日本のサーマルインターフェースマテリアル市場レポート：製品タイプ、用途、地域別、2024年～2032年

日本のサーマルインターフェースマテリアル市場の市場規模は2023年に2億1,260万米ドルに達しました。今後、IMARC Groupは、市場は2032年までに5億1,380万米ドルに達し、2024～2032年の成長率（CAGR）は9.60％になると予測しています。市場は、効果的な熱管理ソリューションへのニーズの高まり、サーマルインターフェースマテリアル（TIM）の配合と技術の継続的な進歩、電子デバイスの需要増加など、いくつかの主要促進要因によって成長を遂げています。

本レポートで扱う主な質問

• 日本のサーマルインターフェースマテリアル市場のこれまでの業績と、今後数年間の業績は？
• COVID-19が日本のサーマルインターフェースマテリアル市場に与えた影響は？
• 日本のサーマルインターフェースマテリアル市場の製品タイプ別の内訳は？
• 日本のサーマルインターフェースマテリアル市場の用途別の内訳は？
• 日本のサーマルインターフェースマテリアル市場のバリューチェーンにはどのような段階がありますか？
• 日本のサーマルインターフェースマテリアルの主要な促進要因と課題は？
• 日本のサーマルインターフェースマテリアル市場の構造と主要プレーヤーは？
• 日本のサーマルインターフェースマテリアル市場における競合の程度は？

目次

第1章 序文

第2章 調査範囲と調査手法

• 調査の目的
• ステークホルダー
• データソース
• 市場推定
• 調査手法

第3章 エグゼクティブサマリー

第4章 日本のサーマルインターフェースマテリアル市場：イントロダクション

• 概要
• 市場力学
• 業界動向
• 競合情報

第5章 日本のサーマルインターフェースマテリアル市場情勢

• 過去および現在の市場動向（2018～2023年）
• 市場予測（2024～2032年）

第6章 日本のサーマルインターフェースマテリアル市場：製品タイプ別の内訳

• テープとフィルム
• エラストマーパッド
• グリースと接着剤
• 相変化材料
• 金属系材料
• その他

第7章 日本のサーマルインターフェースマテリアル市場：用途別の内訳

• 通信
• コンピューター
• 医療機器
• 産業機械
• 耐久消費財
• 自動車エレクトロニクス
• その他

第8章 日本のサーマルインターフェースマテリアル市場：競合情勢

• 概要
• 市場構造
• 市場プレーヤーのポジショニング
• 主要成功戦略
• 競合ダッシュボード
• 企業評価象限

第9章 主要企業のプロファイル

第10章 日本のサーマルインターフェースマテリアル市場：業界分析

• 促進要因・抑制要因・機会
• ポーターのファイブフォース分析
• バリューチェーン分析

第10章 付録

Japan thermal interface material market size reached US$ 212.6 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 513.8 Million by 2032, exhibiting a growth rate (CAGR) of 9.60% during 2024-2032. The market is experiencing growth due to several key drivers, including a growing need for effective thermal management solutions, ongoing advancements in thermal interface material (TIM) formulations and technologies, and the increasing demand for electronic devices.

Thermal interface material (TIMs) play a crucial role in effectively conducting heat between two surfaces within various electronic devices. Their primary function involves filling gaps and eliminating air pockets that may exist between components, such as microprocessors, power transistors, LED modules, and heat sinks or spreaders, to ensure the most efficient dissipation of heat. These materials are specifically engineered to possess high thermal conductivity and low thermal resistance, facilitating the seamless transfer of heat. By promoting efficient heat dissipation, TIMs aid in maintaining optimal operational temperatures, preventing thermal throttling, and enhancing the overall performance of the entire system.

Japan Thermal Interface Material Market Trends:

The Japan thermal interface material market is experiencing robust growth, driven by a convergence of factors that align with the evolving landscape of electronic devices and industrial requirements. A significant driver is the increasing use of electronic devices, encompassing smartphones, laptops, and automotive electronics. These devices are becoming integral to modern life, necessitating efficient thermal management solutions. Furthermore, the rapid advancements in semiconductor technology, marked by higher power densities and increased component integration, have a substantial impact on the market. This trend drives the demand for advanced TIM solutions to effectively dissipate the heat generated by these sophisticated electronic components. The shift toward electric vehicles (EVs) is another driving force. The production of EVs requires effective thermal management solutions to address the heat generated by batteries, power electronics, and electric motors. The expansion of data center infrastructure, driven by the increasing demand for data storage and processing, further catalyzes the market's growth. Additionally, the need to improve energy efficiency in electronic devices is promoting the adoption of TIMs. Moreover, ongoing research and development efforts have led to the development of new TIM formulations with improved thermal conductivity, reliability, and ease of application. These innovations create numerous growth opportunities for the market. Furthermore, regulatory standards and guidelines in various industries, such as automotive and aerospace, mandate effective thermal management to ensure safety and reliability, which is expected to fuel the regional market in the coming years.

Japan Thermal Interface Material Market Segmentation:

Product Type Insights:

• Tapes and Films
• Elastomeric Pads
• Greases and Adhesives
• Phase Change Materials
• Metal Based Materials
• Others

Application Insights:

• Telecom
• Computer
• Medical Devices
• Industrial Machinery
• Consumer Durables
• Automotive Electronics
• Others

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided. Some of the key players include:

• Fuji Polymer Industries Co. Ltd.
• Henkel Japan Ltd. (Henkel AG & Co. KGaA)
• Minoru Co. Ltd.
• Shin-Etsu Chemical Co. Ltd.

Key Questions Answered in This Report:

• How has the Japan thermal interface material market performed so far and how will it perform in the coming years?
• What has been the impact of COVID-19 on the Japan thermal interface material market?
• What is the breakup of the Japan thermal interface material market on the basis of product type?
• What is the breakup of the Japan thermal interface material market on the basis of application?
• What are the various stages in the value chain of the Japan thermal interface material market?
• What are the key driving factors and challenges in the Japan thermal interface material?
• What is the structure of the Japan thermal interface material market and who are the key players?
• What is the degree of competition in the Japan thermal interface material market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Japan Thermal Interface Material Market - Introduction

• 4.1 Overview
• 4.2 Market Dynamics
• 4.3 Industry Trends
• 4.4 Competitive Intelligence

5 Japan Thermal Interface Material Market Landscape

• 5.1 Historical and Current Market Trends (2018-2023)
• 5.2 Market Forecast (2024-2032)

6 Japan Thermal Interface Material Market - Breakup by Product Type

• 6.1 Tapes and Films
  • 6.1.1 Overview
  • 6.1.2 Historical and Current Market Trends (2018-2023)
  • 6.1.3 Market Forecast (2024-2032)
• 6.2 Elastomeric Pads
  • 6.2.1 Overview
  • 6.2.2 Historical and Current Market Trends (2018-2023)
  • 6.2.3 Market Forecast (2024-2032)
• 6.3 Greases and Adhesives
  • 6.3.1 Overview
  • 6.3.2 Historical and Current Market Trends (2018-2023)
  • 6.3.3 Market Forecast (2024-2032)
• 6.4 Phase Change Materials
  • 6.4.1 Overview
  • 6.4.2 Historical and Current Market Trends (2018-2023)
  • 6.4.3 Market Forecast (2024-2032)
• 6.5 Metal Based Materials
  • 6.5.1 Overview
  • 6.5.2 Historical and Current Market Trends (2018-2023)
  • 6.5.3 Market Forecast (2024-2032)
• 6.6 Others
  • 6.6.1 Historical and Current Market Trends (2018-2023)
  • 6.6.2 Market Forecast (2024-2032)

7 Japan Thermal Interface Material Market - Breakup by Application

• 7.1 Telecom
  • 7.1.1 Overview
  • 7.1.2 Historical and Current Market Trends (2018-2023)
  • 7.1.3 Market Forecast (2024-2032)
• 7.2 Computer
  • 7.2.1 Overview
  • 7.2.2 Historical and Current Market Trends (2018-2023)
  • 7.2.3 Market Forecast (2024-2032)
• 7.3 Medical Devices
  • 7.3.1 Overview
  • 7.3.2 Historical and Current Market Trends (2018-2023)
  • 7.3.3 Market Forecast (2024-2032)
• 7.4 Industrial Machinery
  • 7.4.1 Overview
  • 7.4.2 Historical and Current Market Trends (2018-2023)
  • 7.4.3 Market Forecast (2024-2032)
• 7.5 Consumer Durables
  • 7.5.1 Overview
  • 7.5.2 Historical and Current Market Trends (2018-2023)
  • 7.5.3 Market Forecast (2024-2032)
• 7.6 Automotive Electronics
  • 7.6.1 Overview
  • 7.6.2 Historical and Current Market Trends (2018-2023)
  • 7.6.3 Market Forecast (2024-2032)
• 7.7 Others
  • 7.7.1 Historical and Current Market Trends (2018-2023)
  • 7.7.2 Market Forecast (2024-2032)

8 Japan Thermal Interface Material Market - Competitive Landscape

• 8.1 Overview
• 8.2 Market Structure
• 8.3 Market Player Positioning
• 8.4 Top Winning Strategies
• 8.5 Competitive Dashboard
• 8.6 Company Evaluation Quadrant

9 Profiles of Key Players

• 9.1 Fuji Polymer Industries Co. Ltd.
  • 9.1.1 Business Overview
  • 9.1.2 Product Portfolio
  • 9.1.3 Business Strategies
  • 9.1.4 SWOT Analysis
  • 9.1.5 Major News and Events
• 9.2 Henkel Japan Ltd. (Henkel AG & Co. KGaA)
  • 9.2.1 Business Overview
  • 9.2.2 Product Portfolio
  • 9.2.3 Business Strategies
  • 9.2.4 SWOT Analysis
  • 9.2.5 Major News and Events
• 9.3 Minoru Co. Ltd.
  • 9.3.1 Business Overview
  • 9.3.2 Product Portfolio
  • 9.3.3 Business Strategies
  • 9.3.4 SWOT Analysis
  • 9.3.5 Major News and Events
• 9.4 Shin-Etsu Chemical Co. Ltd.
  • 9.4.1 Business Overview
  • 9.4.2 Product Portfolio
  • 9.4.3 Business Strategies
  • 9.4.4 SWOT Analysis
  • 9.4.5 Major News and Events

Please note that this is only a partial list of the key players, and the complete list is provided in the report.

10 Japan Thermal Interface Material Market - Industry Analysis

• 10.1 Drivers, Restraints, and Opportunities
  • 10.1.1 Overview
  • 10.1.2 Drivers
  • 10.1.3 Restraints
  • 10.1.4 Opportunities
• 10.2 Porters Five Forces Analysis
  • 10.2.1 Overview
  • 10.2.2 Bargaining Power of Buyers
  • 10.2.3 Bargaining Power of Suppliers
  • 10.2.4 Degree of Competition
  • 10.2.5 Threat of New Entrants
  • 10.2.6 Threat of Substitutes
• 10.3 Value Chain Analysis

10 Appendix