成形回路部品（MID）市場レポート：2030年までの動向、予測、競合分析

成形回路部品（MID）の動向と予測

世界の成形回路部品（MID）市場は、2024～2030年のCAGR 10.8%で、2030年までに推定30億米ドルに達すると予想されています。この市場の主要促進要因は、軽量で耐久性のある電子部品に対する需要の高まりと、小型化された電子部品に対する需要の増加です。世界の成形回路部品（MID）市場の将来は、通信、家庭用電化製品、自動車、医療、産業、軍事と航空宇宙市場での機会があり、有望に見えます。

成形回路部品（MID）市場別洞察

Lucintelは、センサーが適応スクラッチ制御システムや気候制御用途などのさまざまな用途に使用されるため、予測期間中に最も高い成長が見込まれると予測しています。

この市場では、自動車が予測期間中に最も高い成長を遂げると予想されています。

アジア太平洋は、この地域における熟練労働者の確保と大手OEMメーカーの存在により、予測期間中に最高の成長を遂げると予想されています。

よくある質問

Q1.市場規模は：

A1.世界の成形回路部品（MID）市場は、2030年までに推定30億米ドルに達すると予想されています。

Q2.市場の成長予測は：

A2.世界の成形回路部品（MID）市場は、2024～2030年にかけて10.8%のCAGRで成長すると予想されています。

Q3.市場の成長に影響を与える主要促進要因は：

A3.この市場の主要促進要因は、軽量で耐久性のある電子機器に対する需要の高まりと、小型化された電子機器に対する需要の増加です。

Q4.市場の主要セグメントは：

A4.成形回路部品（MID）市場の将来は、通信、家庭用電化製品、自動車、医療、産業、軍事と航空宇宙市場での機会があり、有望に見えます。

Q5.市場の主要企業は：

A5.主要な成形回路部品（MID）企業の一部は次のとおりです。

• Molex
• TE Connectivity
• Amphenol
• LPKF Laser &Electronics
• Taoglas

Q6.今後、最大となる市場セグメントは：

A6.Lucintelは、センサーが適応スクラッチ制御システムや気候制御用途などのさまざまな用途に使用されるため、予測期間中に最も高い成長が見込まれると予測しています。

Q7.市場において、今後5年間に最大になると予想される地域は：

A7. アジア太平洋は、この地域における熟練労働者の確保と大手OEMメーカーの存在により、予測期間中に最高の成長を遂げると予想されています。

Q8.レポートのカスタマイズは可能か：

A8.はい、Lucintelは追加費用なしで10%のカスタマイズを記載しています。

目次

第1章 エグゼクティブサマリー

第2章 世界の成形回路部品（MID）市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2018～2030年の市場動向と予測分析

• マクロ経済動向（2018～2023年）と予測（2024～2030年）
• 世界の成形回路部品（MID）市場動向（2018～2023年）と予測（2024～2030年）
• 製品タイプ別の世界の成形回路部品（MID）市場
  • アンテナと接続モジュール
  • センサー
  • コネクタとスイッチ
  • 照明システム
  • その他
• プロセス別の世界の成形回路部品（MID）市場
  • レーザーダイレクトストラクチャーリング
  • ツーショット成形
  • 映画技術
• 最終用途産業別の世界の成形回路部品（MID）市場
  • 電気通信
  • 家電
  • 自動車
  • 医療
  • 産業用
  • 軍事と航空宇宙
  • その他

第4章 2018～2030年の地域別の市場動向と予測分析

• 地域別の世界の成形回路部品（MID）市場
• 北米の成形回路部品（MID）市場
• 欧州の成形回路部品（MID）市場
• アジア太平洋の成形回路部品（MID）市場
• その他地域の成形回路部品（MID）市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • 製品タイプ別の世界の成形回路部品（MID）市場の成長機会
  • プロセス別の世界の成形回路部品（MID）市場の成長機会
  • 最終用途産業別の世界の成形回路部品（MID）市場の成長機会
  • 地域別の世界の成形回路部品（MID）市場の成長機会
• 世界の成形回路部品（MID）市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界の成形回路部品（MID）市場の生産能力拡大
  • 世界の成形回路部品（MID）市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• Molex
• TE Connectivity
• Amphenol
• LPKF Laser & Electronics
• Taoglas

Molded Interconnect Device (MID) Trends and Forecast

The future of the global molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets. The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030 with a CAGR of 10.8% from 2024 to 2030. The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.

A more than 150-page report is developed to help in your business decisions.

Molded Interconnect Device (MID) by Segment

The study includes a forecast for the global molded interconnect device (MID) by product type, process, end use industry, and region.

Molded Interconnect Device (MID) Market by Product Type [Shipment Analysis by Value from 2018 to 2030]:

• Antennae & Connectivity Modules
• Sensors
• Connectors & Switches
• Lighting Systems
• Others

Molded Interconnect Device (MID) Market by Process [Shipment Analysis by Value from 2018 to 2030]:

• Laser Direct Structuring
• Two-Shot Molding
• Film Techniques

Molded Interconnect Device (MID) Market by End Use Industry [Shipment Analysis by Value from 2018 to 2030]:

• Telecommunications
• Consumer Electronics
• Automotive
• Medical
• Industrial
• Military & Aerospace
• Others

Molded Interconnect Device (MID) Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Molded Interconnect Device (MID) Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies molded interconnect device (MID) companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the molded interconnect device (MID) companies profiled in this report include-

• Molex
• TE Connectivity
• Amphenol
• LPKF Laser & Electronics
• Taoglas

Molded Interconnect Device (MID) Market Insights

Lucintel forecasts that sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.

Within this market, automotive is expected to witness the highest growth over the forecast period.

APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.

Features of the Global Molded Interconnect Device (MID) Market

Market Size Estimates: Molded interconnect device (MID) market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Molded interconnect device (MID) market size by product type, process, end use industry, and region in terms of value ($B).

Regional Analysis: Molded interconnect device (MID) market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different product types, processes, end use industries, and regions for the molded interconnect device (MID) market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the molded interconnect device (MID) market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the molded interconnect device (MID) market size?

Answer: The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030.

Q2. What is the growth forecast for molded interconnect device (MID) market?

Answer: The global molded interconnect device (MID) market is expected to grow with a CAGR of 10.8% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the molded interconnect device (MID) market?

Answer: The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.

Q4. What are the major segments for molded interconnect device (MID) market?

Answer: The future of the molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets.

Q5. Who are the key molded interconnect device (MID) market companies?

Answer: Some of the key molded interconnect device (MID) companies are as follows:

• Molex
• TE Connectivity
• Amphenol
• LPKF Laser & Electronics
• Taoglas

Q6. Which molded interconnect device (MID) market segment will be the largest in future?

Answer: Lucintel forecasts that sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.

Q7. In molded interconnect device (MID) market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the molded interconnect device (MID) market by product type (antennae & connectivity modules, sensors, connectors & switches, lighting systems, and others), process (laser direct structuring, two-shot molding, and film techniques), end use industry (telecommunications, consumer electronics, automotive, medical, industrial, military & aerospace, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Molded Interconnect Device (MID) Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global Molded Interconnect Device (MID) Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global Molded Interconnect Device (MID) Market by Product Type
  • 3.3.1: Antennae & Connectivity Modules
  • 3.3.2: Sensors
  • 3.3.3: Connectors & Switches
  • 3.3.4: Lighting Systems
  • 3.3.5: Others
• 3.4: Global Molded Interconnect Device (MID) Market by Process
  • 3.4.1: Laser Direct Structuring
  • 3.4.2: Two-Shot Molding
  • 3.4.3: Film Techniques
• 3.5: Global Molded Interconnect Device (MID) Market by End Use Industry
  • 3.5.1: Telecommunications
  • 3.5.2: Consumer Electronics
  • 3.5.3: Automotive
  • 3.5.4: Medical
  • 3.5.5: Industrial
  • 3.5.6: Military & Aerospace
  • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global Molded Interconnect Device (MID) Market by Region
• 4.2: North American Molded Interconnect Device (MID) Market
  • 4.2.2: North American Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
• 4.3: European Molded Interconnect Device (MID) Market
  • 4.3.1: European Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
  • 4.3.2: European Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
• 4.4: APAC Molded Interconnect Device (MID) Market
  • 4.4.1: APAC Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
  • 4.4.2: APAC Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
• 4.5: ROW Molded Interconnect Device (MID) Market
  • 4.5.1: ROW Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
  • 4.5.2: ROW Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Product Type
  • 6.1.2: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Process
  • 6.1.3: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by End Use Industry
  • 6.1.4: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Region
• 6.2: Emerging Trends in the Global Molded Interconnect Device (MID) Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Molded Interconnect Device (MID) Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Molded Interconnect Device (MID) Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Molex
• 7.2: TE Connectivity
• 7.3: Amphenol
• 7.4: LPKF Laser & Electronics
• 7.5: Taoglas