デフォルト表紙
市場調査レポート
商品コード
1425655

成形回路部品(MID)の世界市場レポート 2024年

Molded Interconnect Device (MID) Global Market Report 2024

出版日: 受注後更新 | 発行: The Business Research Company | ページ情報: 英文 200 Pages | 納期: 2~10営業日

● お客様のご希望に応じて、既存データの加工や未掲載情報(例:国別セグメント)の追加などの対応が可能です。  詳細はお問い合わせください。

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=157.14円
成形回路部品(MID)の世界市場レポート 2024年
出版日: 受注後更新
発行: The Business Research Company
ページ情報: 英文 200 Pages
納期: 2~10営業日
  • 全表示
  • 概要
  • 目次
概要

成形回路部品(MID)の市場規模は、近年急速に拡大しています。2023年の15億1,000万米ドルから、2024年には17億7,000万米ドルへ、CAGR17.2%で拡大すると予測されています。この成長は、小型化の動向、コンシューマー・エレクトロニクスの進化、カーエレクトロニクスの進歩、医療機器の革新、スマート製造手法への顕著な移行など、いくつかの要因によるものです。

航空宇宙産業における需要の急増は、成形回路部品市場の成長を促進すると予想されます。成形回路部品は、省スペース、軽量化、信頼性、熱管理、製造効率、設計の柔軟性といった大きな利点を備えており、多様な航空宇宙用途に適しています。例えば、Cadrexが2023年8月に報告したように、航空宇宙産業は2022年に7,410億米ドルの収益を記録し、前年比3%増を記録しました。この業界の要求拡大が、成形回路部品市場の成長を促す主な要因となっています。

2023年の成形回路部品(MID)市場シェアでは、アジア太平洋が最大でした。アジア太平洋は予測期間中に最も急成長する地域となる見込みです。成形回路部品(MID)市場レポートの対象地域は、アジア太平洋、西欧、東欧、北米、南米、中東・アフリカです。

目次

第1章 エグゼクティブサマリー

第2章 市場の特徴

第3章 市場動向と戦略

第4章 マクロ経済シナリオ

  • 高インフレが市場に与える影響
  • ウクライナ・ロシア戦争が市場に与える影響
  • COVID-19による市場への影響

第5章 世界市場規模と成長

  • 世界の成形回路部品市場の促進要因と抑制要因
    • 市場の促進要因
    • 市場の抑制要因
  • 世界の成形回路部品の市場規模実績と成長、2018年~2023年
  • 世界の成形回路部品の市場規模と成長予測、2023年~2028年、2033年

第6章 市場セグメンテーション

  • 世界の成形回路部品市場、製品別セグメンテーション、実績と予測、2018年~2023年、2023年~2028年、2033年
  • アンテナと接続モジュール
  • コネクタとスイッチ
  • センサー
  • 照明
  • 世界の成形回路部品市場、プロセス別セグメンテーション、実績と予測、2018年~2023年、2023年~2028年、2033年
  • レーザーダイレクトストラクチャリング(LDS)
  • 二色成形
  • その他のプロセス
  • 世界の成形回路部品市場、用途別セグメンテーション、実績と予測、2018年~2023年、2023年~2028年、2033年
  • 自動車
  • 消費者製品
  • ヘルスケア
  • 産業用
  • 軍事と航空宇宙
  • 通信とコンピューティング

第7章 地域と国の分析

  • 世界の成形回路部品市場、地域別、実績と予測、2018年~2023年、2023年~2028年、2033年
  • 世界の成形回路部品市場、国別、実績と予測、2018年~2023年、2023年~2028年、2033年

第8章 アジア太平洋市場

第9章 中国市場

第10章 インド市場

第11章 日本市場

第12章 オーストラリア市場

第13章 インドネシア市場

第14章 韓国市場

第15章 西欧市場

第16章 英国市場

第17章 ドイツ市場

第18章 フランス市場

第19章 イタリア市場

第20章 スペイン市場

第21章 東欧市場

第22章 ロシア市場

第23章 北米市場

第24章 米国市場

第25章 カナダ市場

第26章 南米市場

第27章 ブラジル市場

第28章 中東市場

第29章 アフリカ市場

第30章 競合情勢と企業プロファイル

  • 成形回路部品市場の競合情勢
  • 成形回路部品市場の企業プロファイル
    • Molex LLC
    • TE Connectivity Ltd.
    • Amphenol Corporation
    • LPKF Laser &Electronics AG
    • 2E mechatronic GmbH &Co. KG

第31章 競合ベンチマーキング

第32章 競合ダッシュボード

第33章 主要な合併と買収

第34章 将来の見通しと可能性の分析

第35章 付録

目次
Product Code: r12886

Molded Interconnect Device (MID) Global Market Report 2024 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on molded interconnect device (mid) market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

  • Gain a truly global perspective with the most comprehensive report available on this market covering 50+ geographies.
  • Understand how the market has been affected by the coronavirus and how it is responding as the impact of the virus abates.
  • Assess the Russia - Ukraine war's impact on agriculture, energy and mineral commodity supply and its direct and indirect impact on the market.
  • Measure the impact of high global inflation on market growth.
  • Create regional and country strategies on the basis of local data and analysis.
  • Identify growth segments for investment.
  • Outperform competitors using forecast data and the drivers and trends shaping the market.
  • Understand customers based on the latest market shares.
  • Benchmark performance against key competitors.
  • Suitable for supporting your internal and external presentations with reliable high quality data and analysis
  • Report will be updated with the latest data and delivered to you within 3-5 working days of order along with an Excel data sheet for easy data extraction and analysis.
  • All data from the report will also be delivered in an excel dashboard format.

Where is the largest and fastest growing market for molded interconnect device (mid)? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The molded interconnect device (mid) market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

Scope

Markets Covered:

  • 1) By Product: Antenna and Connectivity Modules; Connectors and Switches; Sensors; Lighting
  • 2) By Process: Laser Direct Structuring (LDS); Two-shot molding; Other Processes
  • 3) By Application: Automotive; Consumer products; Healthcare; Industrial; Military and aerospace; Telecommunication And Computing
  • Companies Mentioned: Molex LLC; TE Connectivity Ltd.; Amphenol Corporation; LPKF Laser & Electronics AG; 2E mechatronic GmbH & Co. KG
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery format: PDF, Word and Excel Data Dashboard.

Executive Summary

Molded Interconnect Devices (MIDs) represent sophisticated electromechanical components integrating mechanical and electrical engineering principles in three dimensions. They amalgamate traditional product interfaces-circuit boards, housing, connectors, and wiring-into a singular, compact, and fully functional unit. MIDs typify a production method utilizing selectively plated plastic pieces.

The primary processes employed in Molded Interconnect Devices encompass Laser Direct Structuring (LDS), Two-Shot Molding, and other relevant techniques. Laser Direct Structuring stands out as an environmentally friendly, precise, and pioneering manufacturing method for three-dimensional molded connector devices. These products include antenna and connectivity modules, connectors and switches, sensors, lighting, and other relevant items. Applications span across automotive, consumer products, healthcare, industrial, military and aerospace, as well as telecommunication and computing sectors.

The molded interconnected device market research report is one of a series of new reports from The Business Research Company that provides molded interconnected device market statistics, including molded interconnected device industry global market size, regional shares, competitors with a molded interconnected device market share, detailed molded interconnected device market segments, market trends and opportunities, and any further data you may need to thrive in the molded interconnected device industry. This molded interconnected device market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The molded interconnect device (mid) market size has grown rapidly in recent years. It will grow from $1.51 billion in 2023 to $1.77 billion in 2024 at a compound annual growth rate (CAGR) of 17.2%. The growth observed in the historical period can be credited to several factors, including trends towards miniaturization, the evolution of consumer electronics, advancements in automotive electronics, innovations in medical devices, and a notable shift towards smart manufacturing methodologies.

The molded interconnect device (mid) market size is expected to see rapid growth in the next few years. It will grow to $3.27 billion in 2028 at a compound annual growth rate (CAGR) of 16.5%. Anticipated growth in the forecast period is linked to the continuous evolution of consumer electronics, increased integration of medical devices, expanding automotive electronics, and the swift advancement of rapid prototyping and manufacturing innovations. Noteworthy trends expected in this period encompass adherence to regulatory compliance and quality standards, emphasis on customization and design flexibility, the integration of rapid prototyping and manufacturing technologies, a focus on sustainability and material innovations, and the progression towards Industry 4.0 and smart manufacturing methodologies.

The rising demand for IoT devices is poised to drive the growth of the molded interconnect devices market. IoT devices encompass a multitude of physical items connected to the internet, exchanging data across devices and systems. This surge is fueled by the demand for higher computational speed, efficiency, low-power devices, and intelligent chipsets, primarily within the semiconductor & electronics industry. As reported in August 2022 by Techjury sourced from IoT Analytics, corporate IoT initiatives focused notably on Smart City (23%), Connected Industry (17%), and Connected Building (12%). However, the extraction of value from IoT-related data remains a challenge for 97% of firms, underscoring the market's potential growth.

The burgeoning demand within the aerospace industry is expected to propel the growth of the molded interconnect devices market. Molded interconnect devices offer significant advantages such as space savings, weight reduction, reliability, thermal management, manufacturing efficiency, and design flexibility, aligning well with diverse aerospace applications. For instance, as reported in August 2023 by Cadrex, the aerospace industry recorded revenue of $741 billion in 2022, marking a 3% increase from the previous year. This industry's expanding requirements are a key driver stimulating growth within the molded interconnect devices market.

Technological advancements represent a prominent trend shaping the molded interconnect device market. Key industry players are dedicated to crafting innovative technological solutions adaptable to various facets, leading to the evolution of technologies like laser plastic welding. In November 2021, LPKF Laser & Electronics introduced an innovative technology merging Laser Direct Structuring (LDS) and laser plastic welding. This combination results in aesthetically superior weld seams and robust plastic couplings, with the creation of WeLDS, enabling unprecedented function integration in electronics applications.

Major companies operating in the molded interconnect device market are focusing on pioneering products such as light antennas to bolster market revenues. Light antennas represent a breakthrough in wireless communications, being smaller than a US dime and pivotal in enabling widespread LiFi (Light Fidelity) usage in smartphones and connected devices. As unveiled in February 2023 by pureLiFi Limited, the LiFi Light Antenna is engineered for seamless integration, optimizing performance, size, cost, and production needs. Leveraging the light spectrum, LiFi surpasses conventional technologies like WiFi and 5G in speed, reliability, and security, offering scalability for widespread adoption in smartphones and connected devices.

In September 2022, Tide Rock Holdings completed the acquisition of Plastic Molding Technology (PMT), a strategic move that expands their service capabilities across multiple sites. This acquisition brings onboard a highly skilled team and 95 molding machines ranging from 20 to 500 tons, positioning Tide Rock Holdings to cater to a broader client base in plastic injection and inserts molding. Plastic Molding Technology is renowned in the industry for its expertise and strategic site locations.

Major companies operating in the molded interconnect device (mid) market report are Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd., Chogori Technology Co. Ltd., Mitsubishi Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company, BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, APC Automotive Technologies LLC, Yomura Technologies Inc., T-Ink Inc., ODU GmbH & Co. KG

Asia-Pacific was the largest region in the molded interconnect device (MID) market share in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the molded interconnect device (mid) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the molded interconnect device (mid) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The molded interconnect device market consists of sales of metal spraying and film techniques. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Table of Contents

1. Executive Summary

2. Molded Interconnect Device Market Characteristics

3. Molded Interconnect Device Market Trends And Strategies

4. Molded Interconnect Device Market - Macro Economic Scenario

  • 4.1. Impact Of High Inflation On The Market
  • 4.2. Ukraine-Russia War Impact On The Market
  • 4.3. COVID-19 Impact On The Market

5. Global Molded Interconnect Device Market Size and Growth

  • 5.1. Global Molded Interconnect Device Market Drivers and Restraints
    • 5.1.1. Drivers Of The Market
    • 5.1.2. Restraints Of The Market
  • 5.2. Global Molded Interconnect Device Historic Market Size and Growth, 2018 - 2023, Value ($ Billion)
  • 5.3. Global Molded Interconnect Device Forecast Market Size and Growth, 2023 - 2028, 2033F, Value ($ Billion)

6. Molded Interconnect Device Market Segmentation

  • 6.1. Global Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Antenna and Connectivity Modules
  • Connectors and Switches
  • Sensors
  • Lighting
  • 6.2. Global Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Laser Direct Structuring (LDS)
  • Two-shot molding
  • Other Processes
  • 6.3. Global Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Automotive
  • Consumer products
  • Healthcare
  • Industrial
  • Military and aerospace
  • Telecommunication And Computing

7. Molded Interconnect Device Market Regional And Country Analysis

  • 7.1. Global Molded Interconnect Device Market, Split By Region, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 7.2. Global Molded Interconnect Device Market, Split By Country, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

8. Asia-Pacific Molded Interconnect Device Market

  • 8.1. Asia-Pacific Molded Interconnect Device Market Overview
  • Region Information, Impact Of COVID-19, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.3. Asia-Pacific Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.4. Asia-Pacific Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

9. China Molded Interconnect Device Market

  • 9.1. China Molded Interconnect Device Market Overview
  • 9.2. China Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.3. China Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.4. China Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion

10. India Molded Interconnect Device Market

  • 10.1. India Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.2. India Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.3. India Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

11. Japan Molded Interconnect Device Market

  • 11.1. Japan Molded Interconnect Device Market Overview
  • 11.2. Japan Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.3. Japan Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.4. Japan Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

12. Australia Molded Interconnect Device Market

  • 12.1. Australia Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.2. Australia Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.3. Australia Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

13. Indonesia Molded Interconnect Device Market

  • 13.1. Indonesia Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.2. Indonesia Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.3. Indonesia Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

14. South Korea Molded Interconnect Device Market

  • 14.1. South Korea Molded Interconnect Device Market Overview
  • 14.2. South Korea Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.3. South Korea Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.4. South Korea Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

15. Western Europe Molded Interconnect Device Market

  • 15.1. Western Europe Molded Interconnect Device Market Overview
  • 15.2. Western Europe Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.3. Western Europe Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.4. Western Europe Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

16. UK Molded Interconnect Device Market

  • 16.1. UK Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.2. UK Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.3. UK Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

17. Germany Molded Interconnect Device Market

  • 17.1. Germany Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.2. Germany Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.3. Germany Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

18. France Molded Interconnect Device Market

  • 18.1. France Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.2. France Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.3. France Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

19. Italy Molded Interconnect Device Market

  • 19.1. Italy Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.2. Italy Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.3. Italy Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

20. Spain Molded Interconnect Device Market

  • 20.1. Spain Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.2. Spain Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.3. Spain Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

21. Eastern Europe Molded Interconnect Device Market

  • 21.1. Eastern Europe Molded Interconnect Device Market Overview
  • 21.2. Eastern Europe Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.3. Eastern Europe Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.4. Eastern Europe Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

22. Russia Molded Interconnect Device Market

  • 22.1. Russia Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.2. Russia Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.3. Russia Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

23. North America Molded Interconnect Device Market

  • 23.1. North America Molded Interconnect Device Market Overview
  • 23.2. North America Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.3. North America Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.4. North America Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

24. USA Molded Interconnect Device Market

  • 24.1. USA Molded Interconnect Device Market Overview
  • 24.2. USA Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.3. USA Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.4. USA Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

25. Canada Molded Interconnect Device Market

  • 25.1. Canada Molded Interconnect Device Market Overview
  • 25.2. Canada Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.3. Canada Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.4. Canada Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

26. South America Molded Interconnect Device Market

  • 26.1. South America Molded Interconnect Device Market Overview
  • 26.2. South America Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.3. South America Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.4. South America Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

27. Brazil Molded Interconnect Device Market

  • 27.1. Brazil Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.2. Brazil Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.3. Brazil Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

28. Middle East Molded Interconnect Device Market

  • 28.1. Middle East Molded Interconnect Device Market Overview
  • 28.2. Middle East Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.3. Middle East Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.4. Middle East Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

29. Africa Molded Interconnect Device Market

  • 29.1. Africa Molded Interconnect Device Market Overview
  • 29.2. Africa Molded Interconnect Device Market, Segmentation By Product, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.3. Africa Molded Interconnect Device Market, Segmentation By Process, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.4. Africa Molded Interconnect Device Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

30. Molded Interconnect Device Market Competitive Landscape And Company Profiles

  • 30.1. Molded Interconnect Device Market Competitive Landscape
  • 30.2. Molded Interconnect Device Market Company Profiles
    • 30.2.1. Molex LLC
      • 30.2.1.1. Overview
      • 30.2.1.2. Products and Services
      • 30.2.1.3. Strategy
      • 30.2.1.4. Financial Performance
    • 30.2.2. TE Connectivity Ltd.
      • 30.2.2.1. Overview
      • 30.2.2.2. Products and Services
      • 30.2.2.3. Strategy
      • 30.2.2.4. Financial Performance
    • 30.2.3. Amphenol Corporation
      • 30.2.3.1. Overview
      • 30.2.3.2. Products and Services
      • 30.2.3.3. Strategy
      • 30.2.3.4. Financial Performance
    • 30.2.4. LPKF Laser & Electronics AG
      • 30.2.4.1. Overview
      • 30.2.4.2. Products and Services
      • 30.2.4.3. Strategy
      • 30.2.4.4. Financial Performance
    • 30.2.5. 2E mechatronic GmbH & Co. KG
      • 30.2.5.1. Overview
      • 30.2.5.2. Products and Services
      • 30.2.5.3. Strategy
      • 30.2.5.4. Financial Performance

31. Global Molded Interconnect Device Market Competitive Benchmarking

32. Global Molded Interconnect Device Market Competitive Dashboard

33. Key Mergers And Acquisitions In The Molded Interconnect Device Market

34. Molded Interconnect Device Market Future Outlook and Potential Analysis

  • 34.1 Molded Interconnect Device Market In 2028 - Countries Offering Most New Opportunities
  • 34.2 Molded Interconnect Device Market In 2028 - Segments Offering Most New Opportunities
  • 34.3 Molded Interconnect Device Market In 2028 - Growth Strategies
    • 34.3.1 Market Trend Based Strategies
    • 34.3.2 Competitor Strategies

35. Appendix

  • 35.1. Abbreviations
  • 35.2. Currencies
  • 35.3. Historic And Forecast Inflation Rates
  • 35.4. Research Inquiries
  • 35.5. The Business Research Company
  • 35.6. Copyright And Disclaimer