|
市場調査レポート
商品コード
1159225
成形回路部品の世界市場:予測(2022年~2028年)Molded Interconnect Device Market 2022-2028 |
||||||
● お客様のご希望に応じて、既存データの加工や未掲載情報(例:国別セグメント)の追加などの対応が可能です。 詳細はお問い合わせください。 |
成形回路部品の世界市場:予測(2022年~2028年) |
出版日: 2022年09月23日
発行: Orion Market Research
ページ情報: 英文 120 Pages
納期: 2~3営業日
|
世界の成形回路部品の市場規模は、予測期間中に13%のCAGRで拡大すると予測されています。コンシューマエレクトロニクスにおけるポータブルデバイスの需要の高まりと、自動化の利用拡大が市場成長の主な要因です。
当レポートでは、世界の成形回路部品市場について調査し、市場の概要とともに、プロセス別、製品タイプ別、業界別、地域別の動向、および市場に参入する企業のプロファイルなどを提供しています。
Global Molded Interconnect Device Market Size, Share & Trends Analysis Report by Process (Laser Direct Structuring, Two - Shot Molding and Film Technique), by Product Type (Antennae and Connectivity Modules, Connector and Switches, Sensors, and Lighting), and by Industry (Medical, Automotive, Consumer Electronics, Telecommunication, Aerospace and Defense) Forecast Period (2022-2028)
The global molded interconnect device market is anticipated to grow at a substantial CAGR of 13% during the forecast period. Rising demand for portable devices in consumer electronics as well as growing usage of automated applications are the major factors driving the market growth. Molded interconnect devices are gaining wide acceptance in end-user applications as they reduces the volume by attaining efficient space utilization and thereby optimizing the cost associated with it. Consumption of essential portable electronic devices, such as smartphones, LCD players, tablets are considerably increasing. However, high technical expertise requirement for manufacturing of molded interconnect device can restrain the market growth.
The global molded interconnect device market is segmented based on the process, product type and industry. Based on the process, the market is sub segmented into laser direct structuring, two - shot molding, film technique. Based on the product type, the market is sub-segmented into the antennae and connectivity modules, connector and switches, sensors, lighting. Based on industry, the market is sub-segmented into medical, automotive, consumer electronics, telecommunication, aerospace and defense. The above mentioned segments can be customized as per the requirements.
Geographically market is segmented into North America, Europe, Asia Pacific, and the Rest of the World. Increasing funding activities and initiatives by government in Asia-Pacific region are motivating consumer electronics manufacturers to augment their investments in new technologies and capacity expansions, thereby, driving the market growth. Whereas the increasing penetration of unmanned aerial vehicles in the U.S. defense and aerospace industry is creating significant scope for MID market in North America.
The major companies serving the global molded interconnect device market include Element Solutions Inc., Galtronics, HARTING Technology Group, LPKF Laser & Electronics AG, Molex LLC, DuPont de Nemours, Inc., Ensinger India Engineering Plastics Pvt. Ltd., Evonik Industries AG, JOHNAN Corp., M.I.D Solutions Pty. Ltd. and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers & acquisitions, collaborations, funding, and new product launches, to stay competitive in the market. For instance, In June 2020, a key player in electronic specialty materials, MacDermid Alpha Electronics Solution announced release of Systek SAP. It's a collection of high-performance build-up methods for IC substrate RDL that includes multiple process flows for various materials as well as groundbreaking technology advances in the desmear, conditioning, activation, and metallization steps.
Research Methodology
The market study of the global molded interconnect device market is incorporated by extensive primary and secondary research conducted by the research team at OMR. Secondary research has been conducted to refine the available data to breakdown the market into various segments, derive total market size, market forecast, and growth rate. Different approaches have been worked on to derive the market value and market growth rate. Our team collects facts and data related to the market from different geography to provide a better regional outlook. In the report, the country-level analysis is provided by analyzing various regional players, regional tax laws and policies, consumer behavior, and macro-economic factors. Numbers extracted from secondary research have been authenticated by conducting proper primary research. It includes tracking down key people from the industry and interviewing them to validate the data. This enables our analyst to derive the closest possible figures without any major deviations in the actual number. Our analysts try to contact as many executives, managers, key opinion leaders, and industry experts. Primary research brings authenticity to our reports.
Secondary Sources Include:
The report provides an in-depth analysis of market size, intended quality of the service preferred by consumers. The report will serve as a source for a 360-degree analysis of the market thoroughly integrating different models.
Market Segmentation
The Report Covers: