MID（成形回路部品）市場の2030年までの予測：製品タイプ別、プロセス別、エンドユーザー別、地域別の世界分析

Stratistics MRCによると、MID（成形回路部品）の世界市場は2023年に13億米ドルを占め、予測期間中のCAGRは14.4%で、2030年には35億米ドルに達する見込みです。

MIDは、射出成形されたプラスチック部品に電子部品を直接組み込むことで形成される3次元回路構造です。この技術により、機械的機能と電気的機能を1つの部品に統合した小型・軽量設計が可能になります。MIDは、効率的で省スペースの電子機器を作るために、自動車や家電など様々な産業で利用されています。

コネクテッドデバイスの需要拡大

モノのインターネット（IoT）などの動向に後押しされたコネクテッドデバイスへの需要の高まりは、MID市場の主要な促進要因です。MID技術は、電子部品を3次元構造にシームレスに統合することを可能にし、コンパクトで多機能なデバイスを実現します。自動車、ヘルスケア、コンシューマーエレクトロニクスなどの業界でスマートで相互接続された製品への需要が高まる中、機械的機能と電気的機能を効率的に組み合わせるMIDの能力は、こうした進化する市場ニーズに対応するための重要なソリューションとして位置づけられています。

高い初期投資コスト

特殊な機械や技術を含むMID生産のためのインフラを確立するには、かなりの財源が必要です。企業は、研究開発および生産セットアップのための資金配分に課題を抱えており、普及の妨げとなっています。資金的障壁は潜在的競合企業の市場参入を制限し、MID市場全体の成長を減速させる可能性があります。

製造技術の進歩

製造技術の進歩は、生産効率を高め、設計の可能性を広げることで、MID市場に大きなチャンスをもたらします。アディティブマニュファクチャリング、レーザー直接構造化（LDS）、3Dプリンティングなどの技術革新により、より複雑でカスタマイズされたMID設計が可能になります。これにより製造プロセスが合理化され、複雑な電子機能の統合が可能になります。その結果、MID市場はこうした進歩を活用して、より洗練されたコンパクトでコスト効率の高いソリューションを提供することができ、業界の成長を促進することができます。

原材料価格の変動

原材料価格の変動は、MID市場に大きな脅威をもたらします。MIDは電子部品と構造部品の両方に特殊な材料を使用しているため、これらの原材料価格の変動は製造コストと全体的な収益性に影響を及ぼしかねません。メーカーは競争力のある価格を維持する上で課題に直面する可能性があり、材料コストの不確実性はサプライチェーンを混乱させ、MID市場の安定と成長に影響を及ぼす可能性があります。

COVID-19の影響：

COVID-19の大流行は、世界のサプライチェーンを混乱させ、生産遅延を引き起こし、消費者の需要に影響を与えることで、MID市場に影響を与えています。ロックダウン、社会的遠ざけ策、経済の不確実性により、製造と流通に課題が生じています。さらに、優先順位のシフトや個人消費の減少が、さまざまな産業におけるMIDの導入に影響を与えています。リモートワークへの適応や消費者行動の変化も市場力学に影響を与えており、業界関係者の戦略的調整が必要となっています。

レーザー直接構造化（LDS）セグメントが予測期間中最大になる見込み

レーザ直接構造化（LDS）セグメントは、MID製造における高度な機能により、予測期間中に最大になると予測されています。LDS技術は、レーザービームを使用してモールド基板内の添加剤を選択的に活性化することで、精密で複雑な回路パターンを可能にします。この方法は高い柔軟性と設計の複雑さを提供するため、多様な用途でますます支持されるようになっています。高度な電子機器への需要と小型化傾向の高まりが、市場におけるLDSセグメントの優位性に寄与しています。

予測期間中にCAGRが最も高くなると予想されるセンサーセグメント

MID市場では、予測期間中にセンサーセグメントが最も高い成長率を示すと予測されています。この急成長の背景には、産業界全体でコンパクトで統合されたセンサーソリューションに対する需要が高まっていることがあります。3次元構造内にセンサーをシームレスに埋め込むMID技術の能力は、設計効率と機能性を向上させ、センサーアプリケーションにおけるMIDの採用拡大を促進し、同分野の堅調な成長に寄与しています。

最大のシェアを占める地域

北米がMID市場をリードする構えで、予測期間中最大のシェアを誇っています。この優位性は、堅調なエレクトロニクス産業、技術革新、自動車、ヘルスケア、通信などの分野での広範な採用によるものです。良好な経済状況、確立された製造インフラ、先端技術への積極的な取り組みが、この地域の優位性に寄与しています。コンパクトで多機能な電子ソリューションへの継続的な需要が、北米のMID市場の成長をさらに後押ししています。

CAGRが最も高い地域：

アジア太平洋地域は、エレクトロニクス製造部門の急成長、先端技術の採用拡大、コンシューマーエレクトロニクス市場の拡大により、MID市場の急成長が見込まれています。同地域は、強固なサプライチェーン、コスト効率の高い製造能力、コンパクトで統合された電子ソリューションに対する需要の高まりといったメリットを享受しています。政府の支援策やイノベーションエコシステムの隆盛により、アジア太平洋地域はMIDアプリケーションの中心地となりつつあり、市場の急速な拡大が見込まれています。

無料カスタマイズサービス：

本レポートをご購読のお客様には、以下の無料カスタマイズオプションのいずれかを提供いたします：

• 企業プロファイル
  • 追加市場プレイヤーの包括的プロファイリング（3社まで）
  • 主要企業のSWOT分析（3社まで）
• 地域セグメンテーション
  • 顧客の関心に応じた主要国の市場推計・予測・CAGR（注：フィージビリティチェックによる）
• 競合ベンチマーキング
  • 製品ポートフォリオ、地理的プレゼンス、戦略的提携に基づく主要企業のベンチマーキング

目次

第1章 エグゼクティブサマリー

第2章 序文

• 概要
• ステークホルダー
• 調査範囲
• 調査手法
  • データマイニング
  • データ分析
  • データ検証
  • 調査アプローチ
• 調査ソース
  • 1次調査ソース
  • 2次調査ソース
  • 前提条件

第3章 市場動向分析

• 促進要因
• 抑制要因
• 機会
• 脅威
• 製品分析
• エンドユーザー分析
• 新型コロナウイルス感染症（COVID-19）の影響

第4章 ポーターのファイブフォース分析

• 供給企業の交渉力
• 買い手の交渉力
• 代替品の脅威
• 新規参入業者の脅威
• 競争企業間の敵対関係

第5章 世界のMID市場：製品タイプ別

• アンテナ・接続モジュール
• コネクター・スイッチ
• 照明システム
• センサー
• その他

第6章 世界のMID市場：プロセス別

• レーザー直接構造化（LDS）
• フィルム技術
• ツーショット成形

第7章 世界のMID市場：エンドユーザー別

• 通信
• 自動車
• コンシューマーエレクトロニクス
• 産業
• 医療
• 軍事・航空宇宙
• その他

第8章 世界のMID市場：地域別

• 北米
  • 米国
  • カナダ
  • メキシコ
• 欧州
  • ドイツ
  • 英国
  • イタリア
  • フランス
  • スペイン
  • その他欧州
• アジア太平洋地域
  • 日本
  • 中国
  • インド
  • オーストラリア
  • ニュージーランド
  • 韓国
  • その他アジア太平洋地域
• 南米
  • アルゼンチン
  • ブラジル
  • チリ
  • その他南米
• 中東とアフリカ
  • サウジアラビア
  • アラブ首長国連邦
  • カタール
  • 南アフリカ
  • その他中東とアフリカ

第9章 主な発展

• 契約、パートナーシップ、コラボレーション、合弁事業
• 買収と合併
• 新製品の発売
• 事業拡大
• その他の主要戦略

第10章 企業プロファイル

• Amphenol Corporation
• Cicor Group
• Galtronics USA Inc.（Baylin Technologies）
• Harting Technology Group
• Kubler Group
• LP Technologies, Inc.
• LPKF Laser & Electronics AG
• MacDermid Alpha Electronics Solutions
• MID Solutions, Inc.
• Molex LLC
• Multiple Dimensions AG
• RTP Company
• Taoglas
• TE Connectivity Ltd.
• T-Ink Inc.
• Yomura Technologies Inc.

List of Tables

• Table 1 Global Molded Interconnect Devices (MID) Market Outlook, By Region (2021-2030) ($MN)
• Table 2 Global Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
• Table 3 Global Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
• Table 4 Global Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
• Table 5 Global Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
• Table 6 Global Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
• Table 7 Global Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
• Table 8 Global Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
• Table 9 Global Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
• Table 10 Global Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
• Table 11 Global Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
• Table 12 Global Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
• Table 13 Global Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
• Table 14 Global Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
• Table 15 Global Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 16 Global Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
• Table 17 Global Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
• Table 18 Global Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
• Table 19 Global Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
• Table 20 North America Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
• Table 21 North America Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
• Table 22 North America Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
• Table 23 North America Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
• Table 24 North America Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
• Table 25 North America Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
• Table 26 North America Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
• Table 27 North America Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
• Table 28 North America Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
• Table 29 North America Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
• Table 30 North America Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
• Table 31 North America Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
• Table 32 North America Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
• Table 33 North America Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
• Table 34 North America Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 35 North America Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
• Table 36 North America Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
• Table 37 North America Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
• Table 38 North America Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
• Table 39 Europe Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
• Table 40 Europe Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
• Table 41 Europe Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
• Table 42 Europe Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
• Table 43 Europe Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
• Table 44 Europe Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
• Table 45 Europe Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
• Table 46 Europe Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
• Table 47 Europe Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
• Table 48 Europe Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
• Table 49 Europe Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
• Table 50 Europe Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
• Table 51 Europe Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
• Table 52 Europe Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
• Table 53 Europe Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 54 Europe Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
• Table 55 Europe Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
• Table 56 Europe Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
• Table 57 Europe Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
• Table 58 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
• Table 59 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
• Table 60 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
• Table 61 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
• Table 62 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
• Table 63 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
• Table 64 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
• Table 65 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
• Table 66 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
• Table 67 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
• Table 68 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
• Table 69 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
• Table 70 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
• Table 71 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
• Table 72 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 73 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
• Table 74 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
• Table 75 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
• Table 76 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
• Table 77 South America Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
• Table 78 South America Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
• Table 79 South America Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
• Table 80 South America Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
• Table 81 South America Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
• Table 82 South America Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
• Table 83 South America Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
• Table 84 South America Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
• Table 85 South America Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
• Table 86 South America Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
• Table 87 South America Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
• Table 88 South America Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
• Table 89 South America Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
• Table 90 South America Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
• Table 91 South America Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 92 South America Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
• Table 93 South America Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
• Table 94 South America Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
• Table 95 South America Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
• Table 96 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
• Table 97 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
• Table 98 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
• Table 99 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
• Table 100 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
• Table 101 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
• Table 102 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
• Table 103 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
• Table 104 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
• Table 105 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
• Table 106 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
• Table 107 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
• Table 108 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
• Table 109 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
• Table 110 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 111 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
• Table 112 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
• Table 113 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
• Table 114 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)

According to Stratistics MRC, the Global Molded Interconnect Devices (MID) Market is accounted for $1.3 billion in 2023 and is expected to reach $3.5 billion by 2030 growing at a CAGR of 14.4% during the forecast period. Molded Interconnect Devices (MID) are three-dimensional circuit structures formed by integrating electronics directly into injection-molded plastic components. This technology enables compact and lightweight designs, combining mechanical and electrical functions in a single part. MID is utilized in various industries, such as automotive and consumer electronics, to create efficient and space-saving electronic devices.

Market Dynamics:

Driver:

Growing demand for connected devices

The increasing demand for connected devices, driven by trends like the Internet of Things (IoT), is a key driver in the molded interconnect devices (MID) market. MID technology allows the seamless integration of electronic components into three-dimensional structures, enabling compact and multifunctional devices. As the demand for smart and interconnected products rises across industries such as automotive, healthcare and consumer electronics, MID's ability to efficiently combine mechanical and electrical functions positions it as a crucial solution for meeting these evolving market needs.

Restraint:

High initial investment costs

Establishing the infrastructure for MID production, including specialized machinery and technology, requires substantial financial resources. Companies face challenges in allocating funds for research, development and production setup, hindering widespread adoption. The financial barriers limit market entry for potential competitors and may slow down the overall growth of the MID market.

Opportunity:

Advancements in manufacturing technologies

Advancements in manufacturing technologies present a significant opportunity in the molded interconnect device (MID) market by enhancing production efficiency and expanding design possibilities. Innovations like additive manufacturing, laser direct structuring, and 3D printing enable more intricate and customized MID designs. This streamlines the manufacturing process and allows for the integration of complex electronic functionalities. As a result, the MID market can capitalize on these advancements to offer more sophisticated, compact and cost-effective solutions, fostering industry growth.

Threat:

Fluctuations in raw material prices

Fluctuations in raw material prices pose a significant threat to the molded interconnect device (MID) market. As MID relies on specialized materials for both electronic and structural components, any volatility in the prices of these raw materials can impact production costs and overall profitability. Manufacturers may face challenges in maintaining competitive pricing and the uncertainty in material costs can disrupt supply chains, affecting the stability and growth of the MID market.

Covid-19 Impact:

The COVID-19 pandemic has impacted the molded interconnect devices (MID) market by disrupting global supply chains, causing production delays and affecting consumer demand. Lockdowns, social distancing measures and economic uncertainties have led to challenges in manufacturing and distribution. Additionally, shifts in priorities and reduced consumer spending have influenced the adoption of MID in various industries. Adaptation to remote work and changes in consumer behavior have also influenced market dynamics, requiring strategic adjustments from industry players.

The laser direct structuring (LDS) segment is expected to be the largest during the forecast period

The laser direct structuring (LDS) segment is projected to be the largest in the forecast period due to its advanced capabilities in molded interconnect device (MID) manufacturing. LDS technology enables precise and intricate circuit patterns by selectively activating additives in the molded substrate using laser beams. This method offers high flexibility and design complexity, making it increasingly favored in diverse applications. The demand for sophisticated electronic devices and the growing trend towards miniaturization contribute to the dominance of the LDS segment in the market.

The sensors segment is expected to have the highest CAGR during the forecast period

The sensors segment is anticipated to exhibit the highest growth rate during the forecast period in the molded interconnect devices (MID) market. This surge is attributed to the escalating demand for compact and integrated sensor solutions across industries. MID technology's ability to seamlessly embed sensors within three-dimensional structures enhances design efficiency and functionality, driving the growing adoption of MID in sensor applications and contributing to the segment's robust growth.

Region with largest share:

North America is poised to lead the molded interconnect devices (MID) market, boasting the largest share during the forecast period. This dominance is attributed to a robust electronics industry, technological innovation and widespread adoption across sectors like automotive, healthcare and telecommunications. Favorable economic conditions, a well-established manufacturing infrastructure and a proactive approach towards advanced technologies contribute to the region's prominence. The continuous demand for compact and multifunctional electronic solutions further propels the growth of the MID market in North America.

Region with highest CAGR:

The Asia-Pacific region is poised for rapid growth in the molded interconnect devices (MID) market due to its burgeoning electronics manufacturing sector, increasing adoption of advanced technologies and expanding consumer electronics markets. The region benefits from a robust supply chain, cost-effective manufacturing capabilities and a rising demand for compact and integrated electronic solutions. With supportive government initiatives and a flourishing innovation ecosystem, Asia-Pacific is becoming a focal point for MID applications, contributing to the anticipated swift expansion of the market.

Key players in the market

Some of the key players in Molded Interconnect Devices (MID) market include Amphenol Corporation, Cicor Group, Galtronics USA Inc. (Baylin Technologies), Harting Technology Group, Kubler Group, LP Technologies, Inc., LPKF Laser & Electronics AG, MacDermid Alpha Electronics Solutions, MID Solutions, Inc., Molex LLC, Multiple Dimensions AG, RTP Company, Taoglas, TE Connectivity Ltd., T-Ink Inc. and Yomura Technologies Inc.

Key Developments:

In November 2023, Molex has built a new medical device campus in Poland in a $110m project that adds high power busbar and battery interconnect for its electrification business. The new Molex facility Katowice, Poland, has an initial 23,000 square-meter manufacturing space for advanced medical devices for Phillips-Medisize as well as electric vehicle and electrification interconnect for Molex customers. The site will have advanced medical device assembly, packaging and injection molding and also manufacture interconnect battery solutions for electric vehicles and high-power busbar solutions for Molex's electrification business.

In May 2022, Taoglas has signed a partnership agreement with Dejerao. The company will help Dejerao's customers by providing best-in-class RF antennas for cellular bonding devices used in mobile applications.

In March 2022, Amphenol Corporation has expanded its SURLOK Plus Series to include 8 mm and 10.3 mm right-angle connectors, with a voltage range of 1500 VDC to meet energy storage and high-power connection and transfer requirements.

Product Types Covered:

• Antenna & Connectivity Modules
• Connectors & Switches
• Lighting Systems
• Sensors
• Other Product Types

Processes Covered:

• Laser Direct Structuring (LDS)
• Film Techniques
• Two-Shot Molding

End Users Covered:

• Telecommunications
• Automotive
• Consumer Electronics
• Industrial
• Medical
• Military & Aerospace
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Product Analysis
• 3.7 End User Analysis
• 3.8 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Molded Interconnect Devices (MID) Market, By Product Type

• 5.1 Introduction
• 5.2 Antenna & Connectivity Modules
• 5.3 Connectors & Switches
• 5.4 Lighting Systems
• 5.5 Sensors
• 5.6 Other Product Types

6 Global Molded Interconnect Devices (MID) Market, By Process

• 6.1 Introduction
• 6.2 Laser Direct Structuring (LDS)
• 6.3 Film Techniques
• 6.4 Two-Shot Molding

7 Global Molded Interconnect Devices (MID) Market, By End User

• 7.1 Introduction
• 7.2 Telecommunications
• 7.3 Automotive
• 7.4 Consumer Electronics
• 7.5 Industrial
• 7.6 Medical
• 7.7 Military & Aerospace
• 7.8 Other End Users

8 Global Molded Interconnect Devices (MID) Market, By Geography

• 8.1 Introduction
• 8.2 North America
  • 8.2.1 US
  • 8.2.2 Canada
  • 8.2.3 Mexico
• 8.3 Europe
  • 8.3.1 Germany
  • 8.3.2 UK
  • 8.3.3 Italy
  • 8.3.4 France
  • 8.3.5 Spain
  • 8.3.6 Rest of Europe
• 8.4 Asia Pacific
  • 8.4.1 Japan
  • 8.4.2 China
  • 8.4.3 India
  • 8.4.4 Australia
  • 8.4.5 New Zealand
  • 8.4.6 South Korea
  • 8.4.7 Rest of Asia Pacific
• 8.5 South America
  • 8.5.1 Argentina
  • 8.5.2 Brazil
  • 8.5.3 Chile
  • 8.5.4 Rest of South America
• 8.6 Middle East & Africa
  • 8.6.1 Saudi Arabia
  • 8.6.2 UAE
  • 8.6.3 Qatar
  • 8.6.4 South Africa
  • 8.6.5 Rest of Middle East & Africa

9 Key Developments

• 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 9.2 Acquisitions & Mergers
• 9.3 New Product Launch
• 9.4 Expansions
• 9.5 Other Key Strategies

10 Company Profiling

• 10.1 Amphenol Corporation
• 10.2 Cicor Group
• 10.3 Galtronics USA Inc. (Baylin Technologies)
• 10.4 Harting Technology Group
• 10.5 Kubler Group
• 10.6 LP Technologies, Inc.
• 10.7 LPKF Laser & Electronics AG
• 10.8 MacDermid Alpha Electronics Solutions
• 10.9 MID Solutions, Inc.
• 10.10 Molex LLC
• 10.11 Multiple Dimensions AG
• 10.12 RTP Company
• 10.13 Taoglas
• 10.14 TE Connectivity Ltd.
• 10.15 T-Ink Inc.
• 10.16 Yomura Technologies Inc.