モールド配線デバイス市場：製品タイプ、プロセス、業界別-2025-2030年の世界予測

モールド配線デバイス市場の2023年の市場規模は24億4,000万米ドルで、2024年には27億8,000万米ドルに達すると予測され、CAGR 14.33％で成長し、2030年には62億4,000万米ドルに達すると予測されています。

Molded Interconnect Devices（MID）は、3D射出成形回路キャリアを使用して、電気的および機械的機能を単一パッケージに統合する革新的な技術です。MIDの必要性は、民生用電子機器、自動車、医療機器、通信などさまざまな用途で、小型化、高機能化、性能向上に対する需要が高まっていることから生じています。MIDは、回路とハウジングを1つの部品にまとめることで、スペース、重量、組み立てコストを削減します。MIDの最終用途は複数の業界にまたがり、LEDパッケージからアンテナ、センサーアセンブリまで幅広い用途で使用されています。主な市場成長要因としては、小型化傾向の高まり、効率的な電子機器に対する需要の増加、3D回路印刷技術の進歩などが挙げられます。MID市場のビジネスチャンスは、MIDを統合することでシームレスな接続と車両機能の強化が可能になる車載エレクトロニクスの採用増加に大きく影響されます。自動車技術が電気自動車や自律走行車に向けて進化するにつれて、MIDは不可欠な部品として台頭してくる。しかし市場は、初期製造コストの高さ、標準化された製造プロセスの欠如、複雑な電気部品の統合における技術的課題といった制約に直面しています。こうしたハードルを克服するため、企業はコスト効率の高い3D回路印刷法の開発や、より優れた熱管理のための材料性能の向上といった分野に注力する必要があります。さらに、ポリマー材料の革新に向けた研究開発機関との協力や提携は、MIDの新たな機能を推進する可能性があります。MID市場の競合情勢を考察すると、主要企業は戦略的拡大、合併、技術革新に注力し、競争力を維持しています。成長の道筋を生かすために、企業は新興市場への注力を強め、高度な製造技術に投資し、多様で進化する顧客の需要に応える、より複雑なMID構造の製造を可能にすべきです。

市場力学：急速に進化するモールド配線デバイス市場の主要市場インサイトを公開

モールド配線デバイス市場は、需要と供給のダイナミックな相互作用によって変貌を遂げています。このような市場力学の進化を理解することで、企業は十分な情報に基づいた投資決定、戦略的意思決定、新たなビジネスチャンスの獲得を行うことができます。こうした動向を包括的に把握することで、企業は政治的、地理的、技術的、社会的、経済的な領域にわたる様々なリスクを軽減することができるとともに、消費者行動とそれが製造コストや購買動向に与える影響をより明確に理解することができます。

• 市場促進要因
  • ヘルスケアおよび家電業界におけるニーズの高まり
  • 自動車産業における幅広い用途
  • レーザー直接構造化の高い使用率
• 市場抑制要因
  • 原料コストに関する懸念
• 市場機会
  • 成形相互接続デバイスの技術進歩
  • IIoTエコシステム拡大への投資
• 市場の課題
  • モールド相互接続デバイスの互換性問題

ポーターの5つの力：モールド配線デバイス市場をナビゲートする戦略ツール

ポーターの5つの力フレームワークは、市場情勢の競合情勢を理解するための重要なツールです。ポーターのファイブフォース・フレームワークは、企業の競争力を評価し、戦略的機会を探るための明確な手法を提供します。このフレームワークは、企業が市場内の勢力図を評価し、新規事業の収益性を判断するのに役立ちます。これらの洞察により、企業は自社の強みを活かし、弱みに対処し、潜在的な課題を回避することができ、より強靭な市場でのポジショニングを確保することができます。

PESTLE分析：モールド配線デバイス市場における外部からの影響の把握

外部マクロ環境要因は、モールド配線デバイス市場の業績ダイナミクスを形成する上で極めて重要な役割を果たします。政治的、経済的、社会的、技術的、法的、環境的要因の分析は、これらの影響をナビゲートするために必要な情報を提供します。PESTLE要因を調査することで、企業は潜在的なリスクと機会をよりよく理解することができます。この分析により、企業は規制、消費者の嗜好、経済動向の変化を予測し、先を見越した積極的な意思決定を行う準備ができます。

市場シェア分析モールド配線デバイス市場における競合情勢の把握

モールド配線デバイス市場の詳細な市場シェア分析により、ベンダーの業績を包括的に評価することができます。企業は、収益、顧客ベース、成長率などの主要指標を比較することで、競争上のポジショニングを明らかにすることができます。この分析により、市場の集中、断片化、統合の動向が明らかになり、ベンダーは競争が激化する中で自社の地位を高める戦略的意思決定を行うために必要な知見を得ることができます。

FPNVポジショニング・マトリックスモールド配線デバイス市場におけるベンダーのパフォーマンス評価

FPNVポジショニングマトリックスは、モールド配線デバイス市場においてベンダーを評価するための重要なツールです。このマトリックスにより、ビジネス組織はベンダーのビジネス戦略と製品満足度に基づき評価することで、目標に沿った十分な情報に基づいた意思決定を行うことができます。4つの象限によってベンダーを明確かつ正確にセグメント化し、戦略目標に最適なパートナーやソリューションを特定することができます。

戦略分析と推奨モールド配線デバイス市場における成功への道筋を描く

モールド配線デバイス市場の戦略分析は、世界市場でのプレゼンス強化を目指す企業にとって不可欠です。主要なリソース、能力、業績指標を見直すことで、企業は成長機会を特定し、改善に取り組むことができます。このアプローチにより、競合情勢における課題を克服し、新たなビジネスチャンスを活かして長期的な成功を収めるための体制を整えることができます。

本レポートでは、主要な注目分野を網羅した市場の包括的な分析を提供しています：

1.市場の浸透度：現在の市場環境の詳細なレビュー、主要企業による広範なデータ、市場でのリーチと全体的な影響力の評価。

2.市場の開拓度：新興市場における成長機会を特定し、既存分野における拡大可能性を評価し、将来の成長に向けた戦略的ロードマップを提供します。

3.市場の多様化：最近の製品発売、未開拓の地域、業界の主要な進歩、市場を形成する戦略的投資を分析します。

4.競合の評価と情報：競合情勢を徹底的に分析し、市場シェア、事業戦略、製品ポートフォリオ、認証、規制当局の承認、特許動向、主要企業の技術進歩などを検証します。

5.製品開発およびイノベーション：将来の市場成長を促進すると期待される最先端技術、研究開発活動、製品イノベーションをハイライトしています。

また、利害関係者が十分な情報を得た上で意思決定できるよう、重要な質問にも答えています：

1.現在の市場規模と今後の成長予測は？

2.最高の投資機会を提供する製品、セグメント、地域はどこか？

3.市場を形成する主な技術動向と規制の影響とは？

4.主要ベンダーの市場シェアと競合ポジションは？

5.ベンダーの市場参入・撤退戦略の原動力となる収益源と戦略的機会は何か？

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

• 市場力学
  • 促進要因
    • ヘルスケアおよび家電業界での需要の高まり
    • 自動車産業における幅広い応用
    • レーザーダイレクトストラクチャリングの多用
  • 抑制要因
    • 原材料費に関する懸念
  • 機会
    • 成形相互接続デバイスの技術的進歩
    • IIoTエコシステムの拡大への投資
  • 課題
    • 成形相互接続デバイスの非互換性の問題
• 市場セグメンテーション分析
• ポーターのファイブフォース分析
• PESTEL分析
  • 政治的
  • 経済
  • 社交
  • 技術的
  • 法律上
  • 環境

第6章 モールド配線デバイス市場：製品タイプ別

• アンテナおよび接続モジュール
• コネクタとスイッチ
• 照明システム
• センサー

第7章 モールド配線デバイス市場：プロセス別

• 映画技術
• レーザーダイレクトストラクチャリング
• 2ショット成形

第8章 モールド配線デバイス市場：業界別

• 自動車
• 家電
• 産業
• 医学
• 軍事・航空宇宙
• 通信

第9章 南北アメリカのモールド配線デバイス市場

• アルゼンチン
• ブラジル
• カナダ
• メキシコ
• 米国

第10章 アジア太平洋地域のモールド配線デバイス市場

• オーストラリア
• 中国
• インド
• インドネシア
• 日本
• マレーシア
• フィリピン
• シンガポール
• 韓国
• 台湾
• タイ
• ベトナム

第11章 欧州・中東・アフリカのモールド配線デバイス市場

• デンマーク
• エジプト
• フィンランド
• フランス
• ドイツ
• イスラエル
• イタリア
• オランダ
• ナイジェリア
• ノルウェー
• ポーランド
• カタール
• ロシア
• サウジアラビア
• 南アフリカ
• スペイン
• スウェーデン
• スイス
• トルコ
• アラブ首長国連邦
• 英国

第12章 競合情勢

• 市場シェア分析2023
• FPNVポジショニングマトリックス, 2023
• 競合シナリオ分析
• 戦略分析と提言

企業一覧

• Amphenol Corporation
• Arlington Plating Company
• GALTRONICS Corporation Limited
• Harting Group
• KYOCERA AVX Components Corporation
• LPKF Laser & Electronics SE
• MID Solutions GmbH
• Molex LLC
• RTP Company
• SUZHOU CICOR TECHNOLOGY CO. LTD
• Taoglas
• TE Connectivity
• Teprosa GmbH
• Tongda Group
• Yomura Technologies Inc.

LIST OF FIGURES

• FIGURE 1. MOLDED INTERCONNECT DEVICE MARKET RESEARCH PROCESS
• FIGURE 2. MOLDED INTERCONNECT DEVICE MARKET SIZE, 2023 VS 2030
• FIGURE 3. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, 2018-2030 (USD MILLION)
• FIGURE 4. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 5. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 6. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2023 VS 2030 (%)
• FIGURE 7. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 8. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2023 VS 2030 (%)
• FIGURE 9. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 10. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2023 VS 2030 (%)
• FIGURE 11. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 12. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 13. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 14. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2023 VS 2030 (%)
• FIGURE 15. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 16. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 17. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 18. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 19. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 20. MOLDED INTERCONNECT DEVICE MARKET SHARE, BY KEY PLAYER, 2023
• FIGURE 21. MOLDED INTERCONNECT DEVICE MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

• TABLE 1. MOLDED INTERCONNECT DEVICE MARKET SEGMENTATION & COVERAGE
• TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
• TABLE 3. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, 2018-2030 (USD MILLION)
• TABLE 4. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 5. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 6. MOLDED INTERCONNECT DEVICE MARKET DYNAMICS
• TABLE 7. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 8. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY ANTENNAE & CONNECTIVITY MODULES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 9. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY CONNECTORS & SWITCHES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 10. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY LIGHTING SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 11. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY SENSORS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 12. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 13. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY FILM TECHNIQUES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 14. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY LASER DIRECT STRUCTURING, BY REGION, 2018-2030 (USD MILLION)
• TABLE 15. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY TWO-SHOT MOLDING, BY REGION, 2018-2030 (USD MILLION)
• TABLE 16. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 17. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 18. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 19. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2030 (USD MILLION)
• TABLE 20. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY MEDICAL, BY REGION, 2018-2030 (USD MILLION)
• TABLE 21. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY MILITARY & AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 22. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 23. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 24. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 25. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 26. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 27. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 28. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 29. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 30. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 31. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 32. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 33. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 34. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 35. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 36. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 37. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 38. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 39. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 40. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 41. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 42. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
• TABLE 43. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 44. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 45. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 46. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 47. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 48. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 49. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 50. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 51. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 52. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 53. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 54. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 55. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 56. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 57. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 58. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 59. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 60. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 61. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 62. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 63. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 64. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 65. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 66. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 67. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 68. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 69. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 70. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 71. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 72. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 73. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 74. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 75. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 76. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 77. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 78. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 79. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 80. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 81. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 82. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 83. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 84. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 85. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 86. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 87. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 88. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 89. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 90. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 91. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 92. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 93. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 94. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 95. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 96. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 97. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 98. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 99. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 100. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 101. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 102. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 103. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 104. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 105. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 106. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 107. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 108. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 109. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 110. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 111. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 112. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 113. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 114. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 115. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 116. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 117. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 118. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 119. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 120. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 121. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 122. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 123. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 124. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 125. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 126. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 127. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 128. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 129. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 130. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 131. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 132. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 133. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 134. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 135. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 136. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 137. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 138. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 139. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 140. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 141. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 142. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 143. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 144. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 145. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 146. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 147. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
• TABLE 148. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 149. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
• TABLE 150. MOLDED INTERCONNECT DEVICE MARKET SHARE, BY KEY PLAYER, 2023
• TABLE 151. MOLDED INTERCONNECT DEVICE MARKET, FPNV POSITIONING MATRIX, 2023

The Molded Interconnect Device Market was valued at USD 2.44 billion in 2023, expected to reach USD 2.78 billion in 2024, and is projected to grow at a CAGR of 14.33%, to USD 6.24 billion by 2030.

Molded Interconnect Devices (MIDs) represent an innovative technology that integrates electrical and mechanical functions in a single package, using 3D injection-molded circuit carriers. The necessity for MIDs arises from the growing demand for miniaturization, increased functionality, and enhanced performance in various applications such as consumer electronics, automotive, medical devices, and telecommunications. By combining circuitry and housing into a single component, MIDs reduce space, weight, and assembly costs. The end-use scope of MIDs spans multiple industries, where they serve in applications ranging from LED packages to antennas and sensor assemblies. Key market growth factors include the rising trend toward miniaturization, increasing demand for efficient electronic devices, and advancements in 3D circuit printing technologies. Opportunities in the MID market are significantly influenced by the increasing adoption in automotive electronics, where the integration of MIDs can aid in seamless connectivity and enhanced vehicle functionalities. As automotive technologies evolve towards electric and autonomous vehicles, MIDs stand to gain as essential components. However, the market faces limitations such as high initial manufacturing costs, lack of standardized manufacturing processes, and technical challenges in integrating complex electrical components. To overcome these hurdles, businesses should focus on areas like developing cost-effective 3D circuit printing methods and improving material performance for better thermal management. Moreover, collaborations and partnerships with R&D institutions for innovation in polymer materials could propel new MID capabilities. Insight into the MID market nature reveals a moderately competitive landscape, with key players focusing on strategic expansions, mergers, and technology innovations to maintain a competitive edge. To capitalize on growth avenues, firms should amplify their focus on emerging markets and invest in advanced manufacturing technologies, enabling the production of more complex MID structures that cater to diverse, evolving customer demands.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Molded Interconnect Device Market

The Molded Interconnect Device Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Rising need in healthcare and consumer electronics industry
  • Wide applications in automotive industry
  • High use of laser direct structuring
• Market Restraints
  • Concerns pertaining to raw materials cost
• Market Opportunities
  • Technological advancements in molded interconnect devices
  • Investments in expanding IIoT ecosystem
• Market Challenges
  • Incompatibility issues of molded interconnect devices

Porter's Five Forces: A Strategic Tool for Navigating the Molded Interconnect Device Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Molded Interconnect Device Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Molded Interconnect Device Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Molded Interconnect Device Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Molded Interconnect Device Market

A detailed market share analysis in the Molded Interconnect Device Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Molded Interconnect Device Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Molded Interconnect Device Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Molded Interconnect Device Market

A strategic analysis of the Molded Interconnect Device Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Molded Interconnect Device Market, highlighting leading vendors and their innovative profiles. These include Amphenol Corporation, Arlington Plating Company, GALTRONICS Corporation Limited, Harting Group, KYOCERA AVX Components Corporation, LPKF Laser & Electronics SE, MID Solutions GmbH, Molex LLC, RTP Company, SUZHOU CICOR TECHNOLOGY CO. LTD, Taoglas, TE Connectivity, Teprosa GmbH, Tongda Group, and Yomura Technologies Inc..

Market Segmentation & Coverage

This research report categorizes the Molded Interconnect Device Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Product Type, market is studied across Antennae & Connectivity Modules, Connectors & Switches, Lighting Systems, and Sensors.
• Based on Process, market is studied across Film Techniques, Laser Direct Structuring, and Two-Shot Molding.
• Based on Vertical, market is studied across Automotive, Consumer Electronics, Industrial, Medical, Military & Aerospace, and Telecommunications.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Rising need in healthcare and consumer electronics industry
    • 5.1.1.2. Wide applications in automotive industry
    • 5.1.1.3. High use of laser direct structuring
  • 5.1.2. Restraints
    • 5.1.2.1. Concerns pertaining to raw materials cost
  • 5.1.3. Opportunities
    • 5.1.3.1. Technological advancements in molded interconnect devices
    • 5.1.3.2. Investments in expanding IIoT ecosystem
  • 5.1.4. Challenges
    • 5.1.4.1. Incompatibility issues of molded interconnect devices
• 5.2. Market Segmentation Analysis
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Molded Interconnect Device Market, by Product Type

• 6.1. Introduction
• 6.2. Antennae & Connectivity Modules
• 6.3. Connectors & Switches
• 6.4. Lighting Systems
• 6.5. Sensors

7. Molded Interconnect Device Market, by Process

• 7.1. Introduction
• 7.2. Film Techniques
• 7.3. Laser Direct Structuring
• 7.4. Two-Shot Molding

8. Molded Interconnect Device Market, by Vertical

• 8.1. Introduction
• 8.2. Automotive
• 8.3. Consumer Electronics
• 8.4. Industrial
• 8.5. Medical
• 8.6. Military & Aerospace
• 8.7. Telecommunications

9. Americas Molded Interconnect Device Market

• 9.1. Introduction
• 9.2. Argentina
• 9.3. Brazil
• 9.4. Canada
• 9.5. Mexico
• 9.6. United States

10. Asia-Pacific Molded Interconnect Device Market

• 10.1. Introduction
• 10.2. Australia
• 10.3. China
• 10.4. India
• 10.5. Indonesia
• 10.6. Japan
• 10.7. Malaysia
• 10.8. Philippines
• 10.9. Singapore
• 10.10. South Korea
• 10.11. Taiwan
• 10.12. Thailand
• 10.13. Vietnam

11. Europe, Middle East & Africa Molded Interconnect Device Market

• 11.1. Introduction
• 11.2. Denmark
• 11.3. Egypt
• 11.4. Finland
• 11.5. France
• 11.6. Germany
• 11.7. Israel
• 11.8. Italy
• 11.9. Netherlands
• 11.10. Nigeria
• 11.11. Norway
• 11.12. Poland
• 11.13. Qatar
• 11.14. Russia
• 11.15. Saudi Arabia
• 11.16. South Africa
• 11.17. Spain
• 11.18. Sweden
• 11.19. Switzerland
• 11.20. Turkey
• 11.21. United Arab Emirates
• 11.22. United Kingdom

12. Competitive Landscape

• 12.1. Market Share Analysis, 2023
• 12.2. FPNV Positioning Matrix, 2023
• 12.3. Competitive Scenario Analysis
• 12.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. Amphenol Corporation
• 2. Arlington Plating Company
• 3. GALTRONICS Corporation Limited
• 4. Harting Group
• 5. KYOCERA AVX Components Corporation
• 6. LPKF Laser & Electronics SE
• 7. MID Solutions GmbH
• 8. Molex LLC
• 9. RTP Company
• 10. SUZHOU CICOR TECHNOLOGY CO. LTD
• 11. Taoglas
• 12. TE Connectivity
• 13. Teprosa GmbH
• 14. Tongda Group
• 15. Yomura Technologies Inc.