics growth, rapid prototyping and manufacturing innovations. Major trends in the forecast period include regulatory compliance and quality standards, customization and design flexibility, rapid prototyping and manufacturing technologies, sustainability and material innovations, industry 4.0 and smart manufacturing.

The forecast of 15.4% growth over the next five years reflects a modest reduction of 0.7% from the previous estimate for this market. This reduction is primarily due to the impact of tariffs between the US and other countries. This is likely to directly affect the US through constrained availability of 3D circuitry components, heavily imported from Germany and Japan, disrupting production of advanced automotive sensors and medical devices. The effect will also be felt more widely due to reciprocal tariffs and the negative effect on the global economy and trade due to increased trade tensions and restrictions.

The rising demand for IoT devices is poised to drive the growth of the molded interconnect devices market. IoT devices encompass a multitude of physical items connected to the internet, exchanging data across devices and systems. This surge is fueled by the demand for higher computational speed, efficiency, low-power devices, and intelligent chipsets, primarily within the semiconductor & electronics industry. As reported in August 2022 by Techjury sourced from IoT Analytics, corporate IoT initiatives focused notably on Smart City (23%), Connected Industry (17%), and Connected Building (12%). However, the extraction of value from IoT-related data remains a challenge for 97% of firms, underscoring the market's potential growth.

The burgeoning demand within the aerospace industry is expected to propel the growth of the molded interconnect devices market. Molded interconnect devices offer significant advantages such as space savings, weight reduction, reliability, thermal management, manufacturing efficiency, and design flexibility, aligning well with diverse aerospace applications. For instance, as reported in August 2023 by Cadrex, the aerospace industry recorded revenue of $741 billion in 2022, marking a 3% increase from the previous year. This industry's expanding requirements are a key driver stimulating growth within the molded interconnect devices market.

Technological advancement is a prominent trend gaining traction in the molded interconnect device market. Leading companies in this sector are focusing on developing innovative technological solutions that can adapt to various applications, which has spurred the evolution of technologies like laser plastic welding. For example, in April 2022, SABIC, a Saudi Arabia-based chemical company known for producing chemicals, plastics, agri-nutrients, and metals, introduced the LNP THERMOCOMP OFC08V compound. This high-performance solution is tailored for 5G base station dipole antennas and other electrical and electronic applications. The compound is a glass fiber-reinforced material derived from polyphenylene sulfide (PPS) resin, specifically designed to facilitate lightweight and cost-effective all-plastic antenna designs. It exhibits excellent performance in laser direct structuring (LDS) plating, ensuring strong adhesion between layers, effective warpage control, and reliable dielectric and radio frequency (RF) characteristics.

Major companies operating in the molded interconnect device market are focusing on pioneering products such as light antennas to bolster market revenues. Light antennas represent a breakthrough in wireless communications, being smaller than a US dime and pivotal in enabling widespread LiFi (Light Fidelity) usage in smartphones and connected devices. As unveiled in February 2023 by pureLiFi Limited, the LiFi Light Antenna is engineered for seamless integration, optimizing performance, size, cost, and production needs. Leveraging the light spectrum, LiFi surpasses conventional technologies like WiFi and 5G in speed, reliability, and security, offering scalability for widespread adoption in smartphones and connected devices.

In September 2022, Tide Rock Holdings completed the acquisition of Plastic Molding Technology (PMT), a strategic move that expands their service capabilities across multiple sites. This acquisition brings onboard a highly skilled team and 95 molding machines ranging from 20 to 500 tons, positioning Tide Rock Holdings to cater to a broader client base in plastic injection and inserts molding. Plastic Molding Technology is renowned in the industry for its expertise and strategic site locations.

Major companies operating in the molded interconnect device (MID) market are Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd, Chogori Technology Co. Ltd., Mitsubishi Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company, BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, Yomura Technologies Inc., T-Ink Inc., ODU GmbH & Co. KG

Asia-Pacific was the largest region in the molded interconnect device (MID) market share in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the molded interconnect device (mid) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the molded interconnect device (mid) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The molded interconnect device market consists of sales of metal spraying and film techniques. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Molded Interconnect Device (MID) Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on molded interconnect device (mid) market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for molded interconnect device (mid) ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The molded interconnect device (mid) market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

  • Markets Covered:1) By Product: Antenna And Connectivity Modules; Connectors And Switches; Sensors; Lighting
  • 2) By Process: Laser Direct Structuring (LDS); Two-Shot Molding; Other Processes
  • 3) By Application: Automotive; Consumer Products; Healthcare; Industrial; Military And Aerospace; Telecommunication And Computing
  • Subsegments:
  • 1) By Antenna And Connectivity Modules: Integrated Antennas; RF Modules
  • 2) By Connectors And Switches: Electrical Connectors; Mechanical Switches
  • 3) By Sensors: Temperature Sensors; Pressure Sensors; Proximity Sensors
  • 4) By Lighting: LED Lighting Modules; Decorative Lighting Solutions
  • Companies Mentioned:Molex LLC; TE Connectivity Ltd.; Amphenol Corporation; LPKF Laser & Electronics AG; 2E mechatronic GmbH & Co. KG; Harting Technologiegruppe; Arlington Plating Company; MID Solutions LLC; MacDermid Inc.; JOHNAN Corporation; TactoTek Oy; Axon' Cable S.A.S; S2P Solutions; Suzhou Cicor Technology Co. Ltd; Chogori Technology Co. Ltd.; Mitsubishi Engineering-Plastics Corporation; Galtronics Corporation Ltd.; RTP Company; BASF SE; EMS-Chemie Holding AG; Ensinger GmbH; Zeon Corporation; SelectConnect Technologies; Multiple Dimensions AG; Cicor Group; Tesa SE; Yomura Technologies Inc.; T-Ink Inc.; ODU GmbH & Co. KG
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time Series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data Segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery Format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Molded Interconnect Device (MID) Market Characteristics

3. Molded Interconnect Device (MID) Market Trends And Strategies

4. Molded Interconnect Device (MID) Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Trade Wars and Tariffs, And Covid And Recovery On The Market

  • 4.1. Supply Chain Impact from Tariff War & Trade Protectionism

5. Global Molded Interconnect Device (MID) Growth Analysis And Strategic Analysis Framework

  • 5.1. Global Molded Interconnect Device (MID) PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
  • 5.2. Analysis Of End Use Industries
  • 5.3. Global Molded Interconnect Device (MID) Market Growth Rate Analysis
  • 5.4. Global Molded Interconnect Device (MID) Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
  • 5.5. Global Molded Interconnect Device (MID) Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
  • 5.6. Global Molded Interconnect Device (MID) Total Addressable Market (TAM)

6. Molded Interconnect Device (MID) Market Segmentation

  • 6.1. Global Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Antenna And Connectivity Modules
  • Connectors And Switches
  • Sensors
  • Lighting
  • 6.2. Global Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Laser Direct Structuring (LDS)
  • Two-Shot Molding
  • Other Processes
  • 6.3. Global Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Automotive
  • Consumer Products
  • Healthcare
  • Industrial
  • Military And Aerospace
  • Telecommunication And Computing
  • 6.4. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Antenna And Connectivity Modules, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Integrated Antennas
  • RF Modules
  • 6.5. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Connectors And Switches, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Electrical Connectors
  • Mechanical Switches
  • 6.6. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Sensors, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Temperature Sensors
  • Pressure Sensors
  • Proximity Sensors
  • 6.7. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Lighting, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • LED Lighting Modules
  • Decorative Lighting Solutions

7. Molded Interconnect Device (MID) Market Regional And Country Analysis

  • 7.1. Global Molded Interconnect Device (MID) Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 7.2. Global Molded Interconnect Device (MID) Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Molded Interconnect Device (MID) Market

  • 8.1. Asia-Pacific Molded Interconnect Device (MID) Market Overview
  • Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.3. Asia-Pacific Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.4. Asia-Pacific Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Molded Interconnect Device (MID) Market

  • 9.1. China Molded Interconnect Device (MID) Market Overview
  • 9.2. China Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.3. China Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.4. China Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Molded Interconnect Device (MID) Market

  • 10.1. India Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.2. India Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.3. India Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Molded Interconnect Device (MID) Market

  • 11.1. Japan Molded Interconnect Device (MID) Market Overview
  • 11.2. Japan Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.3. Japan Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.4. Japan Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Molded Interconnect Device (MID) Market

  • 12.1. Australia Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.2. Australia Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.3. Australia Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Molded Interconnect Device (MID) Market

  • 13.1. Indonesia Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.2. Indonesia Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.3. Indonesia Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Molded Interconnect Device (MID) Market

  • 14.1. South Korea Molded Interconnect Device (MID) Market Overview
  • 14.2. South Korea Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.3. South Korea Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.4. South Korea Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Molded Interconnect Device (MID) Market

  • 15.1. Western Europe Molded Interconnect Device (MID) Market Overview
  • 15.2. Western Europe Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.3. Western Europe Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.4. Western Europe Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Molded Interconnect Device (MID) Market

  • 16.1. UK Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.2. UK Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.3. UK Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Molded Interconnect Device (MID) Market

  • 17.1. Germany Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.2. Germany Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.3. Germany Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Molded Interconnect Device (MID) Market

  • 18.1. France Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.2. France Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.3. France Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Molded Interconnect Device (MID) Market

  • 19.1. Italy Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.2. Italy Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.3. Italy Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Molded Interconnect Device (MID) Market

  • 20.1. Spain Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.2. Spain Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.3. Spain Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Molded Interconnect Device (MID) Market

  • 21.1. Eastern Europe Molded Interconnect Device (MID) Market Overview
  • 21.2. Eastern Europe Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.3. Eastern Europe Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.4. Eastern Europe Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Molded Interconnect Device (MID) Market

  • 22.1. Russia Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.2. Russia Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.3. Russia Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Molded Interconnect Device (MID) Market

  • 23.1. North America Molded Interconnect Device (MID) Market Overview
  • 23.2. North America Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.3. North America Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.4. North America Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Molded Interconnect Device (MID) Market

  • 24.1. USA Molded Interconnect Device (MID) Market Overview
  • 24.2. USA Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.3. USA Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.4. USA Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Molded Interconnect Device (MID) Market

  • 25.1. Canada Molded Interconnect Device (MID) Market Overview
  • 25.2. Canada Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.3. Canada Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.4. Canada Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Molded Interconnect Device (MID) Market

  • 26.1. South America Molded Interconnect Device (MID) Market Overview
  • 26.2. South America Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.3. South America Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.4. South America Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Molded Interconnect Device (MID) Market

  • 27.1. Brazil Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.2. Brazil Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.3. Brazil Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Molded Interconnect Device (MID) Market

  • 28.1. Middle East Molded Interconnect Device (MID) Market Overview
  • 28.2. Middle East Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.3. Middle East Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.4. Middle East Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Molded Interconnect Device (MID) Market

  • 29.1. Africa Molded Interconnect Device (MID) Market Overview
  • 29.2. Africa Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.3. Africa Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.4. Africa Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Molded Interconnect Device (MID) Market Competitive Landscape And Company Profiles

  • 30.1. Molded Interconnect Device (MID) Market Competitive Landscape
  • 30.2. Molded Interconnect Device (MID) Market Company Profiles
    • 30.2.1. Molex LLC Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.2. TE Connectivity Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.3. Amphenol Corporation Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.4. LPKF Laser & Electronics AG Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.5. 2E mechatronic GmbH & Co. KG Overview, Products and Services, Strategy and Financial Analysis

31. Molded Interconnect Device (MID) Market Other Major And Innovative Companies

  • 31.1. Harting Technologiegruppe
  • 31.2. Arlington Plating Company
  • 31.3. MID Solutions LLC
  • 31.4. MacDermid Inc.
  • 31.5. JOHNAN Corporation
  • 31.6. TactoTek Oy
  • 31.7. Axon' Cable S.A.S
  • 31.8. S2P Solutions
  • 31.9. Suzhou Cicor Technology Co. Ltd
  • 31.10. Chogori Technology Co. Ltd.
  • 31.11. Mitsubishi Engineering-Plastics Corporation
  • 31.12. Galtronics Corporation Ltd.
  • 31.13. RTP Company
  • 31.14. BASF SE
  • 31.15. EMS-Chemie Holding AG

32. Global Molded Interconnect Device (MID) Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Molded Interconnect Device (MID) Market

34. Recent Developments In The Molded Interconnect Device (MID) Market

35. Molded Interconnect Device (MID) Market High Potential Countries, Segments and Strategies

  • 35.1 Molded Interconnect Device (MID) Market In 2029 - Countries Offering Most New Opportunities
  • 35.2 Molded Interconnect Device (MID) Market In 2029 - Segments Offering Most New Opportunities
  • 35.3 Molded Interconnect Device (MID) Market In 2029 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer